CN214252772U - Optical shaping system for semiconductor laser - Google Patents
Optical shaping system for semiconductor laser Download PDFInfo
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- CN214252772U CN214252772U CN202120445368.4U CN202120445368U CN214252772U CN 214252772 U CN214252772 U CN 214252772U CN 202120445368 U CN202120445368 U CN 202120445368U CN 214252772 U CN214252772 U CN 214252772U
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Abstract
The utility model discloses an optics plastic system for semiconductor laser, include: the laser module comprises a shaping lens group, a single-slit light screen, an indicating plate calibrated with light spot standard scales, a position calibration device used for setting the position of the indicating plate, a detection device with adjustable spatial position and a curing device which are sequentially arranged along a light path; the indicating plate is detachably arranged on the position calibration device and can move along the position calibration device. The utility model provides a customization of multiple facula demand is realized to an optics plastic system accessible equipment, can satisfy the optics plastic of various facula demands, and the system is with low costs, and work efficiency is high.
Description
Technical Field
The utility model belongs to the technical field of optics, concretely relates to optics plastic system for semiconductor laser.
Background
The semiconductor laser is also called as a laser diode, and has the advantages of small volume, long service life, high efficiency, low price and the like, so that the semiconductor laser is easy to be widely applied to various fields of communication, industry, military, medical treatment and the like. Particularly, in recent years, with the rise of the medical and aesthetic industries, the application of high-power semiconductor lasers in the industries is more and more popular. Accordingly, higher demands are made on the quality of the laser beam.
High-power semiconductor lasers are mainly composed of semiconductor chips. Due to the inherent property of the semiconductor laser chip, the light emitted by the chip has a divergence angle (wherein the fast axis divergence angle is generally 28-37 degrees, and the slow axis divergence angle is generally 8-12 degrees), so that the generated light beam has Gaussian distribution, and the increasing requirement on uniform light beam quality cannot be met. Since the divergence angle is the inherent property of the semiconductor laser chip, the outgoing light-emitting angle which meets the application cannot be adjusted from the structure of the semiconductor laser chip, and then the external optical combination is required to compress the semiconductor laser chip to change the optical path of the semiconductor laser chip, so that the purpose of shaping the light beam is achieved.
In the prior art, optical shaping is usually realized by a module splitting method, a fiber microscope visual method and a parallel light coupling method. The light path is simulated and calculated, and then light spot control is carried out in modes of precision and the like so as to meet the light spot requirement.
However, the existing optical shaping method cannot realize the customization of various required light spots on one device, and cannot meet the optical shaping of various light spot requirements of high-power devices in the medical and cosmetic industries. In addition, the existing optical shaping method has higher equipment cost, and partial light beam shaping only controls light spots through theoretical calculation, and the light path calculation process is more complicated due to the diversity of user end requirements, so that the working efficiency is low.
SUMMERY OF THE UTILITY MODEL
In order to solve the above-mentioned problem that exists among the prior art, the utility model provides an optics plastic system for semiconductor laser. The to-be-solved technical problem of the utility model is realized through following technical scheme:
an optical shaping system for a semiconductor laser, comprising: the laser module comprises a shaping lens group, a single-slit light screen, an indicating plate calibrated with light spot standard scales, a position calibration device used for setting the position of the indicating plate, a detection device with adjustable spatial position and a curing device which are sequentially arranged along a light path; the indicating plate is detachably arranged on the position calibration device and can move along the position calibration device.
In an embodiment of the present invention, the shaping lens set is disposed on a six-axis optical adjustment frame, so as to adjust the spatial position of each lens of the shaping lens set according to the shape of the shaping light spot, and solidify the lens set when the shape of the shaping light spot is consistent with the standard scale of the light spot at the corresponding position on the indication board; the light spot standard scale is calibrated according to the focal position of the system and the size of a light spot required by the system at a certain fixed position.
In an embodiment of the present invention, the shaping lens group includes a plurality of FAC lenses.
In an embodiment of the present invention, the single-slit light shielding plate is internally provided with a water cooling circulation system.
In one embodiment of the present invention, the indicator plate is made of aluminum alloy plate after black anodization.
The utility model has the advantages that:
1. the utility model provides an optics plastic system for semiconductor laser shows the facula appearance of optics plastic process through the indicator panel that marks the facula standard scale to adjust through the appearance and finally realize required optics facula, and can realize the customization of multiple facula demand through an equipment, can satisfy the optics plastic of the various facula demands of medical and American trade high power device;
2. the optical shaping system for the semiconductor laser improves the working efficiency;
3. the optical shaping system for the semiconductor laser adopts a simple optical device, so that the overall cost of the system is lower;
4. the utility model discloses a whole light beam plastic process all accomplishes under visual, brings very big convenience and certainty for the optics plastic.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic flow chart of an optical shaping method for a semiconductor laser according to an embodiment of the present invention;
fig. 2 is a block diagram of an optical shaping system for a semiconductor laser according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an optical shaping system for a semiconductor laser according to an embodiment of the present invention;
fig. 4 is a bottom view of fig. 3.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the present invention is not limited thereto.
Example one
Referring to fig. 1, fig. 1 is a schematic flow chart of an optical shaping method for a semiconductor laser according to an embodiment of the present invention, including the following steps:
s1: setting an indicating plate calibrated with light spot standard scales at a certain fixed position; wherein, the light spot standard scale is calibrated according to the focal position of the system and the size of the light spot required by the focal position of the system at the fixed position.
In the present embodiment, the indicator plate may be made of an aluminum alloy plate anodized in black. In particular, a standard scale of spot sizes herein may be tailored to the desired spot size at a certain distance. For example, a 10 × 10mm light spot is required at the position of a central axis in a 100mm space, a spatial position is sought by performing a simulation on a focus, and the size of the light spot of a 60mm position light path is manufactured assuming that the focus is at the position of 60 mm.
In addition, other light spots with different shapes can be customized according to requirements.
In practice, if the laser needs to be shaped to a standard spot at 60mm, the indicator plate can be set at the 60mm position accordingly.
S2: and shaping a light beam emitted by a certain laser chip of the semiconductor laser by using the shaping lens group, and adjusting the spatial position of the shaping lens group so that a shaped light spot is displayed on the indicator board and is consistent with the standard scale of the light spot.
Further, step S2 includes:
s21: and carrying out collimation and shaping on the light beam emitted by the semiconductor laser through a collimation lens group to obtain a parallel light beam.
Generally, FAC (fast axis collimation) and SAC (slow axis collimation) lenses can change the divergence angle of emergent light of a semiconductor chip, and perform spatial coupling through different lens sizes and technical parameters to finally realize a required light beam.
In this embodiment, the FAC lens is selected to shape the light beam emitted from the laser chip to obtain parallel light.
S22: and partially shielding the parallel light beams to form a shaping light spot corresponding to a certain laser chip on the indicating plate.
Specifically, in the embodiment, the single-slit light shielding plate is used for shielding the light beam which is not required to be shaped temporarily in the parallel light beams, and only the light beam corresponding to the laser chip which is required to be shaped passes through, so that the shaped light spot corresponding to the laser chip is formed on the indicator board.
S23: and adjusting the spatial position of the collimating lens group to enable the appearance of the shaped light spot to be consistent with the standard scale of the light spot at the corresponding position on the indicating plate.
Specifically, the spatial position of each lens of the collimating lens group is adjusted, so that the appearance of the shaped light spot is consistent with the calibrated light spot standard scale on the indicator board, and the current position is the position of the lens meeting the requirement.
S3: solidifying the shaping lens group to lock the space position of the lens group corresponding to the current laser chip, finishing the beam shaping of the chip, and specifically comprising:
s31: and dispensing the shaping lens group to pre-solidify the shaping lens group.
In this embodiment, before the entire lens assembly is cured, it needs to be pre-cured by using an optical adhesive to facilitate the fine adjustment of the subsequent position.
The specific pre-curing process is as follows:
firstly, a plurality of glue dispensing points are arranged on the space position of the lens group obtained in the step S2, then, the arranged glue dispensing points are subjected to primary glue dispensing operation, and then, the glue of the points is pre-cured for 30S by using a UV curing lamp.
And further, observing whether the light spot meets the requirements, observing whether the glue amount is full, performing glue filling if the glue amount is not full, and performing pre-curing operation for 30 s.
At this point, the pre-curing operation of the entire lens assembly is completed.
S32: moving the pre-cured shaping lens group to a preset position, and carrying out micro-adjustment on the position of the shaping lens group according to the appearance of the light spot; the preset position is a spatial position where the shaping lens group is located when the shaping light spot is consistent with the light spot standard scale on the indicating plate.
S33: and curing the reshaping lens group after the fine adjustment by using a curing lamp.
Specifically, the present embodiment performs a curing operation on the entire lens group using a UV curing lamp.
Thus, optical shaping of one of the chips of the semiconductor laser is completed.
S4: and repeating the steps until the beam shaping of all the laser chips of the semiconductor laser is finished to obtain the required optical facula.
Because most semiconductor lasers include a plurality of laser chips, if a required collective light spot is to be obtained, each laser chip needs to be shaped one by one, and the required optical light spot is obtained after a plurality of groups of operations.
Specifically, in the present embodiment, the single-slit light shielding plate shields the light beams emitted by the other laser chips, only the light beam corresponding to the laser chip which needs to be shaped currently passes through, the shaping light spot corresponding to the laser chip is displayed on the indication board, and the shaping of the laser chip which needs to be shaped currently is completed by adjusting the position of the lens. And then changing the shading part to shape other laser chips one by one until finishing the shaping of all the laser chips to obtain the required collective light spot.
According to the optical shaping method for the semiconductor laser, the light spot appearance in the optical shaping process is displayed through the indicating plate calibrated with the light spot standard scale, the required optical light spot is finally realized through appearance adjustment, customization of various light spot requirements can be realized through one device, and the working efficiency is improved while optical shaping of various light spot requirements of high-power devices in the medical and American industries is met.
Example two
On the basis of the first embodiment, the present embodiment provides an optical shaping system for a semiconductor laser. The optical shaping system for a semiconductor laser provided in this embodiment can implement the optical shaping method for a semiconductor laser provided in the first embodiment.
Referring to fig. 2, fig. 2 is a block diagram of an optical shaping system for a semiconductor laser according to an embodiment of the present invention, which includes:
the laser module 1 comprises a shaping lens group 2, a single-slit light screen 3, an indicator plate 4 calibrated with light spot standard scales, a position calibration device 5 used for setting the position of the indicator plate, a detection device 6 with adjustable spatial position and a curing device 7 which are sequentially arranged along a light path; the indicating plate 4 is detachably arranged on the position calibration device 5 and can move along the position calibration device 5.
Further, the shaping lens group 2 is arranged on the six-axis optical adjusting frame so as to adjust the spatial position of each lens of the shaping lens group according to the shape of the shaping light spot, and when the shape of the shaping light spot is consistent with the standard scale of the light spot at the corresponding position on the indicating plate, the lens group is solidified; wherein, the light spot standard scale is calibrated according to the focus position of the system and the size of the light spot required by the system at a certain fixed position.
In the present embodiment, the shaping lens set 2 includes a plurality of FAC lenses, and the indicator plate 4 is made of an aluminum alloy plate anodized in black.
In addition, the inside water-cooling heat dissipation circulation system that is equipped with of single slit light screen 3 that this embodiment provided to in time dispel the heat to the single slit light screen, guaranteed the operating duration of system.
In the present embodiment, the position calibration device 5 may be a vernier, the detection device 6 may be a detection camera to detect the optical shaping process, and the curing device 7 may be a UV curing lamp to cure the lens set.
Specifically, the present embodiment also provides a specific implementation structure of an optical shaping system for a semiconductor laser. Referring to fig. 3 and 4, fig. 3 is a schematic structural diagram of an optical shaping system for a semiconductor laser according to an embodiment of the present invention, and fig. 4 is a bottom view of fig. 3, in which the detecting device and the curing device are not shown in the figure.
Specifically, the optical shaping system works as follows:
1. placing the indicating plate with calibrated facula standard scale on the vernier scale, determining the position, and fixing the indicating plate;
2. and installing the laser device to be shaped at the position of the laser module, electrifying by water, and controlling system parameters such as frequency HZ, low current and the like by an electric control mode.
Here, adjusting the system flicker frequency to 60HZ will produce a continuous visual effect, facilitating better spot observation and optical shaping.
3. Placing the FAC lens group on a six-axis optical adjusting frame and behind a laser, adjusting the detection visual angle of all cameras and the space position of a UV curing lamp, and electrifying to detect the normal work of all detection instruments;
4. and arranging a single-slit light shading plate behind the FAC lens group, and adjusting the light shading position to only enable the light beam emitted by the laser chip to be shaped to pass through.
5. Adjusting the spatial position of the FAC lens, and observing red fluorescence by visual indication of the indicator board (the rest laser which does not need to be shaped temporarily is absorbed by a black single-slit light shielding plate); and adjusting the spatial position of the FAC lens according to the preset spot size to enable the spot morphology on the indicating plate to meet the size calibrated on the indicating plate.
6. Exiting the FAC, dispensing, feeding the FAC to the position set in the previous step after dispensing is finished, and observing light spots for fine adjustment;
7. starting a UV curing lamp, curing according to preset parameters, and withdrawing after the precuring is finished;
8. and clamping the next group of FACs and repeating the steps until the shaping requirements of other laser chips are met.
The optical shaping system for the semiconductor laser provided by the embodiment adopts a simple optical device, so that the overall cost of the system is lower. In addition, the whole light beam shaping process is completed under visualization, and great convenience and certainty are brought to optical shaping.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (5)
1. An optical shaping system for a semiconductor laser, comprising: the laser module (1) comprises a shaping lens group (2), a single-slit light screen (3), an indicator plate (4) calibrated with light spot standard scales, a position calibration device (5) used for setting the position of the indicator plate, a detection device (6) with adjustable spatial position and a curing device (7) which are sequentially arranged along a light path; the indicating plate (4) is detachably arranged on the position calibration device (5) and can move along the position calibration device (5).
2. The optical shaping system for semiconductor laser according to claim 1, wherein the shaping lens group (2) is arranged on a six-axis optical adjusting frame so as to adjust the spatial position of each lens of the shaping lens group (2) according to the shape of the shaping light spot, and solidify the lens group when the shape of the shaping light spot is consistent with the standard scale of the light spot of the corresponding position on the indicating plate (4); the light spot standard scale is calibrated according to the focal position of the system and the size of a light spot required by the system at a certain fixed position.
3. Optical shaping system for semiconductor lasers according to claim 1, characterized in that the shaping lens group (2) comprises several FAC lenses.
4. The optical shaping system for semiconductor laser as claimed in claim 1, wherein the single slit light shielding plate (3) is internally provided with a water cooling heat dissipation circulation system.
5. Optical shaping system for semiconductor lasers according to claim 1, characterized in that the indicator plate (4) is made of aluminum alloy plate anodized in black.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120445368.4U CN214252772U (en) | 2021-03-01 | 2021-03-01 | Optical shaping system for semiconductor laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120445368.4U CN214252772U (en) | 2021-03-01 | 2021-03-01 | Optical shaping system for semiconductor laser |
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| CN214252772U true CN214252772U (en) | 2021-09-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114253002A (en) * | 2022-02-28 | 2022-03-29 | 北京明仁视康科技有限公司 | Device, method and system for controlling light beam power distribution |
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- 2021-03-01 CN CN202120445368.4U patent/CN214252772U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114253002A (en) * | 2022-02-28 | 2022-03-29 | 北京明仁视康科技有限公司 | Device, method and system for controlling light beam power distribution |
| CN114253002B (en) * | 2022-02-28 | 2022-04-26 | 北京明仁视康科技有限公司 | Device, method and system for controlling light beam power distribution |
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