CN214251372U - Sensor calibration system - Google Patents
Sensor calibration system Download PDFInfo
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- CN214251372U CN214251372U CN202023225539.7U CN202023225539U CN214251372U CN 214251372 U CN214251372 U CN 214251372U CN 202023225539 U CN202023225539 U CN 202023225539U CN 214251372 U CN214251372 U CN 214251372U
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Abstract
The utility model discloses a sensor calibration system, include: frame, lower mould carrier subassembly, cold and hot exchange assembly, lower mould carrier subassembly sets up in the frame, and cold and hot exchange assembly sets up in lower mould carrier subassembly below for the test temperature of the sensor of placing on the adjustment lower mould carrier subassembly. During specific testing, the cold and heat exchange assembly can adjust the testing temperature in real time to test and calibrate the sensor through the three temperature zones of normal temperature, low temperature and high temperature, and compared with the traditional single temperature zone testing mode, the testing device can effectively reduce the operation difficulty and improve the testing efficiency. In addition, the pressure test and the function calibration can be respectively carried out on the sensor through the upper die pressure adjusting assembly and the pin plate assembly, namely three types of tests of the sensor can be completed through the system, so that the test efficiency is high.
Description
Technical Field
The utility model relates to a sensor technical field, in particular to sensor calibration system.
Background
In the production process of the sensor, three temperature tests, namely a normal temperature test, a low temperature test and a high temperature test, need to be carried out on the sensor.
The traditional temperature measurement mode adopts single temperature zone test operation, carries out the test of single station in proper order, and it is comparatively loaded down with trivial details to switch between the different temperature zones moreover to intensity of labour has been improved, secondly still has the problem that efficiency of software testing is low, and production efficiency is also higher. In addition, different types of sensor products require different devices for testing, so that the cost is high and the occupied space of the devices is large.
Therefore, how to provide a sensor calibration system with flexible test is a technical problem that needs to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a sensor calibration system can effectively test the sensor, and system's simple structure moreover, and manufacturing cost is lower.
In order to achieve the above object, the utility model provides a following technical scheme:
a sensor calibration system, comprising: frame, lower mould carrier subassembly, cold and hot exchange assembly, lower mould carrier subassembly sets up in the frame, cold and hot exchange assembly sets up lower mould carrier subassembly below is used for adjusting the test temperature of the last sensor of placing of lower mould carrier subassembly.
Preferably, still including setting up last mould pressure adjustment assembly in the frame, it includes lifting unit, clamp plate, pressurization module and pressure release module to go up mould pressure adjustment assembly, be equipped with the recess on the lower mould carrier subassembly, the sensor sets up in the recess, lifting unit is used for control the clamp plate goes up and down, works as the clamp plate with lower mould carrier subassembly contact and form airtight cavity, the pressurization module is used for airtight cavity pressurization, the pressure release module is used for right airtight cavity pressure release.
Preferably, the test device further comprises a needle plate assembly, the needle plate assembly is connected with the pressing plate, a test needle is arranged at the bottom of the needle plate assembly and used for contacting with a pin of the sensor when the pressing plate moves downwards.
Preferably, the faller subassembly includes test circuit board, PEEK faller and faller fixed plate, the faller fixed plate with the clamp plate is connected, be equipped with pressurization inlet port and pressure release hole on the faller, be equipped with on the PEEK faller and be used for placing the probe hole of test needle, test circuit board with the PEEK faller passes through the test needle is connected, test circuit board passes through the winding displacement and is connected with the test board card.
Preferably, lower mould carrier subassembly includes base and carrier, be equipped with the recess on the base, the carrier sets up in the recess, the carrier is used for bearing the sensor, the base upper surface is equipped with the circle groove that is used for placing the sealing washer.
Preferably, the heat exchange assembly comprises a heating channel, an exhaust channel and a temperature control cavity, the temperature control cavity is arranged below the base, and the heating channel and the exhaust channel are communicated with the temperature control cavity and used for controlling the temperature in the temperature control cavity so as to adjust the test temperature of the sensor.
Preferably, a plurality of mutually independent grooves are formed in the base, one carrier is arranged in each groove, and the upper die pressure adjusting assembly comprises a plurality of pressurizing modules and pressure relief modules which are one-to-one with the grooves.
Preferably, the rack is further provided with a guide assembly, and the pressing plate is connected with the rack through the guide assembly.
Preferably, the upper part of the rack is also provided with a frame for placing instrument and meter components.
Preferably, the bottom of the frame is provided with a moving assembly for adjusting the position of the frame.
Compared with the prior art, the technical scheme has the following advantages:
the utility model provides a sensor calibration system, include: frame, lower mould carrier subassembly, cold and hot exchange assembly, lower mould carrier subassembly sets up in the frame, and cold and hot exchange assembly sets up in lower mould carrier subassembly below for the test temperature of the sensor of placing on the adjustment lower mould carrier subassembly. During specific testing, the cold and heat exchange assembly can adjust the testing temperature in real time to test and calibrate the sensor through the three temperature zones of normal temperature, low temperature and high temperature, and compared with the traditional single temperature zone testing mode, the testing device can effectively reduce the operation difficulty and improve the testing efficiency. In addition, the pressure testing and the function calibration can be respectively carried out on the sensor through the upper die pressure adjusting assembly and the pin plate assembly, namely three types of tests of the sensor can be completed through the system, so that the testing efficiency is high, and the advantage of convenience in operation is also achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a sensor calibration system according to an embodiment of the present invention;
FIG. 2 is a front view of a sensor calibration system;
FIG. 3 is a side view of a sensor calibration system;
FIG. 4 is a top view of the upper die pressure adjustment assembly;
FIG. 5 is a top view of the needle board assembly;
FIG. 6 is a bottom view of the needle board assembly;
FIG. 7 is a top view of the lower mold carrier assembly and the heat exchange assembly.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 7, fig. 1 is a schematic structural diagram of a sensor calibration system according to an embodiment of the present invention; FIG. 2 is a front view of a sensor calibration system; FIG. 3 is a side view of a sensor calibration system; FIG. 4 is a top view of the upper die pressure adjustment assembly; FIG. 5 is a top view of the needle board assembly; FIG. 6 is a bottom view of the needle board assembly; FIG. 7 is a top view of the lower mold carrier assembly and the heat exchange assembly.
The embodiment of the utility model provides a sensor calibration system, include: the device comprises a rack 1, a lower die carrier assembly 9 and a heat exchange assembly 10, wherein the lower die carrier assembly 9 is arranged on the rack 1, and the heat exchange assembly 10 is arranged below the lower die carrier assembly 9 and used for adjusting the test temperature of a sensor 9-5 arranged on the lower die carrier assembly 9. Wherein, a plurality of groups of sensors 9-5 can be arranged on the lower die carrier to improve the testing efficiency. During specific testing, the cold-heat exchange assembly 10 can adjust the testing temperature in real time, so that the sensor 9-5 can be tested and calibrated through the three temperature regions of normal temperature, low temperature and high temperature, the operation difficulty can be effectively reduced and the testing efficiency can be improved compared with the traditional single-temperature-region testing mode.
Further, still including setting up the last mould pressure adjustment subassembly in frame 1, go up mould pressure adjustment subassembly and include lifting unit 3, clamp plate, pressurization module 6 and pressure release module 7, lifting unit 3 sets up top in frame 1, and the preferred telescoping cylinder of lifting unit 3, pressurization module 6 and pressure release module 7 set up on clamp plate upper portion, are equipped with the recess on the lower mould carrier subassembly 9, and the sensor setting is in the recess. When pressure testing is needed, the lifting assembly 3 controls the pressing plate to move downwards, after the pressing plate is contacted with the lower die carrier assembly 9, a closed cavity is formed between the groove and the pressing plate, the closed cavity is pressurized through the pressurizing module 6, and then the pressure testing can be carried out on the sensor 9-5. The purpose of adjusting the test pressure can be achieved through the mutual matching of the pressurizing module 6 and the pressure relief module 7.
Specifically, referring to fig. 4, the pressurizing module is preferably a pressurizing two-way module, the pressurizing two-way module 6 includes a first pressurizing two-way control valve 6-1, a second pressurizing two-way control valve 6-2, and connection joints of the control valves, and further includes a pressure supply device and a pressure controller, and the precise control of the air pressure in the sealed chamber can be realized through the precise control of the pressure controller; the pressure relief module 7 comprises four cylinders, which are respectively marked as A00, A01, B00 and B01, and the pressure relief module 7 further comprises a cylinder plug and a cylinder fixing plate. When a specific pressure test is carried out, when the sealed cavity is pressurized, the air cylinders A00 and B00 are in a retraction state, the air cylinders A01 and B01 are in an extension state, when the air pressure in the sealed cavity reaches a set pressure, the air cylinders A00 and B00 are in an extension state, the air inlets are blocked by matching air cylinder plugs at the moment so as to keep the pressure in the sealed cavity constant, after the test is finished, the air cylinders A01 and B01 are in a retraction state, and at the moment, air can be exhausted from the air outlets of A01 and B01 so as to realize a pressure relief function.
Further, please refer to fig. 5 and 6, further comprising a pin plate assembly 8, wherein the pin plate assembly 8 is connected to the pressing plate, a testing pin is disposed at the bottom of the pin plate assembly 8, the testing pin is used for contacting with a pin of the sensor when the pressing plate moves down, and the pin plate assembly 8 is connected to the testing board 2-3 through a flat cable to realize the calibration function.
Specifically, faller subassembly 8 includes test circuit board a, PEEK faller b and faller fixed plate c, faller fixed plate c is connected with the clamp plate, PEEK faller b and faller fixed plate c are connected through the locating pin axle d of diagonal setting, be equipped with pressurization inlet port e and pressure release hole f on the faller fixed plate c, be equipped with the probe hole g that is used for placing the test needle on the PEEK faller b, test circuit board a and PEEK faller b are connected through the test needle, the test needle corresponds the pin of sensor 9-5, when lifting unit 3 control clamp plate moved down, can drive PEEK faller b and move down, so that the test needle pricks on the pin, wherein test circuit board a is connected with test integrated circuit board 2-3 through the winding displacement.
Specifically, referring to fig. 7, the lower mold carrier assembly 9 includes a base 9-1 and a carrier 9-2, a groove is formed on the base 9-1, the carrier 9-2 is disposed in the groove, the carrier 9-2 is used for bearing a sensor 9-5, a ring groove 9-4 for placing a sealing ring is formed on the upper surface of the base 9-1, positioning pin sleeves 9-3 are respectively disposed at four corners of the base 9-1, and the sealing performance of the sealed chamber can be improved by the sealing ring groove 9-4, so as to avoid the problem of air leakage, thereby reducing the testing accuracy.
The heat exchange assembly 10 specifically comprises a heating channel, an exhaust channel 10-2 and a temperature control cavity 10-4, wherein the temperature control cavity 10-4 is arranged below the base 9-1, and the heating channel and the exhaust channel 10-2 are communicated with the temperature control cavity 10-4 and used for controlling the temperature in the temperature control cavity 10-4 so as to adjust the test temperature of the sensor.
In order to improve the testing efficiency, a plurality of mutually independent grooves are formed in the base 9-1, a carrier 9-2 is arranged in each groove, the upper die pressure adjusting assembly comprises a plurality of pressurizing modules 6 and pressure relief modules 7 which are one by one corresponding to the grooves, and it can be understood that after the pressure plate is pressed down, a plurality of independent closed cavities are formed in the base 9-1, so that different pressures can be applied to different closed cavities on the premise of sharing the heat exchange assembly 10.
The cold and heat exchange assembly 10 is preferably a cold and heat exchange dual-channel assembly, a temperature control cavity 10-4 can be shared below the two bases, two rear sides of the temperature control cavity 10-4 are respectively communicated with a first heating channel 10-1 and a second heating channel 10-3, and air can be exhausted through an exhaust channel 10-2. In addition, a connecting column 10-5 is further arranged behind the temperature control cavity 10-4, the connecting column 10-5 is connected with an external temperature control device, and airflow is divided into two parts from the connecting column 10-5 and enters the first heating channel 10-1 and the second heating channel 10-3.
In order to ensure the stability of the pressing plate moving up and down, a guide assembly 4 is further arranged on the rack 1, the pressing plate is connected with the rack 1 through the guide assembly 4, the guide assembly comprises guide columns, linear bearings, a guide fixing plate and the like, and specifically, the guide columns can be arranged at four corners of the pressing plate respectively.
In order to improve the integration level of the calibration system, a chassis 1-1 and an electrical cabinet 1-3 are arranged at the bottom of a rack 1, a workbench 1-2 is arranged at the front side of the rack, and a frame 1-4 for placing an instrument assembly 2 is further arranged at the upper part of the rack 1, wherein the instrument assembly 2 comprises a voltmeter 2-1, a universal meter 2-2 and a test board card 2-3.
In addition, in order to facilitate the movement of the rack 1, the bottom of the rack 1 is provided with a moving assembly for adjusting the position of the moving assembly, the moving assembly is preferably a roller, the bottom of the rack 1 is also provided with telescopic support legs, and after the moving assembly is moved in place, the roller is overhead through the telescopic support legs so as to ensure the stability of the rack 1 during working.
It should be noted that, the sensor calibration system provided by the present application can test other types of sensors besides the pressure sensor, and the pressure switching and the temperature switching are more convenient, so that the sensor calibration system has the advantage of flexible use.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
It is right above that the utility model provides a sensor calibration system introduces in detail. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.
Claims (10)
1. A sensor calibration system, comprising: frame, lower mould carrier subassembly, cold and hot exchange assembly, lower mould carrier subassembly sets up in the frame, cold and hot exchange assembly sets up lower mould carrier subassembly below is used for adjusting the test temperature of the last sensor of placing of lower mould carrier subassembly.
2. The sensor calibration system of claim 1, further comprising an upper die pressure adjustment assembly disposed on the frame, wherein the upper die pressure adjustment assembly comprises a lifting assembly, a pressing plate, a pressurizing module and a pressure relief module, a groove is disposed on the lower die carrier assembly, the sensor is disposed in the groove, the lifting assembly is configured to control the pressing plate to lift, when the pressing plate contacts the lower die carrier assembly, a closed chamber is formed, the pressurizing module is configured to pressurize the closed chamber, and the pressure relief module is configured to relieve pressure in the closed chamber.
3. The sensor calibration system of claim 2 further comprising a pin plate assembly, wherein the pin plate assembly is connected to the platen, and a test pin is disposed at the bottom of the pin plate assembly and is configured to contact a pin of the sensor when the platen moves downward.
4. The sensor calibration system of claim 3, wherein the needle plate assembly comprises a test circuit board, a PEEK needle plate and a needle plate fixing plate, the needle plate fixing plate is connected with the pressing plate, a pressurization air inlet hole and a pressure relief hole are formed in the needle plate, a probe hole for placing the test needle is formed in the PEEK needle plate, the test circuit board is connected with the PEEK needle plate through the test needle, and the test circuit board is connected with the test plate card through a flat cable.
5. The sensor calibration system of claim 2 wherein the lower die carrier assembly comprises a base and a carrier, the base having a groove thereon, the carrier being disposed in the groove, the carrier being configured to carry the sensor, the base having an upper surface with a groove for receiving a sealing ring.
6. The sensor calibration system of claim 5, wherein the heat exchange assembly comprises a warming channel, an exhaust channel, and a temperature-controlled cavity, the temperature-controlled cavity is disposed under the base, and the warming channel and the exhaust channel are communicated with the temperature-controlled cavity for controlling the temperature in the temperature-controlled cavity to adjust the testing temperature of the sensor.
7. The system of claim 6, wherein the base has a plurality of independent recesses, each recess having a carrier disposed therein, and the upper mold pressure adjustment assembly includes a plurality of pressurization modules and pressure relief modules, one for each recess.
8. The sensor calibration system of any one of claims 2 to 7 wherein the frame further comprises a guide assembly, the platen being coupled to the frame via the guide assembly.
9. The sensor calibration system of claim 8 wherein the upper portion of the housing further defines a frame for holding an instrument package.
10. The sensor calibration system of claim 9 wherein the bottom of the housing is provided with a movement assembly for adjusting its position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023225539.7U CN214251372U (en) | 2020-12-28 | 2020-12-28 | Sensor calibration system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023225539.7U CN214251372U (en) | 2020-12-28 | 2020-12-28 | Sensor calibration system |
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| Publication Number | Publication Date |
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| CN214251372U true CN214251372U (en) | 2021-09-21 |
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| CN202023225539.7U Active CN214251372U (en) | 2020-12-28 | 2020-12-28 | Sensor calibration system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113640713A (en) * | 2021-10-13 | 2021-11-12 | 苏州纳芯微电子股份有限公司 | Magnetic field sensing element compensation circuit and compensation method |
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2020
- 2020-12-28 CN CN202023225539.7U patent/CN214251372U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113640713A (en) * | 2021-10-13 | 2021-11-12 | 苏州纳芯微电子股份有限公司 | Magnetic field sensing element compensation circuit and compensation method |
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