CN113978019A - High-precision powder forming device for piezoresistor - Google Patents

High-precision powder forming device for piezoresistor Download PDF

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Publication number
CN113978019A
CN113978019A CN202111471224.7A CN202111471224A CN113978019A CN 113978019 A CN113978019 A CN 113978019A CN 202111471224 A CN202111471224 A CN 202111471224A CN 113978019 A CN113978019 A CN 113978019A
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CN
China
Prior art keywords
forming device
pressing plate
powder forming
precision powder
plate
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Pending
Application number
CN202111471224.7A
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Chinese (zh)
Inventor
付国勇
邓凡举
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Bike Electronic Technology Co ltd
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Guangdong Bike Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN202111471224.7A priority Critical patent/CN113978019A/en
Publication of CN113978019A publication Critical patent/CN113978019A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B11/00Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses
    • B30B11/02Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses using a ram exerting pressure on the material in a moulding space
    • B30B11/04Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses using a ram exerting pressure on the material in a moulding space co-operating with a fixed mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B1/00Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen
    • B30B1/32Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by plungers under fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B11/00Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses
    • B30B11/22Extrusion presses; Dies therefor
    • B30B11/30Extrusion presses; Dies therefor using directly-acting fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B15/00Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/32Discharging presses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B7/00Presses characterised by a particular arrangement of the pressing members
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16FSPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • F16F15/04Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
    • F16F15/06Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs
    • F16F15/067Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs using only wound springs

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Press-Shaping Or Shaping Using Conveyers (AREA)

Abstract

The invention discloses a high-precision powder forming device for a piezoresistor, which relates to the field of piezoresistors and aims to solve the problems that when the powder forming device on the market is used, the quantity of the powder forming device is small, ceramic chips are easily connected together in the forming process, and different production machines need to be replaced when the ceramic chips in different shapes are prepared. The first hydraulic rod and the second hydraulic rod which are arranged inside the high-precision powder forming device of the piezoresistor are combined to facilitate single-sided or double-sided pressing, the second hydraulic rod is more convenient to demould ceramic chips, and meanwhile square pressing blocks and circular pressing blocks which are arranged inside the device are convenient to press ceramic chips in different shapes.

Description

High-precision powder forming device for piezoresistor
Technical Field
The invention relates to the field of piezoresistors, in particular to a high-precision powder forming device for a piezoresistor.
Background
The piezoresistor is a resistor device with nonlinear volt-ampere characteristics, and is mainly used for clamping voltage when a circuit bears overvoltage and absorbing redundant current to protect a sensitive device.
Aiming at the problems that when a powder forming device in the market is used, the quantity of the powder forming device is small, ceramic chips are easily connected together in the forming process, and different production machines need to be replaced when the ceramic chips in different shapes are prepared, the high-precision powder forming device for the piezoresistor is provided.
Disclosure of Invention
The invention provides a high-precision powder forming device for a piezoresistor, which solves the problems that when the powder forming device on the market is used, the quantity of the powder formed at one time is small, ceramic chips are easily connected together in the forming process, and different production machines are required to be replaced when the ceramic chips in different shapes are prepared.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a piezo-resistor high accuracy powder forming device, includes the mount pad, the top interval of mount pad is provided with the forming mechanism who is used for carrying out the suppression to ceramic powder, forming mechanism is independent extrusion formula structure, a hydraulic stem is installed at forming mechanism's top.
Preferably, the forming mechanism comprises a forming box, an upper pressing plate, a lower pressing plate and a movable groove, and the lower pressing plate is arranged in the forming box.
Preferably, the bottom of the forming box is symmetrically provided with movable grooves, and the movable grooves penetrate through the bottom of the forming box and the bottom of the lower pressing plate and extend into the lower pressing plate.
Preferably, the bottom of the upper pressing plate is uniformly provided with a square pressing block, the top of the lower pressing plate is provided with a square groove, and the square pressing block is matched with the square groove.
Preferably, the bottom of the upper pressing plate is uniformly provided with a circular pressing block, the top of the lower pressing plate is provided with a circular groove, and the circular pressing block is matched with the circular groove.
Preferably, the bottom of the mounting seat is fixedly provided with a fixing plate, and second hydraulic rods are symmetrically arranged inside the fixing plate.
Preferably, the telescopic end of the second hydraulic rod penetrates through the mounting seat and the forming box and extends to the inside of the movable groove.
Preferably, the bottom of the mounting seat is provided with support shafts in an array, and the length of each support shaft is greater than that of the corresponding fixing plate.
Preferably, the two sides of the forming mechanism are symmetrically provided with connecting plates, the bottoms of the connecting plates are symmetrically provided with dampers, and the bottoms of the dampers are connected with the mounting seat.
Preferably, the connecting shafts are symmetrically installed at the tops of the installation seats, the top plate is installed at the top of each connecting shaft, and the bottom of each top plate is fixedly connected with the corresponding first hydraulic rod.
The invention has the beneficial effects that:
1. the connecting plate cooperation attenuator that the device is inside to be set up is convenient for cushion forming mechanism when forming mechanism carries out the compression moulding to avoid direct extrusion mechanism to lead to ceramic chip flaw to appear.
2. The built-in square briquetting of the device inside cooperates square groove and circular groove with circular briquetting and is convenient for prepare the piezo-resistor of different shapes, and the inside first hydraulic stem that sets up of the device combines together with the second hydraulic stem simultaneously and is convenient for carry out single face or two-sided suppression, and the second hydraulic stem is convenient for drive down the clamp plate and shifts up simultaneously, is convenient for carry out the drawing of patterns to ceramic chip more.
In conclusion, the inside first hydraulic stem that sets up of the device combines together with the second hydraulic stem and is convenient for carry out single face or two-sided suppression to the second hydraulic stem is convenient for more demold ceramic chip, is convenient for suppress ceramic chip of different shapes through the inside square briquetting that sets up of the device and circular briquetting simultaneously.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an exploded view of a coupling structure of a second hydraulic rod according to the present invention.
Fig. 3 is a sectional view of the coupling structure of the molding mechanism of the present invention.
FIG. 4 is a schematic structural diagram of a square groove of the present invention.
Fig. 5 is a structural sectional view of the circular groove of the present invention.
Fig. 6 is an enlarged schematic view of the structure at a in fig. 3 according to the present invention.
Reference numbers in the figures: 1. a mounting seat; 2. a support shaft; 3. a molding mechanism; 301. forming a box; 302. an upper pressure plate; 303. a lower pressing plate; 304. a movable groove; 4. a connecting plate; 5. a damper; 6. a connecting shaft; 7. a top plate; 8. a first hydraulic lever; 9. a fixing plate; 10. a second hydraulic rod; 11. square briquetting; 12. a square groove; 13. a circular pressing block; 14. a circular groove.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly, e.g., as meaning fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed; the type of the electrical appliance provided by the invention is only used for reference. For those skilled in the art, different types of electrical appliances with the same function can be replaced according to actual use conditions, and for those skilled in the art, the specific meaning of the above terms in the present invention can be understood in specific situations.
Example one
Referring to fig. 1-6, in the high-precision powder molding device for the piezoresistor, molding mechanisms 3 for pressing ceramic powder are arranged at intervals on the top of a mounting seat 1, the molding mechanisms 3 are independent extrusion structures, and a first hydraulic rod 8 is mounted on the top of the molding mechanisms 3.
As shown in fig. 2 and 3, the forming mechanism 3 includes a forming box 301, an upper pressing plate 302, a lower pressing plate 303 and a movable groove 304, the lower pressing plate 303 is disposed inside the forming box 301, the movable groove 304 is symmetrically formed in the bottom of the forming box 301, the movable groove 304 penetrates through the bottoms of the forming box 301 and the lower pressing plate 303 and extends to the inside of the lower pressing plate 303, square pressing blocks 11 are uniformly disposed at the bottom of the upper pressing plate 302, a square groove 12 is formed in the top of the lower pressing plate 303, and the square pressing blocks 11 are matched with the square groove 12;
the upper pressing plate 302 and the lower pressing plate 303 are convenient for pressing square ceramic chips under the action of the square pressing block 11 and the square groove 12, and the square pressing block 11 and the square groove 12 are convenient for forming an independent structure.
As shown in fig. 4 and 5, a fixed plate 9 is fixedly mounted at the bottom of the mounting seat 1, second hydraulic rods 10 are symmetrically arranged inside the fixed plate 9, a telescopic end of each second hydraulic rod 10 penetrates through the mounting seat 1 and the forming box 301 and extends into the movable groove 304, support shafts 2 are arranged in a row at the bottom of the mounting seat 1, and the length of each support shaft 2 is greater than that of the fixed plate 9;
the second hydraulic rod 10 drives the lower pressing plate 303 to move, so that the ceramic chip is conveniently demoulded.
As shown in fig. 2 and 3, connecting plates 4 are symmetrically arranged on two sides of the forming mechanism 3, dampers 5 are symmetrically arranged at the bottoms of the connecting plates 4, the bottoms of the dampers 5 are connected with the mounting base 1, connecting shafts 6 are symmetrically arranged at the top of the mounting base 1, a top plate 7 is arranged at the top of the connecting shafts 6, and the bottom of the top plate 7 is fixedly connected with a first hydraulic rod 8;
the damper 5 is convenient to play a role in buffering, and the first hydraulic rod 8 is matched with the second hydraulic rod 10 to realize single-sided or double-sided pressing.
Example two
The difference from the first embodiment is that the bottom of the upper press plate 302 is uniformly provided with circular press blocks 13, the top of the lower press plate 303 is provided with circular grooves 14, and the circular press blocks 13 are matched with the circular grooves 14;
the circular pressing block 13 is matched with the circular groove 14 so as to press the circular ceramic chip conveniently.
When the device is used, the device is taken out firstly, is placed at a proper position and is connected with an external power supply;
at the moment, a proper amount of ceramic powder is added into the forming box 301, after the ceramic powder is added, a first hydraulic rod 8 arranged at the top of the device is started, the first hydraulic rod 8 drives an upper pressing plate 302 arranged at the bottom of the first hydraulic rod to descend, so that the ceramic powder in the forming box 301 is extruded through a square pressing block 11 or a circular pressing block 13 arranged at the bottom of the upper pressing plate 302, and the square pressing block 11 or the circular pressing block 13 is combined with a square groove 12 or a circular groove 14 arranged in a lower pressing plate 303, so that the pressing work of ceramic chips is finished, and the independence of the ceramic chips can be ensured;
meanwhile, the first hydraulic rod 8 and the second hydraulic rod 10 can be simultaneously started to respectively drive the upper pressing plate 302 and the lower pressing plate 303 to approach each other, so that the ceramic powder is pressed;
meanwhile, when the first hydraulic rod 8 drives the upper pressing plate 302 to extrude ceramic powder, the ceramic powder extrudes the forming box 301, and is buffered by the connecting plates 4 symmetrically arranged at two sides of the forming box 301 and the dampers 5 symmetrically arranged at the bottoms of the connecting plates 4, and when the forming box 301 moves downwards, the forming box drives the movable groove 304 arranged at the bottom of the forming box to move downwards until the top of the second hydraulic rod 10 arranged in the movable groove 304 is contacted with the forming box 301;
after the ceramic chip is pressed and formed, the first hydraulic rod 8 is started to contract, so that the upper pressing plate 302 is driven to be separated from the forming box 301, the second hydraulic rod 10 can be started again, the top of the second hydraulic rod 10 is made to be in contact with the lower pressing plate 303, the lower pressing plate 303 is driven to ascend until the lower pressing plate 303 is moved to the outside of the forming box 301, and the formed ceramic chip is conveniently taken out.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (10)

1. The utility model provides a piezo-resistor high accuracy powder forming device, includes mount pad (1), its characterized in that, the top interval of mount pad (1) is provided with forming mechanism (3) that are used for carrying out the suppression to ceramic powder, forming mechanism (3) are independent extrusion formula structure, first hydraulic stem (8) are installed at the top of forming mechanism (3).
2. The high-precision powder forming device for the piezoresistor according to claim 1, wherein the forming mechanism (3) comprises a forming box (301), an upper pressing plate (302), a lower pressing plate (303) and a movable groove (304), and the lower pressing plate (303) is arranged inside the forming box (301).
3. The high-precision powder forming device for the piezoresistor according to claim 2, wherein the bottom of the forming box (301) is symmetrically provided with movable grooves (304), and the movable grooves (304) penetrate through the bottoms of the forming box (301) and the lower pressing plate (303) and extend to the inside of the lower pressing plate (303).
4. The high-precision powder forming device for the piezoresistor according to claim 2, wherein a square pressing block (11) is uniformly arranged at the bottom of the upper pressing plate (302), a square groove (12) is formed at the top of the lower pressing plate (303), and the square pressing block (11) is matched with the square groove (12).
5. The high-precision powder forming device for the piezoresistor according to claim 2, wherein the bottom of the upper pressing plate (302) is uniformly provided with the circular pressing block (13), the top of the lower pressing plate (303) is provided with the circular groove (14), and the circular pressing block (13) is matched with the circular groove (14).
6. The high-precision powder forming device for the piezoresistor according to claim 1, wherein a fixing plate (9) is fixedly installed at the bottom of the installation seat (1), and second hydraulic rods (10) are symmetrically arranged inside the fixing plate (9).
7. The high-precision powder forming device for the piezoresistor according to claim 6, wherein the telescopic end of the second hydraulic rod (10) extends to the inside of the movable groove (304) through the mounting base (1) and the forming box (301).
8. The high-precision powder forming device for the piezoresistor according to claim 7, wherein the support shafts (2) are arranged at the bottom of the mounting seat (1) in an array, and the length of the support shafts (2) is greater than that of the fixing plate (9).
9. The high-precision powder forming device for the piezoresistors as claimed in claim 1, wherein connecting plates (4) are symmetrically arranged on two sides of the forming mechanism (3), dampers (5) are symmetrically arranged at the bottoms of the connecting plates (4), and the bottoms of the dampers (5) are connected with the mounting base (1).
10. The high-precision powder forming device for the piezoresistors as claimed in claim 1, wherein the top of the mounting base (1) is symmetrically provided with connecting shafts (6), the top of each connecting shaft (6) is provided with a top plate (7), and the bottom of each top plate (7) is fixedly connected with a first hydraulic rod (8).
CN202111471224.7A 2021-12-03 2021-12-03 High-precision powder forming device for piezoresistor Pending CN113978019A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111471224.7A CN113978019A (en) 2021-12-03 2021-12-03 High-precision powder forming device for piezoresistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111471224.7A CN113978019A (en) 2021-12-03 2021-12-03 High-precision powder forming device for piezoresistor

Publications (1)

Publication Number Publication Date
CN113978019A true CN113978019A (en) 2022-01-28

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ID=79733187

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111471224.7A Pending CN113978019A (en) 2021-12-03 2021-12-03 High-precision powder forming device for piezoresistor

Country Status (1)

Country Link
CN (1) CN113978019A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114717373A (en) * 2022-03-29 2022-07-08 江苏亚峰合金材料有限公司 Manufacturing equipment and method of novel ferrosilicon rare earth magnesium nodulizer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114717373A (en) * 2022-03-29 2022-07-08 江苏亚峰合金材料有限公司 Manufacturing equipment and method of novel ferrosilicon rare earth magnesium nodulizer

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