CN214234531U

CN214234531U - Plasma cleaning spray head and device

Info

Publication number: CN214234531U
Application number: CN202022920289.2U
Authority: CN
Inventors: 何祥月; 黄涛涛; 康海平; 聂耀
Original assignee: Jiangxi Oumaisi Microelectronics Co Ltd
Current assignee: Jiangxi Oumaisi Microelectronics Co Ltd
Priority date: 2020-12-08
Filing date: 2020-12-08
Publication date: 2021-09-21
Anticipated expiration: 2030-12-08

Abstract

The application provides a plasma cleaning showerhead and apparatus. The plasma cleaning spray head is used for spraying plasma to clean a workpiece to be cleaned and comprises a spray head main body, a spray head and at least one flow guide block. An accommodating cavity for accommodating plasma is formed in the spray head main body. The nozzle head is internally formed with a plurality of through holes communicating with the accommodating chamber, and the plurality of through holes are used for providing ejection channels for plasma. At least one flow guide block is arranged between two adjacent through holes in the plurality of through holes and is used for guiding the flow of the plasma, so that the plasma is uniformly sprayed out, the surface performance of a workpiece to be cleaned can be improved while cleaning and decontaminating are carried out, and the specific process requirements are met.

Description

Plasma cleaning spray head and device

Technical Field

The present disclosure relates to cleaning devices, and particularly to a plasma cleaning nozzle and a plasma cleaning device.

Background

Plasma clean (Plasma clean) is a new high-tech technology, and is widely used in the microelectronics industry for cleaning various terminals and bonding surfaces, such as bonding surfaces of TFT chips, glass substrates, and circuit board terminals. Compared with the traditional cleaning mode, the plasma cleaning method has the advantages of cleaning organic foreign matters and avoiding scratching cleaned parts. The cleaning principle is that physical energetic particles and chemical active groups in working gas in a plasma state act on the surface of an object to be cleaned, and the purposes of oxide reduction and pollutant cleaning are achieved through chemical reaction and physical action.

The terminals are required to be cleaned in the manufacturing process and assembly process of the fingerprint module and the display module, and the purpose is to remove organic matter foreign matters in the terminal area and enable the water drop angle on the surface of the module to meet specific requirements. For example, in the sealing process of a gold thread area of an optical TFT chip fingerprint product, extremely high requirements are placed on the water drop angle of plasma cleaning, the water drop angle is required to be controlled to be 60 degrees +/-5 degrees, otherwise, the glue cannot be dispersed due to an excessively large water drop angle, and the glue overflow phenomenon is generated due to an excessively small water drop angle, so that the process requirements cannot be met. At present, the existing plasma cleaning device has the problem that the water drop angle cannot meet the requirement due to poor uniformity and consistency of each point position of the cleaning jig.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problems, the application provides a plasma cleaning nozzle and a plasma cleaning device, wherein a plurality of through holes are formed in a nozzle head, and at least one flow guide block is arranged between two adjacent through holes in the plurality of through holes to guide the flow of plasma, so that the plasma is uniformly sprayed out, and the surface performance of a workpiece to be cleaned can be better improved while cleaning and decontaminating are carried out, so that specific process requirements are met.

A first aspect of the present application provides a plasma cleaning showerhead. The plasma cleaning spray head is used for spraying plasma to clean a workpiece to be cleaned, and comprises a spray head main body, a spray head and at least one flow guide block; an accommodating cavity for accommodating plasma is formed in the spray head main body; a plurality of through holes communicated with the accommodating cavity are formed inside the nozzle head and are used for providing ejection channels for plasma; the flow guide block is arranged between two adjacent through holes in the through holes and used for guiding the plasma.

In this manner, the plasma cleaning head provides the plurality of through holes in the nozzle head, and can align a plurality of workpieces to be cleaned at a time to clean the plurality of workpieces to be cleaned simultaneously. In addition, set up between two adjacent through-holes in a plurality of through-holes the water conservancy diversion piece can shunt to plasma to make plasma evenly pass through a plurality of through-holes act on a plurality of work pieces of treating to clean, have promoted the clear homogeneity of plasma, can not only clean the decontamination, can also improve the surface property of the work piece of treating to clean itself simultaneously, satisfy specific technological requirement.

Optionally, the nozzle head further comprises at least one isolation portion in one-to-one correspondence with the at least one flow guiding block, the isolation portion is an isolation portion disposed between two adjacent through holes, and the isolation portion is used for isolating the two adjacent through holes, so that the plasma can be shunted into the two adjacent through holes.

Optionally, be provided with the installation department on the isolation, water conservancy diversion piece one end is installed in the installation department on the isolation that corresponds, the other end to hold the chamber extension, so, plasma flows in just shunt plasma when holding the chamber for plasma ability evenly distributed in the intracavity that holds of water conservancy diversion piece both sides can promote plasma distribution's homogeneity better.

Optionally, the number of the through holes is two, and the flow guide block is arranged in the middle of the nozzle head, so that the plasma cleaning nozzle can clean two workpieces to be cleaned simultaneously and uniformly distribute plasma in the two through holes.

Optionally, the installation department is the recess, the water conservancy diversion piece pass through the spiro union mode rotatably install in the installation department, so, can adjust in a flexible way as required the installation angle of water conservancy diversion piece, install through the spiro union mode moreover the water conservancy diversion piece can be convenient for right the water conservancy diversion piece is adjusted, is changed.

Optionally, the plasma cleaning showerhead further comprises a base for mounting the plasma cleaning showerhead on a plasma cleaning apparatus, such that connection of the plasma cleaning showerhead and the plasma cleaning apparatus may be achieved.

Alternatively, the axial direction of the plurality of through holes is perpendicular to the length direction of the nozzle head, so that the plasma can be vertically ejected to clean the workpiece to be cleaned.

A second aspect of the present application provides a plasma cleaning device. The plasma cleaning device comprises a cleaning platform, a plasma generating device and the plasma cleaning spray head. The cleaning platform is used for providing a conveying channel for placing a workpiece to be cleaned and conveying the workpiece to be cleaned. The plasma generating device is connected with the plasma cleaning spray head and used for applying energy to gas to enable the gas to be ionized into plasma and conveying the plasma to the accommodating cavity of the plasma cleaning spray head. The plasma cleaning nozzle is arranged above the conveying channel of the cleaning platform and used for spraying plasma to clean a workpiece to be cleaned passing through the lower part of the plasma cleaning nozzle, wherein each through hole of the plasma cleaning nozzle is aligned with the workpiece to be cleaned.

Optionally, the plasma cleaning device further comprises a cleaning support, and the plasma cleaning spray head is mounted on the cleaning support through a base, so that the connection between the plasma cleaning spray head and the plasma cleaning device can be realized.

Optionally, the installation direction of the plasma cleaning nozzle is set to be perpendicular to the extending direction of the conveying channel, so that the plasma can vertically act on the surface of the workpiece to be cleaned, and the cleaning and decontamination effects and the effect of improving the surface performance of the workpiece to be cleaned are better.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of a plasma cleaning showerhead according to an embodiment of the present disclosure.

Fig. 2 is a top view of fig. 1.

FIG. 3 is a schematic cross-sectional view of the plasma cleaning showerhead of FIG. 2 taken along line V-V.

Fig. 4 is a schematic structural diagram of a plasma cleaning apparatus according to an embodiment of the present disclosure.

Fig. 5 is a schematic view of the plasma cleaning apparatus shown in fig. 4 from another perspective.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. The drawings are for illustration purposes only and are merely schematic representations, not intended to limit the present application. It is to be understood that the embodiments described are only a few examples of the present application and not all examples. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the term "connected" is to be interpreted broadly, e.g. as a fixed connection, a detachable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1 to 3, the present application provides a plasma cleaning showerhead 100, the plasma cleaning showerhead 100 includes a showerhead body 101, a nozzle head 102 and at least one deflector block 103.

An accommodating chamber 106 for accommodating plasma is formed inside the showerhead body 101. The nozzle head 102 is connected to the head body 101, and a plurality of through holes 107 communicating with the accommodating chamber 106 are formed inside the nozzle head 102, and the plurality of through holes 107 are used for providing an ejection passage for plasma. The flow guide block 103 is disposed between two adjacent through holes 107 of the plurality of through holes 107, and is configured to guide the flow of the plasma, so that the plasma entering the accommodating cavity 106 shunts and flows into the through holes 107 on the left and right sides of the flow guide block 103.

It should be noted that the plasma cleaning nozzle 100 not only can clean and decontaminate the workpiece to be cleaned, but also can improve the surface properties of the workpiece to be cleaned, such as improving the wetting property of the surface of the workpiece to be cleaned, improving the adhesive force of the film on the surface of the workpiece to be cleaned, and changing the water drop angle of the surface of the workpiece to be cleaned. Therefore, the more uniformly the plasma is distributed from the plasma cleaning showerhead 100, the better the effect of improving the surface properties of the workpiece itself to be cleaned.

The plasma cleaning showerhead 100 of the present application, which provides the plurality of through holes 107 in the nozzle head 102, can align a plurality of workpieces to be cleaned at a time to clean the plurality of workpieces to be cleaned simultaneously. In addition, set up between two adjacent through-holes in a plurality of through-holes 107 water conservancy diversion piece 103 can shunt the plasma to make plasma evenly pass through a plurality of through-holes 107 act on a plurality of work pieces of treating to clean, promoted the clear homogeneity of plasma, can not only clean the decontamination, can also improve the surface property of the work piece of treating to clean itself simultaneously, satisfy specific technological requirement.

Optionally, the nozzle head 102 further includes at least one partition portion 1021 corresponding to the at least one flow guiding block 103, where the partition portion 1021 is a partition portion disposed between two adjacent through holes 107, and the partition portion 1021 is configured to partition the two adjacent through holes 107, so that the plasma can be shunted into the two adjacent through holes 107.

Optionally, the isolation portion 1021 is provided with a mounting portion 1022, one end of the flow guiding block 103 is mounted on the mounting portion 1022 on the corresponding isolation portion 1021, and the other end extends towards the accommodating cavity 106.

In this embodiment, as shown in fig. 3, the other end of the flow guiding block 103 extends into the accommodating cavity 106, and the length of the flow guiding block 103 extending into the accommodating cavity 106 is approximately equal to the width of the accommodating cavity 106, so that plasma can be divided when plasma starts to flow into the accommodating cavity 106, so that plasma can be uniformly distributed in the accommodating cavities 106 on both sides of the flow guiding block 103, and plasma can be ensured to uniformly act on the workpiece to be cleaned through the plurality of through holes 107 of the nozzle head 102.

In this embodiment, the number of the plurality of through holes 107 is two, and correspondingly, the number of the at least one deflector 103 is one, and the deflector 103 is disposed in the middle of the nozzle head 102, so that the plasma cleaning head 100 can simultaneously clean two workpieces to be cleaned and uniformly distribute plasma among the two through holes 107.

In other embodiments, the number of the plurality of through holes 107 may be more than two, and correspondingly, the number of the at least one flow guiding block 103 may also be more than one, and the at least one flow guiding block 103 may be uniformly arranged on the nozzle head 102 according to the number of the plurality of through holes 107.

In this embodiment, the mounting portion 1022 is a groove, and the guide block 103 is rotatably mounted in the mounting portion 1022 through a screw connection manner, so that the mounting angle of the guide block 103 can be flexibly adjusted as required. It can be understood that the guide block 103 is installed by screwing, so that the guide block 103 can be adjusted and replaced conveniently.

In other embodiments, the flow guiding block 103 and the mounting portion 1022 may be integrally formed, or may be mounted by other connection methods, such as clamping, gluing, and the like.

In this embodiment, as shown in fig. 1, the plasma cleaning showerhead 100 further comprises a base 104, and the base 104 is used to mount the plasma cleaning showerhead 100 on a plasma cleaning apparatus 1000 (as shown in fig. 4), so that the connection between the plasma cleaning showerhead 100 and the plasma cleaning apparatus 1000 can be realized.

In the present embodiment, as shown in fig. 3, the axial direction of the plurality of through holes 107 is perpendicular to the longitudinal direction (a direction shown in fig. 3) of the nozzle head 102, so that plasma can be ejected vertically to clean a workpiece to be cleaned.

In this embodiment, as shown in fig. 3, the apertures of the plurality of through holes 107 become gradually smaller from the inside to the outside, so that the plasma can be gradually and intensively ejected.

Referring to fig. 4 to 5, the present application further provides a plasma cleaning apparatus 1000, wherein the plasma cleaning apparatus 1000 includes a cleaning platform 300, a plasma generating device 400 and the plasma cleaning showerhead 100.

The cleaning platform 300 is used for providing a conveying channel for placing a workpiece to be cleaned and conveying the workpiece to be cleaned.

In this embodiment, the cleaning platform 300 includes a workpiece moving clamp 301, and the workpiece moving clamp 301 is configured to clamp a workpiece carrier 302 and drive the workpiece carrier 302 to move along the conveying channel, wherein a workpiece to be cleaned is placed on the workpiece carrier 302.

In other embodiments, the cleaning platform 300 may not include a workpiece moving clamp 301, and a workpiece to be cleaned may be placed on the cleaning platform 300.

The plasma generating device 400 is used for applying energy to the gas to ionize the gas into plasma, and delivering the plasma to the accommodating cavity of the plasma cleaning showerhead 100. As is well known, plasma is a state of existence of a substance. Usually, the substance exists in three states, solid, liquid and gas, but under some specific external conditions, the substance exists in a fourth state, i.e. plasma. The plasma generation process is not described in detail here.

In this embodiment, the plasma cleaning apparatus 1000 further comprises a cleaning support 200, the cleaning support 200 is used for mounting the plasma cleaning showerhead 100, wherein the plasma cleaning showerhead 100 is mounted on the cleaning support 200 through the base 104, so that the connection between the plasma cleaning showerhead 100 and the plasma cleaning apparatus 1000 can be realized. Preferably, the height and angle of the plasma cleaning showerhead 100 relative to the cleaning platform 300 can be adjusted accordingly by adjusting the cleaning support 200.

In this embodiment, the plasma cleaning showerhead 100 is disposed above the transfer passage of the cleaning platform 300 for ejecting plasma to clean the workpiece to be cleaned passing under the plasma cleaning showerhead 100.

In the present embodiment, the installation direction of the plasma cleaning showerhead 100 is set such that the length direction of the plasma cleaning showerhead 100 is perpendicular to the extension direction of the transfer passage (the X direction shown in fig. 5), and each through hole of the plasma cleaning showerhead 100 is aligned with a workpiece to be cleaned. It can be understood that the length direction of the plasma cleaning nozzle 100 is perpendicular to the extending direction of the conveying channel, so that the plasma can act on the surface of the workpiece to be cleaned perpendicularly, and the cleaning and decontamination effects and the effect of improving the surface performance of the workpiece to be cleaned are better.

In this embodiment, the plasma cleaning device 1000 is applied to clean the optical TFT chip of the fingerprint module by the inventor, because the fingerprint product of the optical TFT chip has a very high requirement on the clean water drop angle of the plasma in the sealing process of the gold thread area, the water drop on the surface of the TFT chip is required to be controlled at 60 ° ± 5 °, otherwise, the water drop angle is too large, which may cause the glue to be unable to be dispersed, and the overflow phenomenon may be generated if the water drop angle is too small.

It is understood that the plasma cleaning device 1000 may also be used to clean workpieces such as glass substrates, silicon wafer chips, printed circuit boards, and the like. In addition, when the plasma cleaning device 1000 is applied to cleaning a workpiece to be cleaned, the water drop angle on the surface of the workpiece to be cleaned can also meet the requirements of other specific angles.

In order to verify the effect of the plasma cleaning device 1000 of the present application in changing the water drop angle on the surface of the TFT chip, the water drop angle on the surface of the TFT chip cleaned by the plasma cleaning device 1000 of the present application is subjected to spot inspection, and 6 carrier plates are spot inspected, wherein 8 TFT chips are placed on each carrier plate, and the spot inspection results are shown in table 1 below (cleaning parameters: moving speed 120mm/s, gas flow 95-100L/min):

TABLE 1

The shower nozzle of traditional plasma cleaning device only sets up a through-hole usually, and the contrast adopts the clean effect of traditional plasma cleaning device, carries out the selective examination to the water droplet angle on the TFT chip surface after the cleanness equally, and 6 support plates of total selective examination place 8 TFT chips on every support plate, and the selective examination result is as shown in following table 2:

TABLE 2

As can be known from statistical data of sampling inspection results, the average value of the water drop angle of the TFT chip cleaned by the plasma cleaning device 1000 is 60.9 degrees, 48 chips meet the requirement that the water drop angle is 60 degrees +/-5 degrees, and the standard deviation of the water drop angle is only 2.4. In contrast, the TFT chip cleaned by the conventional plasma cleaning apparatus has an average value of a water drop angle of 51.9 °, and only 12 chip chips satisfy the requirement of a water drop angle of 60 ° ± 5 °, and the standard deviation of the water drop angle reaches 5.2. Through the comparison, draw, more traditional plasma cleaning device adopts this application when plasma cleaning device 1000 cleans the TFT chip, the standard reaching rate of water droplet angle promotes by a wide margin, and water droplet angle standard deviation also reduces by a wide margin. Therefore, the plasma cleaning device 1000 of the present application can greatly improve the uniformity of the plasma during the ejection, so that the water drop angle on the surface of the workpiece can be accurately controlled within a specified range to meet specific process requirements.

The foregoing is an implementation of the embodiments of the present application, and it should be noted that a person skilled in the art may make various modifications and decorations without departing from the principle of the embodiments of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.

Claims

1. A plasma cleaning showerhead for ejecting plasma to clean a workpiece to be cleaned, comprising:

the plasma torch comprises a torch body, a plasma generating chamber and a plasma generating chamber, wherein an accommodating cavity for accommodating plasma is formed in the torch body;

a nozzle head formed with a plurality of through holes therein communicating with the accommodation chamber, the plurality of through holes for providing an ejection passage for plasma; and

the flow guide block is arranged between two adjacent through holes in the through holes and is used for guiding the plasma.

2. The plasma cleaning showerhead of claim 1, wherein the nozzle head further comprises at least one partition in one-to-one correspondence with the at least one baffle block, the partition being a partition disposed between two adjacent through holes for partitioning the two adjacent through holes.

3. The plasma cleaning showerhead of claim 2, wherein the partitions are provided with mounting portions, one end of the baffle block is mounted to the mounting portion of the corresponding partition, and the other end extends toward the receiving chamber.

4. The plasma cleaning showerhead according to any of claims 1 to 3, wherein the number of the plurality of through holes is two, and the deflector block is disposed at a center portion of the nozzle head.

5. The plasma cleaning showerhead of claim 3, wherein the mounting portion is a groove, and the deflector block is rotatably mounted in the mounting portion by a screw-type connection.

6. The plasma cleaning showerhead of any of claims 1-3, further comprising a pedestal for mounting the plasma cleaning showerhead on a plasma cleaning apparatus.

7. The plasma cleaning showerhead of any of claims 1-3, wherein an axial direction of the plurality of through holes is perpendicular to a length direction of the nozzle head.

8. A plasma cleaning device comprising a cleaning platform, a plasma generating device and a plasma cleaning showerhead according to any of claims 1 to 7, characterized in that:

the cleaning platform is used for providing a conveying channel so as to place a workpiece to be cleaned and convey the workpiece to be cleaned;

the plasma generating device is connected with the plasma cleaning spray head and used for applying energy to gas to ionize the gas into plasma and conveying the plasma to the accommodating cavity of the plasma cleaning spray head;

the plasma cleaning nozzle is arranged above the conveying channel of the cleaning platform and used for spraying plasma to clean a workpiece to be cleaned passing through the lower part of the plasma cleaning nozzle, wherein each through hole of the plasma cleaning nozzle is aligned with the workpiece to be cleaned.

9. The plasma cleaning apparatus of claim 8, further comprising a cleaning support, the plasma cleaning showerhead being mounted on the cleaning support by a pedestal.

10. The plasma cleaning apparatus as claimed in claim 9, wherein the plasma cleaning showerhead is installed in a direction in which a length direction of the plasma cleaning showerhead is perpendicular to an extending direction of the transfer passage.