CN214231040U

CN214231040U - Cooking cup assembly and cooking machine

Info

Publication number: CN214231040U
Application number: CN202022616969.5U
Authority: CN
Inventors: 阮浩翔
Original assignee: Zhejiang Shaoxing Supor Domestic Electrical Appliance Co Ltd
Current assignee: Zhejiang Shaoxing Supor Domestic Electrical Appliance Co Ltd
Priority date: 2020-11-12
Filing date: 2020-11-12
Publication date: 2021-09-21
Anticipated expiration: 2030-11-12

Abstract

The application discloses material reason cup subassembly and cooking machine. The cooking cup component comprises a cooking cup and a cup cover component. The cup cover assembly is covered with the cooking cup and comprises a cup cover body, an anti-overflow electrode and a central cover, the cup cover body comprises a mounting hole for mounting the central cover, the anti-overflow electrode is mounted on the cup cover body, the distance between the end part of the anti-overflow electrode and the side wall of the cooking cup in the horizontal direction is H1, H1 is larger than or equal to 10mm, the distance between the mounting hole in the vertical direction is H2, and H2 is larger than or equal to 50 mm. So set up, because be provided with the anti-overflow electrode, through the anti-overflow electrode obtains resistance to ground, again according to resistance to ground control whether to arrange the cup heating to, prevent that food or foam from spilling over, in addition, H1 and H2 are in above-mentioned within range, also are difficult for arousing the erroneous judgement, improve the reliability of anti-overflow, for example, even have water on the lateral wall of cooking cup 1 or the anti-overflow electrode, also are difficult for arousing the erroneous judgement.

Description

Cooking cup assembly and cooking machine

Technical Field

The application relates to a small household electrical appliances technical field especially relates to cooking cup subassembly and cooking machine.

Background

The cooking machine comprises a cooking machine host and a cooking cup assembly arranged on the cooking machine host. The cooking cup component comprises a cooking cup and a cup cover component covered with the cooking cup. The processor host comprises a host circuit board. Arrange the cup bottom and be provided with heating tube or electromagnetic heating device, utilize heating tube or electromagnetic heating, feed back temperature signal to host computer circuit board through NTC, carry out the heating function.

The food processor is easy to overflow when being used for making thick soup or cooking food such as lobsters and the like which is easy to generate foam, so that the problem of how to prevent overflow in the process of cooking the food is needed to be solved.

Disclosure of Invention

The application discloses cooking cup subassembly and cooking machine, cooking cup subassembly can avoid food to spill over.

In order to realize the purpose, the embodiment of the application discloses a material cup assembly, the material cup assembly comprises a material cup and a cup cover assembly. The cup cover assembly is covered with the cooking cup and comprises a cup cover body, an anti-overflow electrode and a central cover, the cup cover body comprises a mounting hole for mounting the central cover, the anti-overflow electrode is mounted on the cup cover body, the distance between the end part of the anti-overflow electrode and the side wall of the cooking cup in the horizontal direction is H1, H1 is larger than or equal to 10mm, the distance between the mounting hole in the vertical direction is H2, and H2 is larger than or equal to 50 mm. So set up, because be provided with the anti-overflow electrode, through the anti-overflow electrode obtains ground resistance (for example bowl cover control panel handles ground resistance, host computer control panel control switch part break-make), again according to ground resistance control whether to arrange the cup heating to, prevent that food or foam from overflowing, in addition, H1 and H2 are in above-mentioned within range, also are difficult for arousing the erroneous judgement, improve the reliability of anti-overflow, for example, even have water on the lateral wall of cooking cup 1 or the anti-overflow electrode, also are difficult for arousing the erroneous judgement.

Optionally, the cooking cup comprises a maximum scale line, the distance between the end of the anti-overflow electrode and the maximum scale line in the vertical direction is H3, and H3 is greater than or equal to 60 mm. So set up, in the aforesaid within range of H3, be difficult to arouse the erroneous judgement, improve the reliability of anti-overflow, for example, even there is water on the lateral wall of cooking cup or the anti-overflow electrode, also be difficult for arousing the erroneous judgement.

Optionally, the center lid is including being located in the cooking cup and keeping away from the center lid tip of bowl cover body, the tip of anti-overflow electrode is H4 with the distance of center lid tip in the horizontal direction, and 30mm is less than or equal to H4 and is less than or equal to 60 mm. So set up, in the aforesaid within range of H4, be difficult to arouse the erroneous judgement, improve the reliability of anti-overflow, for example, even there is water on the lateral wall of cooking cup or the anti-overflow electrode, also be difficult for arousing the erroneous judgement.

Optionally, the anti-overflow electrode and the cup lid body are integrally injection molded. So set up, insert mutually with the anti-overflow electrode and bowl cover cup and establish and compare through modes such as screw locking, integrative injection moulding makes bowl cover subassembly simple manufacture, moreover, anti-overflow electrode is firm with the combination of relevant structure, is difficult to drop.

Optionally, the anti-overflow electrode is linear and is obliquely inserted into the material processing cup. So set up, the anti-overflow electrode is the integrative injection moulding of bowl cover body of being convenient for more of straight line, has reduced the step of fixed anti-overflow electrode and assembly anti-overflow electrode, and the manufacturing of bowl cover subassembly is simpler.

Optionally, the cup lid body includes bottom, retainer plate, cup lid outer lane and cup lid main part. The bottom cover is provided with the anti-overflow electrode and the mounting hole. The fixing ring is assembled on the bottom cover. The bowl cover outer lane includes the buckling parts, the oral area edge of cooking cup is provided with locking part, the buckling parts winds the circumference rotation of cooking cup and with locking part lock or separation to make bowl cover subassembly and cooking cup locking or unblock. The cup cover main body is assembled on the cup cover outer ring. So set up, the bowl cover body includes bottom, retainer plate, bowl cover outer lane and bowl cover main part and relevant structure, and the simple structure of bowl cover subassembly all can be the injection molding moreover, the demolding of being convenient for.

Optionally, the cup cover assembly comprises a control box and a cup cover circuit board, and the control box is assembled on the cup cover body to form a circuit board cavity; the cup cover circuit board is sealed in the circuit board cavity and comprises a cup cover control board and a signal transmitting module, the cup cover control board processes the ground resistance of the anti-overflow electrode to generate a control signal, and the signal transmitting module transmits the control signal outwards. So set up, the bowl cover subassembly is the part that needs are washd, the bowl cover circuit board is sealed in the control box, can prevent to wash bowl cover subassembly in-process, and the water intaking leads to bowl cover control panel and relevant part to become invalid in the control box, in addition, the control box can also regard as the stress point under the condition that bowl cover subassembly and cooking cup closed through closing the mode lid soon, and the user promotes the control box so that the bowl cover subassembly is around the circumference rotation of the oral area of cooking cup, realizes the locking of bowl cover subassembly or opens, from this, conveniently uncaps and the locking closure.

Optionally, the bowl cover subassembly is followed arrange the circumference anticlockwise or clockwise rotation of cup in order to with arrange the cup lid and close or open, the control box assembly in the edge of bowl cover body. So set up, the control box is located the edge of bowl cover body and is convenient for exert the effort more, consequently, more conveniently uncaps and the locking closure.

Optionally, arrange the cup including arrange the cup handle, under the condition that bowl cover subassembly and arrange the cup lid and close, the control box is located arrange the top of cup handle. So set up, the control box is located the edge of bowl cover body and is located cooking cup handle top, under the condition that bowl cover subassembly and cooking cup closed soon, is convenient for apply the effort more, consequently, conveniently uncaps and the locking closure more.

In another aspect, an embodiment of the present application discloses a food processor. The cooking machine comprises a cooking machine host and the cooking cup assembly, the cooking cup assembly is positioned in the cooking machine host, the cup cover assembly comprises a cup cover circuit board, and the cup cover circuit board is used for processing the ground resistance of the anti-overflow electrode so as to generate a control signal and transmit the control signal outwards; the processor host comprises a host circuit board and a switch component connected with the host circuit board, and the host circuit board controls the switch component to be switched on or off according to the control signal so as to control whether the processing cup is heated or not; or, the cooking machine include the cooking machine host computer with cooking cup subassembly, the cooking machine host computer include the host computer circuit board and with the switch part that the host computer circuit board is connected, the host computer circuit board basis control signal control switch part is expert at or is disconnected to whether control heats the cooking cup. Beneficial effect of cooking machine sees the beneficial effect of cooking cup subassembly no longer redundantly.

Optionally, the host computer circuit board is located the tip of cooking host computer, the bowl cover circuit board is located the edge of bowl cover body, cooking cup subassembly is including cooking cup handle, the bowl cover circuit board with the host computer circuit board is located the both sides of the vertical direction of cooking cup handle. So set up, arrange the cup handle and be located the holistic edge of cooking machine, and host computer circuit board and bowl cover circuit board are located arrange the both sides of the vertical direction of cup handle, avoid having more metalwork separation (for example, the inside metalwork of cooking machine) between host computer circuit board and the bowl cover circuit board, adopt wireless communication mode's between bowl cover circuit board and host computer circuit board under the condition, signal transmission is stable. Under the condition of adopting wired communication mode between bowl cover circuit board and the host computer circuit board, wire between the two can set up in arrange the cup in the handle, and bowl cover circuit board and host computer circuit board are located arrange the both sides of cup handle in vertical direction and are convenient for set up the wire, for example, required wire is shorter and be convenient for set up the wire.

Drawings

Fig. 1 is a cross-sectional view of a food processor of the present application;

FIG. 2 is an enlarged view of a portion A of FIG. 1;

FIG. 3 is a cross-sectional view of a cup lid assembly of the present application;

fig. 4 is an exploded perspective view of a cup lid assembly of the present application.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of the terms "a" or "an" and the like in the description and in the claims of this application do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "plurality" includes two, and is equivalent to at least two. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

Referring to fig. 1 and 2, a cooking cup assembly 10 includes a cooking cup 1 and a cup cover assembly 2. The cooking cup 1 can be made of metal, such as a five-golden cup. Arrange cup subassembly 10 can be including stirring knife tackle spare 3, also can not include stirring knife tackle spare 3, and including stirring knife tackle spare 3's the condition, arrange cup subassembly 10 can realize the function of stirring, for example, stir-fry dish. Bowl cover subassembly 2 with arrange cup 1 lid and close, how the lid closes multiple mode and structure, for example, close in order to realize the lid for arranging cup 1 upset through bowl cover subassembly 2, perhaps, bowl cover subassembly 2 realizes the lid to close in order to close through the mode of revolving around arranging cup 1's circumference rotation. The cup cover assembly 2 comprises a cup cover body 21, an anti-overflow electrode 22 and a central cover 23. The cup lid body 21 includes a mounting hole 2111 for mounting the center lid 23. Mounting hole 2111 is generally centrally located in lid body 21. The anti-overflow electrode 22 is mounted on the cup cover body 21. How the anti-overflow electrode 22 is mounted on the cup lid body 21 may be implemented in various ways and structures, for example, by being inserted into the cup lid body 21 and connected by screws. The distance between the end part 221 of the anti-overflow electrode 22 and the side wall 11 of the cooking cup 1 in the horizontal direction is H1, H1 is more than or equal to 10mm, the distance between the end part 221 of the anti-overflow electrode and the mounting hole 2111 in the vertical direction is H2, and H2 is more than or equal to 50 mm. In the event of foam generation within the cooking cup 1, the end 221 contacts the foam and is processed by the associated circuitry to prevent food within the cooking cup 1 from spilling out. So set up, because be provided with anti-overflow electrode 22 obtains through anti-overflow electrode 22 and hinders to ground (for example bowl cover control panel 251 handles to ground resistance, host computer circuit board 201 control switch part 202 break-make), again according to whether to the ground resistance control to cooking cup 1 heating to, prevent that food or foam from spilling over, in addition, H1 and H2 are in above-mentioned within range, also are difficult for arousing the erroneous judgement, improve the reliability of anti-overflow, for example, even have water on cooking cup 1's lateral wall 11 or anti-overflow electrode 22, also are difficult for arousing the erroneous judgement.

Referring to fig. 2 and 3, the cooking cup 1 includes a maximum scale line L, and a vertical distance between the end 221 of the anti-overflow electrode 22 and the maximum scale line L is H3, and H3 is greater than or equal to 60 mm. With this arrangement, the H3 is less likely to cause erroneous judgment and the reliability of the anti-overflow is improved, and even if water is present on the side wall 11 of the cooking cup 1 or the anti-overflow electrode 22, erroneous judgment is less likely to be caused.

Referring to fig. 2 and 3, the central cover 23 includes a central cover end 231 located in the food cup 1 and far away from the cup cover body 21, a horizontal distance between the end 221 of the anti-overflow electrode 22 and the central cover end 231 is H4, and H4 is greater than or equal to 30mm and less than or equal to 60 mm. With this arrangement, the H4 is less likely to cause erroneous judgment and the reliability of the anti-overflow is improved, and even if water is present on the side wall 11 of the cooking cup 1 or the anti-overflow electrode 22, erroneous judgment is less likely to be caused.

Referring to fig. 1 to 4, the anti-overflow electrode 22 and the cup lid body 21 are integrally formed by injection molding. So set up, insert mutually with the anti-overflow electrode and bowl cover cup and establish and compare through modes such as screw locking, integrative injection moulding makes bowl cover subassembly 2 make simply, moreover, anti-overflow electrode 22 is firm with the combination of relevant structure, is difficult to drop.

Referring to fig. 1 to 4, the anti-overflow electrode 22 is linearly and obliquely inserted into the cooking cup 1. So set up, anti-overflow electrode 22 is the linear and is more convenient for with the integrative injection moulding of bowl cover body 21, has reduced the step of fixed anti-overflow electrode 22 and assembly anti-overflow electrode 22, and bowl cover subassembly 2's manufacturing is simpler.

Referring to fig. 4, the lid body 21 includes a bottom cover 211, a fixing ring 212, a lid outer ring 213, and a lid main body 214. In some embodiments, the lid body 21 further includes a decorative cover 215. The bottom cover 211 is provided with the anti-spill electrode 22 and the mounting hole 2111, and more specifically, as shown in fig. 4, the anti-spill electrode 22 is integrally injection-molded with the bottom cover 211, so that the anti-spill electrode 22 is covered by the covering portion 2112. The fixing ring 212 is assembled to the bottom cover 211, and there may be various structures for assembling, for example, the bottom cover 211 is provided with studs 2113 at intervals around the circumference of the bottom cover 211, the fixing ring 212 is provided with through holes 2121, and the fixing ring 212 is assembled to the bottom cover 211 by the cooperation of the through holes 2121 and the studs 2113. The oral area edge of cooking cup 1 is provided with locking portion 12, and bowl cover outer lane 213 includes buckling parts 2131, buckling parts 2131 wind cooking cup 1's circumference rotation and with locking parts 12 lock or separation to make bowl cover subassembly 2 and cooking cup 1 lock or unblock. The structures of the locking portion 12 and the engaging portion 2131 are not limited, and the locking portion 12 and the engaging portion 2131 may be configured to be locked or unlocked by screwing. The lid main body 214 is assembled to the lid outer ring 213, and any structure may be adopted for assembly, which is not described in detail. So set up, bowl cover body 21 includes bottom 211, retainer plate 212, bowl cover outer lane 213 and bowl cover main part 214 and relevant structure, and bowl cover subassembly 2's simple structure all can be the injection molding moreover, the demolding of being convenient for.

Referring to fig. 1 to 4, the cup lid assembly 2 includes a control box 24 and a lid circuit board 25, and the control box 24 is assembled to the cup lid body 21 to form a circuit board cavity 241. The lid circuit board 25 is sealed in the circuit board cavity 241, for example, the lid circuit board 25 is sealed in the circuit board cavity 241 by glue filling. The cup cover circuit board 25 comprises a cup cover control board 251 and a signal transmitting module 252, the cup cover control board 251 processes the ground resistance of the anti-overflow electrode 22 to generate a control signal, and the signal transmitting module 252 transmits the control signal outwards. So set up, bowl cover subassembly 2 is the part that needs to be washd, bowl cover circuit board 25 is sealed in control box 24, can prevent to wash bowl cover subassembly 2 in-process, and the intaking leads to bowl cover control panel 251 and relevant parts to become invalid in control box 24, in addition, control box 24 is in bowl cover subassembly 2 and arrange under the condition that cup 1 closed through the closure mode lid soon, and control box 24 can also regard as the stress point, and the user promotes control box 24 so that bowl cover subassembly 2 realizes the locking of bowl cover subassembly 2 or opens around the circumference rotation of arranging cup 1's oral area, from this, conveniently uncaps and the locking closure.

Referring to fig. 1 to 4, the cup cover assembly 2 rotates counterclockwise or clockwise along the circumferential direction of the food processing cup 1 to cover or open the food processing cup 1, and the control box 24 is assembled on the edge of the cup cover body 21. The skilled artisan will appreciate that the control box 24 may be located anywhere along the brim, for example, in fig. 4, the bottom lid 211 includes a bottom lid base 2114 and a perimeter wall 2115 around the bottom lid 211, and the control box 24 is assembled with the bottom lid base 2114 and the perimeter wall 2115 to be located along the brim of the lid assembly 2. Control box 24 in an embodiment, under the condition that bowl cover subassembly 2 and cooking cup 1 lid closed, control box 24 is located cooking cup handle 4's top, like this, be convenient for soon close bowl cover subassembly 2 more, also be convenient for uncap and close the lid promptly. The control box 24 can also be located at the edge of the cup lid body 21 through other structures, which are not described in detail.

In the foregoing various cooking cup assemblies, the cup cover assembly 2 includes the button cell 26, and the button cell 26 supplies power to the cup cover circuit board 25.

With reference to fig. 1, the present application discloses a food processor. The food processor comprises a food processor host 20 and any one of the above-mentioned food processor cup assemblies 10. The cooking cup assembly 10 is located in the cooking machine host 20. Cooking host computer 20 include host computer circuit board 201 and with the switch part 202 that host computer circuit board 201 is connected, host computer circuit board 201 according to control signal control switch part 202 is expert at or is disconnected to whether control heats cooking cup 1. The host circuit board 201 includes a signal receiving module 203, and the signal receiving module 203 is configured to receive the control signal transmitted by the signal transmitting module 252. The signal transmitting module 252 and the signal receiving module 203 may transmit signals in a wired or wireless manner. The switch member 202 is not limited in structure, and may be in an on state or an off state to control heating of the cooking cup 1, and may be, for example, a relay.

Referring to fig. 1, the host circuit board 201 is located at an end of the processor host 20, the cup cover circuit board 25 is located at an edge of the cup cover body 21, and the processing cup assembly 10 includes a processing cup handle 4. Bowl cover circuit board 25 with host computer circuit board 201 is located arrange the both sides of cup handle 4 in vertical direction. So set up, arrange cup handle 4 and be located the holistic edge of cooking machine, and host computer circuit board 201 and bowl cover circuit board 25 are located arrange the both sides of 4 vertical directions of cup handle, avoid having more metalwork separation (for example, the inside metalwork of cooking machine) between host computer circuit board 201 and the bowl cover circuit board 25, adopt under the condition of wireless communication mode between bowl cover circuit board 25 and host computer circuit board 201, signal transmission is stable. Under the condition of adopting wired communication mode between bowl cover circuit board 25 and host computer circuit board 201, wire between the two can set up in arrange in the cup handle 4, and bowl cover circuit board 25 and host computer circuit board 201 are located arrange the both sides of cup handle 4 in vertical direction and are convenient for set up the wire, for example, required wire is shorter and be convenient for set up the wire.

The above description is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the scope of the present application.

Claims

1. A gobo assembly, characterized in that, comprises:

a cooking cup (1);

bowl cover subassembly (2), with cooking cup (1) lid closes, including bowl cover body (21), anti-overflow electrode (22) and center lid (23), bowl cover body (21) is including the installation mounting hole (2111) of center lid (23), anti-overflow electrode (22) install in bowl cover body (21), tip (221) of anti-overflow electrode (22) with lateral wall (11) of cooking cup (1) are H1 at the distance of horizontal direction, and H1 is more than or equal to 10mm, with mounting hole (2111) is H2 at the distance of vertical direction, and H2 is more than or equal to 50 mm.

2. The cooking cup assembly according to claim 1, wherein the cooking cup (1) comprises a maximum graduation mark, and the distance between the end (221) of the anti-overflow electrode (22) and the maximum graduation mark in the vertical direction is H3, H3 is more than or equal to 60 mm.

3. The cooking cup assembly according to claim 1 or 2, wherein the central cover (23) comprises a central cover end (231) located inside the cooking cup (1) and far away from the cup cover body (21), and the distance between the end (221) of the anti-overflow electrode (22) and the central cover end (231) in the horizontal direction is H4, and H4 is more than or equal to 30mm and less than or equal to 60 mm.

4. The cooking cup assembly according to claim 1, wherein the anti-overflow electrode (22) is integrally injection molded with the cup cover body (21).

5. The cooking cup assembly according to claim 4, wherein the anti-overflow electrode (22) is linear and is obliquely inserted into the cooking cup (1).

6. The cooking cup assembly according to claim 1, wherein the cup cover body (21) comprises:

a bottom cover (211) provided with the anti-spill electrode (22) and the mounting hole (2111);

a fixing ring (212) assembled to the bottom cover (211);

the cup cover outer ring (213) comprises a buckling part (2131), the edge of the mouth part of the cooking cup (1) is provided with a locking part (12), and the buckling part (2131) rotates around the circumferential direction of the cooking cup (1) to be buckled with or separated from the locking part (12) so as to lock or unlock the cup cover assembly (2) and the cooking cup (1);

and the cup cover main body (214) is assembled on the cup cover outer ring (213).

7. The food cup assembly according to any one of claims 1, 2 and 4 to 6, wherein the cup cover assembly (2) comprises a control box (24) and a cup cover circuit board (25), the control box (24) is assembled on the cup cover body (21) to form a circuit board cavity (241);

the cup cover circuit board (25) is sealed in the circuit board cavity (241) and comprises a cup cover control board (251) and a signal transmitting module (252), the cup cover control board (251) processes the ground resistance of the anti-overflow electrode (22) to generate a control signal, and the signal transmitting module (252) transmits the control signal outwards.

8. The cooking cup assembly according to claim 7, wherein the cup cover assembly (2) rotates anticlockwise or clockwise along the circumferential direction of the cooking cup (1) to be covered with or opened from the cooking cup (1), and the control box (24) is assembled on the edge of the cup cover body (21).

9. The cooking cup assembly according to claim 8, wherein the cooking cup (1) comprises a cooking cup handle (4), and the control box (24) is located above the cooking cup handle (4) when the cup cover assembly (2) and the cooking cup (1) are closed.

10. A food processor, comprising a food processor host and the food processor cup assembly (10) as claimed in any one of claims 1 to 6, wherein the food processor cup assembly (10) is located in the food processor host (20), the cup cover assembly (2) comprises a cup cover circuit board, and the cup cover circuit board (25) processes the ground resistance of the anti-overflow electrode (22) to generate a control signal and transmits the control signal outwards;

the food processor host (20) comprises a host circuit board (201) and a switch component (202) connected with the host circuit board (201), and the host circuit board (201) controls the switch component to be switched on or off according to the control signal so as to control whether the food processing cup is heated or not;

or, including cooking machine host computer and the cooking cup subassembly of any one of claims 7 to 9, cooking machine host computer (20) include host computer circuit board (201) and with switch part (202) that host computer circuit board (201) are connected, host computer circuit board (201) according to control signal control switch part (202) are switched on or off to control whether heat the cooking cup.

11. The food processor of claim 10, wherein the host circuit board (201) is located at an end of the food processor host (20), the cup cover circuit board (25) is located at an edge of the cup cover body (21), the food cup assembly (10) comprises a food cup handle (4), and the cup cover circuit board (25) and the host circuit board (201) are located at two sides of the vertical direction of the food cup handle (4).