CN214228549U - Flexible circuit board, circuit board assembly and equipment - Google Patents
Flexible circuit board, circuit board assembly and equipment Download PDFInfo
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- CN214228549U CN214228549U CN202023232717.9U CN202023232717U CN214228549U CN 214228549 U CN214228549 U CN 214228549U CN 202023232717 U CN202023232717 U CN 202023232717U CN 214228549 U CN214228549 U CN 214228549U
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Abstract
The embodiment of the utility model provides a relate to circuit board design field, disclose a flexible circuit board, circuit board assembly and equipment. The utility model discloses well flexible circuit board includes: the chip comprises a power supply layer, a ground layer, a high-order pad and a low-order pad, wherein the high-order pad is connected with the power supply layer and used for being connected with an IIC address selection pin of the chip and determining an IIC address corresponding to the chip as a first address, the low-order pad is connected with the ground layer and used for being connected with the IIC address selection pin of the chip and determining the IIC address corresponding to the chip as a second address. Therefore, the IIC address of the adjustable chip can be realized on the same flexible circuit board, and the production cost is reduced.
Description
Technical Field
The embodiment of the utility model provides a relate to circuit board design field, in particular to flexible circuit board, circuit board assembly and equipment.
Background
The chip of the current device has a plurality of IIC addresses, and when the device is installed, a unique IIC address needs to be determined for the device, so that the device can be controlled by the unique IIC address. When the required unique IIC address is selected from the IIC addresses, an IIC address selection pin (ID _ SEL pin) in a chip of the equipment is used for selecting, and the IIC address corresponding to the chip is determined according to whether a network communicated with the IIC address selection pin is a high-order network or a low-order network.
The inventors found that at least the following problems exist in the related art: with the increase of the devices to be installed on the terminal, the IIC addresses corresponding to a plurality of external devices may be duplicated and collided, for example, the device 1 and the device 2 installed on the terminal are the same IIC address, and at this time, the IIC address of the device needs to be adjusted. However, in the related art, there is only one pad on the circuit board to which the IIC address selection pin of the chip is connected, and therefore, when the IIC address is changed, the routing of the circuit board needs to be redesigned, which causes a great economic burden and delays the development progress of the product.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a flexible circuit board, circuit board assembly and equipment realize realizing the IIC address of adjustable chip on same flexible circuit board, reduction in production cost.
In order to solve the above technical problem, an embodiment of the utility model provides a flexible circuit board, include: the chip comprises a power supply layer, a ground layer, a high-order pad and a low-order pad, wherein the high-order pad is connected with the power supply layer and used for being connected with an IIC address selection pin of the chip and determining an IIC address corresponding to the chip as a first address, the low-order pad is connected with the ground layer and used for being connected with the IIC address selection pin of the chip and determining the IIC address corresponding to the chip as a second address.
The embodiment of the utility model provides a circuit board assembly is still provided, include: the flexible circuit board, the chip and the gold wire; the flexible circuit board comprises a power layer, a grounding layer, a high-order pad and a low-order pad, wherein the high-order pad is connected with the power layer, and the low-order pad is connected with the grounding layer; the chip comprises an IIC address selection pin; the gold wire is used for connecting the IIC address selection pin of the chip and the high-order bonding pad of the flexible circuit board, and determining the IIC address corresponding to the chip as a first address, or used for connecting the IIC address selection pin of the chip and the low-order bonding pad of the flexible circuit board, and determining the IIC address corresponding to the chip as a second address.
An embodiment of the utility model provides an equipment is still provided, include: the circuit board assembly and the shell.
The embodiment of the utility model provides a for correlation technique, flexible circuit board includes two pads of high-order pad and low level pad, and high-order pad is connected with the power supply layer, can provide high position network for the chip, and low level pad links to each other with the ground plane, provides low position network for the chip. When the IIC address selection pin of the chip is connected with the high-order bonding pad, the IIC address corresponding to the chip is determined to be a first address, when the IIC address selection pin of the chip is connected with the low-order bonding pad, the IIC address corresponding to the chip is determined to be a second address, and the IIC address pin of the chip is only connected with one bonding pad of the high-order bonding pad and the low-order bonding pad, so that the IIC address corresponding to the chip is guaranteed to be a unique address. When the IIC address pins are selectively connected with the high-order bonding pads, the low-order bonding pads are in an idle state, when the IIC address conflict problem occurs, the bonding pads connected with the IIC address pins can be adjusted, the IIC addresses corresponding to the chips are adjusted, the adjusting mode is simple, the flexible circuit board does not need to be redesigned, the time cost and the economic cost for adjusting the IIC addresses are reduced, and the product development efficiency is improved.
In addition, the high-order pad and the low-order pad are arranged adjacently, and the high-order pad and the low-order pad are not overlapped.
In addition, the flexible circuit board further includes: a first identifier and a second identifier; the first mark is used for indicating the position of the high-order bonding pad, and the second mark is used for indicating the position of the low-order bonding pad. Thereby avoiding connection to the wrong pad and ensuring the accuracy of the IIC address selection.
In addition, the number of the high-order bonding pads and the number of the low-order bonding pads are both N, wherein N is determined according to the number of IIC addresses. Thereby facilitating the selection of IIC addresses when the chip has more than two IIC addresses.
In addition, the chip further includes: and the third identifier is used for determining that the bonding pad connected with the IIC address selection pin of the chip is a high-order bonding pad or a low-order bonding pad.
In addition, the chip is a photosensitive chip.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a schematic structural view of a flexible circuit board according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a flexible circuit board according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in the embodiments of the present invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation manner of the present invention, and the embodiments may be mutually incorporated and referred to without contradiction.
The first embodiment of the present invention relates to a flexible circuit board 10, as shown in fig. 1, including: the chip comprises a power supply layer 11, a ground layer 12, a high-order pad 13 and a low-order pad 14, wherein the high-order pad 13 is connected with the power supply layer 11, the high-order pad 13 is used for being connected with an IIC address selection pin of a chip and determining an IIC address corresponding to the chip as a first address, the low-order pad 14 is connected with the ground layer 12, and the low-order pad 14 is used for being connected with the IIC address selection pin of the chip and determining the IIC address corresponding to the chip as a second address. When the IIC address selection pin of the chip is connected with the bonding pad, the IIC address selection pin 1 is used for being connected with the high-order bonding pad, and the IIC address selection pin 2 is used for being connected with the low-order bonding pad.
In addition, the high-order pads 13 and the low-order pads 14 on the flexible circuit board 10 are disposed adjacent to each other, so that a user can easily view the positions of the high-order pads and the low-order pads when performing chip mounting. In addition, the positions of the high-order pad 13 and the low-order pad 14 are not overlapped with each other, so that the circuits connected with the high-order pad and the low-order pad are prevented from influencing each other, and the IIC address cannot be determined clearly.
In addition, the flexible circuit board is also marked with a first mark and a second mark, the first mark is used for marking the position of the high-order bonding pad 13, and the second mark is used for marking the position of the low-order bonding pad 14, so that the chip can be connected to the required bonding pad, and the accuracy of IIC address selection is ensured.
In addition, the shape of the upper pad 13 and the lower pad 14 may be square.
The embodiment of the utility model provides a for correlation technique, flexible circuit board includes two pads of high-order pad and low level pad, and high-order pad is connected with the power supply layer, can provide high position network for the chip, and low level pad links to each other with the ground plane, provides low position network for the chip. When the IIC address selection pin of the chip is connected with the high-order bonding pad, the IIC address corresponding to the chip is determined to be a first address, when the IIC address selection pin of the chip is connected with the low-order bonding pad, the IIC address corresponding to the chip is determined to be a second address, and the IIC address pin of the chip is only connected with one bonding pad of the high-order bonding pad and the low-order bonding pad, so that the IIC address corresponding to the chip is guaranteed to be a unique address. When the IIC address pins are selectively connected with the high-order bonding pads, the low-order bonding pads are in an idle state, when the IIC address conflict problem occurs, the bonding pads connected with the IIC address pins can be adjusted, the IIC addresses corresponding to the chips are adjusted, the adjusting mode is simple, the flexible circuit board does not need to be redesigned, the time cost and the economic cost for adjusting the IIC addresses are reduced, and the product development efficiency is improved.
The second embodiment of the present invention relates to a flexible circuit board 10, and the second embodiment is substantially the same as the first embodiment, and in addition, in the second embodiment of the present invention, the number of the high-order pads 13 and the low-order pads 14 provided in the flexible circuit board 10 is N, where N is determined according to the number of the selected IIC addresses.
Taking the number of the IIC addresses available for selection as 4 as an example, as shown in fig. 2, the number of the upper pads 13 and the lower pads 14 is 2. When the chip is connected with the flexible circuit board, if the IIC address corresponding to the chip is address 1, the IIC address selection pin 1 of the chip is connected with the high-order bonding pad 1; if the IIC address corresponding to the chip is the address 2, the IIC address selection pin 1 of the chip is connected with the high-order bonding pad 2; if the IIC address corresponding to the chip is the address 3, the IIC address selection pin 2 of the chip is connected with the low-order bonding pad 1; if the IIC address corresponding to the chip is address 4, the IIC address selection pin 2 of the chip is connected with the lower bonding pad 2, so that the chip can be freely switched among four different IIC addresses. Similarly, the number of the low-order bonding pads and the high-order bonding pads is increased, so that free switching of more IIC addresses can be provided for the chip, and the problem that the IIC addresses of all devices are repeated and conflict after the flexible circuit board is connected into a plurality of devices is solved.
The utility model discloses the third embodiment relates to a circuit board assembly, include: a flexible circuit board 10, a chip and gold wires; as shown in fig. 1, the flexible circuit board 10 includes a power layer 11, a ground layer 12, a high-order pad 13 and a low-order pad 14, wherein the high-order pad 13 is connected with the power layer 11, and the low-order pad 14 is connected with the ground layer 12; the chip comprises an IIC address selection pin; the gold wire is used for connecting the IIC address selection pin of the chip and the high-order bonding pad of the flexible circuit board, and determining the IIC address corresponding to the chip as a first address, or used for connecting the IIC address selection pin of the chip and the low-order bonding pad of the flexible circuit board, and determining the IIC address corresponding to the chip as a second address.
In addition, the number of the high-order pads and the low-order pads is N, wherein N is determined according to the number of the IIC addresses, and N can be a natural number larger than 0.
In addition, a third identifier is marked on the chip and used for determining whether a bonding pad connected with the IIC address selection pin of the chip is a high-order bonding pad or a low-order bonding pad. The user can directly know the pad of required bridging through looking over the third sign, improves production efficiency.
In addition, the chip type can be sensitization chip, and sensitization chip sets up in the camera, and through sensitization chip and flexible circuit board's connection, flexible circuit board can control the behavior of camera.
In the embodiment, the IIC address selection pin of the chip is respectively provided with different IIC addresses with the high-order bonding pad and the low-order bonding pad on the flexible circuit board, the IIC address of the chip can be adjusted on the same flexible circuit board, the flexible circuit board does not need to be replaced when the IIC address is not switched, and the production cost of the product is reduced.
The utility model discloses the fourth embodiment relates to an equipment, include: the circuit board assembly and the shell. The circuit board assembly is accommodated in the accommodating space formed by the shell, and the shell plays a certain role in protecting the circuit board assembly and prevents the circuit board assembly from being damaged by external influence.
In addition, when the IIC address of the chip is set by using the flexible circuit board, the method specifically includes the following steps:
firstly, determining a bonding pad correspondingly connected on a flexible circuit board according to an IIC address required to be set by a chip; the bonding pads comprise a high-order bonding pad and a low-order bonding pad, the high-order bonding pad is connected with the power layer, the low-order bonding pad is connected with the grounding layer, and when the chip is connected with different bonding pads, IIC addresses corresponding to the chip are different.
And secondly, connecting the IIC address selection pin of the chip with the bonding pad, wherein if the IIC address required to be set by the chip is a first address, the bonding pad is a high-order bonding pad, and if the IIC address required to be set by the chip is a second address, the bonding pad is a low-order bonding pad.
The method comprises the steps of connecting IIC address selection pins of a chip with bonding pads, switching the connected bonding pads, switching the IIC addresses set by the chip from first addresses to second addresses if the bonding pads connected with the IIC address selection pins of the chip are switched from high-order bonding pads to low-order bonding pads, and switching the IIC addresses set by the chip from the second addresses to the first addresses if the bonding pads connected with the IIC address selection pins of the chip are switched from the low-order bonding pads to the high-order bonding pads.
In practical applications, the number of the upper pads and the lower pads may be set according to the number of the IIC addresses corresponding to the chip, for example, when the number of the IIC addresses corresponding to the chip is 4, the sum of the upper pads and the lower pads is set to be 2, when the number of the IIC addresses corresponding to the chip is 6, the number of the lower pads of the upper pads is 3, and so on.
Connect through the chip with the different pad on the flexible circuit board, the realization is to the free change of the IIC address that the chip corresponds, for example, be connected with the sensitization chip of two cameras on the flexible circuit board, be sensitization chip 1 and sensitization chip 2 respectively, if the IIC address that these two sensitization chips correspond is the first address the same, then can change the pad of being connected in arbitrary one sensitization chip and the flexible circuit board, with the purpose of playing the IIC address that switches the sensitization chip and correspond, thereby make the IIC address that sensitization chip 1 and sensitization chip 2 correspond different, conflict appears when avoiding controlling two sensitization chips.
In the embodiment, the IIC address selection pin of the chip is respectively provided with different IIC addresses with the high-order bonding pad and the low-order bonding pad on the flexible circuit board, the IIC address of the chip can be adjusted on the same flexible circuit board, the flexible circuit board does not need to be replaced when the IIC address is not switched, and the production cost of the product is reduced.
The steps of the above methods are divided for clarity, and the implementation may be combined into one step or split some steps, and the steps are divided into multiple steps, so long as the same logical relationship is included, which are all within the protection scope of the present patent; it is within the scope of the patent to add insignificant modifications to the algorithms or processes or to introduce insignificant design changes to the core design without changing the algorithms or processes.
It will be understood by those skilled in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and detail may be made therein without departing from the spirit and scope of the invention in practice.
Claims (8)
1. A flexible circuit board, comprising: a power layer, a ground layer, a high-order pad and a low-order pad,
the high-order bonding pad is connected with the power supply layer, the high-order bonding pad is used for being connected with an IIC address selection pin of a chip and determining an IIC address corresponding to the chip as a first address,
the lower bonding pad is connected with the grounding layer and used for being connected with an IIC address selection pin of a chip and determining an IIC address corresponding to the chip as a second address.
2. The flexible circuit board of claim 1, wherein the high-level bonding pad and the low-level bonding pad are disposed adjacent to each other, and the high-level bonding pad and the low-level bonding pad do not overlap with each other.
3. The flexible circuit board of claim 1, further comprising: a first identifier and a second identifier; the first mark is used for indicating the position of the high-order bonding pad, and the second mark is used for indicating the position of the low-order bonding pad.
4. A circuit board assembly, comprising: the flexible circuit board, the chip and the gold wire;
the flexible circuit board comprises a power layer, a ground layer, a high-order pad and a low-order pad, wherein the high-order pad is connected with the power layer, and the low-order pad is connected with the ground layer;
the chip comprises an IIC address selection pin;
the gold wire is used for connecting the IIC address selection pin of the chip and the high-order bonding pad of the flexible circuit board and determining the IIC address corresponding to the chip as a first address,
or the IIC address selection pin is used for connecting the chip and the lower-order bonding pad of the flexible circuit board, and the IIC address corresponding to the chip is determined as a second address.
5. The circuit board assembly of claim 4, wherein the number of the high-side pads and the low-side pads is N, wherein N is determined according to the number of the IIC addresses.
6. The circuit board assembly of claim 4, wherein the chip further comprises: and the third identifier is used for determining that a bonding pad connected with the IIC address selection pin of the chip is the high-order bonding pad or the low-order bonding pad.
7. The circuit board assembly of claim 4, wherein the chip is a photo-sensitive chip.
8. An apparatus comprising a circuit board assembly according to any one of claims 4 to 7 and a housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023232717.9U CN214228549U (en) | 2020-12-28 | 2020-12-28 | Flexible circuit board, circuit board assembly and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023232717.9U CN214228549U (en) | 2020-12-28 | 2020-12-28 | Flexible circuit board, circuit board assembly and equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214228549U true CN214228549U (en) | 2021-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023232717.9U Active CN214228549U (en) | 2020-12-28 | 2020-12-28 | Flexible circuit board, circuit board assembly and equipment |
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| CN (1) | CN214228549U (en) |
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