CN214225855U - Embedded passive heat conduction case of computer - Google Patents

Embedded passive heat conduction case of computer Download PDF

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Publication number
CN214225855U
CN214225855U CN202120554537.8U CN202120554537U CN214225855U CN 214225855 U CN214225855 U CN 214225855U CN 202120554537 U CN202120554537 U CN 202120554537U CN 214225855 U CN214225855 U CN 214225855U
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CN
China
Prior art keywords
heat conduction
conduction machine
machine case
case
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202120554537.8U
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Chinese (zh)
Inventor
蒋江波
王莉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Zhongtian Qiyue Technology Co ltd
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Tianjin Zhongtian Qiyue Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN202120554537.8U priority Critical patent/CN214225855U/en
Application granted granted Critical
Publication of CN214225855U publication Critical patent/CN214225855U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides an embedded passive heat conduction machine case of computer, including heat conduction machine case, heat conduction machine case front top is equipped with a plurality of wiring holes, and heat conduction machine case front bottom is equipped with the CD inserted hole, and heat conduction machine case front one side is equipped with the jack, and heat conduction machine roof portion is equipped with clearance mechanism through inlaying, and heat conduction machine case both sides fixed mounting has fixed establishment, and four end fixings of heat conduction machine bottom of the case portion are equipped with vibration-damping rubber pad. The utility model provides a passive heat conduction machine case of embedded computer, the clearance mechanism that is equipped with makes outside air get into the heat conduction machine incasement and cools down the CUP, avoid the too high normal work of influence computer of CUP temperature, cooperate second radiator fan to make the heat conduction machine incasement form air cycle simultaneously, the dust filter ash-collecting box is collected the dust in the circulated air, carry out simple location when being equipped with fixed establishment and installing heat conduction machine case, make things convenient for heat conduction machine case installation and keep the stability of heat conduction machine case, the shock attenuation foam pad that is equipped with reduces the harm of heat conduction machine case vibrations to internal electronic component.

Description

Embedded passive heat conduction case of computer
Technical Field
The utility model belongs to the technical field of the computer, concretely relates to embedded passive heat conduction machine case of computer.
Background
The embedded computer is a special computer technology, which is an application-specific computer technology, for example, for network, communication, audio, video, industrial control, etc., from the academic point of view, the embedded system is based on the computer technology and has tailorable software and hardware, and is suitable for a special computer system with strict requirements on functions, reliability, cost, volume and power consumption of the application system, and generally comprises four parts, namely an embedded microprocessor, peripheral hardware equipment, an embedded operating system and an application program of a user. The existing embedded computer can not be provided with other heat dissipation equipment due to the limitation of body type, is not beneficial to CPU heat dissipation after long-time working, and simultaneously, the tightness between a mounting plate and a box body is not strong when the embedded computer is mounted, thus influencing the work of the embedded computer.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a passive heat conduction machine case of embedded computer aims at solving among the prior art embedded computer because the size restriction, can not install other heat-radiating equipment, and long-time work is unfavorable for the CPU heat dissipation, and the mounting panel is not strong between the box compactness when installing embedded computer simultaneously, influences the problem of embedded computer work.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an embedded passive heat conduction machine case of computer, includes heat conduction machine case, heat conduction machine case openly top is equipped with a plurality of wiring holes, heat conduction machine case openly bottom is equipped with the CD inserted hole, heat conduction machine case openly one side is equipped with the jack, heat conduction machine case top is equipped with clearance mechanism through inlaying, heat conduction machine case both sides fixed mounting has fixed establishment, four ends of heat conduction machine case bottom are fixed and are equipped with the vibration damping rubber pad.
In order to make and dispel the heat to heat conduction machine case, as the utility model relates to an embedded computer passive heat conduction machine case is preferred, clearance mechanism is including inlaying the heat radiation fins who locates heat conduction machine roof portion, heat radiation fins top both sides fixed mounting has first radiator fan, first radiator fan top fixed mounting has the filter screen, there is the case lid at the filter screen top through bolt fixed mounting.
In order to make and clear up heat conduction machine incasement dust, conduct the utility model relates to an embedded computer passive heat conduction machine case is preferred, heat conduction machine case back inlays and is equipped with second radiator fan, second radiator fan one side block is connected with the dust collection ash box of straining, there is quick-witted case heating panel dust collection ash box one side of straining through bolt threaded connection.
In order to make things convenient for the installation of heat conduction machine case, as the utility model relates to an embedded computer passive heat conduction machine case is preferred, fixed establishment includes heat conduction machine case both sides fixed mounting's bearing frame, two the bearing frame is the L type, bearing frame one side top is equipped with the shock attenuation foam pad, bearing frame bottom one side is equipped with a plurality of fastening solenoids, the fastening solenoid top is equipped with the antislip strip.
In order to make each part normally work, as the utility model relates to an embedded computer passive heat conduction machine case is preferred, first radiator fan and second radiator fan all with computer internal power switch electric connection, computer internal power switch with for external power electric connection.
Compared with the prior art, the beneficial effects of the utility model are that:
1) the cleaning mechanism is arranged to enable outside air to enter the heat conduction case to cool the CUP, so that the problem that the normal work of a computer is influenced due to the overhigh temperature of the CUP is avoided, meanwhile, a second cooling fan is matched to enable air circulation to be formed in the heat conduction case, and meanwhile, the dust filtering and collecting box collects dust in the circulating air;
2) carry out simple location when being equipped with fixed establishment to the installation of heat conduction machine case, make things convenient for the installation of heat conduction machine case, keep the stability of heat conduction machine case, the shock attenuation foam pad that is equipped with reduces the harm of heat conduction machine case vibrations to internal electronic component.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the present invention;
FIG. 3 is a schematic structural view of the cleaning mechanism of the present invention;
fig. 4 is a schematic structural view of the fixing mechanism of the present invention;
in the figure: 1. a heat-conducting chassis; 2. a wiring hole; 3. a disk insertion opening; 4. a jack; 5. a cleaning mechanism; 51. heat dissipation fins; 52. a first heat dissipation fan; 53. a filter screen; 6. a case cover; 7. a second heat dissipation fan; 8. a dust filtering and collecting box; 9. a chassis heat dissipation plate; 10. a fixing mechanism; 101. a bearing frame; 102. a shock absorbing foam pad; 103. fastening a solenoid; 104. anti-slip strips; 11. shock-absorbing rubber pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides the following technical solutions: including heat conduction machine case 1, the positive top of heat conduction machine case 1 is equipped with a plurality of wiring holes 2, and the positive bottom of heat conduction machine case 1 is equipped with CD inserted hole 3, and the positive one side of heat conduction machine case 1 is equipped with jack 4, and 1 top of heat conduction machine case is equipped with clearance mechanism 5 through inlaying, and 1 both sides fixed mounting of heat conduction machine case has fixed establishment 10, and four end fixings in heat conduction machine case 1 bottom are equipped with rubber-shock absorber pad 11.
Preferably, the cleaning mechanism 5 includes heat dissipation fins 51 embedded in the top of the heat conduction chassis 1, first heat dissipation fans 52 are fixedly mounted on two sides of the top of the heat dissipation fins 51, a filter screen 53 is fixedly mounted on the top of the first heat dissipation fans 52, and the chassis cover 6 is fixedly mounted on the top of the filter screen 53 through bolts.
When the heat dissipation device is used specifically, the first heat dissipation fan 52 sucks the air at the top into the heat conduction case 1 to cool the heat absorbed by the heat dissipation fins 51, so as to reduce the working temperature of the CPU, and the filter screen 53 is arranged to filter the dust in the outside air, so as to prevent the dust from affecting the work of the internal electronic components.
Preferably, the back of the heat conduction case 1 is embedded with a second cooling fan 7, one side of the second cooling fan 7 is connected with a dust filtering and collecting box 8 in a clamping manner, and one side of the dust filtering and collecting box 8 is connected with a case cooling plate 9 through bolts and threads.
During the specific use, the hot air after the cooling of internal circulation is taken out by second radiator fan 7 and is arranged to dust filtration ash collecting box 8, and dust filtration ash collecting box 8 collects the dust in the internal air circulation, and removable quick-witted case heating panel 9 takes off the dust filtration ash collecting box 8 that second radiator fan 7 one side block is connected and washs during the clearance.
Preferably, the fixing mechanism 10 includes bearing frames 101 fixedly mounted on two sides of the heat conducting case 1, the two bearing frames 101 are L-shaped, a shock-absorbing foam pad 102 is disposed on the top of one side of the bearing frame 101, a plurality of fastening spiral tubes 103 are disposed on one side of the bottom of the bearing frame 101, and anti-slip strips 104 are disposed on the tops of the fastening spiral tubes 103.
During the specific use, put into external equipment with heat conduction machine case 1, fix heat conduction machine case 1 through fixed fastening solenoid 103, the antislip strip 104 that is equipped with fixes a position fastening solenoid 103, prevents to move when heat conduction machine case 1 is fixed, and the shock attenuation foam pad 102 that is equipped with reduces the harm of heat conduction machine case 1 vibrations to inside electronic component, improves the stability after heat conduction machine case 1 installs.
Preferably, the first heat dissipation fan 52 and the second heat dissipation fan 7 are both electrically connected to an internal power switch of the computer, and the internal power switch of the computer is electrically connected to an external power supply.
When the computer is used, the power of the first heat dissipation fan 52 and the second heat dissipation fan 7 can be connected to the internal power switch of the computer, so that the first heat dissipation fan 52 and the second heat dissipation fan 7 work normally.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (5)

1. The utility model provides an embedded computer passive heat conduction machine case, includes heat conduction machine case, its characterized in that: the heat-conducting case is characterized in that a plurality of wiring holes are formed in the top of the front face of the heat-conducting case, a compact disc insertion hole is formed in the bottom of the front face of the heat-conducting case, an insertion hole is formed in one side of the front face of the heat-conducting case, a cleaning mechanism is embedded in the top of the heat-conducting case, fixing mechanisms are fixedly mounted on the two sides of the heat-conducting case, and damping rubber pads are fixedly arranged at four ends of the bottom of the heat-conducting case.
2. The embedded computer passive heat conducting chassis of claim 1, wherein: the cleaning mechanism comprises radiating fins embedded in the top of the heat-conducting case, first radiating fans are fixedly mounted on two sides of the top of each radiating fin, a filter screen is fixedly mounted on the top of each first radiating fan, and a case cover is fixedly mounted on the top of each filter screen through bolts.
3. The embedded computer passive heat conducting chassis of claim 1, wherein: the heat conduction machine case back inlays and is equipped with second radiator fan, second radiator fan one side block is connected with the dust filtration ash collecting box, dust filtration ash collecting box one side has the quick-witted case heating panel through bolt threaded connection.
4. The embedded computer passive heat conducting chassis of claim 1, wherein: the fixing mechanism comprises bearing frames fixedly mounted on two sides of the heat conduction case, the two bearing frames are L-shaped, a shock absorption foam pad is arranged at the top of one side of each bearing frame, a plurality of fastening spiral tubes are arranged on one side of the bottom of each bearing frame, and anti-slip strips are arranged at the tops of the fastening spiral tubes.
5. The embedded computer passive heat conducting chassis of claim 2, wherein: the first cooling fan and the second cooling fan are both electrically connected with an internal power switch of the computer, and the internal power switch of the computer is electrically connected with an external power supply.
CN202120554537.8U 2021-03-18 2021-03-18 Embedded passive heat conduction case of computer Expired - Fee Related CN214225855U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120554537.8U CN214225855U (en) 2021-03-18 2021-03-18 Embedded passive heat conduction case of computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120554537.8U CN214225855U (en) 2021-03-18 2021-03-18 Embedded passive heat conduction case of computer

Publications (1)

Publication Number Publication Date
CN214225855U true CN214225855U (en) 2021-09-17

Family

ID=77694088

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120554537.8U Expired - Fee Related CN214225855U (en) 2021-03-18 2021-03-18 Embedded passive heat conduction case of computer

Country Status (1)

Country Link
CN (1) CN214225855U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210917

CF01 Termination of patent right due to non-payment of annual fee