CN214202021U - Camera lens module - Google Patents

Abstract

A camera lens module comprises a shell, a lens assembly, an actuator, a sensor assembly, a bottom plate and a heat dissipation structure. The shell is provided with a top surface side and a bottom surface side, wherein the top surface side and the bottom surface side are communicated to form an accommodating space. The lens assembly is arranged in the accommodating space and is fixed on the shell. An actuator is coupled to the lens assembly, the actuator including a movable substrate. The sensor assembly is connected to the actuator, and the sensor assembly includes an image sensing chip and a circuit board, wherein one side of the image sensing chip is connected to the movable substrate, and the other side of the image sensing chip is connected to the circuit board. The bottom plate is combined with the shell and positioned on the bottom surface side, and a spacing space is formed between the bottom plate and the circuit board. The heat dissipation structure comprises a heat dissipation material, and the heat dissipation structure is arranged in the interval space.

Description

Camera lens module

Technical Field

A lens module, and more particularly, to a camera lens module with heat dissipation and positioning functions.

Background

Camera lens modules are commonly used in video recording devices. In addition to the requirement of high pixel, the present people also require the efficiency of focusing and image compensation.

Because the camera lens module is moving rapidly (whether moving in the horizontal direction or moving in the vertical direction) under the focusing or image anti-shake compensation operation, the internal electronic components such as the image sensor need to input high power to light up, so a large amount of heat energy is generated, if the heat energy cannot be effectively dissipated, the efficiency of the camera lens module may be low, and the service cycle may also be reduced.

In addition, in some camera lens module production and assembly processes, when the probe is required to push the substrate to transmit signals, the substrate is often deviated or inclined by the pushing force, which is not favorable for producing the camera lens module.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a camera lens module of utensil heat dissipation, locate function is provided.

In order to achieve the above object, the present invention provides a camera lens module, which comprises a housing, a lens assembly, an actuator, a sensor assembly, a bottom plate and a heat dissipation structure.

The shell is provided with a top surface side and a bottom surface side, wherein the top surface side and the bottom surface side are communicated to form an accommodating space. The lens assembly is arranged in the accommodating space and is fixed on the shell. An actuator is coupled to the lens assembly, the actuator including a movable substrate. The sensor assembly is connected to the actuator, and the sensor assembly includes an image sensing chip and a circuit board, wherein one side of the image sensing chip is connected to the movable substrate, and the other side of the image sensing chip is connected to the circuit board. The bottom plate is combined with the shell and positioned on the bottom surface side, and a spacing space is formed between the bottom plate and the circuit board. The heat dissipation structure comprises a heat dissipation material, and the heat dissipation structure is arranged in the interval space.

In an embodiment of the camera lens module, the heat dissipation structure further includes a plurality of concave-convex structures disposed on a surface of the bottom plate facing the circuit board and defining a coating area, and the heat dissipation material is a fluid and is coated on the coating area.

In an embodiment of the camera lens module, the heat dissipation structure further includes a plurality of concave-convex structures, the concave-convex structures are disposed on a surface of the circuit board facing the bottom plate and define a coating area, and the heat dissipation material is a fluid and is coated on the coating area.

In an embodiment of the camera lens module, the heat dissipation structure further includes a plurality of retaining walls disposed on the surface of the bottom plate facing the circuit board and forming a heat dissipation area, and the heat dissipation material is disposed in the heat dissipation area.

In an embodiment of the camera lens module, the heat dissipation structure further includes a plurality of retaining walls disposed on a surface of the circuit board facing the bottom plate to form a heat dissipation area, and the heat dissipation material is disposed in the heat dissipation area.

In the camera lens module, in an embodiment, the heat dissipation material is a heat dissipation paste, a liquid metal, a metal layer, or damping oil.

In the camera lens module, in an embodiment, the heat dissipation material is a plurality of spheres, and the heat dissipation structure further includes a lubricant filled in the retaining wall.

In the camera lens module, in an embodiment, the plurality of balls are disposed on a surface of the base plate facing the circuit board and contact the circuit board.

In an embodiment of the camera lens module, the movable substrate has a plurality of metal contacts disposed at a lower end or an edge of the movable substrate, the signal transmitting portion is connected to the edge of the movable substrate via the metal contacts and extends, and the heat dissipation layer is disposed on a surface of the signal transmitting portion.

In the camera lens module, in an embodiment, the heat dissipation layer is made of graphene or a metal sheet.

The utility model discloses still provide a camera lens module of an embodiment, contain actuator, camera lens assembly, sensor assembly, signal transmission portion and heat dissipation layer.

The actuator comprises a fixed frame, wherein the fixed frame is provided with a top surface side and a bottom surface side, and the top surface side and the bottom surface side are communicated to form an accommodating space. The hollow shell is arranged in the fixed frame. The lens assembly is arranged in the accommodating space and is fixed on the fixed frame. The actuator is connected with the lens assembly, and the actuator further comprises a movable substrate, wherein the movable substrate is also provided with a plurality of metal contacts which are arranged at the lower end or the edge of the movable substrate. The sensor assembly is connected to the actuator, and the sensor assembly includes an image sensing chip and a circuit board, wherein one side of the image sensing chip is connected to the movable substrate, and the other side of the image sensing chip is connected to the circuit board. The signal transmission part is connected to the edge of the movable substrate through a metal contact and protrudes out of the fixed frame. The heat dissipation layer is laid on the surface of the signal transmission part.

The utility model discloses provide a camera lens module of embodiment in addition, contain actuator, camera lens assembly, sensor assembly and an at least probe.

The actuator comprises a fixed frame, wherein the fixed frame is provided with a top surface side and a bottom surface side, and the top surface side and the bottom surface side are communicated to form an accommodating space. The lens assembly is arranged in the accommodating space and is fixed on the fixed frame. The actuator is connected with the lens assembly and further comprises a movable substrate, the movable substrate bears the fixed frame, the movable substrate comprises a plurality of AF signal columns, and the AF signal columns are welded to the flexible electric conductors. The probe is used for pushing the flexible electric conductor to transmit the focusing signal. The sensor assembly is connected to the actuator.

In the camera lens module, in an embodiment, the flexible conductor is a conductive plate, and the conductive plate is attached to the surface of the actuator.

In the camera lens module, in an embodiment, the fixing frame is provided with a hole corresponding to the AF signal post, and the flexible conductor is a conductive plate extending from the hole and attached to the surface of the fixing frame.

The utility model discloses a camera lens module of an embodiment is provided again, contains actuator, camera lens assembly, sensor assembly, signal transmission portion, fixed plate and an at least probe.

The actuator comprises a fixed frame, wherein the fixed frame is provided with a top surface side and a bottom surface side, and the top surface side and the bottom surface side are communicated to form an accommodating space. The lens assembly is arranged in the accommodating space and is fixed on the fixed frame. The actuator is connected with the lens assembly and further comprises a movable substrate, the movable substrate carries the fixed frame, the movable substrate comprises a plurality of AF signal columns, and the AF signal columns are welded to the conducting wires. The sensor assembly is connected to the actuator. The movable substrate of the signal transmission part is provided with a plurality of metal contacts and arranged at the lower end or the edge of the movable substrate, the signal transmission part is connected with the edge of the movable substrate through the metal contacts and protrudes out of the fixed frame, and the signal transmission part is connected with the conducting wire. The fixed plate is provided with a plurality of signal contacts, the fixed plate is connected with the signal transmission part, and the probe is used for pushing the signal contacts of the fixed plate to transmit focusing signals.

In an embodiment of the camera lens module, the heat dissipation layer is disposed on a surface of the signal transmission portion.

The utility model has the beneficial effects that: through the camera lens module according to at least one embodiment of the present invention, the performance is good. In some embodiments, the heat dissipation structure is disposed in the space to effectively conduct and dissipate heat, thereby maintaining the operation performance of the camera lens module. In some embodiments, the problems of the prior art are solved by welding the AF signal column, so that the movable substrate is not deflected, inclined or inverted when the probe is pushed (a focusing signal is transmitted). Overall, the camera lens module of the present invention has benefits.

The present invention will be described in detail with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.

Drawings

Fig. 1 is a cross-sectional view of an embodiment of a camera lens module according to the present invention.

Fig. 2 is a schematic diagram illustrating a relationship between a heat dissipation structure and a bottom plate of an embodiment of the camera lens module of the present invention.

Fig. 3 is a schematic view illustrating a relationship between a heat dissipation structure and a bottom plate of an embodiment of the camera lens module of the present invention.

Fig. 4 is a schematic diagram illustrating a relationship between a heat dissipation structure and a circuit board according to an embodiment of the camera lens module of the present invention.

Fig. 5 is a schematic diagram illustrating a relationship between a heat dissipation structure and a circuit board according to an embodiment of the camera lens module of the present invention.

Fig. 6 is a schematic diagram illustrating a relationship between a heat dissipation structure and a circuit board according to an embodiment of the camera lens module of the present invention.

Fig. 7A is a schematic diagram illustrating a relationship between a heat dissipation structure and a circuit board according to an embodiment of the present invention.

Fig. 7B is a schematic diagram illustrating a relationship between a heat dissipation structure and a circuit board according to an embodiment of the camera lens module of the present invention.

Fig. 8 is a schematic diagram illustrating a relationship between a heat dissipation structure, a circuit board and a bottom plate according to an embodiment of the present invention.

Fig. 9 is an external view of the camera lens module according to an embodiment of the present invention.

Fig. 10A is an external view of an embodiment of a movable substrate according to the present invention.

Fig. 10B is an external view of the camera lens module according to an embodiment of the present invention.

Fig. 10C is an external view of the camera lens module according to an embodiment of the present invention.

Fig. 11 is an external view of the camera lens module according to an embodiment of the present invention.

Fig. 12 is an external view of a camera lens module according to an embodiment of the present invention.

Wherein, the reference numbers:

1: camera lens module

10: shell

101 top side

102 bottom surface side

103 opening of the mold

11: fixing frame

111 hole opening

12 lens assembly

13 actuator

131 movable substrate

14 sensor assembly

1411 AF Signal column

142 image sensing chip

143 circuit board

15: bottom plate

16 heat radiation structure

161 Heat dissipating material

162 concave-convex structure

163 retaining wall

164: sphere

165 lubricating liquid

166 first heat dissipation platform

167 second heat dissipation platform

17 space of the space

18 signal transmission part

19 heat dissipation layer

20: probe

30 flexible electric conductor

301 signal contact

40 electrically conductive wire

50: fixing plate

A1 coating zone

A2 heat dissipation area

S is a containing space

Detailed Description

The following describes the structural and operational principles of the present invention in detail with reference to the accompanying drawings:

fig. 1 is a cross-sectional view of an embodiment of a camera lens module 1 according to the present invention. The camera lens module 1 includes a housing 10, a lens assembly 12, an actuator 13, a sensor assembly 14, a base plate 15, and a heat dissipation structure 16 (see fig. 2 for details).

The housing 10 has a top surface side 101 and a bottom surface side 102, and the top surface side 101 and the bottom surface side 102 are communicated to form an accommodating space S. The lens assembly 12 is disposed in the accommodating space S and fixed in the housing 10. An actuator 13 is attached to the lens assembly 12, the actuator 13 including a movable substrate 131. The sensor assembly 14 is connected to the actuator 13, the sensor assembly 14 includes an image sensor chip 142 and a circuit board 143, and the image sensor chip 142 is connected to the movable substrate 131 on one side and to the circuit board 143 on the other side. The bottom plate 15 is coupled to the housing 10 and located on the bottom surface side 102, and a space 17 is provided between the bottom plate 15 and the circuit board 143. The heat dissipation structure 16 includes a heat dissipation material 161, and the heat dissipation structure 16 is disposed in the space 17. Here, since the heat dissipation structure 16 (the heat dissipation member 161) is disposed in the space 17, when the camera lens module 1 is operated, the heat dissipation can be assisted, so that the camera lens module 1 is not overheated to affect the operation efficiency (for example, the actuator 13 is operated to move the movable substrate 131 for image focusing and optical compensation), and the overheating may affect the image quality of the image sensor chip 142, i.e., noise may be generated.

Please refer to fig. 2 and fig. 3, which are schematic diagrams illustrating a relationship between the heat dissipation structure 16 and the bottom plate 15 according to an embodiment of the camera lens module 1 of the present invention. In the embodiment shown in fig. 2, the heat dissipation structure 16 further includes a plurality of concave-convex structures 162, and the concave-convex structures 162 are disposed on the surface of the bottom plate 15 facing the circuit board 143. The periphery of the concave-convex structure 162 defines a coating area a1, and the heat dissipation material 161 is a fluid that can be coated on the coating area a 1. The heat dissipation material 161 is, for example, heat dissipation paste, liquid metal, or damping oil, but is not limited thereto. Which in some embodiments may be a metal layer. The concave-convex structure 162 has an irregular distribution, and in some embodiments, may be made of metal, but not limited thereto, and in some embodiments, the concave-convex structure 162 is made of ceramic. The concave-convex structure 162 is used to restrict the liquid heat dissipation material 161 such as heat dissipation paste, liquid metal, etc. from flowing to the non-heat dissipation region, so that the concave-convex structure 162 reduces the flowing ability (increases the friction), and the concave-convex structure 162 can increase the contact area and enhance the heat dissipation effect.

In some embodiments, the concave-convex structure 162 can be constructed by the heat dissipation material 161 itself. In some embodiments, only the heat sink 161 is disposed in the space 17 without the concave-convex structure 162.

Referring to fig. 3, the difference from the embodiment shown in fig. 2 is that, in the embodiment shown in fig. 3, the concave-convex structure 162 is disposed on the surface of the circuit board 143 facing the bottom plate 15, and the periphery of the concave-convex structure 162 defines a coating area a1, and has a heat dissipation material 161 (fluid) coated on the coating area a 1.

Please refer to fig. 4 and fig. 5, which are schematic diagrams illustrating a relationship between the heat dissipation structure 16 and the circuit board 143 according to an embodiment of the camera lens module 1 of the present invention. In this embodiment, the heat dissipation structure 16 further includes a plurality of retaining walls 163, the retaining walls 163 are disposed on the surface of the bottom plate 15 facing the circuit board 143 and form a heat dissipation area a2, and the heat dissipation material 161 is disposed in the heat dissipation area a 2. The retaining wall 163 may be an extension of the material of the bottom plate 15, or may be formed of heat-resistant glue or sheet metal, and the present invention is not limited thereto. The heat dissipation material 161 may be, but is not limited to, a heat dissipation paste, a liquid metal, or damping oil, as described above. Referring to fig. 5, in this embodiment, the difference from the embodiment shown in fig. 4 is that the retaining wall 163 is disposed on the surface of the circuit board 143 facing the bottom plate 15, and the retaining wall 163 may be formed by extending the material of the circuit board 143, or by using heat-resistant glue, or by using a metal sheet, which is not limited in the present invention. Please refer to the above description for the heat dissipating material 161, which is not described herein.

Please refer to fig. 6, which is a schematic diagram illustrating a relationship between the heat dissipation structure 16 and the circuit board 143 according to an embodiment of the camera lens module 1 of the present invention. In this embodiment, the heat dissipation material 161 is a plurality of balls 164, and the heat dissipation structure 16 further includes a lubricant 165 located in the retaining wall 163, the retaining wall 163 can be disposed on the bottom plate 15, and can also be disposed on the circuit board 143. The retaining wall 163 can limit the ball 164 from rolling inside and falling out of the heat dissipation area a2, and the lubricant 165 can adhere to the surface of the ball 164 to buffer the friction of the ball 164 rolling. The ball 164 may be made of ceramic or metal. In some embodiments, the heat dissipation structure 16 does not contain the lubricant 165, and whether the lubricant 165 is used is considered according to the user's requirement, which is not limited by the present invention.

Fig. 7A and 7B are schematic diagrams of a relationship between the heat dissipation structure 16 and the circuit board 143 of an embodiment of the camera lens module 1 of the present invention. In the embodiment of fig. 7A, a plurality of balls 164 are disposed on the surface of the bottom plate 15 facing the circuit board 143, and contact the circuit board 143 through point contact. As shown in fig. 7A, the top of the sphere 164 contacts the circuit board 143. In the embodiment shown in fig. 7B, a plurality of balls 164 are disposed on the surface of the circuit board 143 facing the bottom plate 15, and the tops of the balls 164 contact the bottom plate 15. The ball 164 may be made of metal or ceramic material, so as to assist heat conduction and heat dissipation during the operation of the camera lens module 1.

Fig. 8 is a schematic diagram showing a relationship between the heat dissipation structure 16, the circuit board 143 and the bottom plate 15 according to an embodiment of the camera lens module 1 of the present invention. In this embodiment, the heat dissipation structure 16 includes a first heat dissipation platform 166 and a second heat dissipation platform 167, which are respectively disposed on the circuit board 143 and the bottom plate 15, wherein the surfaces of the first heat dissipation platform 166 and the second heat dissipation platform 167 are polished surfaces or mirror surfaces, and the smooth surfaces of the first heat dissipation platform 166 and the second heat dissipation platform are in contact with each other, so as to reduce friction generated during the operation of the camera lens module 1, which affects the anti-shake operation, and achieve the heat dissipation effect. In some embodiments, the first heat dissipation platform 166 and the second heat dissipation platform 167 are metal, however, the present invention is not limited thereto. In some materials that can achieve the purpose of heat dissipation, the surface of the material is smooth and flat, which is also the scope of protection of the present invention.

Please refer to fig. 9, which is an external view of the camera lens module 1 according to an embodiment of the present invention. The bottom plate 15 is omitted here for convenience of illustration. In this embodiment, the camera lens module 1 further includes a signal transmitting portion 18 and a heat dissipation layer 19, the movable substrate 131 has a plurality of metal contacts (not shown) disposed on an upper surface or an edge of the movable substrate 131, and the signal transmitting portion 18 is a flexible structure and has electrical and thermal conductivity. The signal transmitting portion 18 is connected to the edge of the movable substrate 131 via a metal contact, extends, and is disposed between the housing 10 and the actuator 13 (the fixed frame 11), the signal transmitting portion 18 is connected to a fixed plate 50 outside the housing 10, and the fixed plate 50 is made of a heat conductive material. Thus, the generated heat can be conducted to the outside when the camera lens module 1 is operated. In the embodiment shown in fig. 9, a heat dissipation layer 19 is further disposed on the surface of the signal transmission portion 18 to assist heat conduction and heat dissipation. In some embodiments, the heat dissipation layer 19 is graphene or a metal sheet.

In some embodiments, the camera lens module 1 is not provided with the spacing space 17, the appearance of the camera lens module 1 is similar to that of fig. 9, the movable substrate 131 has a plurality of metal contacts (not shown) for AF signal disposed at the lower end or edge of the movable substrate 131, the signal transmitting portion 18 is connected to the edge of the movable substrate 131 through the metal contacts to protrude out of the fixed frame 11 and have a certain gap with the fixed frame 11, and extends out of the housing 10 to dissipate heat through the connection of the fixed plate 50, or the surface of the signal transmitting portion 18 is laid with the heat dissipating layer 19 to further increase the heat dissipating effect. In other words, the utility model provides a heat radiation structure 16 of camera lens module 1 of a plurality of embodiments, the utility model discloses it is unlimited to have, looks at user's demand and selects the camera lens module 1 who is suitable for what kind of embodiments.

Referring to fig. 10A to 10C, fig. 10A is an external view of a movable substrate 131 according to an embodiment of the present invention. Fig. 10B is an external schematic view of the camera lens module 1 according to an embodiment of the present invention. Fig. 10C is an external schematic view of a camera lens module according to an embodiment of the present invention.

The camera lens module 1 includes a housing 10, a lens assembly 12, an actuator 13, a sensor assembly 14, and at least one probe 20. The actuator 13 includes a fixed frame 11, and the fixed frame 11 is an outer case of the actuator 13. For convenience of illustration, the housing 10 and the lens assembly 12 are omitted in fig. 10B. The detailed structure can be seen from the description of FIG. 1 and the related paragraphs.

As shown in fig. 10A and 10B, the actuator 13 further includes a movable substrate 131, the movable substrate 131 carries the fixed frame 11, the movable substrate 131 includes a plurality of AF signal pillars 1411, and the AF signal pillars 1411 are soldered to the flexible conductor 30. The probe 20 is used to push against the flexible electrical conductor 30 (signal contact 301) to transmit the focus signal. Since the AF signal column 1411 is soldered to the flexible conductor 30, the probe 20 can transmit the focusing signal after pushing the flexible conductor 30 (signal contact 301).

In the creation of the present invention, the probe 20 pushes the flexible conductor 30 (signal contact 301) to transmit the focusing signal, so that the movable substrate 131 will not be inclined or inverted by the pushing force, which will affect the variation of the camera lens module 1 during the assembling process.

As shown in fig. 10B, in this embodiment, the fixing frame 11 is provided with a hole 111 corresponding to the AF signal pillar 1411, the flexible conductor 30 is a conductive plate, extends from the hole 111 and is attached to the surface of the fixing frame 11, the flexible conductor 30 has a signal contact 301, and the probe 20 pushes the signal contact 301 of the flexible conductor 30 to transmit the focusing signal. In this embodiment, there are four probes 20.

The flexible conductor 30 is a conductive plate having a signal contact 301 attached to the surface of the fixed frame 11 of the actuator 13. The probe 20 pushes against the signal contact 301 on the surface of the fixed frame 11 to transmit the focus signal. The actuator 13 may be a Voice Coil Motor (VCM). In some embodiments, the actuator 13 is a linear memory metal (SMA) actuation based actuator.

As shown in fig. 10C, the difference from fig. 10B is that in this embodiment, the flexible conductive body 30 is welded to the AF signal column 1411, extends from the opening 103 of the housing 10 and is attached to the surface of the housing 10, and similarly, the flexible conductive body 30 has the signal contact 301, and the probe 20 pushes the signal contact 301 of the flexible conductive body 30 to transmit the focusing signal.

Please refer to fig. 11, which is an external view of the camera lens module 1 according to an embodiment of the present invention. The difference from the embodiment shown in fig. 10B is that the flexible conductors 30 are soldered to the AF signal posts 1411 of the movable substrate 131, extend outside the housing 10, and are connected to the fixed board 50. The signal contacts 301 are disposed on the fixing plate 50, so that the probes 20 push against the signal contacts 301 of the fixing plate 50 to transmit the focusing signal. In this embodiment, the flexible electrical conductor 30 is coated with a heat dissipation layer 19 to assist in heat dissipation.

Please refer to fig. 12, which is an external view of the camera lens module 1 according to an embodiment of the present invention. In this embodiment, the movable substrate 131 includes a plurality of AF signal pillars 1411, the AF signal pillars 1411 are soldered to a conductive line 40, and the signal transmission portion 18 is further connected to the conductive line 40. The conductive wire 40 may be connected to the signal transmission part 18 inside the housing 10. In this embodiment, the signal transmitting portion 18 is the flexible conductor 30, and the signal transmitting portion 18 (the flexible conductor 30) extends outside the housing 10 and is connected to the fixing plate 50. The conductive wire 40 is connected to the signal transmission unit 18 (the flexible conductor 30) outside the housing 10. The fixing plate 50 has signal contacts 301, and in this structure, the probes 20 push against the signal contacts 301 of the fixing plate 50 to transmit focusing signals. In addition, in this embodiment, a heat dissipation layer 19 is disposed on the surface of the signal transmission portion 18 (the flexible conductive body 30) to assist heat dissipation.

Through the camera lens module according to at least one embodiment of the present invention, the performance is good. In some embodiments, the heat dissipation structure is disposed in the space to effectively conduct and dissipate heat, thereby maintaining the operation performance of the camera lens module. In some embodiments, the problems of the prior art are solved by welding the AF signal column, so that the movable substrate is not deflected, inclined or inverted when the probe is pushed (a focusing signal is transmitted). Overall, the camera lens module of the present invention has benefits.

Naturally, the present invention can be embodied in many other forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be made by one skilled in the art without departing from the spirit or essential attributes thereof, and it is intended that all such changes and modifications be considered as within the scope of the appended claims.

Claims (16)

1. A camera lens module, comprising:

a shell having a top side and a bottom side, wherein the top side and the bottom side are communicated to form an accommodating space;

a lens assembly, which is arranged in the accommodating space and fixed on the shell;

an actuator coupled to the lens assembly, the actuator including a movable substrate;

a sensor assembly connected to the actuator, the sensor assembly including an image sensing chip and a circuit board, the image sensing chip having one side connected to the movable substrate and the other side connected to the circuit board;

a bottom plate combined with the shell and positioned on the bottom surface side, wherein a spacing space is arranged between the bottom plate and the circuit board; and

a heat dissipation structure, which comprises a heat dissipation material and is arranged in the space.

2. The camera lens module as claimed in claim 1, wherein the heat dissipation structure further includes a plurality of concave-convex structures disposed on a surface of the base plate facing the circuit board and defining a coating area, and the heat dissipation material is a fluid body coated on the coating area.

3. The camera lens module as claimed in claim 1, wherein the heat dissipation structure further includes a plurality of concave-convex structures disposed on a surface of the circuit board facing the bottom plate and defining a coating area, and the heat dissipation material is a fluid body coated on the coating area.

4. The camera lens module as claimed in claim 1, wherein the heat dissipation structure further includes a plurality of retaining walls disposed on the surface of the bottom plate facing the circuit board and forming a heat dissipation area, the heat dissipation material being disposed in the heat dissipation area.

5. The camera lens module as claimed in claim 1, wherein the heat dissipation structure further includes a plurality of retaining walls disposed on a surface of the circuit board facing the bottom plate and forming a heat dissipation area, the heat dissipation material being disposed in the heat dissipation area.

6. The camera lens module of claim 1, wherein the heat sink material is a heat sink paste, a liquid metal, a metal layer or a damping oil.

7. The camera lens module as claimed in claim 4 or 5, wherein the heat sink is a plurality of balls, and the heat sink further comprises a lubricant filled in the retaining walls.

8. The camera lens module as claimed in claim 7, wherein the balls are disposed on a surface of the base plate facing the circuit board and contact the circuit board.

9. The camera lens module as claimed in claim 1, further comprising a signal transmission portion and a heat dissipation layer, wherein the movable substrate has a plurality of metal contacts disposed on a lower surface or an edge of the movable substrate, the signal transmission portion is connected to the edge of the movable substrate via the metal contacts and extends, and the heat dissipation layer is disposed on a surface of the signal transmission portion.

10. The camera lens module of claim 9, wherein the heat dissipation layer is graphene or a metal sheet.

11. A camera lens module, comprising:

the actuator comprises a fixed frame, a first connecting piece and a second connecting piece, wherein the fixed frame is provided with a top surface side and a bottom surface side, and the top surface side and the bottom surface side are communicated to form an accommodating space;

a lens assembly, which is arranged in the accommodating space and fixed on the fixed frame; the actuator is connected with the lens assembly and also comprises a movable substrate, wherein the movable substrate is provided with a plurality of metal contacts and is arranged at the lower end or the edge of the movable substrate;

a sensor assembly connected to the actuator, the sensor assembly including an image sensing chip and a circuit board, the image sensing chip having one side connected to the movable substrate and the other side connected to the circuit board;

a signal transmission part connected to the edge of the movable substrate via the metal contacts and protruding out of the fixed frame; and

and the heat dissipation layer is laid on the surface of the signal transmission part.

12. A camera lens module, comprising:

the actuator comprises a fixed frame, a first connecting piece and a second connecting piece, wherein the fixed frame is provided with a top surface side and a bottom surface side, and the top surface side and the bottom surface side are communicated to form an accommodating space;

a lens assembly, which is arranged in the accommodating space and fixed on the fixed frame; the actuator is connected with the lens assembly and also comprises a movable substrate, the movable substrate bears the fixed frame, the movable substrate comprises a plurality of AF signal columns, and the AF signal columns are welded on a flexible electric conductor;

a sensor assembly connected to the actuator; and

at least one probe is used for pushing the flexible electric conductor to transmit a focusing signal.

13. The camera lens module as claimed in claim 12, wherein the flexible conductor is a conductive plate attached to the surface of the actuator.

14. The camera lens module as claimed in claim 12, wherein the fixing frame has a hole corresponding to the AF signal posts, and the flexible conductor is a conductive plate extending from the hole and attached to the surface of the fixing frame.

15. A camera lens module, comprising:

the actuator comprises a fixed frame, a first connecting piece and a second connecting piece, wherein the fixed frame is provided with a top surface side and a bottom surface side, and the top surface side and the bottom surface side are communicated to form an accommodating space;

a lens assembly, which is arranged in the accommodating space and fixed on the fixed frame; the actuator is connected with the lens assembly and also comprises a movable substrate, the movable substrate bears the fixed frame, the movable substrate comprises a plurality of AF signal columns, the AF signal columns are welded on a conducting wire, and the movable substrate is also provided with a plurality of metal contacts which are arranged at the lower end or the edge of the movable substrate;

a sensor assembly connected to the actuator;

a signal transmission part connected to the edge of the movable substrate via the metal contacts and protruding out of the fixed frame, the signal transmission part being connected to the conductive wire;

a fixing plate including a plurality of signal contacts, the fixing plate being connected to the signal transmitting portion; and

at least one probe is used for pushing the signal contacts of the fixing plate to transmit a focusing signal.

16. The camera lens module of claim 15, further comprising a heat dissipation layer disposed on a surface of the signal transmission portion.

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