CN214201237U - Wafer surface flaw detection system - Google Patents
Wafer surface flaw detection system Download PDFInfo
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- CN214201237U CN214201237U CN202120164536.2U CN202120164536U CN214201237U CN 214201237 U CN214201237 U CN 214201237U CN 202120164536 U CN202120164536 U CN 202120164536U CN 214201237 U CN214201237 U CN 214201237U
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Abstract
The utility model discloses a wafer surface flaw detection system, which comprises a base, a frame, an X-axis sliding table, a Y-axis sliding table, a crawler belt, an objective table, a spectrum confocal sensor, a Z-axis sliding table, a microscope system and a control circuit; the microscope system comprises an objective lens and a microscope body; the microscope system is fixed on the third slide block; the objective lens is fixed on the fixed block of the third slider and is over against the wafer; the spectrum confocal sensor is fixed on the fixed block of the third sliding block and is opposite to the upper part of the wafer; the spectrum confocal sensor is positioned right in front of the objective lens. Because the utility model adopts the spectrum confocal sensor to measure the distance in real time with high speed and high precision, the distance measuring time is short; the microscope system realizes automatic high-speed high-precision focusing through the cooperation of the spectrum confocal sensor and the control circuit, can ensure the definition of a real-time image, and realizes accurate judgment of defects on the surface of a wafer.
Description
Technical Field
The utility model relates to a wafer detection field especially relates to a wafer surface flaw detecting system.
Background
As semiconductor feature sizes become smaller and smaller, processing and measurement equipment becomes more advanced, so that the reduction of the wafer feature size makes the detection of wafer surface defects become more important.
The existing wafer surface flaw detection system cannot adjust the distance between a microscope objective and a wafer in real time according to the morphological characteristics of the wafer, is low in focusing precision, cannot ensure the definition of an image and cannot focus in advance, and therefore cannot realize quick and accurate judgment of the wafer surface flaws.
Therefore, the present invention provides a wafer surface flaw detection system.
SUMMERY OF THE UTILITY MODEL
The utility model provides a pair of can realize real-time range finding, high-speed high accuracy is focused, clear wafer surface flaw detecting system of image.
In order to achieve the above purpose, the technical solution of the present invention is as follows:
the utility model relates to a wafer surface flaw detection system, which comprises a base, a frame, an X-axis sliding table, a Y-axis sliding table, a crawler belt, an objective table, a spectrum confocal sensor, a Z-axis sliding table, a microscope system and a control circuit; the frame is fixed above the base;
the control circuit comprises a microprocessor, a spectrum confocal sensor, a first grating ruler and a feedback signal of a second grating ruler; and the microprocessor controls the first linear motor, the second linear motor, the non-contact linear motor and the microscope system according to the feedback signal to realize the precise control of displacement.
The X-axis sliding table comprises a marble X-bearing support, a first linear motor, a first grating scale, four first limiting buffers, two I-shaped first sliding rails parallel to each other and four first sliding blocks; the X bearing support is fixed on the upper surface of the base; the stator of the first linear motor, the first grating ruler and the first sliding rail are mutually parallel and fixed on the upper surface of the X bearing support; a rotor (not marked in the figure) of the first linear motor is connected with the Y-shaped bearing support; the first limiting buffer is fixed on the upper surface of the X bearing support; the two first sliding blocks are matched with one first sliding rail for use.
The Y-axis sliding table comprises a marble Y-bearing support, a second linear motor, a second grating scale, two second limiting buffers, two I-shaped second sliding rails parallel to each other and four second sliding blocks; the Y bearing support and the X bearing support are connected through a first sliding rail and a first sliding block to form sliding fit along the X axis direction; the stator of the second linear motor, the second grating ruler and the second sliding rail are mutually parallel and fixed on the upper surface of the Y bearing support; the second limiting buffer is fixed on the upper surface of the Y-shaped bearing support; the two second sliding blocks are matched with one second sliding rail for use.
The crawler belt is used for controlling wiring of a circuit and comprises a first crawler belt and a second crawler belt; two ends of the first crawler belt are fixedly connected with the base and the Y-shaped bearing support respectively; and two ends of the second crawler belt are fixedly connected with the Y bearing support and the carrying bearing respectively.
The object stage comprises an object bearing and a wafer tray; the carrying support and the Y bearing support are connected through a second sliding rail and a second sliding block to form sliding fit along the Y-axis direction; the wafer tray is provided with a U-shaped groove so as to facilitate taking and placing of the wafer.
The Z-axis sliding table comprises a non-contact linear motor, two stator fixing blocks, two third sliding rails and a third sliding block; the two stator fixing blocks are respectively fixed on the frame; the non-contact linear motor is positioned between the two third sliding rails, and two ends of a stator of the motor are respectively fixed on the two stator fixing blocks; and the third sliding block is connected with the rack through two third sliding rails to form sliding fit along the Z-axis direction.
The microscope system comprises an objective lens and a microscope body; the microscope system is fixed on the third slide block; the objective lens is fixed on the fixed block of the third slider and is over against the wafer.
The spectrum confocal sensor is fixed on the fixed block of the third sliding block and is opposite to the upper part of the wafer; the spectrum confocal sensor is positioned right in front of the objective lens.
After the scheme is adopted, because the utility model adopts the spectrum confocal sensor to measure the distance in real time with high speed and high precision, the distance measuring time is short (the distance measuring time is less than or equal to 1 ms); the control circuit realizes the precise displacement control of the X-axis sliding table, the Y-axis sliding table and the Z-axis sliding table through a feedback and control system; the microscope system realizes automatic high-speed high-precision focusing (focusing time is less than 10ms, and focusing precision is less than or equal to 0.2um) through the cooperation of the spectrum confocal sensor and the control circuit, can ensure the definition of a real-time image, and realizes accurate judgment of defects on the surface of a wafer.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Description of the reference symbols
The device comprises a base 1, a rack 2, an X-axis sliding table 3, a Y-axis sliding table 4, a crawler 5, an objective table 6, a spectrum confocal sensor 7, a Z-axis sliding table 8 and a microscope system 9;
the X-shaped bearing comprises an X-shaped bearing support 31, a first linear motor 32, a first grating ruler 33, a first limiting buffer 34, a first sliding rail 35 and a first sliding block 36;
a Y bearing support 41, a second linear motor 42, a second grating ruler 43, a second limiting buffer 44, a second sliding rail 45 and a second sliding block 46;
a carrier holder 61, a wafer tray 62;
a first crawler belt 51, a second crawler belt 52;
a stator fixing block 81, a third slide rail 82 and a third slide block 83;
an objective lens 91, a microscope body 92.
Detailed Description
As shown in fig. 1, the utility model relates to a wafer surface flaw detection system, which comprises a base 1, a frame 2, an X-axis sliding table 3, a Y-axis sliding table 4, a crawler 5, an object stage 6, a spectrum confocal sensor 7, a Z-axis sliding table 8, a microscope system 9 and a control circuit; the frame 2 is fixed above the base 1;
the control circuit comprises a microprocessor, a spectrum confocal sensor 7, a first grating ruler 33 and a feedback signal of a second grating ruler 43; the microprocessor controls the first linear motor 32, the second linear motor 42, the non-contact linear motor (not shown) and the microscope system 9 according to the feedback signals to realize the precise control of the displacement.
The X-axis sliding table 3 comprises a marble X-bearing support 31, a first linear motor 32, a first grating ruler 33, four first limiting buffers 34, two I-shaped first sliding rails 35 which are parallel to each other and four first sliding blocks 36; the X-shaped bearing support 31 is fixed on the upper surface of the base 1; the stator of the first linear motor 32, the first grating ruler 33 and the first slide rail 35 are parallel to each other and fixed on the upper surface of the X-bearing bracket 31; a mover (not shown) of the first linear motor 32 is connected to the Y bearing bracket 41; the first limit buffer 34 is fixed on the upper surface of the X-bearing support 31; two first sliders 36 are used in cooperation with one first slide rail 35.
The Y-axis sliding table 4 comprises a marble Y-shaped bearing support 41, a second linear motor 42, a second grating ruler 43, two second limiting buffers 44, two I-shaped second sliding rails 45 which are parallel to each other and four second sliding blocks 46; the Y bearing support 41 and the X bearing support 31 are connected through a first slide rail 35 and a first slide block 36 to form sliding fit along the X axis direction; the stator of the second linear motor 42, the second grating ruler 43 and the second slide rail 45 are parallel to each other and fixed on the upper surface of the Y bearing support 41; the second limit buffer 44 is fixed on the upper surface of the Y bearing support 41; two second sliding blocks 46 are used in cooperation with one second sliding rail 45.
The crawler 5 is used for wiring of a control circuit and comprises a first crawler 51, a second crawler 52; two ends of the first crawler belt 51 are fixedly connected with the base 1 and the Y-shaped bearing support 41 respectively; the two ends of the second crawler belt 52 are fixedly connected with the Y bearing support 41 and the carrying support 61 respectively.
The object stage 6 comprises an object bearing 61 and a wafer tray 62; the carrying support 61 and the Y bearing support 41 are connected through a second slide rail 45 and a second slide block 46 to form sliding fit along the Y-axis direction; the wafer tray 62 is provided with a U-shaped groove for facilitating the taking and placing of the wafer.
The Z-axis sliding table 8 comprises a non-contact linear motor (not shown in the figure), two stator fixing blocks 81, two third sliding rails 82 and a third sliding block 83; the two stator fixing blocks 81 are respectively fixed on the frame 2; the non-contact linear motor is positioned between the two third slide rails 82, and two ends of a stator of the motor are respectively fixed on the two stator fixing blocks 81; the third slider 83 is connected with the frame 2 through two third slide rails 82 to form a sliding fit along the Z-axis direction.
The microscope system 9 includes an objective lens 91, a microscope body 92; the microscope system 9 is fixed to the third slide 83; the objective lens 91 is fixed on the fixed block of the third slider 83 and faces the upper side of the wafer.
The spectrum confocal sensor 7 is fixed on the fixed block of the third slide block 83 and is opposite to the upper part of the wafer; the spectral confocal sensor 7 is located directly in front of the objective lens 91.
The working principle of the utility model is as follows:
referring to fig. 1, the present invention provides a method for detecting a wafer surface defect, comprising the following steps:
s1, system initialization: the X-axis sliding table 3, the Y-axis sliding table 4, the objective table 6, the Z-axis sliding table 8 and the microscope system 9 respectively run to initial positions; the detection system presets n test point positions in advance according to the test requirements of the wafer;
s2, preparing a wafer: placing the wafer to be detected on the wafer tray 62 through the manipulator;
s3, detecting wafer point 1: the spectrum confocal sensor 7 senses the thickness information of the wafer and feeds back a signal to the control circuit, and the microprocessor controls the movement of a non-contact linear motor (a Z-axis sliding table 8) according to the feedback signal and simultaneously drives the objective lens 91 to move to a proper position to ensure that the image is always clear;
s4, detecting wafer point 2-n: according to a preset point position, the control circuit controls the X-axis sliding table 3, the Y-axis sliding table 4 moves to a set position, meanwhile, the spectrum confocal sensor 7 senses thickness information of a wafer to achieve high-speed high-precision distance measurement, a feedback signal is fed back to the control circuit, the microprocessor controls the movement of a non-contact linear motor (Z-axis sliding table 8) according to the feedback signal, and meanwhile, the microprocessor drives the objective lens 91 to move to a proper position to ensure that an image is always clear;
s5, completing the test: the manipulator takes down the wafer to complete the wafer test;
and repeating the steps S1-S5 until all wafers are detected to be defective.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A wafer surface flaw detection system is characterized in that: the device comprises a base, a rack, an X-axis sliding table, a Y-axis sliding table, a crawler belt, an object stage, a spectrum confocal sensor, a Z-axis sliding table, a microscope system and a control circuit; the frame is fixed above the base; the control circuit comprises a microprocessor, a spectrum confocal sensor, a first grating ruler and a feedback signal of a second grating ruler; and the microprocessor controls the first linear motor, the second linear motor, the non-contact linear motor and the microscope system according to the feedback signal to realize the precise control of displacement.
2. The wafer surface defect detection system of claim 1, wherein: the X-axis sliding table comprises a marble X-bearing support, a first linear motor, a first grating scale, four first limiting buffers, two I-shaped first sliding rails parallel to each other and four first sliding blocks; the X bearing support is fixed on the upper surface of the base; the stator of the first linear motor, the first grating ruler and the first sliding rail are mutually parallel and fixed on the upper surface of the X bearing support; a rotor of the first linear motor is connected with the Y bearing support; the first limiting buffer is fixed on the upper surface of the X bearing support; the two first sliding blocks are matched with one first sliding rail for use.
3. The wafer surface defect detection system of claim 1, wherein: the Y-axis sliding table comprises a marble Y-bearing support, a second linear motor, a second grating scale, two second limiting buffers, two I-shaped second sliding rails parallel to each other and four second sliding blocks; the Y bearing support and the X bearing support are connected through a first sliding rail and a first sliding block to form sliding fit along the X axis direction; the stator of the second linear motor, the second grating ruler and the second sliding rail are mutually parallel and fixed on the upper surface of the Y bearing support; the second limiting buffer is fixed on the upper surface of the Y-shaped bearing support; the two second sliding blocks are matched with one second sliding rail for use.
4. The wafer surface defect detection system of claim 1, wherein: the object stage comprises an object bearing and a wafer tray; the carrying support and the Y bearing support are connected through a second sliding rail and a second sliding block to form sliding fit along the Y-axis direction; the wafer tray is provided with a U-shaped groove so as to facilitate taking and placing of the wafer.
5. The wafer surface defect detection system of claim 1, wherein: the Z-axis sliding table comprises a non-contact linear motor, two stator fixing blocks, two third sliding rails and a third sliding block; the two stator fixing blocks are respectively fixed on the frame; the non-contact linear motor is positioned between the two third sliding rails, and two ends of a stator of the motor are respectively fixed on the two stator fixing blocks; and the third sliding block is connected with the rack through two third sliding rails to form sliding fit along the Z-axis direction.
6. The wafer surface defect detection system of claim 1, wherein: the microscope system comprises an objective lens and a microscope body; the microscope system is fixed on the third slide block; the objective lens is fixed on the fixed block of the third slider and is over against the wafer.
7. The wafer surface defect detection system of claim 1, wherein: the spectrum confocal sensor is fixed on the fixed block of the third sliding block and is opposite to the upper part of the wafer; the spectrum confocal sensor is positioned right in front of the objective lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120164536.2U CN214201237U (en) | 2021-01-21 | 2021-01-21 | Wafer surface flaw detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120164536.2U CN214201237U (en) | 2021-01-21 | 2021-01-21 | Wafer surface flaw detection system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214201237U true CN214201237U (en) | 2021-09-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120164536.2U Active CN214201237U (en) | 2021-01-21 | 2021-01-21 | Wafer surface flaw detection system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214201237U (en) |
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2021
- 2021-01-21 CN CN202120164536.2U patent/CN214201237U/en active Active
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