CN214199919U - Thickness measuring device for PCB base plate based on high temperature resistant material - Google Patents
Thickness measuring device for PCB base plate based on high temperature resistant material Download PDFInfo
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- CN214199919U CN214199919U CN202023202914.6U CN202023202914U CN214199919U CN 214199919 U CN214199919 U CN 214199919U CN 202023202914 U CN202023202914 U CN 202023202914U CN 214199919 U CN214199919 U CN 214199919U
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- 239000000463 material Substances 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000003825 pressing Methods 0.000 claims description 33
- 238000005259 measurement Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- A Measuring Device Byusing Mechanical Method (AREA)
Abstract
The utility model relates to the technical field of PCB substrate production, in particular to a thickness measuring device for a PCB substrate based on high temperature resistant materials, which comprises a support plate, a scale rod and a spiral rod, wherein both sides of the top of the support plate are fixedly connected with connecting rods, the outer side of the central position of the connecting rods is provided with a first spring, a press plate is arranged right above the support plate, the bottom of the press plate is fixedly connected with a press block, both sides of the press plate are provided with limit holes which are bilaterally symmetrical, the connecting rods are arranged in the limit holes arranged on the press plate, in the utility model, the scale rod and the press block can be driven to conveniently move downwards through the arranged connecting rods, the first spring, the top plate and the press plate to fix and measure the PCB substrate, the thickness of the PCB substrate can be measured by reading the degree of the scale rod, and the PCB substrate can be directly placed on the support block to directly measure through the arrangement, the measuring efficiency is greatly improved, and the measuring time is saved.
Description
Technical Field
The utility model relates to a PCB base plate production technical field specifically is a thickness measurement device for PCB base plate based on high temperature resistant material.
Background
The substrate is a basic material for manufacturing the PCB, generally, the substrate is a copper clad laminate, a single-sided printed board and a double-sided printed board are manufactured by selectively processing hole processing, chemical copper plating, electrolytic copper plating, etching and the like on the substrate material-the copper clad laminate to obtain a required circuit pattern, the other type of multilayer printed board is manufactured by using an inner core thin copper clad laminate as a base and alternately laminating and bonding a conductive pattern layer and a prepreg together at one time to form interconnection among more than 3 conductive pattern layers, and the multilayer printed board has the functions of conduction, insulation and support, and the performance, quality, processability, manufacturing cost, manufacturing level and the like of the printed board depend on the substrate material to a great extent.
Traditional PCB base plate is directly measured through the micrometer when carrying out thickness measurement usually, and the micrometer often needs the staff to hold the PCB base plate when measuring this moment and measures, and this kind of mode tests each PCB base plate, and ten waste time and energy, consequently, proposes a thickness measurement device for PCB base plate based on high temperature resistant material to above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a thickness measurement device for PCB base plate based on high temperature resistant material to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a thickness measuring device for a PCB substrate based on high temperature resistant materials comprises a support plate, a scale rod and a spiral rod, wherein connecting rods are fixedly connected to two sides of the top of the support plate, a first spring is arranged on the outer side of the central position of each connecting rod, a pressing plate is arranged right above the support plate, pressing blocks are fixedly connected to the bottom of the pressing plate, limiting holes which are bilaterally symmetrical are formed in two sides of the pressing plate, connecting rods are arranged in the limiting holes formed in the pressing plate, a top plate is fixedly connected to the tops of the connecting rods, limiting chutes are formed in the top plate, the top plate is fixedly connected with a groove-shaped mechanical wheel through the limiting chutes, limiting grooves are formed in the outer sides of the groove-shaped mechanical wheel, limiting rods are arranged in the limiting grooves formed in the groove-shaped mechanical wheel, one side of each limiting rod is fixedly connected with the scale rod, a limiting plate is fixedly connected to the tops of the scale rods, and the bottoms of the scale rods are fixedly connected with the pressing plates, the support plate is characterized in that a limiting chute is formed in the central position of the support plate, a support block is arranged in the limiting chute formed in the central position of the support plate, a positioning rod is fixedly connected to the outer side of the support block, a screw rod is fixedly connected to the bottom of the support block, a second spring is arranged on the outer side of the screw rod, a knob is rotatably connected to the central position of the bottom of the support plate, a threaded hole is formed in the knob, the knob is fixedly connected with the screw rod through the threaded hole, a support rod is fixedly connected to the outer side of the bottom of the.
Preferably, a scale rod is arranged in a limiting sliding groove formed in the top plate, a limiting rod is arranged in the limiting sliding groove formed in the top plate, the top of the limiting rod is fixedly connected with a limiting plate, and the bottom of the limiting rod is fixedly connected with a pressing plate.
Preferably, the bottom of the first spring is fixedly connected with the pressing plate, the top of the first spring is fixedly connected with the top plate, the number of the first springs is two, and the two first springs are arranged symmetrically left and right relative to the scale rod.
Preferably, the number of the positioning rods is four, the positioning rods are uniformly distributed outside the supporting block, positioning grooves are uniformly distributed in the center of the supporting plate, and the positioning grooves are provided with the positioning rods.
Preferably, the top of the second spring is fixedly connected with the supporting block, the bottom of the second spring is fixedly connected with the supporting plate, a through hole is formed in the bottom of the central position of the supporting plate, and a screw rod is arranged in the through hole formed in the supporting plate.
Compared with the prior art, the beneficial effects of the utility model are that:
1. in the utility model, the scale rod and the pressing block can be driven to conveniently move downwards through the arranged connecting rod, the first spring, the top plate and the pressing plate, the PCB substrate is fixed and measured, the thickness of the PCB substrate can be measured by reading the degree of the scale rod, and the PCB substrate can be directly placed on the supporting block to be directly measured through the arrangement, so that the measuring efficiency is greatly improved, and the measuring time is saved;
2. the utility model discloses in, the height of adjustment supporting shoe that can make things convenient for quick through the knob and the hob that set up can carry out the zero calibration to this measuring device through the regulation to the supporting shoe height, makes this measuring device's measured value more accurate, can fix a position the supporting shoe through the locating lever that sets up and second spring and prevent the supporting shoe skew, makes the supporting shoe more stable.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the positioning rod mounting structure of the present invention;
FIG. 3 is a schematic view of the installation structure of the pressing block of the present invention;
FIG. 4 is a schematic view of the groove-shaped mechanical wheel of the present invention;
fig. 5 is a schematic structural diagram of a portion a of fig. 1 according to the present invention.
In the figure: 1. a support plate; 2. a top plate; 3. a support bar; 4. a base plate; 5. a graduated rod; 6. a limiting rod; 7. a limiting plate; 8. pressing a plate; 9. a connecting rod; 10. a first spring; 11. briquetting; 12. a groove-shaped mechanical wheel; 13. positioning a rod; 14. a screw rod; 15. a second spring; 16. a knob; 17. and (7) a supporting block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution:
a thickness measuring device for a PCB substrate based on high temperature resistant materials comprises a support plate 1, a scale rod 5 and a spiral rod 14, wherein both sides of the top of the support plate 1 are fixedly connected with connecting rods 9, the outer side of the central position of the connecting rods 9 is provided with a first spring 10, a pressing plate 8 is arranged right above the support plate 1, the bottom of the pressing plate 8 is fixedly connected with a pressing block 11, both sides of the pressing plate 8 are provided with bilaterally symmetrical limiting holes, the connecting rods 9 are arranged in the limiting holes of the pressing plate 8, the top of the connecting rods 9 is fixedly connected with a top plate 2, a limiting chute is arranged in the top plate 2, the top plate 2 is fixedly connected with a groove-shaped mechanical wheel 12 through the limiting chute, the outer side of the groove-shaped mechanical wheel 12 is provided with a limiting groove, a limiting rod 6 is arranged in the limiting groove of the groove-shaped mechanical wheel 12, one side of the limiting rod 6 is fixedly connected with the scale rod 5, the top of the scale rod 5 is fixedly connected with a limiting plate 7, and the bottom of the scale rod 5 is fixedly connected with the pressing plate 8, through this setting can be convenient to PCB substrate thickness memorability measurement, reduce measuring time, improve work efficiency, spacing spout has been seted up to 1 central point of backup pad department, be equipped with supporting shoe 17 in the spacing spout that 1 central point of backup pad department was established, supporting shoe 17 outside fixedly connected with locating lever 13, supporting shoe 17 bottom fixedly connected with hob 14, the hob 14 outside is equipped with second spring 15, 1 bottom central point of backup pad department rotates and is connected with knob 16, the screw hole has been seted up in knob 16, knob 16 passes through screw hole and 14 fixed connection of hob, 1 bottom outside fixedly connected with bracing piece 3 of backup pad, 3 bottom fixedly connected with bottom plates 4 of bracing piece.
The top plate 2 is provided with a limit chute which is internally provided with a scale rod 5, the top of the limit rod 6 is fixedly connected with a limit plate 7, the bottom of the limit rod 6 is fixedly connected with a pressing plate 8, the thickness of the PCB substrate can be conveniently measured through the arrangement, the bottom of a first spring 10 is fixedly connected with the pressing plate 8, the top of the first spring 10 is fixedly connected with the top plate 2, the number of the first springs 10 is two, the two first springs 10 are symmetrically arranged on the left and right of the scale rod 5, the PCB substrate can be automatically clamped through the arrangement, the thickness record detection of the PCB substrate is convenient, the number of the positioning rods 13 is four, the positioning rods 13 are uniformly distributed outside the support block 17, the central position of the support plate 1 is provided with uniformly distributed positioning grooves, the positioning rods 13 are arranged in the positioning grooves arranged in the support plate 1, and the support block 17 can be positioned through the arrangement, the supporting block 17 is more stable, the top of the second spring 15 is fixedly connected with the supporting block 17, the bottom of the second spring 15 is fixedly connected with the supporting plate 1, a through hole is formed in the bottom of the central position of the supporting plate 1, the spiral rod 14 is arranged in the through hole formed in the supporting plate 1, and the measuring device can be conveniently subjected to zeroing calibration through the arrangement, so that the measured value of the measuring device is more accurate.
The working process is as follows: when the thickness measuring device for the PCB substrate is used, firstly, the limiting plate 7 is dragged upwards, the limiting plate is driven to move upwards under the action of the limiting plate 7, the graduated rod 5 drives the pressing plate 8 to move upwards, the pressing rod 8 drives the pressing block 11 to move upwards at the moment, the pressing plate 8 slides upwards outside the supporting rod 3 at the same time, the first spring 10 is compressed, the first spring 10 generates elasticity, the PCB substrate with the thickness to be measured is prevented above the supporting block 17 at the moment, then the limiting plate 7 is slowly released, the pressing plate 8 is driven to move downwards under the action of the first spring 10, the limiting rod 6 slides in a groove arranged on the groove-shaped mechanical wheel 12 at the moment, the groove-shaped mechanical wheel 12 rotates to drive the limiting rod 6 to move downwards, the pressing block 11 is tightly connected with the PCB substrate under the action of the first spring 10 until the pressing block 11 is in contact with the PCB substrate, the scales at the junction of the top of the graduated rod 5 and the top plate 2 are observed, carry out the record, take out the PCB base plate after the record finishes, after this device uses for a long time, inevitable supporting shoe 17 can produce the displacement, lead to measuring inaccurately, rotate knob 16 this moment, hob 14 reciprocates under knob 16's effect, hob 14 drives supporting shoe 17 and reciprocates this moment, fix a position supporting shoe 17 through locating lever 13 this moment and prevent that supporting shoe 17 from taking place the skew, can make bracing piece 3 remove more stably through second spring 15 this moment, can promote clamp plate 18 downstream through first spring 10 simultaneously, observe scale bar 5 and roof 2 top juncture this moment, the correction finishes when the number of degrees is 0, stop rotating knob 16.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a thickness measurement device for PCB base plate based on high temperature resistant material, includes backup pad (1), scale rod (5) and hob (14), its characterized in that: the device is characterized in that connecting rods (9) are fixedly connected to two sides of the top of the supporting plate (1), first springs (10) are arranged on the outer sides of the central positions of the connecting rods (9), pressing plates (8) are arranged right above the supporting plate (1), pressing blocks (11) are fixedly connected to the bottoms of the pressing plates (8), limiting holes which are bilaterally symmetrical are formed in two sides of each pressing plate (8), the connecting rods (9) are arranged in the limiting holes formed in the pressing plates (8), top plates (2) are fixedly connected to the tops of the connecting rods (9), limiting chutes are formed in the top plates (2), groove-shaped mechanical wheels (12) are fixedly connected to the top plates (2) through the limiting chutes, limiting grooves are formed in the outer sides of the groove-shaped mechanical wheels (12), limiting rods (6) are arranged in the limiting grooves formed in the groove-shaped mechanical wheels (12), and one sides of the limiting rods (6) are fixedly connected with the scale rods (5), the top of the scale rod (5) is fixedly connected with a limit plate (7), the bottom of the scale rod (5) is fixedly connected with a pressure plate (8), a limiting chute is arranged at the central position of the supporting plate (1), a supporting block (17) is arranged in the limiting chute arranged at the central position of the supporting plate (1), a positioning rod (13) is fixedly connected with the outer side of the supporting block (17), a screw rod (14) is fixedly connected with the bottom of the supporting block (17), a second spring (15) is arranged on the outer side of the screw rod (14), a knob (16) is rotatably connected at the central position of the bottom of the support plate (1), a threaded hole is formed in the knob (16), the knob (16) is fixedly connected with the screw rod (14) through the threaded hole, the supporting plate is characterized in that a supporting rod (3) is fixedly connected to the outer side of the bottom of the supporting plate (1), and a bottom plate (4) is fixedly connected to the bottom of the supporting rod (3).
2. The thickness measuring device for the PCB substrate based on the high temperature resistant material as claimed in claim 1, wherein: be equipped with scale rod (5) in the spacing spout that roof (2) were established, be equipped with gag lever post (6) in the spacing spout that roof (2) were established, gag lever post (6) top and limiting plate (7) fixed connection, gag lever post (6) bottom and clamp plate (8) fixed connection.
3. The thickness measuring device for the PCB substrate based on the high temperature resistant material as claimed in claim 1, wherein: the bottom of the first spring (10) is fixedly connected with the pressing plate (8), the top of the first spring (10) is fixedly connected with the top plate (2), the number of the first springs (10) is two, and the first springs (10) are arranged symmetrically left and right relative to the scale rod (5).
4. The thickness measuring device for the PCB substrate based on the high temperature resistant material as claimed in claim 1, wherein: the number of the positioning rods (13) is four, the positioning rods (13) are uniformly distributed outside the supporting block (17), positioning grooves which are uniformly distributed are formed in the central position of the supporting plate (1), and the positioning rods (13) are arranged in the positioning grooves formed in the supporting plate (1).
5. The thickness measuring device for the PCB substrate based on the high temperature resistant material as claimed in claim 1, wherein: the top of the second spring (15) is fixedly connected with the supporting block (17), the bottom of the second spring (15) is fixedly connected with the supporting plate (1), a through hole is formed in the bottom of the central position of the supporting plate (1), and a screw rod (14) is arranged in the through hole formed in the supporting plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023202914.6U CN214199919U (en) | 2020-12-25 | 2020-12-25 | Thickness measuring device for PCB base plate based on high temperature resistant material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023202914.6U CN214199919U (en) | 2020-12-25 | 2020-12-25 | Thickness measuring device for PCB base plate based on high temperature resistant material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214199919U true CN214199919U (en) | 2021-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023202914.6U Active CN214199919U (en) | 2020-12-25 | 2020-12-25 | Thickness measuring device for PCB base plate based on high temperature resistant material |
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| Country | Link |
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| CN (1) | CN214199919U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466518A (en) * | 2022-04-13 | 2022-05-10 | 深圳市中电网络技术有限公司 | Be used for high-accuracy circuit board fixed equipment |
-
2020
- 2020-12-25 CN CN202023202914.6U patent/CN214199919U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466518A (en) * | 2022-04-13 | 2022-05-10 | 深圳市中电网络技术有限公司 | Be used for high-accuracy circuit board fixed equipment |
| CN114466518B (en) * | 2022-04-13 | 2022-06-28 | 深圳市中电网络技术有限公司 | Be used for high-accuracy circuit board fixed equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No.11-3, Hongyi Road, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Synchronous Electronic Technology Co.,Ltd. Country or region after: China Address before: No.11-3, Hongyi Road, Wuxi City, Jiangsu Province, 214000 Patentee before: P.C.B.A. ELECTRONIC (WUXI) LTD. Country or region before: China |
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| CP03 | Change of name, title or address |