CN214193506U - Electroplating device with positioning structure for hardware processing - Google Patents

Abstract

The utility model discloses a hardware processing is with electroplating device that has location structure, including main part, filtering duct and coating bath, the top of main part is provided with the support, and the top of support is fixed with the stopper, the coating bath sets up in the inside of main part, and the inside arrangement of coating bath has the mount. This electroplating device that hardware processing was with having location structure is provided with rabbling mechanism, the effect of rabbling mechanism is with constantly renewing the negative pole membrane (renew the positive pole membrane under some circumstances), therefore can obtain careful cladding material under higher deposition rate, and in the aspect of clean, can help driving away the filth granule on the part, the grease that often washes the solution, guarantee to contact with fresh solution, will spout excellent top end trachea mouth and gas-supply pipe erection joint, gaseous will directly spout from first orifice and second orifice department respectively, accomplish the stirring to the plating solution in the coating bath, and this design is applicable to very deep groove, in order to prevent the solution layering, make solution concentration keep even from beginning to end.

Description

Electroplating device with positioning structure for hardware processing

Technical Field

The utility model relates to an electroplate device technical field, specifically be a hardware processing is with electroplating device that has location structure.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis, thereby playing the roles of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like, and an electroplating device plays an important role in the process of hardware processing.

Inside plating solution is static in the electroplating device use in market, can't accomplish to renew cathode film etc. and lead to electroplating efficiency comparatively low to influenced the holistic work efficiency of device, and electroplating device in the electroplating process of hardware, often directly throw it into the coating bath, brought the trouble for staff's the process of taking, for this reason, we propose such hardware processing with the electroplating device who has location structure.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a hardware processing is with electroplating device that has location structure to inside plating solution is static in the electroplating device use that proposes in solving above-mentioned background art, can't accomplish to update negative pole membrane etc. leads to electroplating efficiency comparatively low, thereby has influenced the holistic work efficiency of device, and electroplates the device in the electroplating process of hardware, often directly throws it into the coating bath, has brought troublesome problem for staff's the process of taking.

In order to achieve the above object, the utility model provides a following technical scheme: an electroplating device with a positioning structure for hardware processing comprises a main body, a filtering pipeline and a plating tank, wherein a support is arranged above the main body, a limiting block is fixed at the top of the support, a placing groove is arranged on the outer wall of the support, a cathode bar is arranged on the inner side of the placing groove, a rotating shaft is arranged below the placing groove, a placing plate is fixed at the tail end of the rotating shaft, a stirring mechanism is arranged above the placing plate, an anode bar is arranged below the rotating shaft, the plating tank is arranged inside the main body, a fixing frame is arranged inside the plating tank, a sliding groove is arranged inside the fixing frame, a movable frame is arranged outside the fixing frame, a sliding block is fixed on the inner side of the movable frame, a hook is arranged on the outer wall of the movable frame, the filtering pipeline is arranged at the right end of the plating tank, and the tail end of the filtering pipeline is connected with a filter, a motor is arranged below the filter.

Preferably, the stirring mechanism comprises a branch frame, a gas pipe, a spray rod, a gas pipe opening, a first spray hole, a sealing screw seat and a second spray hole, the second spray hole is formed in the branch frame, the spray rod is fixed to the top end of the branch frame, the first spray hole is formed in the spray rod, the gas pipe opening is formed in the upper portion of the spray rod, the gas pipe is connected to the tail end of the gas pipe opening, and the sealing screw seat is installed at two ends of the spray rod.

Preferably, the first spray holes are equally distributed in the spray rod, two groups of branch brackets are arranged, and the branch brackets are symmetrically distributed about the vertical center line of the spray rod.

Preferably, the couple is provided with three groups, and every group of couple is provided with threely, and the couple passes through the outer wall connection of welding and adjustable shelf moreover, and the axis of couple coincides mutually with the axis of adjustable shelf simultaneously.

Preferably, the upper surface of the placing plate is tightly attached to the outer surface of the sealing screw seat, and the placing plate and the support form a rotating structure through a rotating shaft.

Preferably, the movable frame is fixedly connected with the sliding block, and the movable frame is matched with the sliding groove through the sliding block to form a sliding structure.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the electroplating device with the positioning structure for hardware processing is provided with a stirring mechanism, the stirring mechanism is used for constantly updating a cathode film (updating an anode film under certain conditions), so that a fine coating can be obtained at a higher deposition speed, dirt particles on a part can be driven away in the aspect of cleaning, dissolved grease is frequently washed, contact with a fresh solution is guaranteed, meanwhile, an air pipe opening at the top end of a spray rod is connected with an air pipe in an installing mode, gas is directly sprayed out from a first spray hole and a second spray hole respectively, stirring of electroplating solution in a plating tank is completed, and the design is suitable for a deep tank, so that solution layering is prevented, and the concentration of the solution is kept uniform all the time;

2. the three groups of hooks are arranged, each group of hooks is three, the hooks are connected with the outer wall of the movable frame through welding, the central axes of the hooks coincide with the central axes of the movable frame, workers can directly hang hardware on the hooks, the workers can conveniently take and place, the operation is convenient, the practicability is high, the upper surface of the placing plate is tightly attached to the outer surface of the sealing screw seat, the placing plate and the support form a rotating structure through a rotating shaft, the direction and the position of the placing plate can be adjusted through the rotating shaft, the placing plate has good flexibility, the placing plate is rotated to the inner side of the support, and the stirring mechanism can be directly placed above the placing plate;

3. be fixed connection between adjustable shelf and the slider, and the adjustable shelf is mutually supported through slider and spout and is constituted sliding structure, slides the adjustable shelf to the mount top through the slip slider, and the staff can hang the hardware this moment and put, and has avoided the contact of staff's hand with the plating solution in the operation process, has avoided the harm etc. that the plating solution brought to the hand.

Drawings

FIG. 1 is a schematic view of the front perspective structure of the present invention;

FIG. 2 is a schematic sectional view of the hanging rack of the present invention;

fig. 3 is a schematic view of the three-dimensional structure of the stirring mechanism of the present invention.

In the figure: 1. a main body; 2. an anode rod; 3. a stirring mechanism; 301. a branch frame; 302. a gas delivery pipe; 303. Spraying a rod; 304. an air pipe opening; 305. a first nozzle hole; 306. sealing the screw seat; 307. a second nozzle hole; 4. A rotating shaft; 5. a cathode bar; 6. a placement groove; 7. a support; 8. a limiting block; 9. placing the plate; 10. a filter; 11. a filtration pipeline; 12. a motor; 13. plating bath; 14. a chute; 15. a movable frame; 16. hooking; 17. a slider; 18. a fixing frame.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: an electroplating device with a positioning structure for hardware processing comprises a main body 1, a filtering pipeline 11 and a plating tank 13, wherein a bracket 7 is arranged above the main body 1, a limiting block 8 is fixed at the top of the bracket 7, a placing groove 6 is arranged on the outer wall of the bracket 7, a cathode bar 5 is arranged on the inner side of the placing groove 6, a rotating shaft 4 is arranged below the placing groove 6, a placing plate 9 is fixed at the tail end of the rotating shaft 4, a stirring mechanism 3 is arranged above the placing plate 9, an anode bar 2 is arranged below the rotating shaft 4, the plating tank 13 is arranged in the main body 1, a fixed frame 18 is arranged in the plating tank 13, a sliding groove 14 is arranged in the fixed frame 18, a movable frame 15 is arranged on the outer side of the fixed frame 18, a sliding block 17 is fixed on the inner side of the movable frame 15, a hook 16 is arranged on the outer wall of the movable frame 15, the filtering pipeline 11 is arranged at the right end of the plating tank 13, the tail end of the filtering pipeline 11 is connected with a filter 10, and a motor 12 is arranged below the filter 10;

the stirring mechanism 3 comprises a branch frame 301, a gas pipe 302, a spray rod 303, a gas pipe opening 304, a first spray hole 305, a sealing screw seat 306 and a second spray hole 307, the second spray hole 307 is arranged in the branch frame 301, the spray rod 303 is fixed at the top end of the branch frame 301, the first spray hole 305 is arranged in the spray rod 303, the gas pipe opening 304 is arranged above the spray rod 303, the gas pipe 302 is connected with the tail end of the gas pipe opening 304, the sealing screw seats 306 are arranged at two ends of the spray rod 303, the first spray holes 305 are uniformly distributed in the spray rod 303, the branch frame 301 is provided with two groups, the branch frame 301 is symmetrically distributed about the vertical central line of the spray rod 303, the stirring mechanism 3 is used for continuously updating a cathode film (updating an anode film under certain conditions), so that a fine coating can be obtained at a high deposition speed, and dirt particles on other parts can be removed in the aspect of cleaning, the dissolved grease is washed frequently to ensure the grease to contact with the fresh solution, meanwhile, the air pipe opening 304 at the top end of the spray rod 303 is connected with the air pipe 302 in an installing way, the air is respectively and directly sprayed out from the first spray hole 305 and the second spray hole 307 to complete the stirring of the electroplating solution in the plating tank 13, and the design is suitable for a deep tank to prevent the solution from layering and keep the concentration of the solution uniform all the time;

the three groups of hooks 16 are arranged, each group of hooks 16 is three, the hooks 16 are connected with the outer wall of the movable frame 15 through welding, meanwhile, the central axis of each hook 16 is coincided with the central axis of the movable frame 15, and workers can directly hang hardware on the hooks 16, so that the workers can conveniently take and place, and the operation is convenient and the practicability is strong;

the upper surface of the placing plate 9 is tightly attached to the outer surface of the sealing screw seat 306, the placing plate 9 and the bracket 7 form a rotating structure through the rotating shaft 4, the direction and the position of the placing plate 9 are adjusted through rotating the rotating shaft 4, the flexibility is good, the placing plate 9 is rotated to the inner side of the bracket 7, and the stirring mechanism 3 can be directly arranged above;

be fixed connection between adjustable shelf 15 and the slider 17, and adjustable shelf 15 mutually supports through slider 17 and spout 14 and constitutes sliding construction, slides adjustable shelf 15 to mount 18 top through sliding slider 17, and the staff can hang the hardware this moment and put, and has avoided the contact of staff's hand with the plating solution in the operation process, has avoided the harm etc. that the plating solution brought to the hand.

The working principle is as follows: for the electroplating device with the positioning structure for hardware processing, firstly, electroplating solution is poured into the plating tank 13, then the anode rod 2 and the cathode rod 5 are sequentially placed into the plating tank 13, the gas pipe opening 304 at the top end of the stirring mechanism 3 is connected with the gas pipe 302 in an installing manner and is placed into the plating tank 13, gas is directly sprayed out from the first spray hole 305 and the second spray hole 307 respectively to complete the stirring of the electroplating solution in the plating tank 13, so that the solution is prevented from layering, the solution concentration is kept uniform all the time, the movable frame 15 is slid to the upper part of the fixed frame 18 through the sliding block 17, a worker can hang the hardware at the moment, the contact between the hand of the worker and the electroplating solution is avoided in the operation process, the damage of the electroplating solution to the hand and the like are avoided, the sliding block 17 is used for sliding the movable frame 15 into the plating tank 13 again to enable the hardware to complete the electroplating process in the electroplating solution, after the electroplating is finished, a user can take out the anode rod 2 and the cathode rod 5 and directly place the anode rod in the placing groove 6, the placing plate 9 is rotated to the inner side of the support 7 through the rotating shaft 4, the stirring mechanism 3 is directly placed on the support 7, and the using process of the electroplating device with the positioning structure for the whole hardware processing is finished.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a hardware processing is with electroplating device who has location structure, includes main part (1), filtering duct (11) and coating bath (13), its characterized in that: a support (7) is arranged above the main body (1), a limiting block (8) is fixed at the top of the support (7), a placing groove (6) is arranged on the outer wall of the support (7), a cathode bar (5) is arranged on the inner side of the placing groove (6), a rotating shaft (4) is arranged below the placing groove (6), a placing plate (9) is fixed at the tail end of the rotating shaft (4), a stirring mechanism (3) is arranged above the placing plate (9), an anode bar (2) is arranged below the rotating shaft (4), a plating tank (13) is arranged inside the main body (1), a fixing frame (18) is arranged inside the plating tank (13), a sliding groove (14) is arranged inside the fixing frame (18), a movable frame (15) is arranged outside the fixing frame (18), and a sliding block (17) is fixed on the inner side of the movable frame (15), and the outer wall of the movable frame (15) is provided with a hook (16), the filtering pipeline (11) is arranged at the right end of the plating tank (13), the tail end of the filtering pipeline (11) is connected with a filter (10), and a motor (12) is arranged below the filter (10).

2. The electroplating device with the positioning structure for hardware processing according to claim 1, wherein: the stirring mechanism (3) comprises a branch frame (301), an air pipe (302), a spray rod (303), an air pipe opening (304), a first spray hole (305), a sealing screw seat (306) and a second spray hole (307), the second spray hole (307) is formed in the branch frame (301), the spray rod (303) is fixed to the top end of the branch frame (301), the first spray hole (305) is formed in the spray rod (303), the air pipe opening (304) is arranged above the spray rod (303), the air pipe (302) is connected to the tail end of the air pipe opening (304), and the sealing screw seats (306) are installed at two ends of the spray rod (303).

3. The electroplating device with the positioning structure for hardware processing according to claim 2, wherein: the first spray holes (305) are uniformly distributed in the spray rod (303), two groups of branch brackets (301) are arranged, and the branch brackets (301) are symmetrically distributed about the vertical center line of the spray rod (303).

4. The electroplating device with the positioning structure for hardware processing according to claim 1, wherein: couple (16) are provided with three groups, and couple (16) every group is provided with threely, and couple (16) are connected through the outer wall of welding and adjustable shelf (15) moreover, and the axis of couple (16) coincides mutually with the axis of adjustable shelf (15) simultaneously.

5. The electroplating device with the positioning structure for hardware processing according to claim 1, wherein: the upper surface of the placing plate (9) is tightly attached to the outer surface of the sealing screw seat (306), and the placing plate (9) and the support (7) form a rotating structure through the rotating shaft (4).

6. The electroplating device with the positioning structure for hardware processing according to claim 1, wherein: the movable frame (15) is fixedly connected with the sliding block (17), and the movable frame (15) is matched with the sliding groove (14) through the sliding block (17) to form a sliding structure.

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