CN214176015U - Schottky diode - Google Patents
Schottky diode Download PDFInfo
- Publication number
- CN214176015U CN214176015U CN202120078204.2U CN202120078204U CN214176015U CN 214176015 U CN214176015 U CN 214176015U CN 202120078204 U CN202120078204 U CN 202120078204U CN 214176015 U CN214176015 U CN 214176015U
- Authority
- CN
- China
- Prior art keywords
- heating panel
- schottky diode
- heat dissipation
- heat
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 50
- 230000017525 heat dissipation Effects 0.000 claims description 38
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 21
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 230000002349 favourable effect Effects 0.000 abstract description 5
- 239000003570 air Substances 0.000 abstract 1
- 239000012080 ambient air Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 7
- 239000004519 grease Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004347 surface barrier Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a technical field of diode especially relates to a schottky diode, and the bottom of body is provided with the pin, and the transversal D of personally submitting of body appears, is provided with the heating panel on the arcwall face of body, and the transversal wave setting of personally submitting of heating panel is formed with the channel between heating panel and the body. Through set up the heating panel in the body outside, be convenient for improve schottky diode's radiating effect, especially the wave setting is personally submitted in the cross section of heating panel, the inboard heat of the heating panel of being convenient for outwards gives off to be favorable to the heating panel outside cold air to flow into the heating panel inboard, make whole heating panel ambient air flow more even, better take away the heat of body transmission, thereby improve schottky diode's radiating effect.
Description
Technical Field
The application relates to the technical field of diodes, in particular to a Schottky diode.
Background
The schottky diode is named by its inventor schottky doctor, SBD is short for schottky barrier diode, SBD is not made by using P-type semiconductor and N-type semiconductor contact to form PN junction principle, but by using metal-semiconductor junction principle formed by metal and semiconductor contact, so SBD is also called metal-semiconductor (contact) diode or surface barrier diode, which is a hot carrier diode.
However, during the use of the schottky diode, the conductivity of the schottky diode is easily affected by the temperature, and the relative variation of the stable voltage of the schottky diode is greatly changed along with the temperature increase. Meanwhile, the reverse current of the Schottky diode is easily influenced by the change of the temperature, the smaller the reverse current of the Schottky diode is, the better the one-way conductivity of the Schottky diode is, but when the temperature of the Schottky diode rises, the reverse current of the Schottky diode is increased, so that the one-way conductivity of the Schottky diode is influenced.
In view of the above-described related art, the inventors consider that the following drawbacks exist: the schottky diode has the problem of insufficient heat dissipation, so that the service life and the conductivity of the schottky diode are easily influenced.
SUMMERY OF THE UTILITY MODEL
In order to facilitate improving the heat dissipation effect of the Schottky diode, the application provides the Schottky diode.
The application provides a schottky diode adopts following technical scheme:
the utility model provides a schottky diode, includes the body, the bottom of body is provided with the pin, the transversal D shape of personally submitting of body, be provided with the heating panel on the arcwall face of body, the transversal wave setting of personally submitting of heating panel, be formed with the channel between heating panel and the body.
Through adopting above-mentioned technical scheme, through the setting of heating panel, and the transversal wave setting of personally submitting of heating panel, the inboard heat of the heating panel of being convenient for outwards gives off, and is favorable to the heating panel outside cold air inflow heating panel inboard for the air current flows more evenly around the whole heating panel, better takes away the heat of body transmission, is convenient for improve the radiating effect of body.
Preferably, a heat conducting sheet is arranged between the heat dissipation plate and the body.
Through adopting above-mentioned technical scheme, the heat conduction effect of conducting strip is good, is convenient for improve the heat transfer efficiency of conducting strip, and then improves the radiating effect of body.
Preferably, the body is provided with an installation groove, and the heat conducting fins are arranged in the installation groove.
By adopting the technical scheme, the heat conducting fins are arranged in the mounting grooves, so that the contact area between the heat conducting fins and the mounting grooves is increased, and the heat transfer efficiency of the heat conducting fins is improved; on the other hand, the connection stability of the heat-conducting fin is improved.
Preferably, the radiating plate extends to form a radiating side plate, and the radiating side plate is abutted to the plane of the body.
Through adopting above-mentioned technical scheme, the area of contact between body and the heating panel is further increased in the setting of heat dissipation curb plate, and then improves the radiating effect of body.
Preferably, the heat dissipation plate is provided with a plurality of heat dissipation holes.
Through adopting above-mentioned technical scheme, the radiating effect of schottky diode is further convenient for improve in the setting of louvre.
Preferably, the heat dissipation plate is made of an aluminum plate or a copper plate.
By adopting the technical scheme, the heat dissipation plate adopts the aluminum plate or the copper plate, so that the heat dissipation plate has good heat conductivity and is further convenient to improve the heat dissipation effect;
on the other hand, the aluminum plate or the copper plate has good pressure bearing performance, so that the body can be further supported and fixed.
Preferably, the heat dissipation plate is provided in plurality and uniformly distributed in a vertical direction.
Through adopting above-mentioned technical scheme, the heating panel is equipped with a plurality ofly, can further be convenient for improve the radiating effect of body.
Preferably, an air duct is formed between two adjacent heat dissipation plates.
Through adopting above-mentioned technical scheme, the setting in wind channel, the inboard heat of further being convenient for heating panel outwards gives off to it is inboard to be favorable to the cold air inflow heating panel of heating panel outside, makes whole heating panel peripheral air flow more even, better takes away the heat of body transmission, further improves schottky diode's radiating effect.
Preferably, a reinforcing block is arranged at the joint of the pin and the body.
Through adopting above-mentioned technical scheme, the setting of boss is convenient for increase the connection stability between pin and the body, effectively reduces the probability that the pin buckles.
In summary, the present application includes at least one of the following beneficial technical effects:
1. due to the arrangement of the heat dissipation plate, the cross section of the heat dissipation plate is in the wave shape, so that cold air outside the heat dissipation plate can flow into the inner side of the heat dissipation plate, the air flow around the whole heat dissipation plate is more uniform, the heat transferred by the body can be better taken away, and the heat dissipation effect of the body can be improved;
2. through the arrangement of the heat conducting fins, the heat conducting effect of the heat conducting fins is good, so that the heat transfer efficiency of the heat conducting fins is improved conveniently, and the heat radiating effect of the body is further improved;
3. through the setting of heat dissipation curb plate, further increase the area of contact between body and the heating panel, and then improve the radiating effect of body.
Drawings
Fig. 1 is a schematic view illustrating an overall structure of a schottky diode according to an embodiment of the present disclosure;
fig. 2 is an exploded view of a schottky diode according to an embodiment of the present disclosure;
fig. 3 is another schematic structural diagram of a schottky diode according to the second embodiment of the present application.
Description of reference numerals: 1. a body; 2. a pin; 3. a heat dissipation plate; 4. a channel; 5. a heat dissipation side plate; 6. an air duct; 7. mounting grooves; 8. a heat conductive sheet; 9. a reinforcing block; 10. and (4) heat dissipation holes.
Detailed Description
The present application is described in further detail below with reference to figures 1-3.
The schottky diode is a metal-semiconductor device in which a noble metal (gold, silver, aluminum, platinum, or the like) a is used as a positive electrode, an N-type semiconductor B is used as a negative electrode, and a barrier formed on a contact surface between the two has rectifying characteristics.
The embodiment of the application discloses a Schottky diode.
Example 1:
referring to fig. 1, the LED lamp comprises a body 1, wherein a pin 2 is arranged at the bottom end of the body 1, and the cross section of the body 1 is D-shaped.
Referring to fig. 1, be provided with heating panel 3 on the arcwall face of body 1, the wave setting is personally submitted in heating panel 3's transversal, and heating panel 3 sets up along body 1's vertical direction, be formed with channel 4 between heating panel 3 and the body 1, the inboard heat of heating panel 3 of being convenient for outwards gives off, and be favorable to the 3 outsides cold air of heating panel to flow into heating panel 3 inboardly, it is more even to make 3 peripheral air flows of whole heating panel, the heat of body 1 transmission is better taken away, be convenient for improve body 1's radiating effect.
Be provided with a plurality of louvres 10 on the heating panel 3, further make whole heating panel 3 around the air current flow more even, better take away the heat of body 1 transmission, and then be convenient for improve body 1's radiating effect.
Referring to fig. 1 and 2, two ends of the heat dissipation plate 3 extend to form heat dissipation side plates 5, the heat dissipation side plates 5 are connected with the plane of the body 1, the contact area between the heat dissipation side plates 5 and the body 1 is increased, and the heat dissipation effect of the body 1 is further improved. And the heat dissipation plate 3 and the heat dissipation side plate 5 are both made of aluminum plates or copper plates, and have good heat conduction and pressure bearing performance.
Referring to fig. 2, an installation groove 7 is formed in the arc surface of the body 1, a heat conducting fin 8 is arranged in the installation groove 7, and the heat conducting fin 8 is flush with the arc surface of the body 1 and connected with the heat dissipation plate 3. Specifically, the heat conducting sheet 8 can be made of heat conducting silicone grease, which is also called thermal grease or heat conducting paste, and is a high heat conducting insulating organic silicon material, which has high heat conductivity, excellent heat conductivity, good electrical insulating property (only aiming at insulating heat conducting silicone grease), wider use temperature, good use stability, lower consistency and good construction performance, and can keep the state of grease in use for a long time at the temperature of-50 ℃ to +230 ℃.
Referring to fig. 2, a reinforcing block 9 is arranged at the joint of the pin 2 and the body 1, so that the strength of the pin 2 is improved, and the bending probability of the pin 2 is effectively reduced.
The implementation principle of the schottky diode in the embodiment of the application is as follows:
before the diode is mounted, the heat-conducting sheet 8 is placed in the mounting groove 7, and then the heat-radiating plate 3 is assembled on the body 1. The diode is at the in-process of using, because the setting of heating panel 3 and conducting strip 8, and the wave setting is personally submitted in the cross section of heating panel 3, the inboard heat of heating panel 3 of being convenient for outwards gives off, and be favorable to the 3 outside cold air of heating panel to flow into heating panel 3 inboardly, make 3 peripheral air flows of whole heating panel flow more even, better take away the heat of 1 transmission of body, and then improve schottky diode's radiating effect.
Example 2:
this example differs from example 1 in that: referring to fig. 3, heating panel 3 has a plurality ofly along vertical direction evenly distributed, is formed with wind channel 6 between two adjacent heating panels 3, and the inboard heat of heating panel 3 of further being convenient for outwards gives off to it is inboard that the cold air that further does benefit to the 3 outsides of heating panel flows into heating panel 3, makes whole heating panel 3 peripheral air flow more even, can further be convenient for improve the radiating effect of body 1.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (9)
1. The utility model provides a schottky diode, includes body (1), the bottom of body (1) is provided with pin (2), the transversal D of personally submitting of body (1) appears, its characterized in that: be provided with heating panel (3) on the arcwall face of body (1), the cross section of heating panel (3) personally submits the wave setting, be formed with channel (4) between heating panel (3) and body (1).
2. A schottky diode according to claim 1 wherein: and a heat conducting fin (8) is arranged between the heat radiating plate (3) and the body (1).
3. A schottky diode according to claim 2 wherein: the heat conducting plate is characterized in that the body (1) is provided with an installation groove (7), and the heat conducting plate (8) is arranged in the installation groove (7).
4. A schottky diode according to claim 1 wherein: the heat dissipation plate (3) extends to form a heat dissipation side plate (5), and the heat dissipation side plate (5) is abutted to the plane of the body (1).
5. A schottky diode according to claim 1 wherein: the heat dissipation plate (3) is provided with a plurality of heat dissipation holes (10).
6. A schottky diode according to claim 1 wherein: the heat dissipation plate (3) is made of aluminum plates or copper plates.
7. A schottky diode according to claim 1 wherein: the heat dissipation plates (3) are arranged in a plurality of positions and are uniformly distributed along the vertical direction.
8. The schottky diode of claim 7 wherein: an air duct (6) is formed between every two adjacent heat dissipation plates (3).
9. A schottky diode according to claim 1 wherein: and a reinforcing block (9) is arranged at the joint of the pin (2) and the body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120078204.2U CN214176015U (en) | 2021-01-12 | 2021-01-12 | Schottky diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120078204.2U CN214176015U (en) | 2021-01-12 | 2021-01-12 | Schottky diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214176015U true CN214176015U (en) | 2021-09-10 |
Family
ID=77592648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120078204.2U Expired - Fee Related CN214176015U (en) | 2021-01-12 | 2021-01-12 | Schottky diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214176015U (en) |
-
2021
- 2021-01-12 CN CN202120078204.2U patent/CN214176015U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210910 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |