CN214164166U

CN214164166U - Mounting structure of semiconductor precision mold

Info

Publication number: CN214164166U
Application number: CN202022061336.2U
Authority: CN
Inventors: 张一恒
Original assignee: Shijiazhuang Xinyue Precision Mould Co ltd
Current assignee: Shijiazhuang Xinyue Precision Mould Co ltd
Priority date: 2020-09-19
Filing date: 2020-09-19
Publication date: 2021-09-10
Anticipated expiration: 2030-09-19

Abstract

The utility model relates to an accurate mould field specifically is a mounting structure of accurate mould of semiconductor, including the fly leaf, the figure of fly leaf is four groups, and horizontal adjacent two sets of through first limiting plate connection, vertical adjacent two sets of between the fly leaf through second limiting plate connection, four groups the limiting plate is all installed on the surface of fly leaf. The utility model discloses a first pneumatic cylinder can drive the fly leaf and transversely adjust, then can drive the fly leaf through the second pneumatic cylinder and vertically adjust to make can adapt to the not mould of equidimension, carry out the centre gripping to the four corners of mould simultaneously, thereby make spacing firm, avoid appearing the condition of relative slip, comparatively practical is fit for extensively promoting and using.

Description

Mounting structure of semiconductor precision mold

Technical Field

The utility model relates to an accurate mould field specifically is a mounting structure of accurate mould of semiconductor.

Background

The mould mainly realizes the processing of article appearance through the change of forming material physical state, the prime has the title of "the female" of industry, precision mold is one kind of mould, indicate precision casting's exclusive mould, it is more accurate than ordinary mould to require, traditional mould all is fixed on the lathe through the screw, consequently, there is the defect of being not convenient for dismantle, when the mould goes wrong or need overhaul, the degree of difficulty of construction has been increased, the speed of construction has been reduced, be not convenient for use.

Current patent cn201921705250.x discloses a mounting structure of accurate mould, including the mount pad, the equal fixed mounting in the left and right sides of mount pad has the mounting panel, the left and right sides of mount pad inner chamber bottom fixed mounting respectively has servo motor and bearing, the inboard fixedly connected with transfer line of bearing, the outside transmission of servo motor and transfer line is connected with the conveyer belt, the top of servo motor and transfer line is the first connecting block of fixedly connected with and second connecting block respectively, the top of first connecting block and second connecting block is the first carousel of fixedly connected with and second carousel respectively, the equal fixedly connected with spliced pole in top of first carousel and second carousel. This precision mold's mounting structure, overall structure is simple, has avoided using the bolt to fix precision mold on equipment, has realized precision mold convenient to detach's purpose, has improved the construction speed of dismantlement, convenient to use.

The device of above-mentioned patent design carries out the centre gripping through splint in the use, but does not possess firm function in the vertical direction of splint centre gripping direction to the condition of slight slip appears easily, and the steadiness of installation is poor, does not possess the function of removal moreover. Therefore, we propose a mounting structure of a semiconductor precision mold.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a mounting structure of accurate mould of semiconductor has solved the problem that proposes among the background art.

In order to achieve the above object, the utility model provides a following technical scheme: the mounting structure of the semiconductor precision die comprises four groups of movable plates, wherein two groups of the movable plates which are transversely adjacent are connected through a first limiting plate, two groups of the movable plates which are longitudinally adjacent are connected through a second limiting plate, and limiting plates are mounted on the surfaces of the four groups of the movable plates;

two groups of transversely adjacent movable plates are provided with first limiting grooves matched with the first limiting plates on the side wall close to each other, two ends of each first limiting plate are respectively inserted into the two groups of first limiting grooves, two ends of each first limiting plate are fixedly connected with first hydraulic cylinders, and the outer ends of the first hydraulic cylinders are fixedly connected with the inner walls of the first limiting grooves;

the two sets of vertical adjacent lateral walls that the fly leaf is close to each other all set up with the second spacing groove of second limiting plate adaptation, peg graft respectively in two sets of the both ends of second limiting plate second spacing inslot chamber and fixedly connected with second pneumatic cylinder, the outer end of second pneumatic cylinder and the inner wall fixed connection of second spacing groove.

As a preferred embodiment of the present invention, the bottom middle portion of the movable plate is fixedly provided with a universal wheel.

As an embodiment of the present invention, the bottom both sides of the movable plate are fixedly provided with a third hydraulic cylinder, and the tail end of the third hydraulic cylinder is fixedly connected with an extension plate.

As an optimal implementation mode of the utility model, the limiting plate is the right-angle plate, the inner wall fixed mounting of limiting plate has the rubber pad.

As an optimized implementation mode of the utility model, the bottom of the support plate is provided with anti-skid lines.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a mounting structure of accurate mould of semiconductor can drive the fly leaf through first pneumatic cylinder and transversely adjust, then can drive the fly leaf through the second pneumatic cylinder and vertically adjust to make can adapt to the not mould of equidimension, carry out the centre gripping to the four corners of mould simultaneously, thereby make spacing firm, avoid appearing the condition of relative slip.

2. The utility model discloses a mounting structure of accurate mould of semiconductor can remove through the universal wheel of fly leaf bottom for remove convenient and fast, can drive the extension board through the third pneumatic cylinder and support when using simultaneously, make to support firm, make to promote the steadiness.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic view of the overall structure of the mounting structure of the semiconductor precision mold according to the present invention;

fig. 2 is a schematic view of a transverse connection structure of a movable plate of the mounting structure of the semiconductor precision mold according to the present invention;

fig. 3 is a schematic view of the vertical connection structure of the movable plate of the mounting structure of the semiconductor precision mold of the present invention.

In the figure: 1. a movable plate; 2. a first limit plate; 3. a second limiting plate; 4. a limiting plate; 5. a first limit groove; 6. a first hydraulic cylinder; 7. a universal wheel; 8. a third hydraulic cylinder; 9. a support plate; 10. a second limit groove; 11. and a second hydraulic cylinder.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "disposed" are to be interpreted broadly, and may be, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed; the utility model discloses in provide only supply the reference with the model of electrical apparatus. For those skilled in the art, different types of electrical appliances with the same function can be replaced according to actual use conditions, and for those skilled in the art, the specific meaning of the above terms in the present invention can be understood in specific situations.

Referring to fig. 1-3, the present invention provides a technical solution: the mounting structure of the semiconductor precision die comprises movable plates 1, wherein the number of the movable plates 1 is four, two groups of the movable plates 1 which are adjacent in the transverse direction are connected through a first limiting plate 2, two groups of the movable plates 1 which are adjacent in the longitudinal direction are connected through a second limiting plate 3, and limiting plates 4 are mounted on the surfaces of the four groups of the movable plates 1;

two groups of transversely adjacent movable plates 1 are provided with first limiting grooves 5 matched with the first limiting plates 2 on the side walls close to each other, two ends of each first limiting plate 2 are respectively inserted into the two groups of first limiting grooves 5, two ends of each first limiting plate 2 are fixedly connected with first hydraulic cylinders 6, and the outer ends of the first hydraulic cylinders 6 are fixedly connected with the inner walls of the first limiting grooves 5;

vertical adjacent two sets of a lateral wall that fly leaf 1 is close to each other all sets up the second spacing groove 10 with the adaptation of second limiting plate 3, peg graft respectively in two sets of the both ends of second limiting plate 3 inner chamber and fixedly connected with second pneumatic cylinder 11 of second spacing groove 10, the outer end of second pneumatic cylinder 11 and the inner wall fixed connection of second spacing groove 10 please refer to in this embodiment and read 1, 2 and 3, and is concrete, and first pneumatic cylinder 6 and second pneumatic cylinder 11 can drive fly leaf 1 and adjust to the feasible not mould that can adapt to equidimension, spacing through four sets of limiting plates 4 to the mould four corners simultaneously, thereby make spacing firm.

Referring to fig. 2 in the embodiment, a universal wheel 7 is fixedly installed in the middle of the bottom of the movable plate 1, and specifically, the universal wheel 7 is convenient to move.

Referring to fig. 2 in the embodiment, third hydraulic cylinders 8 are fixedly mounted on both sides of the bottom of the movable plate 1, a support plate 9 is fixedly connected to the tail end of the third hydraulic cylinder 8, and specifically, the third hydraulic cylinders 8 can drive the support plate 9 to support and adjust the support height.

In this embodiment, referring to fig. 1, the limiting plate 4 is a right-angle plate, and a rubber pad is fixedly mounted on an inner wall of the limiting plate 4.

In the embodiment, referring to fig. 2, the bottom of the supporting plate 9 is provided with anti-slip lines, specifically, slip is avoided.

It should be noted that, the mounting structure of the semiconductor precision mold of the present invention includes all the parts known by the technicians in the field or the general standard parts, the structure and principle of the mounting structure are known by the technicians in the technical manual or by the conventional experimental method, at the idle position of the device, all the electric devices in the above mentioned are connected by the wires, referring to the power elements, the electric devices and the adaptive monitoring computer and power supply, the specific connection means should refer to the following working principle, the electric connection between the electric devices is completed in sequence, the detailed connection means is the known technology in the field, the following main introduces the working principle and process, without describing the electric control, during the working, first according to the size of the mold, the first hydraulic cylinder 6 is started to drive the movable plates 1 at the left and right sides to adjust the position along the first limiting plate 2, thereby make the distance adaptation mould size between the limiting plate 4 of left and right sides, then will restart second pneumatic cylinder 11 and make the width that the mould was made in the regulation of front and back side fly leaf 1, then place the mould between four groups of limiting plate 4, then restart first pneumatic cylinder 6 and second pneumatic cylinder 11 and make the mould centre gripping firm again, in-process of installing the mould is being carried out, support through universal wheel 7, thereby can guarantee the mobility of fly leaf 1, then the centre gripping is firm back, make the mould can quick travel to the assigned position through universal wheel 7, in-process when using simultaneously, make extension board 9 support through starting third pneumatic cylinder 8, thereby make the support firm, the device simple structure, and convenient for operation, therefore, the clothes hanger is strong in practicability.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a mounting structure of accurate mould of semiconductor, includes fly leaf (1), its characterized in that: the number of the movable plates (1) is four, two transversely adjacent groups of the movable plates (1) are connected through a first limiting plate (2), two longitudinally adjacent groups of the movable plates (1) are connected through a second limiting plate (3), and limiting plates (4) are arranged on the surfaces of the four groups of the movable plates (1);

one side wall, close to each other, of each two transversely adjacent groups of the movable plates (1) is provided with a first limiting groove (5) matched with the first limiting plate (2), two ends of each first limiting plate (2) are respectively inserted into the two groups of first limiting grooves (5), two ends of each first limiting plate (2) are respectively and fixedly connected with a first hydraulic cylinder (6), and the outer end of each first hydraulic cylinder (6) is fixedly connected with the inner wall of each first limiting groove (5);

vertical adjacent two sets of lateral wall that fly leaf (1) is close to each other all sets up second spacing groove (10) with second limiting plate (3) adaptation, peg graft respectively in two sets of the both ends of second limiting plate (3) second spacing groove (10) inner chamber and fixedly connected with second pneumatic cylinder (11), the outer end of second pneumatic cylinder (11) and the inner wall fixed connection of second spacing groove (10).

2. The mounting structure of a semiconductor precision mold according to claim 1, characterized in that: the middle of the bottom of the movable plate (1) is fixedly provided with a universal wheel (7).

3. The mounting structure of a semiconductor precision mold according to claim 1, characterized in that: and third hydraulic cylinders (8) are fixedly mounted on two sides of the bottom of the movable plate (1), and supporting plates (9) are fixedly connected to the tail ends of the third hydraulic cylinders (8).

4. The mounting structure of a semiconductor precision mold according to claim 1, characterized in that: the limiting plate (4) is a right-angle plate, and a rubber pad is fixedly mounted on the inner wall of the limiting plate (4).

5. A mounting structure of a semiconductor precision mold according to claim 3, characterized in that: the bottom of the support plate (9) is provided with anti-skid grains.