CN216267259U - Avoid high thermal diffusivity injection mold frame of mould deformation - Google Patents
Avoid high thermal diffusivity injection mold frame of mould deformation Download PDFInfo
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- CN216267259U CN216267259U CN202122879357.XU CN202122879357U CN216267259U CN 216267259 U CN216267259 U CN 216267259U CN 202122879357 U CN202122879357 U CN 202122879357U CN 216267259 U CN216267259 U CN 216267259U
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Abstract
The utility model discloses a high-heat-dissipation injection mold frame capable of avoiding mold deformation, which comprises a mold frame base, wherein a cooling box is fixedly installed on the upper end surface of the inner side of the mold frame base, an upper mold base is fixedly installed on the inner side surface of the mold frame base, which is positioned at the lower end of the cooling box, a lower mold base is arranged on the inner side surface of the mold frame base, which is positioned at the lower end of the upper mold base, and an installation box is fixedly installed on the bottom end surface of the inner side of the mold frame base. According to the high-heat-dissipation injection mold frame capable of avoiding mold deformation, the cooling box structure is arranged, and water cooling heat dissipation can be performed on the injection mold frame in the mold machining process, so that the temperature difference between the inside and the outside of the mold is not too large, the deformation of the mold is avoided, the defective rate is reduced, the vibration motor on the surface of the injection mold frame can perform vibration demolding on the forming mold through the arranged installation box structure, and the injection mold frame is matched with the stripping structure to perform rapid demolding, so that the injection mold frame is convenient and simple to use and convenient to operate.
Description
Technical Field
The utility model relates to the technical field of injection mold structures, in particular to a high-heat-dissipation injection mold frame capable of avoiding mold deformation.
Background
An injection mold is a tool for producing plastic products; the injection molding is a processing method used in batch production of parts with complex shapes, a die carrier is a support of a die, for example, all parts of the die are combined and fixed according to a certain rule and position on a die casting machine, and the part of the die which can be installed on the die casting machine to work is called the die carrier and consists of a push-out mechanism, a guide mechanism, a pre-reset mechanism, a die pin cushion block and a seat plate; the existing injection mold frame has certain defects when in use, has poor heat dissipation, causes large temperature difference inside and outside the mold, is easy to deform, has trouble in material removal and is difficult to treat.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a high-heat-dissipation injection mold frame capable of avoiding mold deformation, which can effectively solve the problems in the background art.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the high-heat-dissipation injection mold frame capable of avoiding mold deformation comprises a mold frame base, wherein a cooling box is fixedly installed on the upper end surface of the inner side of the mold frame base, an upper mold base is fixedly installed on the inner side surface of the mold frame base, which is located at the lower end of the cooling box, a lower mold base is arranged on the inner side surface of the mold frame base, which is located at the lower end of the upper mold base, and an installation box is fixedly installed on the bottom end surface of the inner side of the mold frame base;
the cooling box is characterized in that communicating ports are fixedly arranged at the middle of the two side surfaces of the cooling box, water-cooling pipes are fixedly arranged on the inner side surfaces of the cooling box and are fixedly connected with the communicating ports, a heat-conducting plate is fixedly arranged on the bottom end surface of the cooling box, and a communicating pipe is fixedly arranged at the middle of the surface of the heat-conducting plate.
Preferably, the locating plates are symmetrically arranged at two side edges of the two end surfaces of the die carrier base, the side baffle plates are fixedly arranged at the two side edges of the upper end surface of the die carrier base, the die carrier top plate is fixedly arranged at the upper end surface of the side baffle plates, the lifting lugs are fixedly arranged at the two side edges of the upper end surface of the die carrier top plate, and the injection molding port is formed in the middle of the surface of the die carrier top plate.
Preferably, the bottom surface of the upper die holder is provided with an upper die groove, and the surfaces of the two ends of the upper die holder are fixedly provided with butt-joint blocks at the middle part.
Preferably, the middle of the two end surfaces of the lower die base is provided with a butt joint groove, the butt joint groove is fixedly connected with the butt joint block, the upper end surface of the lower die base is provided with a lower die cavity, and the two sides of the lower die cavity on the upper end surface of the lower die base are provided with stripping grooves.
Preferably, the mounting groove has been seted up on the surface of install bin, the surface of mounting groove is close to both sides edge fixed mounting and has telescopic cylinder, telescopic cylinder's fixed surface installs the stripping frame, the fixed surface of stripping frame installs the stripping claw, the surface of mounting groove is located middle part department fixed mounting and has shock dynamo, telescopic cylinder and shock dynamo and external power supply electric connection.
Preferably, the bottom surface of the die carrier base is fixedly provided with a rubber pad, the thickness of the rubber pad is set to be five centimeters, and the rubber pad is connected with the die carrier base through an adhesive.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, through the arranged cooling box structure, water cooling heat dissipation can be carried out on the die in the die machining process, so that the temperature difference between the inside and the outside of the die is not too large, the die is prevented from deforming, the defective product rate is reduced, through the arranged installation box structure, the vibration motor on the surface of the cooling box structure can carry out vibration demoulding on the forming die, and the cooling box structure is matched with the stripping structure to carry out quick demoulding, so that the use is convenient and simple, and the operation is convenient.
Drawings
FIG. 1 is a schematic view of the overall structure of a high heat dissipation injection mold rack of the present invention for avoiding deformation of the mold;
FIG. 2 is a schematic structural diagram of a cooling box of the injection mold frame with high heat dissipation performance for avoiding mold deformation according to the present invention;
FIG. 3 is a schematic structural view of an upper mold base of the high heat dissipation injection mold base for avoiding mold deformation according to the present invention;
FIG. 4 is a schematic structural diagram of a lower mold base of the high heat dissipation injection mold base for avoiding mold deformation according to the present invention;
fig. 5 is a schematic structural diagram of an installation box of the injection mold frame with high heat dissipation performance for avoiding mold deformation according to the utility model.
In the figure: 1. a mold base; 101. positioning a plate; 102. a side dam; 103. a mould frame top plate; 104. lifting lugs; 105. an injection molding port; 2. a cooling tank; 201. a communication port; 202. a water-cooled tube; 203. a heat conducting plate; 204. a communicating pipe; 3. an upper die holder; 301. feeding a die cavity; 302. a butt joint block; 4. a lower die holder; 401. a butt joint groove; 402. a lower die cavity; 403. a stripping groove; 5. installing a box; 501. mounting grooves; 502. a telescopic cylinder; 503. a stripping frame; 504. a stripping claw; 505. a vibration motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-5, a high heat dissipation injection mold base capable of avoiding mold deformation includes a mold base 1, a cooling box 2 is fixedly installed on the upper end surface of the inner side of the mold base 1, an upper mold base 3 is fixedly installed on the inner side surface of the mold base 1, which is located at the lower end of the cooling box 2, a lower mold base 4 is arranged on the inner side surface of the mold base 1, which is located at the lower end of the upper mold base 3, and an installation box 5 is fixedly installed on the bottom end surface of the inner side of the mold base 1;
the middle parts of the two side surfaces of the cooling box 2 are fixedly provided with communicating ports 201, the inner side surface of the cooling box 2 is fixedly provided with a water-cooling pipe 202, the water-cooling pipe 202 is fixedly connected with the communicating ports 201, the bottom end surface of the cooling box 2 is fixedly provided with a heat-conducting plate 203, the middle part of the surface of the heat-conducting plate 203 is fixedly provided with a communicating pipe 204, after the raw material injection molding is finished, the communicating ports 201 at the two ends can be connected through a water pump and a water pipe, so that the cold water is subjected to water-cooling circulation, the cooling effect is achieved by matching with the water-cooling pipe 202, and the heat-conducting plate 203 can accelerate the heat conduction;
the mold base 1 is fixedly fixed with a workbench through the positioning plate 101, a mold frame structure for installation can be formed by the side baffle plate 102 and the mold frame top plate 103, the device structure can be easily moved to a designated place by a hoisting device and the lifting lugs 104, and after an injection molding process is started, molten raw materials can be poured from the injection molding opening 105;
an upper die groove 301 is formed in the bottom end surface of the upper die holder 3, a butt joint block 302 is fixedly installed in the middle of the two end surfaces of the upper die holder 3, the upper die groove 301 is used for installing an upper die, and the butt joint block 302 can be used for being in seamless butt joint with the lower die holder 4;
the lower die holder 4 is provided with a butt joint groove 401 at the middle part of the two end surfaces of the lower die holder 4, the butt joint groove 401 is fixedly connected with the butt joint block 302, the upper end surface of the lower die holder 4 is provided with a lower die cavity 402, the upper end surface of the lower die holder 4 is provided with stripper grooves 403 at the two sides of the lower die cavity 402, the butt joint groove 401 is matched with the butt joint block 302 for fixing, the lower die cavity 402 is used for installing a lower die, and the stripper grooves 403 can facilitate the extension of a stripper frame 503;
the surface of the mounting box 5 is provided with a mounting groove 501, a telescopic cylinder 502 is fixedly mounted on the surface of the mounting groove 501 close to the edges of two sides, a stripping frame 503 is fixedly mounted on the surface of the telescopic cylinder 502, a stripping claw 504 is fixedly mounted on the surface of the stripping frame 503, a vibration motor 505 is fixedly mounted on the surface of the mounting groove 501 in the middle, the telescopic cylinder 502 and the vibration motor 505 are electrically connected with an external power supply, after injection molding is finished, in the mold forming process, firstly, mold stripping is carried out through the vibration motor 505, then the telescopic cylinder 502 is started, so that the stripping frame 503 drives the stripping claw 504 to jack up a mold from the surface of the lower mold groove 402, and stripping is completed;
the bottom surface of the die carrier base 1 is fixedly provided with a rubber pad, the thickness of the rubber pad is set to be five centimeters, the rubber pad is connected with the die carrier base 1 through an adhesive, and the rubber pad can play a certain buffering and damping effect in the using process of the device.
The working principle is as follows: after the process of moulding plastics begins, can pour the fused raw materials from moulding plastics mouthful 105, wait for the raw materials to mould plastics and finish the back, accessible water pump and the intercommunication mouth 201 of water piping connection both ends, thereby make cold water carry out the water-cooling circulation, and cooperate water-cooled tube 202 to reach the effect of cooling, and heat-conducting plate 203 can accelerate thermal conduction, the back of finishing moulding plastics, in the mould forming process, at first carry out the mould through shock dynamo 505 and take off the material, then start telescopic cylinder 502, make and take off work or material rest 503 drive and take off material claw 504 and jack-up the mould from lower die cavity 402 surface, thereby accomplish and take off the material.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides an avoid high heat dissipating injection mold frame of mould deformation which characterized in that: the cooling device comprises a die set base (1), wherein a cooling box (2) is fixedly installed on the surface of the inner upper end of the die set base (1), an upper die base (3) is fixedly installed on the surface of the inner side of the die set base (1) and is positioned at the lower end of the cooling box (2), a lower die base (4) is arranged on the surface of the inner side of the die set base (1) and is positioned at the lower end of the upper die base (3), and an installation box (5) is fixedly installed on the surface of the inner bottom end of the die set base (1);
the utility model discloses a cooler, including cooler (2), water-cooling pipe (202), intercommunication mouth (201), heat-conducting plate (203), the bottom fixed surface of cooler (2) installs heat-conducting plate (203), the surface of heat-conducting plate (203) is located middle part fixed mounting and has communicating pipe (204), the both sides surface of cooler (2) is located middle part fixed mounting.
2. The high heat dissipation injection mold frame capable of avoiding mold deformation as set forth in claim 1, wherein: locating plate (101) are installed to the both ends surface of die carrier base (1) both sides edge symmetry, the upper end surface of die carrier base (1) is located both sides edge fixed mounting and has side shield (102), the upper end fixed surface of side shield (102) installs die carrier roof (103), the upper end surface of die carrier roof (103) is close to both sides edge fixed mounting and has lug (104), the surface of die carrier roof (103) is located middle part department and has seted up mouth of moulding plastics (105).
3. The high heat dissipation injection mold frame capable of avoiding mold deformation as set forth in claim 1, wherein: an upper die groove (301) is formed in the bottom end surface of the upper die base (3), and butt-joint blocks (302) are fixedly mounted in the middle of the two end surfaces of the upper die base (3).
4. The high heat dissipation injection mold frame capable of avoiding mold deformation as set forth in claim 3, wherein: the butt joint structure is characterized in that butt joint grooves (401) are formed in the middle of the two end surfaces of the lower die holder (4), the butt joint grooves (401) are fixedly connected with butt joint blocks (302), a lower die groove (402) is formed in the upper end surface of the lower die holder (4), and stripping grooves (403) are formed in the two sides, located on the lower die groove (402), of the upper end surface of the lower die holder (4).
5. The high heat dissipation injection mold frame capable of avoiding mold deformation as set forth in claim 1, wherein: mounting groove (501) have been seted up on the surface of install bin (5), the surface of mounting groove (501) is close to both sides edge fixed mounting has telescopic cylinder (502), the fixed surface of telescopic cylinder (502) installs stripping frame (503), the fixed surface of stripping frame (503) installs stripping claw (504), the surface of mounting groove (501) is located middle part fixed mounting there is vibrating motor (505), telescopic cylinder (502) and vibrating motor (505) and external power supply electric connection.
6. The high heat dissipation injection mold frame capable of avoiding mold deformation as set forth in claim 1, wherein: the die carrier base is characterized in that a rubber pad is fixedly installed on the surface of the bottom end of the die carrier base (1), the thickness of the rubber pad is set to be five centimeters, and the rubber pad is connected with the die carrier base (1) through an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122879357.XU CN216267259U (en) | 2021-11-23 | 2021-11-23 | Avoid high thermal diffusivity injection mold frame of mould deformation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122879357.XU CN216267259U (en) | 2021-11-23 | 2021-11-23 | Avoid high thermal diffusivity injection mold frame of mould deformation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216267259U true CN216267259U (en) | 2022-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122879357.XU Active CN216267259U (en) | 2021-11-23 | 2021-11-23 | Avoid high thermal diffusivity injection mold frame of mould deformation |
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| Country | Link |
|---|---|
| CN (1) | CN216267259U (en) |
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2021
- 2021-11-23 CN CN202122879357.XU patent/CN216267259U/en active Active
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