CN214161678U - Non-contact laser welding device - Google Patents
Non-contact laser welding device Download PDFInfo
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- CN214161678U CN214161678U CN202023082929.3U CN202023082929U CN214161678U CN 214161678 U CN214161678 U CN 214161678U CN 202023082929 U CN202023082929 U CN 202023082929U CN 214161678 U CN214161678 U CN 214161678U
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Abstract
The utility model provides a non-contact laser welding device, which comprises a laser welding device and a solder ball feeding mechanism; the solder ball feeding mechanism comprises a turntable, a chassis, a storage barrel and a feeding pipe; the chassis supports the rotary table, the rotary table is driven by the dividing device to intermittently rotate, a plurality of feeding holes are distributed on the rotary table along a circumference, a discharging hole matched with the feeding holes is arranged on the chassis, and the feeding holes on the rotary table can be sequentially rotated above the discharging hole to feed the solder balls into the discharging hole one by one; the storage barrel is positioned above the turntable and comprises a funnel-shaped feeding barrel and a flat feeding barrel, two ends of the bottom of the feeding barrel are respectively provided with two feeding ports, and the distance between the two feeding ports is equal to the distance between the two adjacent feeding holes; a slope surface for assisting feeding is arranged at the bottom of the feeding barrel; the feeding pipe is internally provided with a feeding channel communicated with the discharge hole, and the bottom of the feeding pipe extends into a welding head of the laser welding device. The utility model discloses can solve the unordered problem of piling up and causing the feed not smooth, the feed inefficacy of solder ball.
Description
Technical Field
The utility model belongs to the technical field of laser welding, concretely relates to non-contact laser welding device.
Background
Electronic devices are generally welded by adopting SMT welding and wire feeding welding, wherein the surface of a welding pad of the electronic devices welded by SMT is easy to oxidize, and in a welding flux added with rosin for resisting oxidation, the rosin volatilizes in the using process and has certain corrosivity on precise electronic components. Wire feed bonding is a continuous bond where flux tends to flow over the bonding surface making precise control of the bond point difficult.
Ball jet laser welding is a non-contact type of welding that uses solder balls to weld workpieces in place of SMT and wire feed welding in some conditions. In the existing ball-spraying type laser welding device, a solder ball feeding cylinder is in a funnel shape, solder balls automatically slide down to a feeding pipe under the action of gravity, and the solder balls in the feeding cylinder are easy to extrude and accumulate, so that the phenomenon of unsmooth feeding or empty feeding is caused.
The patent document CN201410460637.9 discloses a solder ball soldering device, which makes the solder ball not easy to be stuck during the solder ball injection, however, the device implants the solder ball by disposing a circle of separation holes on the edge of the solder ball separation component, during the rotation of the solder ball separation component, the solder ball is still likely to be thrown out of the separation holes by the centrifugal force, so the probability of implantation failure is high; and the structure is complicated and bloated, the number of driving mechanisms is large, and the popularization and the use are not facilitated.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a non-contact laser welding device to solve laser welding device's solder ball and pile up in disorder and cause the problem that the feed is smooth and the feed became invalid.
The utility model provides a following technical scheme:
a non-contact laser welding device comprises a laser welder and a solder ball feeding mechanism;
the solder ball feeding mechanism is positioned on the side edge of a welding head of the laser welder and comprises a turntable, a chassis, a storage barrel and a feeding pipe;
the base plate is fixedly arranged and supports the rotary plate, the rotary plate is driven by the dividing device to intermittently rotate, a plurality of feeding holes are distributed on the rotary plate along the circumference which is concentric with the rotary plate, a discharging hole matched with the feeding holes is arranged on the base plate, and the feeding holes on the rotary plate can be sequentially rotated to be above the discharging holes so as to feed the solder balls into the discharging holes one by one;
the storage barrel is fixedly installed and positioned above the rotary table, the storage barrel comprises a funnel-shaped feeding barrel and a flat feeding barrel which are sequentially connected from top to bottom, the feeding barrel covers two feeding holes along the flat direction of the feeding barrel, two ends of the bottom of the feeding barrel along the flat direction of the feeding barrel are respectively provided with two feeding ports, and the distance between the two feeding ports is equal to the distance between the two adjacent feeding holes; the bottom of the feeding barrel is also provided with a slope surface for auxiliary feeding, and two ends of the slope surface respectively extend towards the two feeding ports;
the feeding pipe is arranged at the bottom of the base plate, a feeding channel which is communicated with the discharge hole and inclines downwards is arranged in the feeding pipe, and the bottom of the feeding pipe extends into a welding head of the laser welding device.
Further, one alternative of the sloping surface is as follows: the slope surface and the feeding barrel are integrally formed, and the high end and the low end of the slope surface respectively extend to the edges of the two feeding ports.
Preferably, the relationship between the inclination direction of the slope surface and the turning direction of the turntable is as follows: the rotary disc rotates from the feeding port corresponding to the lower end of the slope surface to the feeding port corresponding to the upper end of the slope surface.
Another alternative for a ramp is: the bottom of the feeding cylinder is provided with a material stirring block horizontally supported by a rotating shaft, and the material stirring block can rock in the feeding cylinder; the top of the material stirring block is provided with the slope surface, and the slope surface is an arch with two ends respectively bent towards the two feeding ports in opposite directions.
Preferably, the turntable is provided with a plurality of racks, the end part of the rotating shaft of the material stirring block extends out of the feeding cylinder and is connected with a sector gear in a key mode, the sector gear is meshed with the racks, and the racks can drive the sector gear to rotate.
Preferably, the longitudinal sections of the racks and the sector gear are both arc-shaped, and the racks are uniformly distributed on the same circumference concentric with the turntable.
Furthermore, a balancing weight is installed on the sector gear, and the balancing weight is located on one side, which deviates from the direction of the rack, of the sector gear.
Furthermore, the bottom of the feeding cylinder is respectively formed with a limiting block at two ends of the material pulling block, a movable gap for the material pulling block to shake is reserved between one side wall of the limiting block and the material pulling block, and the other side wall of the limiting block is a hole wall of the feeding opening.
Preferably, the bottom of the material poking block is of an arch shape with two raised ends, and the bottom of the material poking block is suspended in the air.
The utility model has the advantages that:
the utility model is used for spray the solder ball to laser welding ware to the realization is to work piece non-contact welding. The solder ball feeding mechanism of the device comprises a turntable, a chassis, a storage barrel and a feeding pipe, wherein the storage barrel is positioned above the turntable, the flat feeding barrel can automatically and orderly arrange solder balls into a row, and then the solder balls are fed into a feeding hole of the turntable through a feeding port at the bottom of the flat feeding barrel, so that the problem that the solder balls are disorderly stacked and extruded in the funnel-shaped feeding barrel and cannot be smoothly discharged, and the feeding action fails is avoided. The slope surface at the bottom of the feeding cylinder further promotes the solder balls to roll to the feeding port flexibly so as to ensure the effectiveness of the feeding action.
The rotary disc can intermittently rotate relative to the base plate, so that two adjacent feeding holes on the rotary disc can correspond to two feeding ports in the storage cylinder one by one, and the solder balls discharged by the storage cylinder are received. When the feeding of one feeding hole is failed, the empty feeding hole just moves to the position below the second feeding hole to receive the solder balls after the next rotation of the turntable, so that the phenomenon of failure of feeding is further effectively reduced.
The utility model discloses the stirring piece that can rock is installed to the installation in feeding cylinder, and stirring piece's pivot tip installation sector gear installs the rack with this sector gear meshing on the carousel, and when the carousel rotated, rack drive sector gear rocked slightly to stir the solder ball in the storage cylinder, make them can smoothly roll into the feed mouth, avoid the solder ball because of gravity and the extrusion of each other the feed jamming problem appears. The utility model discloses a stirring piece does not dispose actuating mechanism in addition, but utilizes the rotatory synchronous drive stirring piece of carousel to rock ingeniously, has reduced driving piece quantity, makes the structure of this device compacter, has also reduced the drive energy consumption.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic top view of the present invention;
FIG. 2 is a schematic view of the connection structure between the welding head and the feeding pipe of the present invention;
fig. 3 is a schematic view of the internal structure of a storage cylinder in embodiment 1 of the present invention;
fig. 4 is a schematic top view of a solder ball supply mechanism according to embodiment 3 of the present invention;
fig. 5 is a schematic structural view of the material stirring block inside the material storage barrels of embodiments 2 and 3 of the present invention in a balanced state;
FIG. 6 is a schematic structural view of the material pushing block in the material storage barrels of embodiments 2 and 3 of the present invention;
fig. 7 is a schematic view of a matching structure of a rack and a sector gear according to embodiment 3 of the present invention;
fig. 8 is a schematic cross-sectional structure view of the inside of a storage canister according to embodiment 3 of the present invention;
fig. 9 is another schematic cross-sectional structure diagram of the inside of the storage canister according to embodiment 3 of the present invention.
Labeled as: 10. a laser welder; 11. welding a head; 20. a solder ball feeding mechanism; 21. a turntable; 211. a feed port; 22. a chassis; 221. a discharge hole; 23. a feeding cylinder; 24. a feeding cylinder; 241. a feeding port; 242. a slope surface; 243. a rotating shaft; 244. a material stirring block; 245. a limiting block; 246. a clearance for movement; 25. a feed pipe; 251. a feed channel; 26. a sector gear; 27. a rack; 28. a balancing weight; 30. and (7) solder balls.
Detailed Description
Example 1
As shown in fig. 1, a noncontact laser welding apparatus includes a laser welder 10 and a solder ball supply mechanism 20.
The solder ball supply mechanism 20 is located on the side of the welding head 11 of the laser welder 10, and the solder ball supply mechanism 20 comprises a turntable 21, a chassis 22, a storage barrel and a feed pipe 25.
As shown in fig. 1 to 3, the chassis 22 is fixedly installed on the frame, and the chassis 22 can horizontally support the turntable 21. The rotary table 21 is driven by the indexing device to intermittently rotate, a plurality of feeding holes 211 are distributed on the rotary table 21 along a circumference concentric with the rotary table to receive solder balls 30 provided by the storage cylinder, the solder balls 30 can be steel balls, solder balls and other materials, the diameter of the solder balls is 0.53-0.55mm, and the diameter of the solder balls is slightly larger than the aperture of the injection holes of the welding head. The base plate 22 is provided with a discharge hole 221 adapted to the feed hole 211, and the feed hole 211 of the rotary plate 21 is sequentially rotated above the discharge hole 221 to feed the solder balls 30 one by one into the discharge hole 221, and then fed into the solder head 11 through the feed pipe 25 installed below the base plate 22.
The storage cylinder is fixedly arranged on a bracket and is positioned above the turntable 21. As shown in fig. 3 and 9, the storage cylinder includes a funnel-shaped feeding cylinder 23 and a flat feeding cylinder 24 connected in sequence from top to bottom, and solder balls can be fed from the top of the feeding cylinder 23. The feeding cylinder 24 covers two feeding holes along the flat direction, and two feeding ports 241 are respectively arranged at two ends of the bottom of the feeding cylinder 24 along the flat direction, the distance between the two feeding ports 241 is equal to the distance between two adjacent feeding holes 211, so that the two feeding ports 241 can feed two feeding holes 211 at the same time, and when the feeding holes are blocked by solder balls, the corresponding feeding ports do not feed in the beat.
As shown in FIG. 3, the bottom of the feeding barrel 24 is further provided with a slope 242 for assisting feeding, the slope 242 is integrally formed with the feeding barrel 24, and the high end and the low end of the slope 242 respectively extend to the edges of the two feeding ports 241. The inclined slope structure is beneficial to the solder balls to roll into the feeding port quickly, and the solder balls are prevented from moving inflexibly due to clamping stagnation. The relationship between the direction of inclination of the ramp 242 and the direction of rotation of the turntable 21 is: the turntable 21 rotates from the feeding port corresponding to the lower slope end to the feeding port corresponding to the higher slope end, that is, the solder balls preferentially roll into the feeding port from the lower slope end, so that the solder balls can enter the previous feeding hole under most conditions, the feeding port at the higher slope end is in a standby state in a normal state, and only when the feeding of the previous feeding hole fails, the feeding port at the higher slope end feeds the feeding hole again, so that the failure probability of feeding is reduced.
As shown in fig. 2, a feeding channel 251 which is communicated with the discharge hole 221 and is inclined downwards is arranged in the feeding pipe 25, the bottom of the feeding pipe 25 extends into a welding head 11 of the laser welding device, after the solder balls 30 enter the welding head through the feeding channel 251, the high-power laser instantly melts the solder balls 30, and the solder balls are sprayed to the surface of a workpiece.
The working process of the embodiment is as follows: placing a plurality of solder balls 30 into the storage cylinder, automatically arranging the solder balls into a row in the flat feeding cylinder 24, starting the indexing driving device of the turntable 21, rotating the turntable 21 to align the first two feeding holes with the two feeding ports 241, automatically dropping the solder balls into the two feeding holes, then rotating the turntable 21 again for one beat, aligning the second feeding hole with the high-end feeding port on the right side, aligning the third feeding hole with the feeding port on the lower end on the left side, and feeding the solder balls into the third feeding hole from the feeding port on the lower end of the slope surface to repeat the steps. When the feed hole 211 carrying the solder balls moves above the discharge hole 221 on the chassis, the solder balls 30 automatically drop into the discharge hole 221, and then are fed into the laser welding head through the feed channel 251, thereby repeatedly feeding the solder balls to the laser welding head.
Example 2
As shown in FIGS. 5 and 6, the present embodiment is different from embodiment 1 in the structure of the slope surface part in the feeding barrel. In the present embodiment, a material-stirring block 244 horizontally supported by a rotating shaft 243 is installed at the bottom of the feeding cylinder, wherein a slope surface is located at the top of the material-stirring block 244, and the slope surface is an arched slope surface with two ends respectively bending towards two feeding ports, and the material-stirring block 244 can slightly shake in the feeding cylinder 24, that is: when feeding, the balance of the pressure distribution of the solder balls to the material-stirring block is destroyed due to the movement of the solder balls at the bottom of the feeding cylinder 24, so that the material-stirring block 244 slightly shakes, and the solder balls are stirred to roll, thereby further improving the feeding efficiency of the solder balls.
Example 3
As shown in fig. 5 to 9, the present embodiment is different from embodiment 2 in that: the material poking block 244 realizes shaking through the matching structure of the sector gear 26 and the rack 27. Specifically, the plurality of racks 27 are installed on the turntable 21, the end of the rotating shaft of the material shifting block 244 extends out of the feeding cylinder 24 and is connected with the sector gear 26 in a rear key mode, the sector gear 26 is meshed with the racks 27, the racks 27 can drive the sector gear 26 to rotate, so that the material shifting block 244 is driven to shake, the material shifting block 244 can be controlled to slightly shake by reasonably configuring parameters such as the number of teeth, the tooth space, the modulus and the like of the sector gear, and the solder balls can roll. The bottom of the material poking block 244 is arched with two raised ends, and the bottom of the material poking block 244 is suspended, so that sufficient space is provided for the shaking of the material poking block. Limiting blocks 245 are respectively formed at two ends of the material shifting block 244 at the bottom of the feeding cylinder 24, a movable gap 246 for the material shifting block to swing is reserved between one side wall of the limiting block 245 and the material shifting block 244, and the other side wall of the limiting block 245 is a hole wall of the feeding port 241.
As shown in fig. 4, the rack 27 and the sector gear 26 are arc-shaped in longitudinal section so that the engagement therebetween does not interfere with the rotation of the turntable. The plurality of racks 27 are uniformly distributed on the same circumference concentric with the turntable 21. As shown in fig. 7, a weight block 28 is mounted on the sector gear 26, the weight block 28 is located on the side of the sector gear 26 facing away from the rack, and when the working rack rotates through the material storage barrel, the sector gear 26 automatically rotates reversely under the action of the weight block 28 to reset the material poking block 244 to prepare for the next feeding action.
The working process of the device is as follows:
placing a plurality of solder balls 30 into a storage cylinder, automatically arranging the solder balls into a row in a flat feeding cylinder 24, starting an indexing driving device of a turntable 21, rotating the turntable 21 to enable the front two feeding holes to be aligned with the two feeding ports 241, and automatically dropping the solder balls into the two feeding holes; in the rotating process of the turntable, the rack 27 is meshed with the sector gear 26, and the material stirring block 244 is driven to slightly shake to stir the solder balls in the feeding cylinder 24, so that the two solder balls smoothly roll into the two feeding ports 241 respectively, and the failure of feeding is avoided. After the material shifting action is completed, the material shifting block 244 automatically resets under the action of the counterweight 28. The turntable 21 is then rotated one more cycle, with the second inlet hole aligned with the right side feed port, the third inlet hole aligned with the left side feed port, and solder balls fed from the left side feed port into the third inlet hole, and so on. When the feed hole carrying the solder balls moves above the discharge hole 221 on the chassis 22, the solder balls automatically drop into the discharge hole 221, and then are fed into the laser welding head through the feed channel 251, thereby repeating the feeding of the solder balls to the laser welding head.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A non-contact laser welding device is characterized by comprising a laser welder and a solder ball feeding mechanism;
the solder ball feeding mechanism is positioned on the side edge of a welding head of the laser welder and comprises a turntable, a chassis, a storage barrel and a feeding pipe;
the base plate is fixedly arranged and supports the rotary plate, the rotary plate is driven by the dividing device to intermittently rotate, a plurality of feeding holes are distributed on the rotary plate along the circumference which is concentric with the rotary plate, a discharging hole matched with the feeding holes is arranged on the base plate, and the feeding holes on the rotary plate can be sequentially rotated to be above the discharging holes so as to feed the solder balls into the discharging holes one by one;
the storage barrel is fixedly installed and positioned above the rotary table, the storage barrel comprises a funnel-shaped feeding barrel and a flat feeding barrel which are sequentially connected from top to bottom, the feeding barrel covers two feeding holes along the flat direction of the feeding barrel, two ends of the bottom of the feeding barrel along the flat direction of the feeding barrel are respectively provided with two feeding ports, and the distance between the two feeding ports is equal to the distance between the two adjacent feeding holes; the bottom of the feeding barrel is also provided with a slope surface for auxiliary feeding, and two ends of the slope surface respectively extend towards the two feeding ports;
the feeding pipe is arranged at the bottom of the base plate, a feeding channel which is communicated with the discharge hole and inclines downwards is arranged in the feeding pipe, and the bottom of the feeding pipe extends into a welding head of the laser welding device.
2. The laser welding device as claimed in claim 1, wherein the slope is integrally formed with the feeding barrel, and the two ends of the slope extend to the edges of the two feeding ports.
3. The laser welding apparatus according to claim 2, wherein the relationship between the direction of inclination of the ramp and the direction of rotation of the turntable is: the rotary disc rotates from the feeding port corresponding to the lower end of the slope surface to the feeding port corresponding to the upper end of the slope surface.
4. The laser welding apparatus according to claim 1, wherein a stirring block horizontally supported by a rotating shaft is installed at the bottom of the feeding cylinder, and the stirring block can rock in the feeding cylinder; the top of the material stirring block is provided with the slope surface, and the slope surface is an arch with two ends respectively bent towards the two feeding ports.
5. The laser welding apparatus as claimed in claim 4, wherein a plurality of racks are mounted on the turntable at intervals, the end of the shaft of the stirring block extending out of the feeding cylinder is connected to a sector gear, the sector gear is engaged with the racks, and the racks can drive the sector gear to rotate when the turntable rotates.
6. The laser welding apparatus according to claim 5, wherein the rack and the sector gear are both arc-shaped in longitudinal section, and a plurality of the racks are uniformly distributed on the same circumference concentric with the turntable.
7. The laser welding apparatus of claim 6, wherein a weight is mounted on the sector gear on a side of the sector gear facing away from the rack.
8. The non-contact laser welding device according to claim 4, wherein a limiting block is formed at the bottom of the feeding cylinder at two ends of the material pulling block, a movable gap for the material pulling block to swing is left between one side wall of the limiting block and the material pulling block, and the other side wall of the limiting block is a hole wall of the feeding port.
9. The laser welding apparatus according to claim 4, wherein the bottom of the deflector block is arched with both ends raised, and the bottom of the deflector block is suspended.
Priority Applications (1)
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CN202023082929.3U CN214161678U (en) | 2020-12-18 | 2020-12-18 | Non-contact laser welding device |
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CN202023082929.3U CN214161678U (en) | 2020-12-18 | 2020-12-18 | Non-contact laser welding device |
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CN214161678U true CN214161678U (en) | 2021-09-10 |
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CN202023082929.3U Active CN214161678U (en) | 2020-12-18 | 2020-12-18 | Non-contact laser welding device |
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