CN214152888U - Semiconductor heat sink and semiconductor device - Google Patents
Semiconductor heat sink and semiconductor device Download PDFInfo
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- CN214152888U CN214152888U CN202023335580.XU CN202023335580U CN214152888U CN 214152888 U CN214152888 U CN 214152888U CN 202023335580 U CN202023335580 U CN 202023335580U CN 214152888 U CN214152888 U CN 214152888U
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Abstract
The application discloses a semiconductor heat dissipation device and a semiconductor device, and relates to the technical field of semiconductors, the semiconductor heat dissipation device comprises a plurality of semiconductor modules and a cooling structure, wherein the semiconductor modules are stacked to form a semiconductor module, each semiconductor module is provided with a first shell, a spacing structure is arranged in each first shell, the spacing structures divide the first shells into a first area and a second area, and a cooling channel is arranged in each first area; the cooling structure is connected with the cooling channel and used for radiating heat of the semiconductor module. The semiconductor module with the cooling channels is stacked into the semiconductor module, and the cooling structures are arranged on two sides of the semiconductor module and connected with the cooling channels. Therefore, the semiconductor module can be cooled through the cooling structure, the heat dissipation efficiency of the semiconductor module is improved, the energy consumption required by cooling is reduced, the installation strength of the semiconductor module is reduced, and the whole volume and weight of a semiconductor device are reduced.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a semiconductor heat dissipation device and a semiconductor device.
Background
Among the prior art, a plurality of semiconductor modules are by horizontal installation on the same horizontal plane of a water-cooling board to between water-cooling board and semiconductor module, place graphite flake or heat conduction silicone grease, and fasten module and water-cooling board through set screw, ensure that the water-cooling board carries out higher heat exchange to a plurality of semiconductor modules.
However, in the prior art, the installation of a plurality of semiconductor modules has large integral volume, and the water cooling plate is too heavy, so that the application fields of small volume and light weight are not satisfied; the water cooling plate has low heat dissipation efficiency, and the semiconductor modules are mechanically connected with the water cooling plate, so that the heat dissipation of the plurality of semiconductor modules is poor, the working temperature is high, and the service life of chips in the semiconductor module is influenced; the strong mechanical connection of the plurality of semiconductor modules and the water cooling plate can cause the deformation of the module tube shell, so that huge stress exists in the product, the light path deviation can be caused, or the elements bonded by the internal glue are separated, the thickness of the tube shell of the module needs to be increased to increase the strength, and the weight and the cost are increased; the structure of water-cooling board buries the structure of aluminum product for the copper pipe usually, in order to improve the radiating efficiency, need be equipped with the water-cooling board high pressure water of big water-cooling machine usually to improve water pressure and improve water cooling speed, it is big to cause the energy consumption like this, increases holistic weight of laser instrument and volume moreover.
SUMMERY OF THE UTILITY MODEL
An object of the present application is to provide a semiconductor heat dissipation device and a semiconductor device, which can improve the heat dissipation efficiency of a semiconductor module and reduce the energy consumption required for cooling.
The embodiment of the application is realized as follows:
a semiconductor heat dissipation device comprises a cooling structure and a plurality of semiconductor modules, wherein the semiconductor modules are stacked to form a semiconductor module, each semiconductor module is provided with a first shell, a spacing structure is arranged in each first shell, the spacing structures and the first shells are of an integral structure, each spacing structure divides each first shell into a first area and a second area, and a cooling channel is arranged in each first area; the cooling structure is connected with the cooling channel and used for dissipating heat of the semiconductor module.
In an embodiment, the cooling structure includes a plurality of first fluid manifolds and a plurality of first connecting pipes, the plurality of first fluid manifolds are respectively disposed at two sides of the semiconductor module, and the first fluid manifolds are provided with a plurality of first holes; the plurality of first connecting pipes are respectively arranged on the plurality of first holes, the first fluid header pipe is connected with the cooling channel of each first shell through the plurality of first connecting pipes, and the cooling structure connects the plurality of first shells in parallel.
In an embodiment, the cooling structure includes a first fluid inlet pipe and a first fluid outlet pipe, and the first fluid inlet pipe is disposed on the first fluid header pipe and used for a refrigerant to enter; the first fluid outlet pipe is arranged on the first fluid main pipe and used for discharging the refrigerant.
In an embodiment, the cooling structure includes a plurality of second fluid manifolds and a plurality of second connecting pipes, the plurality of second fluid manifolds are respectively disposed at two sides of the semiconductor module, and the second fluid manifolds are provided with a plurality of second holes; each second connecting pipe is of a U-shaped structure, the second connecting pipes are arranged on the second holes respectively, and the second fluid header pipe is connected with the cooling channel of each first shell through the second connecting pipes.
In an embodiment, the cooling structure includes a plurality of first connection joints, and each of the second connection pipes is connected to the cooling passage of each of the first housings through the first connection joints.
In an embodiment, the cooling structure includes a second fluid inlet pipe and a second fluid outlet pipe, and the second fluid inlet pipe is disposed on the second fluid header pipe and is used for a refrigerant to enter; and the second fluid outlet pipe is arranged on the second fluid header pipe and used for discharging the refrigerant.
In one embodiment, the cooling structure includes a plurality of third connecting pipes, each of the third connecting pipes is of a U-shaped structure, and the plurality of third connecting pipes are connected to the cooling channel of each of the first housings, and are used for connecting a plurality of the semiconductor modules in series.
In an embodiment, the cooling structure includes a plurality of second connectors, and each of the third connecting pipes is connected to the cooling channel of each of the first housings through the second connectors.
In one embodiment, a third fluid inlet pipe is arranged on the first shell positioned at the top of the semiconductor module and used for a refrigerant to enter; and a third fluid outlet pipe is arranged on the first shell positioned at the bottom of the semiconductor module and used for discharging a refrigerant.
A semiconductor device comprises a semiconductor heat dissipation device and a chip, wherein the semiconductor heat dissipation device is the semiconductor heat dissipation device, and the chip is arranged on the semiconductor heat dissipation device.
Compared with the prior art, the beneficial effect of this application is:
according to the semiconductor module, the semiconductor modules with the cooling channels are stacked, so that the installation space is saved. And this application is at semiconductor module both sides installation cooling structure, makes cooling structure and cooling channel link to each other to can dispel the heat to the semiconductor module through cooling structure, improve the radiating efficiency of semiconductor module, reduce the required energy consumption of cooling, and reduce the installation intensity of semiconductor module, reduce semiconductor device's whole volume and weight.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a semiconductor heat dissipation device according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a semiconductor heat dissipation device according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a semiconductor heat dissipation device according to an embodiment of the present application.
Fig. 4 is a schematic structural diagram of a semiconductor heat dissipation device according to an embodiment of the present application.
Fig. 5 is a schematic structural diagram of a semiconductor device according to an embodiment of the present application.
Icon: 1-a semiconductor heat sink; 2-a semiconductor module; 21-a first housing; 210-a spacer structure; 211 — a first region; 212-a second region; 22-a cooling channel; 3-a semiconductor module; 4-a cooling structure; 41-first fluid manifold; 410-a first aperture; 411-first fluid inlet pipe; 412-a first fluid outlet pipe; 42-a first connection pipe; 421-a first sealing ring; 422-a second sealing ring; 43-a second fluid manifold; 430-a second aperture; 431-a second fluid inlet; 432-a second fluid outlet pipe; 44-a second connecting tube; 45-a first connector; 46-a third connecting tube; 47-a second connector; 48-a third fluid inlet; 49-a third fluid outlet pipe; 5-a semiconductor device; 51-chip.
Detailed Description
The terms "first," "second," "third," and the like are used for descriptive purposes only and not for purposes of indicating or implying relative importance, and do not denote any order or order.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present application, it should be noted that the terms "inside", "outside", "left", "right", "upper", "lower", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally arranged when products of the application are used, and are used only for convenience in describing the application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the application.
In the description of the present application, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements.
The technical solution of the present application will be clearly and completely described below with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a semiconductor device 5 according to an embodiment of the present disclosure. A semiconductor device 5 comprises a semiconductor heat sink 1 and a chip 51, wherein the chip 51 is arranged on the semiconductor heat sink 1, and the semiconductor heat sink 1 is used for dissipating heat of the chip 51.
Fig. 2 is a schematic structural diagram of a semiconductor heat dissipation device 1 according to an embodiment of the present application. The semiconductor heat sink 1 includes a cooling structure 4 and a plurality of semiconductor modules 2, and the plurality of semiconductor modules 2 are stacked to form a semiconductor module 3.
Each semiconductor module 2 has a first housing 21, a cooling channel 22 (see fig. 5) is disposed in the first housing 21, and the cooling structure 4 is connected to the cooling channel 22 for dissipating heat from the semiconductor module 3, wherein five, six, or ten semiconductor modules 2 are provided, and in this embodiment, ten semiconductor modules 2 are provided.
The cooling structure 4 includes a plurality of first fluid manifolds 41 and a plurality of first connecting pipes 42, the plurality of first fluid manifolds 41 are respectively disposed on both sides of the semiconductor module 3, and a plurality of first holes 410 are disposed on the first fluid manifolds 41; a plurality of first connection pipes 42 are respectively provided on the plurality of first holes 410, and each first fluid manifold 41 is connected to the cooling passage 22 of the respective first housing 21 through the first connection pipe 42. There may be two, three, four, five or six first fluid manifolds 41, and in this embodiment, there are two first fluid manifolds 41.
The cooling structure 4 further includes a first fluid inlet pipe 411 and a first fluid outlet pipe 412, the first fluid inlet pipe 411 is disposed on the first fluid header 41, and is used for a refrigerant to enter; the first fluid outlet pipe 412 is disposed on the first fluid header 41 for discharging the refrigerant. The coolant can be coolant, cooling gas or water.
In an operation process, an operator fills a refrigerant into the first fluid header 41 through the first fluid inlet pipe 411, the refrigerant enters the cooling channels 22 of the first housings 21 through the first connecting pipe 42, and is finally discharged through the first fluid outlet pipe 412, and meanwhile, heat generated during operation of the semiconductor modules 2 is taken away, so that heat dissipation and cooling are performed on the semiconductor modules 3.
In the semiconductor heat sink 1 of the present application, a plurality of semiconductor modules 2 with cooling channels 22 are stacked to form a semiconductor module 3, and cooling structures 4 are mounted on both sides of the semiconductor module 3, and each first fluid manifold 41 is connected to the cooling channel 22 of each first housing 21 through a first connecting pipe 42 to form a parallel cooling passage. Therefore, the heat dissipation efficiency of the semiconductor module 3 is improved, the energy consumption required by cooling is reduced, the installation strength of the semiconductor module 3 is reduced, and the whole volume and weight of a semiconductor device are reduced.
In this embodiment, the first connecting pipe 42 is provided with the first sealing ring 421 and the second sealing ring 422, the cooling structure 4 and the first housing 21 are hermetically connected through the first sealing ring 421 and the second sealing ring 422, and the sealing effect is more stable and reliable due to the arrangement of the double sealing rings.
Fig. 3 is a schematic structural diagram of a semiconductor heat dissipation device 1 according to an embodiment of the present application. The cooling structure 4 comprises a plurality of second fluid manifolds 43 and a plurality of second connecting pipes 44, the plurality of second fluid manifolds 43 are respectively arranged at two sides of the semiconductor module 3, and a plurality of second holes 430 are arranged on the second fluid manifolds 43; the plurality of second connection pipes 44 are respectively disposed on the plurality of second holes 430, each of the second connection pipes 44 is of a U-shaped structure, and each of the second fluid manifolds 43 is connected to the cooling passage 22 (see fig. 5) of each of the first housings 21 through the second connection pipe 44. There may be two, three, four, five or six of the second fluid manifolds 43, and in this embodiment, there are two of the second fluid manifolds 43.
The cooling structure 4 includes a plurality of first connection joints 45, and each of the second connection pipes 44 is connected to the cooling passage 22 of the respective first housing 21 through the first connection joint 45.
The cooling structure 4 further includes a second fluid inlet pipe 431 and a second fluid outlet pipe 432, wherein the second fluid inlet pipe 431 is disposed on the second fluid header pipe 43 and is used for the refrigerant to enter; the second fluid outlet pipe 432 is disposed on the second fluid header pipe 43 for discharging the refrigerant. The coolant can be coolant, cooling gas or water.
In an operation process, an operator fills a refrigerant into the second fluid header pipe 43 through the second fluid inlet pipe 431, the refrigerant enters the cooling channels 22 of the first housings 21 through the second connecting pipe 44, and is finally discharged through the second fluid outlet pipe 432, and meanwhile, heat generated during the operation of the semiconductor modules 2 is taken away, so that the semiconductor modules 3 are cooled.
In the semiconductor heat sink 1 of the present application, a plurality of semiconductor modules 2 with cooling channels 22 are stacked to form a semiconductor module 3, and cooling structures 4 are mounted on both sides of the semiconductor module 3, and each second fluid manifold 43 is connected to the cooling channel 22 of each first housing 21 through a second connecting pipe 44 to form a parallel cooling passage. Therefore, the heat dissipation efficiency of the semiconductor module 3 is improved, the energy consumption required by cooling is reduced, the installation strength of the semiconductor module 3 is reduced, and the whole volume and weight of a semiconductor device are reduced.
Fig. 4 is a schematic structural diagram of a semiconductor heat dissipation device 1 according to an embodiment of the present application. The cooling structure 4 includes a plurality of third connection pipes 46, each of the third connection pipes 46 is of a U-shaped configuration, and each of the third connection pipes 46 is connected to the cooling passage 22 (see fig. 5) of the respective first housings 21 for connecting the plurality of semiconductor modules 2 in series. The number of the third connecting pipes 46 may be four, five, six or nine, and in this embodiment, the number of the third connecting pipes 46 is nine.
The cooling structure 4 includes a plurality of second connectors 47, and each third connection pipe 46 is connected to the cooling passage 22 of the respective first housing 21 through the second connector 47.
The cooling structure 4 further includes a third fluid inlet tube 48 and a third fluid outlet tube 49, wherein the third fluid inlet tube 48 is disposed on the first housing 21 at the top of the semiconductor module 3 for the refrigerant to enter; the third fluid outlet pipe 49 is disposed on the first housing 21 at the bottom of the semiconductor module 3 for discharging the cooling medium. The coolant can be coolant, cooling gas or water.
In an operation process, an operator fills the refrigerant into the cooling channels 22 of the first housing 21 through the third fluid inlet tube 48, the refrigerant sequentially enters the cooling channels 22 of the first housings 21 through the third connecting tube 46, and is finally discharged through the third fluid outlet tube 49, and meanwhile, the heat generated during the operation of each semiconductor module 2 is taken away, so that the semiconductor module 3 is cooled.
In the semiconductor heat sink 1 of the present application, the plurality of semiconductor modules 2 with the cooling channels 22 are stacked to form the semiconductor module 3, the cooling structures 4 are mounted on both sides of the semiconductor module 3, and the plurality of third connecting pipes 46 are connected in sequence to the plurality of cooling channels 22 of the first housing 21 to form a serial cooling passage. Therefore, the cooling medium flow is reduced, the size and the weight of the semiconductor heat dissipation device 1 are further reduced, the heat dissipation efficiency of the semiconductor module 3 is improved, the energy consumption required by cooling is reduced, the installation strength of the semiconductor module 3 is reduced, and the whole size and the weight of a semiconductor device are reduced.
Fig. 5 is a schematic structural diagram of a semiconductor heat dissipation device 1 according to an embodiment of the present application. The first housing 21 has a spacing structure 210 therein, the spacing structure 210 divides the first housing 21 into a first region 211 and a second region 212, the first region 211 is provided with a cooling channel 22 therein, and the second region 212 is provided with related components requiring temperature reduction, such as the chip 51 and the semiconductor device 5.
In an operation process, the cooling medium flows into the cooling channel 22 from one side of the first housing 21, then flows out from the other side of the first housing 21, and takes away heat generated by the semiconductor module 2 during operation, thereby dissipating heat and reducing temperature of the semiconductor module 2.
In one embodiment, the cooling channel 22 is formed by a plurality of partitions, which are not connected to the inner surface of the first housing 21, and a gap is left between the partitions.
It should be noted that the features of the embodiments in the present application may be combined with each other without conflict.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A semiconductor heat sink, comprising:
the semiconductor module comprises a plurality of semiconductor modules, a plurality of cooling channels and a plurality of cooling channels, wherein the semiconductor modules are stacked to form a semiconductor module, each semiconductor module is provided with a first shell, a spacing structure is arranged in each first shell, the spacing structure and the first shells are of an integral structure, the spacing structure divides the inner space of each first shell into a first area and a second area, and the first area is internally provided with the cooling channels; and
and the cooling structure is connected with the cooling channel and used for dissipating heat of the semiconductor module.
2. The semiconductor heat sink of claim 1, wherein the cooling structure comprises:
the first fluid header pipes are respectively arranged at two sides of the semiconductor module, and a plurality of first holes are formed in the first fluid header pipes;
a plurality of first connecting pipes respectively provided on the plurality of first holes, each of the first fluid manifolds being connected to the cooling passage of each of the first housings through the first connecting pipe;
wherein the cooling structure connects a plurality of the first housings in parallel.
3. The semiconductor heat sink of claim 2, wherein the cooling structure comprises:
the first fluid inlet pipe is arranged on the first fluid main pipe and used for the refrigerant to enter;
and the first fluid outlet pipe is arranged on the first fluid main pipe and used for discharging the refrigerant.
4. The semiconductor heat sink of claim 1, wherein the cooling structure comprises:
the plurality of second fluid header pipes are respectively arranged at two sides of the semiconductor module, and a plurality of second holes are formed in the second fluid header pipes;
and each second connecting pipe is of a U-shaped structure, the second connecting pipes are respectively arranged on the second holes, and each second fluid header pipe is connected with the cooling channel of the first shell through the second connecting pipe.
5. The semiconductor heat sink of claim 4, wherein the cooling structure comprises:
a plurality of first connection joints through which each of the second connection pipes is connected to the cooling passage of the respective first housing.
6. The semiconductor heat sink of claim 5, wherein the cooling structure comprises:
the second fluid inlet pipe is arranged on the second fluid header pipe and used for allowing a refrigerant to enter;
and the second fluid outlet pipe is arranged on the second fluid header pipe and used for discharging the refrigerant.
7. The semiconductor heat sink of claim 1, wherein the cooling structure comprises:
and a plurality of third connection pipes, each of which has a U-shaped configuration, each of which is connected to the cooling passage of each of the first housings, for connecting the plurality of semiconductor modules in series.
8. The semiconductor heat sink of claim 7, wherein the cooling structure comprises:
and each third connecting pipe is connected with the cooling channel of each first shell through the second connecting head.
9. The semiconductor heat sink according to claim 2, wherein a third fluid inlet pipe is provided on the first housing at the top of the semiconductor module for a cooling medium to enter;
and a third fluid outlet pipe is arranged on the first shell positioned at the bottom of the semiconductor module and used for discharging a refrigerant.
10. A semiconductor device, comprising:
a semiconductor heat sink according to any one of claims 1 to 9; and
and the chip is arranged on the semiconductor heat dissipation device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023335580.XU CN214152888U (en) | 2020-12-30 | 2020-12-30 | Semiconductor heat sink and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023335580.XU CN214152888U (en) | 2020-12-30 | 2020-12-30 | Semiconductor heat sink and semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214152888U true CN214152888U (en) | 2021-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023335580.XU Active CN214152888U (en) | 2020-12-30 | 2020-12-30 | Semiconductor heat sink and semiconductor device |
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| CN (1) | CN214152888U (en) |
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- 2020-12-30 CN CN202023335580.XU patent/CN214152888U/en active Active
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