CN214152715U - Film capacitor heat abstractor - Google Patents
Film capacitor heat abstractor Download PDFInfo
- Publication number
- CN214152715U CN214152715U CN202120389732.XU CN202120389732U CN214152715U CN 214152715 U CN214152715 U CN 214152715U CN 202120389732 U CN202120389732 U CN 202120389732U CN 214152715 U CN214152715 U CN 214152715U
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- Prior art keywords
- heat
- core
- heat dissipation
- film capacitor
- channel
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- 239000003990 capacitor Substances 0.000 title claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims abstract description 48
- 238000005057 refrigeration Methods 0.000 claims abstract description 40
- 239000002826 coolant Substances 0.000 claims abstract description 12
- 238000004804 winding Methods 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 13
- 239000006185 dispersion Substances 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 21
- 239000011232 storage material Substances 0.000 description 12
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
The embodiment of the utility model provides a relate to condenser technical field, concretely relates to film capacitor heat abstractor, including fixing the surface at the core and being located the outside first heat dissipation mechanism of casing, winding the surface of core and being used for with the temperature transmission of core is for external second heat dissipation mechanism, with first heat dissipation with controller, the position that second heat dissipation mechanism connects the surface of core and with the temperature sensor that the controller is connected, the beneficial effects of the utility model are that: the utility model discloses the setting of first heat dissipation mechanism has increased heat conduction area and heat radiating area, and heat dispersion is good, improves condenser heat dispersion, and the setting of second heat dissipation mechanism is convenient for transmit the heat on the film capacitor for the coolant in the refrigeration case to reduce the temperature of core, reach film capacitor's radiating effect.
Description
Technical Field
The utility model relates to a condenser technical field, concretely relates to film capacitor heat abstractor.
Background
A Film Capacitor (Film Capacitor) is also called a Plastic Film Capacitor (Plastic Film Capacitor). The film capacitor is a capacitor with excellent performance because the film capacitor has many excellent characteristics by using a plastic film as a dielectric. Its main equivalence is as follows: no polarity, high insulation resistance, excellent frequency characteristics (wide frequency response), and low dielectric loss. Due to the above advantages, the thin film capacitor is used in a large number of analog circuits. Particularly, in the signal connection portion, a capacitor with good frequency characteristics and extremely low dielectric loss must be used to ensure that the signal is not distorted too much when being transmitted, and when the film capacitor has a large capacity, the heating power is also large, and an excessively high temperature easily causes the aging or breakdown phenomenon of the film core of the film capacitor, thereby further increasing the internal temperature of the film capacitor, causing the sealed film capacitor to bulge or crack, causing unstable performance and short service life.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, an embodiment of the utility model provides a film capacitor heat abstractor.
The purpose of the utility model is realized like this:
the utility model provides a film capacitor heat abstractor, is including fixing the surface at the core and being located the outside first heat dissipation mechanism of casing, winding the surface of core and be used for with the temperature transfer of core is for external second heat dissipation mechanism, with first heat dissipation with the controller that second heat dissipation mechanism connects, be located the surface of core and with the temperature sensor that the controller is connected, first heat dissipation mechanism include with a plurality of heat-conducting plates of the outer fixed surface of core is connected, be located the outside heating panel of casing, pass the casing just makes the heat-conducting plate with the connecting plate that the heating panel is connected.
The heat conducting plate, the heat radiating plate and the connecting plate are internally provided with a first channel, a second channel and a third channel respectively, and the first channel, the second channel and the third channel are communicated with each other.
And heat conduction oil is arranged in the first channel, the second channel and the third channel.
The heat-conducting plate adopts the semiconductor refrigeration piece, connecting plate and heating panel all adopt heat-conducting material, the refrigeration face of semiconductor refrigeration piece and the outer fixed surface of core are connected, the heating face of semiconductor refrigeration piece and the one end fixed connection of connecting plate.
The heat conducting plate is connected with the controller.
The second heat dissipation mechanism comprises a cooling pipe, a pump body, a refrigeration box and coolant, wherein the cooling pipe is wound on the outer surface of the core and is spirally arranged, the pump body is connected with a liquid inlet pipe of the cooling pipe, the refrigeration box is connected with a liquid outlet pipe of the cooling pipe, and the coolant is located in the refrigeration box, a liquid inlet of the pump body is connected with the refrigeration box and draws the coolant in the refrigeration box into the cooling pipe.
The controller is connected with the pump body.
The utility model discloses beneficial effect does: the utility model discloses the setting of first heat dissipation mechanism has increased heat conduction area and heat radiating area, and heat dispersion is good, improves condenser heat dispersion, and the setting of second heat dissipation mechanism is convenient for transmit the heat on the film capacitor for the coolant in the refrigeration case to reduce the temperature of core, reach film capacitor's radiating effect, and the cooling tube is the heliciform and twines on the core, prolongs the dwell time of coolant on the core in limited space, has greatly improved the radiating effect.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of embodiment 1 in the A-A direction;
FIG. 3 is a schematic view of the structure of embodiment 2 in the A-A direction;
in the figure: the device comprises a core 1, a shell 2, a heat conducting plate 3, a heat radiating plate 4, a connecting plate 5, a refrigeration box 6, a coolant 7, a pump body 8, a liquid inlet pipe 9, a cooling pipe 10 and a liquid discharge pipe 11.
Detailed Description
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention.
Example 1:
as shown in fig. 1 and 2, a film capacitor heat dissipation device, the film capacitor includes a core 1 and a housing 2 located outside the core 1, the core 1 is fixed inside the housing 2, and includes a first heat dissipation mechanism fixed on the outer surface of the core 1 and located outside the housing 2, a second heat dissipation mechanism wound on the outer surface of the core 1 and used for transferring the temperature of the core 1 to the outside, a controller connected to the first heat dissipation mechanism and the second heat dissipation mechanism, and a plurality of temperature sensors located on the outer surface of the core 1 and connected to the controller, the plurality of temperature sensors are fixed and uniformly distributed on the outer surface of the core 1 and fixedly connected to the outer surface of the core 1, so as to detect the temperature of each part of the outer surface of the core 1, and thus the heat generated by the core is discharged to the outside through the first heat dissipation mechanism and the second heat dissipation mechanism, the controller adopts siemens s7-200PLC controller, first heat dissipation mechanism include with a plurality of heat-conducting plates 3 of the outer fixed surface of core 1 is connected, be located 2 outside heating panel 4 of casing, pass casing 2 just makes heat-conducting plate 3 with connecting plate 5 that heating panel 4 is connected, the outer fixed surface of heat-conducting plate 3 and core 1 is connected for the heat that produces core 1 passes through connecting plate 5 and transmits for heating panel 4, thereby reaches radiating effect, and heating panel 4's surface area is great, has increased heat radiating area.
The heat conducting plate 3, the heat dissipation plate 4 and the connecting plate 5 are internally provided with a first channel, a second channel and a third channel respectively, the first channel, the second channel and the third channel are communicated with each other, heat conducting oil is arranged in the first channel, the second channel and the third channel, the heat conducting oil accelerates the absorption and the transmission of heat of the heat conducting plate 3 and improves the heat conducting and heat dissipation capacity, and the arrangement of the heat conducting plate 3 and the heat dissipation plate 4 increases the heat conducting area and the heat dissipation area, the heat dissipation performance is good, and the heat dissipation performance of the capacitor is improved.
The second heat dissipation mechanism is including the winding 1 surface of core and be the cooling tube 10 of heliciform setting, the pump body 8 of being connected with the feed liquor pipe 9 of cooling tube 10, the refrigeration case 6 of being connected with the drain pipe 11 of cooling tube 10, be located cold-storage agent 7 in the refrigeration case 6, the inlet of pump body 8 with the refrigeration case 6 is connected and will cold-storage agent 7 suction in the refrigeration case 6 in the cooling tube 10. The controller with the pump body 8 is connected, thereby the pump body 8 is connected the operating condition of control pump body 8 with the controller, cooling tube 10 is the heliciform from top to bottom with the surface parcel of core 1, the cooling tube 10 of being convenient for carries out even heat dissipation to the surface of core 1, the radiating effect is good, and cooling tube 10 prolongs the dwell time of cold-storage agent 7 on core 1 in limited space, the radiating effect has greatly been improved, pump body 8 is in 7 suction cooling tubes 10 of cold-storage agent of refrigeration case 6, utilize cold-storage agent 7 to dispel the heat to core 1, the radiating effect is good, cool-down the processing in refrigeration case 6 is arranged into to cold-storage agent 7 through the absorbed heat.
Example 2:
as shown in fig. 1 and 3, a film capacitor heat dissipation device, the film capacitor includes a core 1 and a housing 2 located outside the core 1, the core 1 is fixed inside the housing 2, and includes a first heat dissipation mechanism fixed on the outer surface of the core 1 and located outside the housing 2, a second heat dissipation mechanism wound on the outer surface of the core 1 and used for transferring the temperature of the core 1 to the outside, a controller connected to the first heat dissipation mechanism and the second heat dissipation mechanism, and a plurality of temperature sensors located on the outer surface of the core 1 and connected to the controller, the plurality of temperature sensors are fixed and uniformly distributed on the outer surface of the core 1 and fixedly connected to the outer surface of the core 1, so as to detect the temperature of each part of the outer surface of the core 1, and thus the heat generated by the core is discharged to the outside through the first heat dissipation mechanism and the second heat dissipation mechanism, the controller adopts siemens s7-200PLC controller, first heat dissipation mechanism include with a plurality of heat-conducting plates 3 of the outer fixed surface of core 1 is connected, be located 2 outside heating panel 4 of casing, pass casing 2 just makes heat-conducting plate 3 with connecting plate 5 that heating panel 4 is connected, the outer fixed surface of heat-conducting plate 3 and core 1 is connected for the heat that produces core 1 passes through connecting plate 5 and transmits for heating panel 4, thereby reaches radiating effect, and heating panel 4's surface area is great, has increased heat radiating area.
The heat-conducting plate 3 adopts the semiconductor refrigeration piece, connecting plate 5 and heating panel 4 all adopt heat-conducting material, the refrigeration face of semiconductor refrigeration piece and the outer fixed surface of core 1 are connected, the heating face of semiconductor refrigeration piece and the one end fixed connection of connecting plate 5. The heat conducting plate 3 is connected with the controller, when the temperature detected by the temperature sensor is lower than the set temperature, the controller controls the heat conducting plate 3 to stop working, the semiconductor refrigeration piece utilizes the Peltier effect of the semiconductor material, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be realized.
The second heat dissipation mechanism is including the winding 1 surface of core and be the cooling tube 10 of heliciform setting, the pump body 8 of being connected with the feed liquor pipe 9 of cooling tube 10, the refrigeration case 6 of being connected with the drain pipe 11 of cooling tube 10, be located cold-storage agent 7 in the refrigeration case 6, the inlet of pump body 8 with the refrigeration case 6 is connected and will cold-storage agent 7 suction in the refrigeration case 6 in the cooling tube 10. The controller with the pump body 8 is connected, thereby the pump body 8 is connected the operating condition of control pump body 8 with the controller, cooling tube 10 is the heliciform from top to bottom with the surface parcel of core 1, the cooling tube 10 of being convenient for carries out even heat dissipation to the surface of core 1, the radiating effect is good, and cooling tube 10 prolongs the dwell time of cold-storage agent 7 on core 1 in limited space, the radiating effect has greatly been improved, pump body 8 is in 7 suction cooling tubes 10 of cold-storage agent of refrigeration case 6, utilize cold-storage agent 7 to dispel the heat to core 1, the radiating effect is good, cool-down the processing in refrigeration case 6 is arranged into to cold-storage agent 7 through the absorbed heat.
The utility model discloses the setting of first heat dissipation mechanism has increased heat conduction area and heat radiating area, and heat dispersion is good, improves condenser heat dispersion, and the setting of second heat dissipation mechanism is convenient for transmit the heat on the film capacitor for the coolant in the refrigeration case to reduce the temperature of core, reach film capacitor's radiating effect, and the cooling tube is the heliciform and twines on the core, prolongs the dwell time of coolant on the core in limited space, has greatly improved the radiating effect.
It should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicating the directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The terms "comprises," "comprising," or any other similar term are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, article, or apparatus.
So far, the technical solution of the present invention has been described with reference to the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, a person skilled in the art can make equivalent changes or substitutions to the related technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.
Claims (7)
1. A film capacitor heat abstractor which characterized in that: including fixing the surface at the core and being located the outside first heat dissipation mechanism of casing, winding the surface of core and be used for with the temperature transfer of core is external second heat dissipation mechanism, with first heat dissipation with the controller that second heat dissipation mechanism connects, be located the surface of core and with the temperature sensor that the controller is connected, first heat dissipation mechanism include with a plurality of heat-conducting plates of the outer fixed surface of core is connected, be located the outside heating panel of casing, pass the casing just makes the heat-conducting plate with the connecting plate that the heating panel is connected.
2. The film capacitor heat sink of claim 1, wherein: the heat conducting plate, the heat radiating plate and the connecting plate are internally provided with a first channel, a second channel and a third channel respectively, and the first channel, the second channel and the third channel are communicated with each other.
3. The film capacitor heat sink of claim 2, wherein: and heat conduction oil is arranged in the first channel, the second channel and the third channel.
4. The film capacitor heat sink of claim 1, wherein: the heat-conducting plate adopts the semiconductor refrigeration piece, connecting plate and heating panel all adopt heat-conducting material, the refrigeration face of semiconductor refrigeration piece and the outer fixed surface of core are connected, the heating face of semiconductor refrigeration piece and the one end fixed connection of connecting plate.
5. The film capacitor heat sink of claim 4, wherein: the heat conducting plate is connected with the controller.
6. The film capacitor heat sink of claim 1, wherein: the second heat dissipation mechanism comprises a cooling pipe, a pump body, a refrigeration box and coolant, wherein the cooling pipe is wound on the outer surface of the core and is spirally arranged, the pump body is connected with a liquid inlet pipe of the cooling pipe, the refrigeration box is connected with a liquid outlet pipe of the cooling pipe, and the coolant is located in the refrigeration box, a liquid inlet of the pump body is connected with the refrigeration box and draws the coolant in the refrigeration box into the cooling pipe.
7. The film capacitor heat sink of claim 2, wherein: the controller is connected with the pump body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120389732.XU CN214152715U (en) | 2021-02-22 | 2021-02-22 | Film capacitor heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120389732.XU CN214152715U (en) | 2021-02-22 | 2021-02-22 | Film capacitor heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214152715U true CN214152715U (en) | 2021-09-07 |
Family
ID=77554334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120389732.XU Expired - Fee Related CN214152715U (en) | 2021-02-22 | 2021-02-22 | Film capacitor heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214152715U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420452A (en) * | 2022-02-10 | 2022-04-29 | 北京国家新能源汽车技术创新中心有限公司 | Structure of thin film capacitor and heat dissipation method |
| CN115064380A (en) * | 2022-07-19 | 2022-09-16 | 益阳市锦汇电子有限公司 | Capacitor protection device |
-
2021
- 2021-02-22 CN CN202120389732.XU patent/CN214152715U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420452A (en) * | 2022-02-10 | 2022-04-29 | 北京国家新能源汽车技术创新中心有限公司 | Structure of thin film capacitor and heat dissipation method |
| CN114420452B (en) * | 2022-02-10 | 2023-10-31 | 北京国家新能源汽车技术创新中心有限公司 | Structure of thin film capacitor and heat dissipation method |
| CN115064380A (en) * | 2022-07-19 | 2022-09-16 | 益阳市锦汇电子有限公司 | Capacitor protection device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210907 |