CN214151091U - Infrared induction device - Google Patents
Infrared induction device Download PDFInfo
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- CN214151091U CN214151091U CN202022326775.1U CN202022326775U CN214151091U CN 214151091 U CN214151091 U CN 214151091U CN 202022326775 U CN202022326775 U CN 202022326775U CN 214151091 U CN214151091 U CN 214151091U
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Abstract
The utility model discloses an infrared induction device, including the casing, run through the upper end of casing installs two sets of input spool, run through the lower extreme of casing installs two sets of output spool, the dust screen is all installed to the both sides of casing, the front end of casing is by the preceding shrouding of well installation, the middle part of preceding shrouding is installed the response window, the fixed screw is installed in the four corners of preceding shrouding, the rear end of casing is by the back shrouding of well installation, the front plate frame is installed by the front end in the inside of casing, the spout is all installed by the well in the upper and lower end in the inside of casing, the middle part of spout is provided with the slider, installs the circuit board between two sets of sliders, the front end of circuit board is by one side installation and hinders the pressure capacitor, the front end of circuit board is by last installation photosensitive tube; the utility model discloses possess good radiating effect, avoid the high sensitivity that influences infrared induction of temperature, and the response scope is wide, be convenient for simultaneously to the maintenance of device and to the change of component.
Description
Technical Field
The utility model relates to an induction system field, concretely relates to infrared induction system.
Background
The infrared sensing device is an energy-saving device developed according to the infrared reflection principle, has the advantages of high sensitivity, intelligence, energy conservation, convenience in installation and the like, is widely applied to multiple fields of sensing lamps, sensing faucets, sensing hand dryers, sensing urinals and the like, and is generally used as an energy-saving switch of other devices.
The existing infrared sensing device has certain disadvantages when in use, the existing infrared sensing device has poor heat dissipation effect when in use, and the sensitivity of the device can be influenced because the infrared sensing is sensitive to temperature; when the existing infrared induction device is used, the divergence face of the oscillating light is small, so that the induction range of the device is reduced, and the practicability is influenced; when the existing infrared induction device is used, elements are all arranged inside the device, and the element is inconvenient to overhaul or replace, so that certain influence is brought to actual use.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an infrared induction device, which solves the problems that the existing infrared induction device has poor heat dissipation effect when in use, and the sensitivity of the device is influenced because the infrared induction is sensitive to temperature; when the existing infrared induction device is used, the divergence face of the oscillating light is small, so that the induction range of the device is reduced, and the practicability is influenced; when the existing infrared induction device is used, elements are all arranged inside the device, and the technical problem that the elements are inconvenient to overhaul or replace is solved.
The purpose of the utility model can be realized by the following technical scheme:
an infrared induction device comprises a shell, wherein two groups of input wire tubes are installed at the upper end of the shell in a penetrating mode, two groups of output wire tubes are installed at the lower end of the shell in a penetrating mode, dust screens are installed on two sides of the shell, a front sealing plate is installed in the middle of the front end of the shell, an induction window is installed in the middle of the front sealing plate, fixing screws are installed at four corners of the front sealing plate, and a rear sealing plate is installed in the middle of the rear end of the shell;
a front plate frame is mounted close to the front end inside the shell, sliding grooves are mounted close to the middle of the upper end and the lower end inside the shell, sliding blocks are arranged in the middle of the sliding grooves, a circuit board is mounted between the two groups of sliding blocks, a voltage-resistant capacitor is mounted close to one side of the front end of the circuit board, a photosensitive tube is mounted close to the upper end of the front end of the circuit board, a silicon controlled rectifier is mounted close to the lower end of the front end of the circuit board, and a processing chip is mounted close to the other side of the front end of the circuit board;
the front end of circuit board leans on mid-mounting to have the spliced pole, the integrated package is installed to the front end of spliced pole, five infrared luminotrons of group are installed to the front end of integrated package, the inside both sides of casing lean on the equal equidistance of lower extreme to install a plurality of group's board grooves, lie in and install the heating panel between two sets of board grooves of lower extreme with one side.
As a further aspect of the present invention: the casing is the hollow cube in inside, and the diameter of dust screen is less than the prismatic length of casing, and the both sides of two sets of dust screens and casing are embedded swing joint.
As a further aspect of the present invention: the diameter of response window equals the diameter of dust screen, and the response window is the arcwall face setting, and the embedded fixed connection of response window and preceding shrouding.
As a further aspect of the present invention: the front plate frame and the main viewing surface of the circuit board are both in square arrangement, the side length of an inner frame of the front plate frame is larger than that of the circuit board, and the periphery of the front plate frame is fixedly connected with the inner wall of the shell.
As a further aspect of the present invention: the heating panel is the wave setting, and the upper and lower extreme and the board groove of heating panel are embedded swing joint, and the inner wall fixed connection of board groove and casing.
As a further aspect of the present invention: the inside of casing is leaned on the back and is installed the back plate frame, and the telescopic link is all installed to the lower extreme by last in the middle part of back plate frame, and the elasticity dop is installed to the front end of telescopic link, and the connection card post is installed to the rear end middle part of circuit board corresponding the position of elasticity dop, elasticity dop and connection card post activity joint.
An infrared induction device comprises the following specific use steps:
the method comprises the following steps: when the infrared induction device is used, firstly, a circuit of the circuit board, an external device and an external power supply is switched on by virtue of a lead, the connection and disconnection of the lead are realized by an input line tube and an output line tube, the connection and disconnection of the power supply of the external device are controlled, then, the infrared induction device is started, the current is reduced after passing through a voltage resistance capacitor, and acts on the integrated block through the connecting column, then, the integrated block generates oscillation to act on the infrared luminotron to emit oscillation light, the oscillation light is outwards diffused through the induction window of the arc-shaped surface and is controlled by the processing chip, at the moment, the interior of the silicon controlled rectifier is switched off, the power supply in the infrared induction device is in a disconnected state, the power supply of the external device is switched off, and the external device stops working;
step two: when a foreign object is shielded at the front part of the induction window, the oscillating light emitted by the infrared light-emitting tube is blocked by the foreign object and reflected to the photosensitive tube, and is controlled by the processing chip, at the moment, the internal part of the silicon controlled rectifier is switched on, the power supply in the infrared induction device is switched on, the external device is switched on, and starts to work;
step three: infrared induction system is at the in-process of work, the intelligent part is controlled by processing chip, the response window that the arcwall face set up is convenient for enlarge the diffusion range of the oscillating light that infrared luminous tube sent, increase response scope, the heat that produces in the working process is partly through the dust screen give off infrared induction system outside, another part takes place the heat exchange with the lower heating panel of temperature, guarantee the inside normal temperature of infrared induction system, when needs overhaul or change the component infrared induction system, utilize the instrument to take off the fixed screw, take off preceding shrouding, again pull out the casing with the circuit board outside, accomplish and overhaul or the component is changed, push back the circuit board inside the casing again, it can to go up preceding shrouding and fixed screw again.
The utility model has the advantages that:
1. the utility model discloses a set up heating panel cooperation dust screen, after infrared induction system worked for a long time, the internal component can produce a large amount of heats, at this moment, because the inside and outside difference in temperature of infrared induction system, some heat can distribute to the infrared induction system outside through the dust screen, utilize the board groove to install and fix the heating panel, because the temperature of heating panel is lower, so another part heat can take place the heat exchange with the heating panel, mutually support and reduce the temperature in the infrared induction system, avoid the sensitivity of high influence infrared induction of temperature, wavy heating panel has increased area of contact, be more favorable to the heat transfer, when the photosensitive tube in the infrared induction system can not receive the reverberation and lead to the circuit disconnection to stop working, the temperature of heating panel can reduce gradually again, be convenient for next heat transfer;
2. the induction window and the connecting column are matched with the infrared light emitting tube, the connecting column is utilized to increase the connecting distance, so that the front end of the infrared light emitting tube extends to the outside of the shell, and the induction window is an arc-shaped surface, so that when the integrated block oscillates to enable the infrared light emitting tube to generate oscillating light, the oscillating light can be preferentially dispersed onto the induction window, and when the oscillating light passes through the arc-shaped surface of the induction window, the oscillating light can be further dispersed to increase the dispersion range, so that the induction range of the infrared induction device is enlarged, and the use limitation caused by the small induction range of the infrared induction device is avoided;
3. through setting up telescopic link and elasticity dop cooperation circuit board, utilize elasticity dop and connector card post to establish the relation of connection of telescopic link and circuit board, because infrared induction device's main component is all installed on the circuit board, consequently, need overhaul or when the component was changed infrared induction device, utilize the instrument to take off the fixed screw, take off preceding shrouding, with the help of the telescopic link, again with the circuit board pull out the casing external, the telescopic link is stretched, accomplish and overhaul or the component is changed, push back the circuit board inside the casing again, the telescopic link is compressed again, again adorn preceding shrouding and fixed screw again can, need not to carry out whole dismantlement to infrared induction device, conveniently overhaul and the change of component.
4. The utility model discloses a set up heating panel cooperation dust screen, mutually support and reduce the inside temperature of infrared induction device, avoid the sensitivity of the high temperature influence infrared induction, through setting up response window and spliced pole cooperation infrared luminotron, increase the dispersion scope of shock light, enlarge infrared induction device's induction range with the time, avoid causing the use limitation because of infrared induction device induction range is little, through setting up telescopic link and elasticity dop cooperation circuit board, the convenience is to infrared induction device's maintenance and the change of component.
Drawings
Fig. 1 is a schematic view of the overall structure of an infrared sensing device of the present invention;
fig. 2 is a rear view of the overall structure of an infrared sensor of the present invention;
fig. 3 is a front view of the internal structure of the housing of the infrared sensor of the present invention;
fig. 4 is a side view of the internal structure of the housing of the infrared sensor of the present invention;
fig. 5 is a schematic view of the connection between the circuit board and the telescopic rod in the infrared sensing device of the present invention.
In the figure: 1. a housing; 2. an input conduit; 3. a dust screen; 4. an induction window; 5. an output line pipe; 6. fixing screws; 7. a front closing plate; 8. a rear closing plate; 9. a front panel frame; 10. a chute; 11. a slider; 12. a circuit board; 13. a voltage-resistance capacitor; 14. a light-sensitive tube; 15. processing the chip; 16. silicon controlled rectifier; 17. integrating the blocks; 18. an infrared light emitting tube; 19. a heat dissipation plate; 20. connecting columns; 21. a plate groove; 22. a rear plate frame; 23. a telescopic rod; 24. an elastic chuck; 25. and connecting the clamping columns.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-5, an infrared sensing device includes a housing 1, two sets of input line tubes 2 are installed at the upper end of the housing 1, two sets of output line tubes 5 are installed at the lower end of the housing 1, dust screens 3 are installed at both sides of the housing 1, a front sealing plate 7 is installed at the front end of the housing 1 near the middle, a sensing window 4 is installed at the middle of the front sealing plate 7, fixing screws 6 are installed at four corners of the front sealing plate 7, and a rear sealing plate 8 is installed at the rear end of the housing 1 near the middle;
a front plate frame 9 is mounted near the front end inside the shell 1, sliding chutes 10 are mounted near the middle of the upper end and the lower end inside the shell 1, sliding blocks 11 are arranged in the middle of the sliding chutes 10, a circuit board 12 is mounted between the two groups of sliding blocks 11, a voltage-resistant capacitor 13 is mounted near one side of the front end of the circuit board 12, a photosensitive tube 14 is mounted near the upper end of the front end of the circuit board 12, a silicon controlled rectifier 16 is mounted near the lower end of the front end of the circuit board 12, and a processing chip 15 is mounted near the other side of the front end of the circuit board 12;
the front end of the circuit board 12 is provided with a connecting column 20 near the middle part, the front end of the connecting column 20 is provided with an integrated block 17, the front end of the integrated block 17 is provided with five groups of infrared light emitting tubes 18, the two sides of the inside of the shell 1 are provided with a plurality of groups of plate grooves 21 near the upper and lower ends at equal intervals, and a heat dissipation plate 19 is arranged between the two groups of plate grooves 21 at the upper and lower ends on the same side.
The diameter of response window 4 equals the diameter of dust screen 3, and response window 4 is the arcwall face setting, increases and diverges the face, enlarges the response scope, and response window 4 and preceding shrouding 7 embedded fixed connection.
The front plate frame 9 and the circuit board 12 are arranged in a square shape, the side length of an inner frame of the front plate frame 9 is larger than that of the circuit board 12, the periphery of the front plate frame 9 is fixedly connected with the inner wall of the shell 1, and the front plate frame 9 is convenient to install the front sealing plate 7.
The heat dissipation plate 19 is arranged in a wave shape, so that the contact area is increased, heat dissipation is facilitated, the upper end and the lower end of the heat dissipation plate 19 are movably connected with the plate groove 21 in an embedded mode, and the plate groove 21 is fixedly connected with the inner wall of the shell 1.
The back plate frame 22 is installed by the back to casing 1's inside, and telescopic link 23 is all installed by upper and lower end in the middle part of back plate frame 22, and elasticity dop 24 is installed to the front end of telescopic link 23, and the connection card post 25 is installed to the corresponding position of elasticity dop 24 in the middle part of the rear end of circuit board 12, elasticity dop 24 with connect card post 25 activity joint, convenient to detach and installation.
An infrared induction device comprises the following specific use steps:
the method comprises the following steps: when the device is used, firstly, a circuit of a circuit board 12, an external device and an external power supply is connected through a lead, the connection and disconnection of the lead are realized through an input line tube 2 and an output line tube 5, the connection and disconnection of the power supply of the external device are controlled, then, an infrared sensing device is started, current is reduced after passing through a 564j400V voltage-resistant capacitor 13, and acts on an ES56031E integrated block 17 through a connecting column 20, then, the integrated block 17 generates oscillation to act on a PH-303 infrared light-emitting tube 18 to emit oscillation light, the oscillation light is outwards diffused through an arc-shaped sensing window 4 and is controlled by a CS9803GP processing chip 15, at the moment, the inside of a BTA16-600B silicon controlled rectifier 16 is disconnected, the power supply inside the infrared sensing device is in a disconnected state, the power supply of the external device is disconnected, and the external device stops working;
step two: when a foreign object is shielded at the front part of the induction window 4, the oscillating light emitted by the infrared light emitting tube 18 is blocked by the foreign object and reflected to the photosensitive tube 14, and is controlled by the processing chip 15, at the moment, the interior of the silicon controlled rectifier 16 is switched on, the power supply in the infrared induction device is in a switched-on state, the power supply of the external device is switched on, and the infrared light emitting tube 18 starts to work;
step three: infrared induction device is at the in-process of work, the intelligent part is controlled by processing chip 15, the response window 4 that the arcwall face set up is convenient for enlarge the diffusion range of the oscillating light that infrared luminous tube 18 sent, increase the response scope, the heat that produces in the working process is partly to give off the infrared induction device outside through dust screen 3, another part takes place the heat exchange with the lower heating panel 19 of temperature, guarantee the inside normal temperature of infrared induction device, when needs overhaul or when changing the component infrared induction device, utilize the instrument to take off fixed screw 6, shrouding 7 before taking off, again with circuit board 12 outside pulling out casing 1, accomplish and overhaul or the component is changed, again with circuit board 12 push back inside casing 1, it can to install preceding shrouding 7 and fixed screw 6 again.
The utility model discloses a set up heating panel 19 and cooperate dust screen 3, after infrared induction system worked for a long time, the internal component can produce a large amount of heats, at this moment, because the inside and outside difference in temperature of infrared induction system, some heat can be given off to the infrared induction system outside through dust screen 3, utilize board groove 21 to install and fix heating panel 19, because the temperature of heating panel 19 is lower, therefore another part heat can take place the heat exchange with heating panel 19, mutually support and reduce the temperature in the infrared induction system, avoid the sensitivity of infrared induction of too high influence of temperature, corrugated heating panel 19 has increased area of contact, be more favorable to the heat transfer, when the photosensitive tube 14 in the infrared induction system can not receive the reverberation and lead to the circuit disconnection stop work, the temperature of heating panel 19 can reduce gradually, be convenient for next heat transfer; the induction window 4 and the connecting column 20 are matched with the infrared light emitting tube 18, the connecting distance is increased by the connecting column 20, so that the front end of the infrared light emitting tube 18 extends to the outside of the shell 1, and because the induction window 4 is an arc-shaped surface, when the integrated block 17 oscillates to enable the infrared light emitting tube 18 to generate oscillating light, the oscillating light can be preferentially dispersed onto the induction window 4, and when the oscillating light passes through the arc-shaped surface of the induction window 4, the oscillating light can be further dispersed, so that the dispersion range is increased, the induction range of the infrared induction device is expanded, and the use limitation caused by the small induction range of the infrared induction device is avoided; through setting up telescopic link 23 and elastic chuck 24 cooperation circuit board 12, utilize elastic chuck 24 and connection card post 25 to establish the relation of connection of telescopic link 23 and circuit board 12, because infrared induction device's main component all installs on circuit board 12, consequently, need overhaul infrared induction device or when the component was changed, utilize the instrument to take off fixed screw 6, take off preceding shrouding 7, with the help of telescopic link 23, again with circuit board 12 outside pulling out casing 1, telescopic link 23 is stretched, accomplish and overhaul or the component is changed, again with circuit board 12 push back inside casing 1, telescopic link 23 is recompressed, again before adorning shrouding 7 and fixed screw 6 can, need not to carry out whole dismantlement to infrared induction device, convenient maintenance and the change of component.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (6)
1. An infrared induction device, its characterized in that: the intelligent control cabinet comprises a shell (1), wherein two groups of input line tubes (2) are installed at the upper end of the shell (1), two groups of output line tubes (5) are installed at the lower end of the shell (1), dust screens (3) are installed on the two sides of the shell (1), a front sealing plate (7) is installed at the front end of the shell (1) in the middle, an induction window (4) is installed in the middle of the front sealing plate (7), fixing screws (6) are installed at the four corners of the front sealing plate (7), and a rear sealing plate (8) is installed at the rear end of the shell (1) in the middle;
a front plate frame (9) is mounted in the shell (1) close to the front end, sliding grooves (10) are mounted in the shell (1) close to the upper end and the lower end, sliding blocks (11) are arranged in the middle of the sliding grooves (10), a circuit board (12) is mounted between the two groups of sliding blocks (11), a voltage-resistant capacitor (13) is mounted at one side of the front end of the circuit board (12) close to the middle, a photosensitive tube (14) is mounted at the upper end of the front end of the circuit board (12), a silicon controlled rectifier (16) is mounted at the lower end of the front end of the circuit board (12) close to the lower end, and a processing chip (15) is mounted at the other side of the front end of the circuit board (12);
the front end of circuit board (12) leans on mid-mounting to have spliced pole (20), integrated package (17) are installed to the front end of spliced pole (20), five infrared emitting tubes (18) of group are installed to the front end of integrated package (17), a plurality of groups board groove (21) are installed to the equal equidistance of lower extreme in the inside both sides of casing (1) lean on, lie in and install heating panel (19) between two sets of board grooves (21) of upper and lower extreme with one side.
2. An infrared sensing device according to claim 1, wherein: the casing (1) is a hollow cube, the diameter of the dust screen (3) is smaller than the edge length of the casing (1), and the two sides of the two sets of dust screens (3) and the casing (1) are both in embedded movable connection.
3. An infrared sensing device according to claim 1, wherein: the diameter of the induction window (4) is equal to that of the dustproof net (3), the induction window (4) is arranged in an arc-shaped surface, and the induction window (4) is fixedly connected with the front sealing plate (7) in an embedded mode.
4. An infrared sensing device according to claim 1, wherein: the front frame (9) and the circuit board (12) are arranged in a square shape, the side length of an inner frame of the front frame (9) is larger than that of the circuit board (12), and the periphery of the front frame (9) is fixedly connected with the inner wall of the shell (1).
5. An infrared sensing device according to claim 1, wherein: the heat dissipation plate (19) is arranged in a wave shape, the upper end and the lower end of the heat dissipation plate (19) are movably connected with the plate groove (21) in an embedded mode, and the plate groove (21) is fixedly connected with the inner wall of the shell (1).
6. An infrared sensing device according to claim 1, wherein: the inside of casing (1) leans on the back to install back plate frame (22), and telescopic link (23) are all installed to the middle part of back plate frame (22) by last lower extreme, and elasticity dop (24) are installed to the front end of telescopic link (23), and connection card post (25) are installed to the rear end middle part of circuit board (12) corresponding the position of elasticity dop (24), elasticity dop (24) and connection card post (25) activity joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022326775.1U CN214151091U (en) | 2020-10-19 | 2020-10-19 | Infrared induction device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022326775.1U CN214151091U (en) | 2020-10-19 | 2020-10-19 | Infrared induction device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214151091U true CN214151091U (en) | 2021-09-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022326775.1U Active CN214151091U (en) | 2020-10-19 | 2020-10-19 | Infrared induction device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214151091U (en) |
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2020
- 2020-10-19 CN CN202022326775.1U patent/CN214151091U/en active Active
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