CN214147062U - Novel noise reduction formula computer heat dissipation device - Google Patents

Novel noise reduction formula computer heat dissipation device Download PDF

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Publication number
CN214147062U
CN214147062U CN202021695892.9U CN202021695892U CN214147062U CN 214147062 U CN214147062 U CN 214147062U CN 202021695892 U CN202021695892 U CN 202021695892U CN 214147062 U CN214147062 U CN 214147062U
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China
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mounting
protection
mounting groove
face
installation base
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CN202021695892.9U
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Chinese (zh)
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蔡宇华
王艺璇
宋召良
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Yiyang Vocational & Technical College
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Yiyang Vocational & Technical College
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Priority to CN202021695892.9U priority Critical patent/CN214147062U/en
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Abstract

The utility model discloses a novel noise reduction formula computer cooling device, including installation base and protection machanism, the both sides of terminal surface all are provided with the fixed block under the installation base, be provided with the mounting groove on the up end of installation base, the mounting groove sets up to the T font, the lower extreme inside the mounting groove on the installation base is provided with the semiconductor refrigeration piece, be provided with the installation piece in the inside upper end of mounting groove on the inside wall of installation base both sides, be provided with the fixed plate on the lateral wall of installation piece, be provided with a plurality of support column on the up end of fixed plate, protection machanism sets up on the up end of installation base. The utility model discloses simple structure, reasonable in design can dispel the heat to computer host bottom fast noiselessly, increases the radiating effect of computer, improves the stability of computer operation, can prevent effectively simultaneously that the host computer from empting and colliding, protects the host computer.

Description

Novel noise reduction formula computer heat dissipation device
Technical Field
The utility model relates to a computer cooling equipment technical field specifically is a novel noise reduction formula computer cooling device.
Background
Along with the rapid development of economy and science and technology in China, computers are widely used in daily life, study and work, and along with the continuous increase of the storage capacity of the computers, more and more information can be stored and memorized. The computer can not only carry out calculation, but also store the data and programs participating in the operation, intermediate results and final results for the user to call at any time; various information (such as video, language, characters, graphics, images, music and the like) can be arithmetically operated and logically operated through a coding technology, and the computer mainly comprises: the computer comprises a host, a display screen, a mouse, a keyboard and other parts, wherein the host is one of the most important parts of the computer.
The defects of the prior art are as follows:
present computer host computer is direct placing on subaerial or shelf usually, though the inside of computer host computer is provided with heat radiation structure, but the unable circulation of terminal surface air under the host computer leads to the radiating effect of host computer lower extreme poor, has influenced the radiating effect of host computer to a certain extent, and the host computer machine case outside does not set up corresponding protective structure simultaneously, emptys easily when receiving the collision and damages inner structure even.
Disclosure of Invention
An object of the utility model is to provide a novel noise reduction formula computer heat dissipation device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a novel noise-reducing type computer heat dissipation device comprises an installation base and a protection mechanism, wherein fixed blocks are arranged on two sides of the lower end face of the installation base, an installation groove is formed in the upper end face of the installation base, the installation groove is T-shaped, a semiconductor refrigeration sheet is arranged at the lower end inside the installation groove on the installation base, an installation block is arranged at the upper end inside the installation groove on the inner side wall of the two sides of the installation base, a fixed plate is arranged on the side wall of the installation block, a plurality of support columns are arranged on the upper end face of the fixed plate, the protection mechanism is arranged on the upper end face of the installation base and consists of a plurality of first protection plates, a plurality of second protection plates, a plurality of springs and a plurality of rubber support blocks, and the first protection plates are arranged on two sides of the installation groove on the upper end face of the installation base, the mounting base is characterized in that second protection plates are arranged on the other two sides of the mounting groove on the upper end face of the mounting base, a plurality of springs are arranged on the side faces, close to the middle side of the mounting base, of the first protection plate and the side faces, close to the middle side of the mounting base, of the second protection plate, and rubber supporting blocks are arranged at the other ends of the springs.
Preferably, the inner side wall of the mounting base is provided with a dustproof net at the lower end of the semiconductor refrigeration sheet, and the inner side wall of the mounting base is provided with a rubber pad at the upper end of the mounting block.
Preferably, a sawtooth-shaped anti-slip groove is formed in the lower end face of the fixing block.
Preferably, the fixed plate is made by aluminum plate, be provided with a plurality of heat conduction mouth on the fixed plate between the support column, be provided with a plurality of heat conduction post on the lower terminal surface of fixed plate between the heat conduction mouth.
Preferably, the upper end surface of the supporting column and the upper end surface of the mounting block are on the same horizontal plane.
Preferably, a plurality of grooves are formed in the first protection plate and the second protection plate.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a be provided with the mounting groove on the up end of installation base, the mounting groove sets up to the T font, and the lower extreme in the mounting groove on the installation base is provided with the semiconductor refrigeration piece, through the refrigeration of semiconductor refrigeration piece and the ventilation cooling of mounting groove, can dispel the heat to computer main machine bottom noiselessly fast, increases the radiating effect of computer, improves the stability of computer operation;
2. the utility model discloses a be provided with protection machanism, protection machanism sets up on the up end of installation base, and protection machanism is by the first guard plate of a plurality of, a plurality of second guard plate, a plurality of spring and a plurality of rubber support shoe, through protection machanism's effect, can prevent effectively that the host computer from empting and colliding, protects the main frame.
Drawings
FIG. 1 is an overall perspective view of the novel noise-reducing computer heat sink of the present invention;
FIG. 2 is a schematic view of the internal structure of the mounting base of the novel noise-reducing computer heat dissipation device of the present invention;
fig. 3 is the utility model relates to a novel noise reduction formula computer cooling device whole front view.
In the figure: 1. installing a base; 101. a fixed block; 102. mounting grooves; 103. a dust screen; 104. a rubber pad; 2. a protection mechanism; 21. a first guard plate; 211. a groove; 22. a second guard plate; 23. a spring; 24. a rubber support block; 3. a semiconductor refrigeration sheet; 4. mounting blocks; 5. a fixing plate; 51. a support pillar; 52. a heat conducting port; 53. a heat-conducting column.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a novel noise-reducing type computer heat dissipation device comprises an installation base 1 and a protection mechanism 2, wherein fixed blocks 101 are welded on two sides of the lower end face of the installation base 1, an installation groove 102 is formed in the upper end face of the installation base 1, the installation groove 102 is T-shaped, a semiconductor refrigerating sheet 3 is installed at the lower end inside the installation groove 102 on the installation base 1 through a bolt, an installation block 4 is welded at the upper end inside the installation groove 102 on the inner side walls of two sides of the installation base 1, a fixed plate 5 is installed on the side wall of the installation block 4 through a bolt, a plurality of support columns 51 are welded on the upper end face of the fixed plate 5, the protection mechanism 2 is installed on the upper end face of the installation base 1, the protection mechanism 2 comprises a plurality of first protection plates 21, a plurality of second protection plates 22, a plurality of springs 23 and a plurality of rubber support blocks 24, the first protection plates 21 are welded on two sides of the installation groove 102 on the upper end face of the installation base 1, second protection plates 22 are welded on the other two sides of the installation groove 102 on the upper end face of the installation base 1, a plurality of springs 23 are installed on the side faces, close to one side in the middle of the installation base 1, of the first protection plates 21 and the second protection plates 22, and rubber supporting blocks 24 are installed at the other ends of the springs 23.
In order to prevent dust from penetrating into the mounting groove 102, protect the semiconductor cooling plate 3, and increase the stability of the installation of the computer host, in this embodiment, preferably, a dust-proof net 103 is installed at the lower end of the semiconductor cooling plate 3 on the inner side wall of the mounting base 1, and a rubber pad 104 is connected to the upper end of the mounting block 4 on the inner side wall of the mounting base 1 by hot melting.
In order to increase the friction force of the lower end surface of the fixing block 101 and increase the stability of the mounting base 1, in this embodiment, preferably, the lower end surface of the fixing block 101 is provided with a sawtooth-shaped anti-slip groove.
In order to increase the heat conduction effect and better absorb heat from the semiconductor refrigeration sheet 3, in the present embodiment, preferably, the fixing plate 5 is made of an aluminum plate, a plurality of heat conduction ports 52 are formed between the support pillars 51 on the fixing plate 5, and a plurality of heat conduction columns 53 are welded between the heat conduction ports 52 on the lower end surface of the fixing plate 5.
In order to increase the stability of placing the computer main body case inside the installation groove 102, in the present embodiment, it is preferable that the upper end surface of the support column 51 and the upper end surface of the installation block 4 are on the same horizontal plane.
In order to increase the ventilation area and increase the heat dissipation effect of the side surface of the computer host, in this embodiment, preferably, the first protection plate 21 and the second protection plate 22 are both provided with a plurality of grooves 211.
The working principle is as follows: in the device, when the device is used, the computer mainframe is firstly put into the mounting groove 102 from the upper ends of the first protection plate 21 and the second protection plate 22 and is placed on the upper end surface of the mounting block 4, in the working process of the computer, the semiconductor refrigerating sheet 3 can be started to work to absorb heat and refrigerate, and the air circulation is increased by the mounting groove 102 to dissipate heat, so that the bottom of the computer main machine can be quickly dissipated without noise, the heat dissipation effect of the computer is increased, the running stability of the computer is improved, meanwhile, a protection mechanism 2 is arranged, the protection mechanism 2 is composed of a plurality of first protection plates 21, a plurality of second protection plates 22, a plurality of springs 23 and a plurality of rubber supporting blocks 24, the first protection plate 21, the second protection plate 22 and the spring 23 are used for compression-resistant buffering, so that the host can be effectively prevented from toppling and colliding, and the host computer is protected.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a novel noise reduction formula computer heat dissipation device, includes installation base (1) and protection machanism (2), its characterized in that: the mounting structure comprises a mounting base (1), wherein fixing blocks (101) are arranged on two sides of the lower end face of the mounting base (1), a mounting groove (102) is formed in the upper end face of the mounting base (1), the mounting groove (102) is T-shaped, a semiconductor refrigerating sheet (3) is arranged at the lower end inside the mounting groove (102) on the mounting base (1), a mounting block (4) is arranged at the upper end inside the mounting groove (102) on the inner side walls of the two sides of the mounting base (1), a fixing plate (5) is arranged on the side wall of the mounting block (4), a plurality of supporting columns (51) are arranged on the upper end face of the fixing plate (5), a protection mechanism (2) is arranged on the upper end face of the mounting base (1), and the protection mechanism (2) is composed of a plurality of first protection plates (21), a plurality of second protection plates (22), a plurality of springs (23) and a plurality of rubber supporting blocks (24), the mounting structure is characterized in that first protection plates (21) are arranged on the two sides of the mounting groove (102) on the upper end face of the mounting base (1), second protection plates (22) are arranged on the other two sides of the mounting groove (102) on the upper end face of the mounting base (1), a plurality of springs (23) are arranged on the side faces, close to one side in the middle of the mounting base (1), of the first protection plates (21) and the second protection plates (22), and rubber support blocks (24) are arranged at the other ends of the springs (23).
2. The novel noise-reducing computer heat sink of claim 1, wherein: the semiconductor refrigeration device is characterized in that a dustproof net (103) is arranged at the lower end of the semiconductor refrigeration piece (3) on the inner side wall of the installation base (1), and a rubber pad (104) is arranged at the upper end of the installation block (4) on the inner side wall of the installation base (1).
3. The novel noise-reducing computer heat sink of claim 1, wherein: and a sawtooth-shaped anti-skidding groove is formed in the lower end face of the fixing block (101).
4. The novel noise-reducing computer heat sink of claim 1, wherein: the fixed plate (5) is made by aluminum plate, be provided with a plurality of heat conduction mouth (52) on fixed plate (5) between support column (51), be provided with a plurality of heat conduction post (53) on the lower terminal surface of fixed plate (5) between heat conduction mouth (52).
5. The novel noise-reducing computer heat sink of claim 1, wherein: the upper end surface of the supporting column (51) and the upper end surface of the mounting block (4) are on the same horizontal plane.
6. The novel noise-reducing computer heat sink of claim 1, wherein: the first protection plate (21) and the second protection plate (22) are provided with a plurality of grooves (211).
CN202021695892.9U 2020-08-14 2020-08-14 Novel noise reduction formula computer heat dissipation device Active CN214147062U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021695892.9U CN214147062U (en) 2020-08-14 2020-08-14 Novel noise reduction formula computer heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021695892.9U CN214147062U (en) 2020-08-14 2020-08-14 Novel noise reduction formula computer heat dissipation device

Publications (1)

Publication Number Publication Date
CN214147062U true CN214147062U (en) 2021-09-07

Family

ID=77521943

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021695892.9U Active CN214147062U (en) 2020-08-14 2020-08-14 Novel noise reduction formula computer heat dissipation device

Country Status (1)

Country Link
CN (1) CN214147062U (en)

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