CN214125536U

CN214125536U - SMD 5G communication module

Info

Publication number: CN214125536U
Application number: CN202120295952.6U
Authority: CN
Inventors: 何超
Original assignee: Shenzhen Yixuan Communication Co ltd
Current assignee: Shenzhen Yixuan Communication Co ltd
Priority date: 2021-02-01
Filing date: 2021-02-01
Publication date: 2021-09-03
Anticipated expiration: 2031-02-01

Abstract

The utility model relates to a patch type 5G communication module, which comprises a substrate; the substrate is provided with a power interface, a signal interface for transmitting signals, a control interface for module control, a communication interface for communication and a data interface for transmitting data; the power interface is positioned on one side of the substrate; the signal interface and the control interface are both positioned on the side edge of the substrate opposite to the power interface; the signal interface and the control interface are arranged adjacently; the communication interface and the data interface are positioned on one end part of the substrate; the communication interface is arranged adjacent to the data interface; a reserved interface is also arranged on the substrate; through adopting the better LGA packaging mode of integrated level, set up signal interface, control interface, communication interface and data interface on 5G module, richened the interface type of 5G module to set up and reserve the interface, the user can set up to required interface type according to the application scene demand of difference, and the interface is abundant, and is multiple functional, can the wide application in various application scenes.

Description

SMD 5G communication module

Technical Field

The utility model relates to the field of communication, more specifically say, relate to a SMD 5G communication module.

Background

With the perfect construction of the 5G network, the 5G terminal extends from the personal user market to the Internet of things industry, for example, handheld devices such as mobile phones extend to industrial Internet of things devices such as industrial DTUs/security guards/coal mines. The high-performance service with ultra-large bandwidth and ultra-low time delay is provided for the industrial Internet of things through a plurality of advanced communication technologies such as 5G eMBB/mMTC/uRLLc unique to the 5G technology.

The wireless communication module adopts LCC encapsulation at present many, is the surface mounting type encapsulation form that four sides of module only have the electrode contact and do not have the pin, has the radiating good characteristic of pin installation facility and integration, but this kind of wireless communication module has pin signal less and external interface less, and the interface that externally provides is very limited, and the function is comparatively single, can't satisfy the demand of multiple application scene.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in that there is the less problem of interface in above-mentioned current wireless communication module, to the above-mentioned defect of prior art, provides a SMD 5G communication module.

The utility model provides a technical scheme that its technical problem adopted is: constructing a patch type 5G communication module, which comprises a substrate; the substrate is provided with a power interface, a signal interface for transmitting signals, a control interface for module control, a communication interface for communication and a data interface for transmitting data;

the power interface is positioned on one side of the substrate; the signal interface and the control interface are both positioned on the side edge of the substrate opposite to the power interface; the signal interface and the control interface are arranged adjacently; the communication interface and the data interface are positioned on one end part of the substrate; the communication interface is arranged adjacent to the data interface; and a reserved interface is also arranged on the substrate.

Further, the signal interface comprises an I2C interface and an I2S interface; the I2C interface and the I2S interface are disposed on opposite sides of the substrate from the power interface; the I2S interface is disposed adjacent to the I2C interface.

Further, the communication interface comprises a USIM interface; the USIM interface is arranged adjacent to the data interface.

Further, the data interface comprises an RGMI interface, a PCIE interface and a USB interface which are adjacently arranged at one end of the substrate in sequence; the USIM interface is positioned at one side of the RGMI interface, which is far away from the PCIE interface.

Further, the control interface comprises a GPIO control interface; the GPIO control interface is positioned at the side of the I2S interface far away from the I2C interface.

Further, the reserved interface comprises a first reserved interface and a second reserved interface; the first reserved interface is arranged adjacent to the power interface; the second reserved interface is arranged at the end part, opposite to the data interface, of the 5G module.

Furthermore, the substrate is also provided with an antenna interface; the antenna interface is arranged on the adjacent edge of the second reserved interface.

Further, the number of the antenna interfaces is 9.

Further, the number of the pins of the substrate is 275.

Further, the substrate is composed of a 12-layer PCB board.

The beneficial effects of the utility model reside in that: through adopting the better LGA packaging mode of integrated level, set up signal interface, control interface, communication interface and data interface on 5G module, richened the interface type of 5G module to set up and reserve the interface, the user can set up to required interface type according to the application scene demand of difference, and the interface is abundant, and is multiple functional, can the wide application in various application scenes.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work according to the drawings:

fig. 1 is a schematic structural diagram of a patch 5G communication module according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, a clear and complete description will be given below with reference to the technical solutions of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

The utility model constructs a patch type 5G communication module, as shown in figure 1, which comprises a substrate 9; the substrate 9 is provided with a power interface, a signal interface for transmitting signals, a control interface for module control, a communication interface for communication, and a data interface for transmitting data;

the power interface is positioned at one side of the substrate 9; the signal interface and the control interface are both positioned on the side edge of the substrate 9 opposite to the power interface; the signal interface and the control interface are arranged adjacently; the communication interface and the data interface are located on one end of the substrate 9; the communication interface is arranged adjacent to the data interface; the substrate 9 is also provided with a reserved interface.

Wherein, the pin of each type interface on the base plate 9 all is located base plate 9 bottom, can directly carry out SMD installation during the use, adopt the better LGA encapsulation mode of integrated level, set up signal interface on 5G module, control interface, communication interface and data interface, can correspondingly carry out signal transmission, state control, application function such as communication connection and data transmission, the interface type of 5G module has been richened, and set up and reserve the interface, the user can be according to the application scene demand of difference, it sets up to required interface type to reserve the interface, the interface is abundant, multiple functions, can wide application in various application scenes.

In the above embodiment, the power interface is located in the area 1 in the figure, and is used for receiving the external power supply voltage. The substrate 9 is provided with a power management chip inside, and the power interface receives an external power supply voltage, transmits the external power supply voltage to the power management chip, and outputs the external power supply voltage to the power management chip.

In the above embodiment, the substrate 9 has a size of 42mm 46mm 3.2 mm.

In further embodiments, the signal interface includes an I2C interface and an I2S interface; the I2C interface and the I2S interface are arranged on the opposite side of the substrate 9 from the power interface; the I2S interface is disposed adjacent to the I2C interface. The I2S interface is used for audio signal transmission, and the I2C interface is used for bus data transmission. In the figure, the area 21 is an I2C interface, and the area 22 is an I2S interface

In a further embodiment, the communication interface comprises a USIM interface; the USIM interface is arranged adjacent to the data interface.

In a further embodiment, the data interface includes an RGMI interface, a PCIE interface and a USB interface which are adjacently disposed in sequence at one end of the substrate 9; the USIM interface is positioned at one side of the RGMI interface far away from the PCIE interface.

In the above embodiment, the USIM interface is used for connecting with the SIM card, the USIM interface is located in the area 3 in the drawing, the RGMI interface is located in the area 41 in the drawing, the PCIE interface is located in the area 42 in the drawing, and the USB interface is located in the area 43 in the drawing. The USB interface and the PCIE interface are both used for high-speed data transmission, the USB interface is divided into USB2.0 and USB3.0, and the PCIE interface is divided into PCIE2.0 and PCIE 3.0.

In a further embodiment, the control interface comprises a GPIO control interface; the GPIO control interface is positioned at the side of the I2S interface far away from the I2C interface. The GPIO control interface can output GPIO signals to control the state of a module product, and comprises energy consumption monitoring and running state lamp control of the module. The GPIO control interface is located in region 7 of the figure.

In a further embodiment, the reservation interface comprises a first reservation interface and a second reservation interface; the first reserved interface is arranged adjacent to the power interface; the second reserved interface is arranged at the end opposite to the data interface on the 5G module. The first reserved interface is located in an area 51 in the figure, the second reserved interface is located in an area 52 in the figure, and the first reserved interface can be additionally provided with a Wifi interface for wireless communication and an RF interface for radio frequency when needed. IF needed, the second reserved interface can be additionally provided with an IF interface for communication connection, an RF interface for radio frequency, a status light interface, a Wifi interface for wireless communication and the like.

In a further embodiment, the substrate 9 is also provided with an antenna interface; the antenna interface is arranged on the adjacent edge of the second reserved interface.

In a further embodiment, the number of antenna interfaces is 9.

In the above embodiment, the antenna interface is located in the area 61 in the figure. The 9-antenna design scheme is provided, and meanwhile, the use scene of 2/4/6/8-antenna supporting can be extended.

In a further embodiment, the number of pins of the substrate 9 is 275. The utility model provides abundant pin foot signal, reach 275 pin signals, can satisfy various interfaces and functions, including general USB2.0, USB3.0 and Mini-PCIE2.0, Mini-PCIE3.0, also can expand to interfaces such as GPIO and I2S/I2C simultaneously, the interface type of 5G module has been richened, and set up and reserve the interface, the user can be according to the application scene demand of difference, set up to required interface type with reserving the interface, the interface is abundant, complete functions, can wide application in various application scenes.

In a further embodiment, the substrate 9 is constituted by a 12-layer PCB board. The high-integration design scheme of any-order wiring is adopted, the good performance of multiple interfaces and low power consumption can be provided, the interfaces provided externally comprise universal USB2.0/3.0 and Mini-PCIE2.0/3.0, the interfaces such as GPIO (general purpose input/output) and I2S/I2C can be expanded, 2/4/6/8/9 antennas can be flexibly configured, and slot configuration of USIM and eSIM is met.

It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.

Claims

1. The utility model provides a SMD 5G communication module which characterized in that: comprises a substrate; the substrate is provided with a power interface, a signal interface for transmitting signals, a control interface for module control, a communication interface for communication and a data interface for transmitting data;

2. The patch type 5G communication module according to claim 1, wherein the signal interface comprises an I2C interface and an I2S interface; the I2C interface and the I2S interface are disposed on opposite sides of the substrate from the power interface; the I2S interface is disposed adjacent to the I2C interface.

3. The patch type 5G communication module according to claim 1, wherein the communication interface comprises a USIM interface; the USIM interface is arranged adjacent to the data interface.

4. The patch type 5G communication module according to claim 3, wherein the data interface comprises an RGMI interface, a PCIE interface and a USB interface which are adjacently arranged at one end of the substrate in sequence; the USIM interface is positioned at one side of the RGMI interface, which is far away from the PCIE interface.

5. The patch type 5G communication module according to claim 2, wherein the control interface comprises a GPIO control interface; the GPIO control interface is positioned at the side of the I2S interface far away from the I2C interface.

6. The patch type 5G communication module according to claim 5, wherein the reserved interface comprises a first reserved interface and a second reserved interface; the first reserved interface is arranged adjacent to the power interface; the second reserved interface is arranged at the end part, opposite to the data interface, of the 5G module.

7. The patch type 5G communication module according to claim 6, wherein the substrate is further provided with an antenna interface; the antenna interface is arranged on the adjacent edge of the second reserved interface.

8. The patch type 5G communication module according to claim 7, wherein the number of the antenna interfaces is 9.

9. The patch type 5G communication module according to claim 1, wherein the number of the pins of the substrate is 275.

10. The patch type 5G communication module according to claim 1, wherein the substrate is formed of a 12-layer PCB.