CN214111136U

CN214111136U - Cooling forming device of thermal contraction hot film covering machine

Info

Publication number: CN214111136U
Application number: CN202022120981.7U
Authority: CN
Inventors: 郑国强; 肖春生; 郑俊伟
Original assignee: Shantou Baohua Food & Beverage Co ltd
Current assignee: Shantou Baohua Food & Beverage Co ltd
Priority date: 2020-09-24
Filing date: 2020-09-24
Publication date: 2021-09-03
Anticipated expiration: 2030-09-24

Abstract

The utility model discloses a cooling forming device of thermal contraction hot film chartered plane, including organism, holding down plate, spout, top board and electric telescopic handle, there is the holding down plate body cavity bottom fixed mounting, the spout has all been fixed to organism inner wall both sides, there is the top board body cavity through spout slidable mounting, the equal fixed mounting in top board upper surface both ends has electric telescopic handle, the fixed surface inlays under the top board has semiconductor refrigeration piece No. one, semiconductor refrigeration piece upper surface has a heating panel through heat dissipation silicone grease fixed pasting, fixed surface installs the water tank No. one on the top board, water tank one side fixed mounting has the circulating pump No. one. The utility model discloses can cool off the shaping to the upper surface and the lower surface of thermal contraction membrane simultaneously at the in-process that uses, and multiple cooling heat dissipation mode mutually supports to effectively promote the cooling shaping efficiency to the thermal contraction membrane.

Description

Cooling forming device of thermal contraction hot film covering machine

Technical Field

The utility model relates to a equipment for packing technical field specifically is a cooling forming device of hot membrane chartered plane of thermal contraction.

Background

In the packaging machinery industry, film wrapping machines are short for wrapping film packaging machines, sometimes also referred to as wrapping machines, wrapping machines. The function is to meet the packaging requirements of cargo containerized storage, transportation and mechanical loading and unloading operation. Widely used with the collection cost of products such as foreign trade export, food and beverage, system irrigation, papermaking, dyestuff, plastic chemical industry, glass pottery, quick-witted S electroforming spare, improve production efficiency, can prevent the damage of goods in handling again to play dustproof, dampproofing and the effect of keeping a public place clean.

However, the cooling and forming device of the prior thermal shrinkage hot film packaging machine has the following defects:

the cooling forming device of the existing thermal contraction hot film packaging machine can only cool one surface of the upper surface or the lower surface of the thermal contraction film in the using process, and the cooling forming mode is single, so that the cooling forming efficiency of the thermal contraction film is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a cooling forming device of thermal contraction hot film chartered plane to in solving above-mentioned background art, the cooling forming device of current thermal contraction hot film chartered plane can only cool off the upper surface of thermal contraction membrane or a face in the lower surface in the in-process that uses, and the single of cooling shaping mode comparison, thereby lead to the lower problem of cooling shaping efficiency to the thermal contraction membrane.

In order to achieve the above object, the utility model provides a following technical scheme: a cooling forming device of a thermal contraction hot film packaging machine comprises a machine body, a lower pressing plate, sliding grooves, an upper pressing plate and an electric telescopic rod, wherein the lower pressing plate is fixedly arranged at the bottom of an inner cavity of the machine body, the sliding grooves are fixedly formed in two sides of the inner wall of the machine body, the upper pressing plate is slidably arranged in the inner cavity of the machine body through the sliding grooves, the electric telescopic rod is fixedly arranged at two ends of the upper surface of the upper pressing plate, a semiconductor refrigerating sheet is fixedly embedded on the lower surface of the upper pressing plate, a heating plate is fixedly adhered on the upper surface of the semiconductor refrigerating sheet through heat dissipation silicone grease, a water tank is fixedly arranged on the upper surface of the upper pressing plate, a circulating pump is fixedly arranged on one side of the water tank, an S-shaped heat collecting pipe is fixedly embedded in an inner cavity of the upper pressing plate, one end of the S-shaped heat collecting pipe is connected with the circulating pump, the other end of the S-shaped heat collecting pipe is fixedly connected with the water tank, the second exhaust pipe is used for placing the heat-packaged heat shrinkable film on a lower pressing plate in the inner cavity of the machine body, the electric telescopic rod is controlled to stretch and retract, so that the upper pressing plate is pushed to press down along the sliding groove through the electric telescopic rod, the heat shrinkable film can be clamped and fixed through the mutual matching of the upper pressing plate and the lower pressing plate, the Peltier effect of a semiconductor material is simultaneously utilized through the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet, so that the cold energy can be released, the upper surface and the lower surface of the heat shrinkable film can be simultaneously cooled and molded through the released cold energy, the cooling liquid in the first water tank and the cooling liquid in the second water tank are simultaneously extracted through the first circulating pump and the second circulating pump, the cooling liquid is respectively injected into the inner cavities of the first S-shaped heat collecting pipe and the second S-shaped heat collecting pipe, and the cooling liquid continuously circulates in the inner cavities of the first S-, the heat transmitted to the upper pressing plate and the lower pressing plate can be taken away, the first stirring paddle and the second stirring paddle are synchronously driven by the first motor and the second motor to stir the cooling liquid, the cooling speed of the cooling liquid can be accelerated, the cooling forming speed of the heat shrinkage film can be further improved, the heat release surfaces of the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet can be cooled through the first heat dissipation plate and the second heat dissipation plate, and the influence of the released heat on the cooling forming speed of the heat shrinkage film is avoided.

Preferably, a water tank top fixed mounting has a motor, the power take off end fixedly connected with stirring rake of a motor, can drive a stirring rake through a motor.

Preferably, lower clamp plate upper surface fixed inlays and has No. two semiconductor refrigeration pieces, No. two semiconductor refrigeration piece bottom surfaces are fixed through heat conduction silicone grease and are pasted and have No. two heating panels, and No. two heating panels can dispel the heat to the heat release face of No. two semiconductor refrigeration pieces.

Preferably, lower fixed surface installs No. two water tanks under the holding down plate, No. two water tank one end fixed mounting have No. two circulating pumps, the holding down plate inner chamber is fixed to be inlayed and is had No. two S type thermal-collecting tubes, No. two S type thermal-collecting tube one end links to each other with No. two circulating pumps, No. two S type thermal-collecting tube other ends link to each other with No. two water tanks, and the coolant liquid is at the continuous circulation in No. two S type thermal-collecting tube inner chambers, can take away the heat on transmitting the holding down plate.

Preferably, the lower extreme fixed mounting of No. two water tanks has No. two motors, No. two stirring rakes of power take off end fixedly connected with of No. two motors can drive No. two stirring rakes through No. two motors.

Preferably, No. two blast pipes of No. two water tank other end tops fixedly connected with, No. one blast pipe of water tank top one side fixed mounting, No. one water tank and No. two water tank accessible blast pipe and No. two blast pipe discharge.

The utility model provides a cooling forming device of thermal contraction hot film chartered plane possesses following beneficial effect:

(1) the utility model discloses a semiconductor refrigeration piece and No. two semiconductor refrigeration pieces utilize semiconductor material's Peltier effect simultaneously to can release cold volume, through the cold volume that releases, can cool off the shaping through upper surface and the lower surface to the thermal contraction membrane simultaneously.

(2) The utility model discloses a coolant liquid in a circulating pump and No. two circulating pumps are simultaneously extracted to a water tank and No. two water tanks, and pour into a S type thermal-collecting tube and No. two S type thermal-collecting tube inner chambers with the coolant liquid respectively, the coolant liquid is at the continuous circulation in a S type thermal-collecting tube and No. two S type thermal-collecting tube inner chambers, can take away the heat on transmitting top board and holding down plate, and stir the coolant liquid through a motor and No. two motor synchronous drive stirring rakes and No. two stirring rakes, can accelerate the cooling rate of coolant liquid, thereby can further promote the cooling shaping speed to the thermal contraction membrane.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the first water tank of the present invention;

FIG. 3 is a schematic structural view of the upper platen of the present invention;

fig. 4 is the structural schematic diagram of the lower pressing plate and the second water tank of the present invention.

In the figure: 1. a body; 101. a lower pressing plate; 102. a chute; 103. an upper pressure plate; 104. an electric telescopic rod; 2. a first semiconductor refrigeration chip; 201. a first heat dissipation plate; 202. a first water tank; 203. a first circulating pump; 204. a first S-shaped heat collecting pipe; 3. a first motor; 301. a first stirring paddle; 302. a first exhaust pipe; 4. a second semiconductor refrigerating sheet; 401. a second heat dissipation plate; 402. a second water tank; 403. a second circulating pump; 404. a second S-shaped heat collecting pipe; 5. a second motor; 501. a second stirring paddle; 502. and a second exhaust pipe.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

As shown in fig. 1-4, the utility model provides a technical scheme: a cooling forming device of a thermal contraction hot film packaging machine comprises a machine body 1, a lower pressing plate 101, sliding grooves 102, an upper pressing plate 103 and an electric telescopic rod 104, wherein the lower pressing plate 101 is fixedly arranged at the bottom of the inner cavity of the machine body 1, the sliding grooves 102 are fixedly arranged on two sides of the inner wall of the machine body 1, the upper pressing plate 103 is slidably arranged in the inner cavity of the machine body 1 through the sliding grooves 102, the electric telescopic rod 104 is fixedly arranged at two ends of the upper surface of the upper pressing plate 103, a semiconductor refrigerating sheet 2 is fixedly embedded on the lower surface of the upper pressing plate 103, a heat dissipation plate 201 is fixedly adhered on the upper surface of the semiconductor refrigerating sheet 2 through heat dissipation silicone grease, a water tank 202 is fixedly arranged on the upper surface of the upper pressing plate 103, a circulating pump 203 is fixedly arranged on one side of the water tank 202, an S-shaped heat collection pipe 204 is fixedly embedded in the inner cavity of the upper pressing plate 103, one end of the S-shaped heat collection pipe 204 is connected with the circulating pump 203, the other end of the first S-shaped heat collecting pipe 204 is fixedly connected with the first water tank 202, the second exhaust pipe 502 is used for placing a heat-packaged heat shrinkable film on the lower pressing plate 101 in the inner cavity of the machine body 1, the electric telescopic rod 104 is controlled to stretch and retract, so that the upper pressing plate 103 is pushed to press down along the sliding groove 102 through the electric telescopic rod 104, the heat shrinkable film can be clamped and fixed through mutual matching of the upper pressing plate 103 and the lower pressing plate 101, the Peltier effect of a semiconductor material is simultaneously utilized through the first semiconductor refrigerating sheet 2 and the second semiconductor refrigerating sheet 4, so that cold energy can be released, the upper surface and the lower surface of the heat shrinkable film can be simultaneously cooled and molded through the released cold energy, the cooling liquid in the first water tank 202 and the second water tank 402 can be simultaneously extracted through the first circulating pump 203 and the second circulating pump 403, and the cooling liquid is respectively injected into the inner cavities of the first S-shaped heat collecting pipe 204 and the second S-shaped heat collecting pipe 404, the cooling liquid continuously circulates in the inner cavities of the first S-shaped heat collecting tube 204 and the second S-shaped heat collecting tube 404, heat transmitted to the upper pressing plate 103 and the lower pressing plate 101 can be taken away, the first motor 3 and the second motor 5 synchronously drive the first stirring paddle 301 and the second stirring paddle 501 to stir the cooling liquid, the cooling speed of the cooling liquid can be accelerated, the cooling forming speed of the heat shrinkable film can be further improved, the heat releasing surfaces of the first semiconductor refrigerating sheet 2 and the second semiconductor refrigerating sheet 4 can be cooled through the first heat dissipation plate 201 and the second heat dissipation plate 401, and the influence of the released heat on the cooling forming speed of the heat shrinkable film is avoided.

A water tank 202 top fixed mounting has a motor 3, a motor 3's power take off end fixedly connected with stirring rake 301, can drive a stirring rake 301 through a motor 3.

Fixed surface inlays on holding down plate 101 has No. two semiconductor refrigeration pieces 4, No. two semiconductor refrigeration piece 4 bottom surfaces are fixed through heat conduction silicone grease and are pasted and have No. two heating panels 401, and No. two heating panels 401 can dispel the heat to the heat release face of No. two semiconductor refrigeration pieces 4.

No. two water tanks 402 are fixedly mounted on the lower surface of the lower pressing plate 101, No. two circulating pumps 403 are fixedly mounted at one end of each water tank 402, an inner cavity of the lower pressing plate 101 is fixedly inlaid with two S-shaped heat collecting tubes 404, one ends of the two S-shaped heat collecting tubes 404 are connected with the two circulating pumps 403, the other ends of the two S-shaped heat collecting tubes 404 are connected with the two water tanks 402, and cooling liquid circulates continuously in the inner cavities of the two S-shaped heat collecting tubes 404 and can take away heat transferred to the lower pressing plate 101.

No. two motor 5 of lower extreme fixed mounting of water tank 402, No. two motor 5's power take off end fixedly connected with stirring rake 501 No. two, can drive stirring rake 501 No. two through No. two motor 5.

No. two blast pipe 502 of No. two water tank 402 other end tops fixedly connected with, No. one blast pipe 302 of No. one water tank 202 top one side fixed mounting, No. one water tank 202 and No. two water tank 402 accessible blast pipe 302 and No. two blast pipe 502 discharge.

It should be noted that, in the cooling and forming device of the thermal contraction hot film packaging machine, when in operation, the second exhaust pipe 502 places the thermal contraction film after thermal packaging on the lower pressing plate 101 in the inner cavity of the machine body 1, the electric telescopic rod 104 is controlled to stretch and retract, so that the upper pressing plate 103 is pushed by the electric telescopic rod 104 to press down along the chute 102, so that the thermal contraction film can be clamped and fixed by the mutual matching of the upper pressing plate 103 and the lower pressing plate 101, the Peltier effect of the semiconductor material is utilized by the first semiconductor refrigerating sheet 2 and the second semiconductor refrigerating sheet 4 at the same time, so that the cold energy can be released, the released cold energy can be simultaneously cooled and formed by the upper surface and the lower surface of the thermal contraction film, the cooling liquid in the first water tank 202 and the second water tank 402 can be simultaneously extracted by the first circulating pump 203 and the second circulating pump 403, and the cooling liquid can be respectively injected into the inner cavities of the first S-type heat collecting pipe 204 and the second, the coolant continuously circulates in the inner cavities of the first S-shaped heat collecting tube 204 and the second S-shaped heat collecting tube 404, heat transmitted to the upper pressing plate 103 and the lower pressing plate 101 can be taken away, the first motor 3 and the second motor 5 synchronously drive the first stirring paddle 301 and the second stirring paddle 501 to stir the coolant, the cooling speed of the coolant can be accelerated, the cooling forming speed of the heat shrinkable film can be further improved, the first water tank 202 and the second water tank 402 can be discharged through the first exhaust pipe 302 and the second exhaust pipe 502, the heat releasing surfaces of the first refrigerating semiconductor sheet 2 and the second refrigerating sheet 4 can be cooled through the first heat dissipation plate 201 and the second heat dissipation plate 401, and the released heat is prevented from influencing the cooling forming speed of the heat shrinkable film.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a cooling forming device of thermal contraction hot film chartered plane, includes organism (1), holding down plate (101), spout (102), top board (103) and electric telescopic handle (104), organism (1) inner chamber bottom fixed mounting has holding down plate (101), spout (102) have all been fixed to organism (1) inner wall both sides, organism (1) inner chamber has top board (103) through spout (102) slidable mounting, the equal fixed mounting in top board (103) upper surface both ends has electric telescopic handle (104), its characterized in that: fixed surface inlays under top board (103) and has semiconductor refrigeration piece (2) No. one, semiconductor refrigeration piece (2) upper surface has heating panel (201) No. one through heat dissipation silicone grease fixed paste, fixed surface installs water tank (202) on top board (103), water tank (202) one side fixed mounting has circulating pump (203) No. one, top board (103) inner chamber is fixed to be inlayed and has S type thermal-collecting tube (204) No. one, S type thermal-collecting tube (204) one end links to each other with circulating pump (203) No. one, S type thermal-collecting tube (204) other end links to each other with water tank (202) is fixed.

2. The cooling and forming device of the thermal contraction hot film covering machine according to claim 1, characterized in that: a motor (3) is fixedly installed at the top of the first water tank (202), and a first stirring paddle (301) is fixedly connected with the power output end of the motor (3).

3. The cooling and forming device of the thermal contraction hot film covering machine according to claim 1, characterized in that: lower clamp plate (101) upper surface fixed inlays and has No. two semiconductor refrigeration pieces (4), No. two semiconductor refrigeration piece (4) bottom surface is fixed through heat conduction silicone grease and is pasted and have No. two heating panels (401).

4. The cooling and forming device of the thermal contraction hot film covering machine according to claim 1, characterized in that: no. two water tank (402) are fixedly installed to holding down plate (101) lower surface, No. two circulating pump (403) are installed to No. two water tank (402) one end fixed mounting, holding down plate (101) inner chamber is fixed and is inlayed and have No. two S type thermal-collecting tube (404), No. two S type thermal-collecting tube (404) one end links to each other with No. two circulating pump (403), No. two S type thermal-collecting tube (404) other end links to each other with No. two water tank (402).

5. The cooling and forming device of the thermal contraction hot film covering machine according to claim 4, characterized in that: no. two motors (5) are fixedly mounted at the lower end of the No. two water tanks (402), and a second stirring paddle (501) is fixedly connected with the power output end of the No. two motors (5).

6. The cooling and forming device of the thermal contraction hot film covering machine according to claim 5, characterized in that: no. two blast pipe (502) of No. two water tank (402) other end top fixedly connected with, No. one blast pipe (302) of No. one water tank (202) top one side fixed mounting.