CN214100539U

CN214100539U - Temperature self-adaptation switch board

Info

Publication number: CN214100539U
Application number: CN202023345256.6U
Authority: CN
Inventors: 朱海光; 厉幸静
Original assignee: Hangzhou Anzhong Electric Co ltd
Current assignee: Zhejiang Anzhong Electric Co ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-08-31
Anticipated expiration: 2030-12-31

Abstract

The utility model provides a temperature self-adaptation switch board belongs to switch board technical field. The temperature self-adaptive power distribution cabinet comprises a cabinet body, a heat dissipation mechanism and a cooling mechanism. The plywood is installed at internal interval of cabinet, heat dissipation mechanism includes fan and heat exchange tube, the output of fan with cabinet body intercommunication, the heat exchange tube sets up the plywood surface, just the heat exchange tube tip runs through the plywood, cooling mechanism includes refrigeration spare and cooling tube, the refrigeration spare is installed cabinet body surface, the one end of cooling tube with the refrigeration end of refrigeration spare is connected. The utility model discloses a refrigeration piece, cooling tube and heat exchange tube cooperation reduce the temperature of plywood and the internal portion of cabinet, do benefit to the electronic equipment to the internal portion of cabinet and cool down, in addition, can carry the internal portion of cabinet with external gas through the fan for the gas flow of the internal portion of cabinet does benefit to the steam discharge of the internal portion of cabinet, does benefit to the heat dissipation of the internal portion of cabinet.

Description

Temperature self-adaptation switch board

Technical Field

The utility model relates to a switch board field particularly, relates to a temperature self-adaptation switch board.

Background

The power distribution cabinet is a general name of a motor control center and is mainly used in occasions with dispersed loads and less loops, and the power distribution cabinet is mainly divided into a power distribution cabinet, a lighting distribution cabinet and a metering cabinet.

The inside electronic equipment that installs usually of switch board, these electronic equipment can produce the heat when using, and current switch board radiating effect is poor, and temperature self-adaptation ability is poor, inconveniently carries out cooling, and the inside electronic equipment of switch board appears damaging easily in high temperature environment.

SUMMERY OF THE UTILITY MODEL

In order to compensate above not enough, the utility model provides a temperature self-adaptation switch board aims at improving that traditional switch board radiating effect is poor, the inconvenient problem of cooling down that carries on.

The utility model discloses a realize like this:

the utility model provides a temperature self-adaptation switch board, including the cabinet body, heat dissipation mechanism and cooling body.

The plywood is installed at internal interval of cabinet, heat dissipation mechanism includes fan and heat exchange tube, the output of fan with cabinet body intercommunication, the heat exchange tube sets up the plywood surface, just the heat exchange tube tip runs through the plywood, cooling mechanism includes refrigeration spare and cooling tube, the refrigeration spare is installed cabinet body surface, the one end of cooling tube with the refrigeration end of refrigeration spare is connected, the other end of cooling tube is installed the cabinet is internal, just the one end of heat exchange tube runs through the cooling tube.

In an embodiment of the present invention, an extension plate is disposed at the bottom end of the cabinet body, the extension plate is a trough plate, and the fan is fixedly connected to the extension plate.

The utility model discloses an in one embodiment, the louvre has been seted up on cabinet body top, the baffle is installed on cabinet body top, the baffle cross-section is the chevron shape.

In an embodiment of the present invention, a heat conducting washer is installed on the top end of the heat exchange tube, and the heat conducting washer is located on the upper end surface of the laminate.

In an embodiment of the present invention, the heat conducting gasket is communicated with the heat exchanging pipe, and the surface of the heat conducting gasket is spaced apart from the surface of the heat exchanging pipe.

In an embodiment of the present invention, the cooling pipe is located below the corresponding laminate, and the heat exchange pipe is fixedly connected to the laminate.

In an embodiment of the present invention, the heat exchange tube surface fastening cover is provided with a sealing ring, and the sealing ring is bonded and sealed with the cooling tube by a sealant.

The utility model discloses an in one embodiment, the refrigeration piece includes cooler bin and feed liquor pipe, the cooler bin is installed cabinet body surface, the feed liquor pipe communicate in the cooler bin, cooler bin one end with the cooler bin intercommunication, just the one end of cooler bin seals the setting.

The utility model discloses an in the embodiment, the refrigeration piece still includes the semiconductor refrigeration piece, the cooler bin surface inlays and is equipped with the conducting strip, the refrigeration face of semiconductor refrigeration piece with the conducting strip is fixed, the face setting of heating of semiconductor refrigeration piece is in the cooler bin outside, just radiating fin is installed to the face of heating of semiconductor refrigeration piece.

The utility model discloses an in the embodiment, the cooling tank bottom intercommunication has the drain pipe, just the feed liquor pipe shaft with the drain pipe shaft all is provided with the valve.

The utility model has the advantages that: the utility model discloses a temperature self-adaptation switch board that above-mentioned design obtained, during the use, utilize the refrigeration piece to cool off the cooling tube, and then can cool off the heat exchange tube, can reduce plywood and the temperature of the internal portion of cabinet, alright cool down with the electronic equipment to the internal portion of cabinet, do benefit to electronic equipment and use at the internal portion of cabinet, in addition, start the fan, the fan can carry the internal portion of cabinet with external gas for the gas flow of the internal portion of cabinet, do benefit to the steam discharge of the internal portion of cabinet, do benefit to the heat dissipation of the internal portion of cabinet.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a temperature adaptive power distribution cabinet provided by an embodiment of the present invention;

fig. 2 is a schematic view of a connection structure of a cabinet body and a laminate according to an embodiment of the present invention;

fig. 3 is a schematic structural view of a refrigeration piece according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a position a in fig. 3 according to an embodiment of the present invention.

In the figure: 100-a cabinet body; 110-layer plate; 120-support plate; 130-heat dissipation holes; 140-a baffle; 300-a heat dissipation mechanism; 310-a fan; 320-heat exchange tube; 321-a sealing ring; 330-thermally conductive gasket; 340-air holes; 500-a cooling mechanism; 510-a refrigeration element; 511-a cooling tank; 512-liquid inlet pipe; 513-semiconductor refrigerating sheets; 514-heat conducting block; 515-a liquid outlet pipe; 520-cooling tube.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Examples

Referring to fig. 1-4, the present invention provides a temperature adaptive power distribution cabinet, which includes a cabinet 100, a heat dissipation mechanism 300 and a cooling mechanism 500.

The heat dissipation mechanism 300 is used for conveying gas to the inside of the cabinet 100, so that the gas inside the cabinet 100 flows, the hot gas inside the cabinet 100 is blown out, the heat dissipation and cooling inside the cabinet 100 are facilitated, and the cooling mechanism 500 is used for cooling and cooling the inside of the cabinet 100.

Referring to fig. 1-2, the cabinet 100 is provided with a plurality of laminates 110 at intervals, in an implementation, the joints between the laminates 110 and the cabinet 100 are welded and fixed, so that the connection between the laminates 110 and the cabinet 100 is more stable, the plurality of laminates 110 can be arranged at intervals along the height direction of the cabinet 100, and the electronic devices can be placed on the surfaces of the laminates 110.

In this embodiment, a support plate 120 is disposed at the bottom end of the cabinet 100, the support plate 120 is a trough plate, the blower 310 is fixedly connected to the support plate 120, the support plate 120 is used for supporting the cabinet 100 and the blower 310, and a connection portion of the support plate 120 and the cabinet 100 is integrally formed; the top end of the cabinet body 100 is provided with the heat dissipation hole 130, the top end of the cabinet body 100 is provided with the baffle 140, the cross section of the baffle 140 is in a herringbone shape, the heat dissipation hole 130 is formed, the discharge of hot air in the cabinet body 100 is facilitated, the baffle 140 can block the possibility that dust, water liquid and the like fall into the top end of the cabinet body 100, and the possibility that impurities enter the inside of the cabinet body 100 through the heat dissipation hole 130 is reduced.

Referring to fig. 1-2, the heat dissipation mechanism 300 includes a fan 310 and a heat exchange tube 320, an output end of the fan 310 is communicated with the cabinet 100, the heat exchange tube 320 is disposed on a surface of the laminate 110, and an end of the heat exchange tube 320 penetrates through the laminate 110, in a specific implementation, the fan 310 is started, the fan 310 can convey external air into the cabinet 100, so as to accelerate air flow inside the cabinet 100, facilitate discharge of hot air inside the cabinet 100, and facilitate heat dissipation inside the cabinet 100, and in addition, the heat exchange tube 320 is disposed, so as to facilitate air to pass through the laminate 110, and facilitate air circulation.

In this embodiment, the heat conducting gasket 330 is installed at the top end of the heat exchanging tube 320, and the heat conducting gasket 330 is located on the upper end surface of the laminate 110, both the heat exchanging tube 320 and the cooling tube 520 can be made of materials with good heat conducting performance such as copper and aluminum, and the heat conducting gasket 330 can be made of heat conducting silica gel, when the electronic device is placed on the surface of the laminate 110, one side of the heat conducting gasket 330 is tightly attached to the electronic device, heat generated by the electronic device can be transferred to the heat exchanging tube 320 through the heat conducting gasket 330, the cooling element 510 can cool the cooling tube 520, so as to cool the heat exchanging tube 320, reduce the temperature of the heat exchanging tube 320, and further cool the electronic device; further, the heat conducting gasket 330 is communicated with the heat exchanging pipe 320, and the surface of the heat conducting gasket 330 is provided with air holes 340 at intervals, and the arrangement of the air holes 340 is beneficial to the air to enter and exit the heat conducting gasket 330.

Referring to fig. 1-4, the cooling mechanism 500 includes a cooling element 510 and a cooling tube 520, the cooling element 510 is installed on the surface of the cabinet 100, one end of the cooling tube 520 is connected to the cooling end of the cooling element 510, the other end of the cooling tube 520 is installed in the cabinet 100, and one end of the heat exchange tube 320 penetrates through the cooling tube 520, in specific implementation, the cooling element 510 is used for cooling the cooling tube 520, so as to cool the heat exchange tube 320, and achieve the purpose of cooling the laminate 110 and the inside of the cabinet 100.

In the embodiment, the cooling pipe 520 is located below the corresponding laminate 110, the heat exchange pipe 320 is fixedly connected with the cooling pipe 520 and the laminate 110, and the cooling pipe 520 and the heat exchange pipe 320 can support the laminate 110, so that the possibility of deformation of the laminate 110 is reduced; the sealing ring 321 is tightly sleeved on the surface of the heat exchange tube 320, the sealing ring 321 is bonded and sealed with the cooling tube 520 through sealant, and the sealing effect of the joint of the cooling tube 520 and the heat exchange tube 320 can be improved by additionally arranging the sealing ring 321;

preferably, the refrigerating element 510 includes a cooling box 511 and a liquid inlet pipe 512, the cooling box 511 is installed on the surface of the cabinet body 100, the liquid inlet pipe 512 is communicated with the cooling box 511, one end of the cooling pipe 520 is communicated with the cooling box 511, and one end of the cooling pipe 520 is arranged in a closed manner, the cooling box 511 is filled with cooling liquid through the liquid inlet pipe 512, the cooling liquid is mainly water, and the cooling pipe 520 can be cooled by the cooling liquid;

furthermore, the refrigerating element 510 further comprises a semiconductor refrigerating sheet 513, a heat conducting block 514 is embedded on the surface of the cooling box 511, a refrigerating surface of the semiconductor refrigerating sheet 513 is fixed with the heat conducting block 514, a heating surface of the semiconductor refrigerating sheet 513 is arranged outside the cooling box 511, a heat radiating fin is arranged on the heating surface of the semiconductor refrigerating sheet 513, the heat conducting block 514 can be made of materials with good heat conducting performance such as copper and aluminum, and the arrangement of the heat conducting block 514 and the semiconductor refrigerating sheet 513 can cool the cooling liquid inside the cooling box 511, so that the use of the cooling liquid is facilitated; the bottom end of the cooling box 511 is communicated with a liquid outlet pipe 515, the pipe body of the liquid inlet pipe 512 and the pipe body of the liquid outlet pipe 515 are respectively provided with a valve, the liquid outlet pipe 515 is additionally arranged, the cooling liquid in the cooling box 511 can be discharged, and the arrangement of the valves is favorable for an operator to adjust the flow of the liquid inlet pipe 512 or the liquid outlet pipe 515.

Specifically, the working principle of the temperature self-adaptive power distribution cabinet is as follows: when the cooling device is used, the electronic equipment is arranged on the surface of the laminate 110, and when the refrigerating piece 510 works, the cooling pipe 520 can be cooled, so that the heat exchange pipe 320 can be cooled, the temperature of the laminate 110 and the temperature inside the cabinet body 100 can be reduced, the electronic equipment on the surface of the laminate 110 can be cooled, and the possibility of damage of the electronic equipment due to overhigh temperature is reduced; in addition, start fan 310, inside fan 310 can carry the cabinet body 100 with the gas of external world for the inside gas flow of cabinet body 100 does benefit to the inside steam of cabinet body 100 and discharges, does benefit to the inside heat dissipation of cabinet body 100, and the setting of heat exchange tube 320 does benefit to gas and passes plywood 110, does benefit to gaseous circulation.

It should be noted that the specific model specifications of the fan 310, the refrigerating element 510 and the semiconductor refrigerating sheet 513 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.

The power supply of the fan 310, the cooling member 510 and the semiconductor cooling plate 513 and the principle thereof will be apparent to those skilled in the art and will not be described in detail herein.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A temperature self-adaptive power distribution cabinet is characterized by comprising

The cabinet comprises a cabinet body (100), wherein laminated plates (110) are installed inside the cabinet body (100) at intervals;

the heat dissipation mechanism (300) comprises a fan (310) and a heat exchange tube (320), the output end of the fan (310) is communicated with the cabinet body (100), the heat exchange tube (320) is arranged on the surface of the laminate (110), and the end part of the heat exchange tube (320) penetrates through the laminate (110);

cooling body (500), cooling body (500) are including refrigeration piece (510) and cooling tube (520), refrigeration piece (510) are installed the cabinet body (100) surface, the one end of cooling tube (520) with the refrigeration end of refrigeration piece (510) is connected, the other end of cooling tube (520) is installed in the cabinet body (100), just the one end of heat exchange tube (320) is run through cooling tube (520).

2. The temperature-adaptive power distribution cabinet according to claim 1, wherein a support plate (120) is disposed at a bottom end of the cabinet body (100), the support plate (120) is a trough plate, and the fan (310) is fixedly connected to the support plate (120).

3. The temperature self-adaptive power distribution cabinet according to claim 1, wherein heat dissipation holes (130) are formed in the top end of the cabinet body (100), a baffle (140) is installed on the top end of the cabinet body (100), and the cross section of the baffle (140) is in a herringbone shape.

4. The temperature-adaptive power distribution cabinet according to claim 1, wherein a heat conducting gasket (330) is mounted at the top end of the heat exchange pipe (320), and the heat conducting gasket (330) is located on the upper end face of the laminate (110).

5. The temperature-adaptive power distribution cabinet according to claim 4, wherein the heat conducting gasket (330) is communicated with the heat exchange pipe (320), and air holes (340) are formed in the surface of the heat conducting gasket (330) at intervals.

6. The temperature-adaptive power distribution cabinet according to claim 1, wherein the cooling pipes (520) are located below the corresponding laminate (110), and the heat exchange pipes (320) are fixedly connected with the cooling pipes (520) and the laminate (110).

7. The temperature-adaptive power distribution cabinet according to claim 1, wherein a sealing ring (321) is fixedly sleeved on the surface of the heat exchange tube (320), and the sealing ring (321) is bonded and sealed with the cooling tube (520) through a sealing adhesive.

8. The temperature-adaptive power distribution cabinet according to claim 1, wherein the cooling member (510) comprises a cooling box (511) and a liquid inlet pipe (512), the cooling box (511) is installed on the surface of the cabinet body (100), the liquid inlet pipe (512) is communicated with the cooling box (511), one end of the cooling pipe (520) is communicated with the cooling box (511), and one end of the cooling pipe (520) is closed.

9. The temperature self-adaptive power distribution cabinet according to claim 8, wherein the cooling member (510) further comprises a semiconductor cooling sheet (513), a heat conducting block (514) is embedded on the surface of the cooling box (511), the cooling surface of the semiconductor cooling sheet (513) is fixed to the heat conducting block (514), the heating surface of the semiconductor cooling sheet (513) is arranged outside the cooling box (511), and a heat radiating fin is installed on the heating surface of the semiconductor cooling sheet (513).

10. The temperature-adaptive power distribution cabinet according to claim 8, wherein a liquid outlet pipe (515) is connected to a bottom end of the cooling box (511), and a valve is disposed on each of a pipe body of the liquid inlet pipe (512) and a pipe body of the liquid outlet pipe (515).