CN214099600U - Automatic polishing clamp for semiconductor - Google Patents

Automatic polishing clamp for semiconductor Download PDF

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Publication number
CN214099600U
CN214099600U CN202120378074.4U CN202120378074U CN214099600U CN 214099600 U CN214099600 U CN 214099600U CN 202120378074 U CN202120378074 U CN 202120378074U CN 214099600 U CN214099600 U CN 214099600U
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China
Prior art keywords
support column
base
fixed block
semiconductor
automatic polishing
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CN202120378074.4U
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Chinese (zh)
Inventor
姚力军
边逸军
潘杰
王学泽
韩松
罗明浩
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Ningbo Jiangfeng Electronic Material Co Ltd
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Ningbo Jiangfeng Electronic Material Co Ltd
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Priority to CN202120378074.4U priority Critical patent/CN214099600U/en
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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

The utility model provides an automatic polishing clamp for semiconductor, automatic polishing clamp includes base and perpendicular to the at least three fixed subassembly that the base set up, fixed subassembly includes fixed block and support column, the fixed block with support column sliding connection, fixed subassembly pass through the support column with base sliding connection. The automatic polishing clamp has high compatibility, can stably clamp semiconductor parts in various shapes, reduces repeated replacement of various clamps in the production process, saves cost, improves production efficiency and is convenient to manage.

Description

Automatic polishing clamp for semiconductor
Technical Field
The utility model belongs to semiconductor processing device field relates to an automatic polishing clamp of semiconductor.
Background
After finishing the processing, the surface of the semiconductor precision component is subjected to a finishing process, which is called polishing. The polishing machine generates severe periodic vibration during the polishing process and rubs against a workpiece to be polished, so that the surface of the workpiece is smoothed, which is the principle of polishing. According to the principle, the polishing machine can drive the products to vibrate together when vibrating, so that the products need to be fixed stably, otherwise the products can shake or even fly out to cause injury to people or objects; therefore, a customized jig matching with the product shape is required to be manufactured and fixed during polishing, and then polishing work is performed. Because of the wide variety of semiconductor precision parts, the part of every overall dimension all needs to be made the anchor clamps of customization, and is with higher costs, and production efficiency is low, and inconvenient management.
CN 112192482 a discloses a semiconductor laser bar fixing clamp, which is mainly used for clamping and transferring semiconductor laser bars; this anchor clamps include the framework, and slide set up in layering in the framework, the framework encloses into a through-hole, the relative both sides wall of through-hole all is equipped with the holding spout, the layering set up in the through-hole, just the both ends of layering respectively with two holding spout sliding connection, at least one be equipped with elastomeric element in the holding spout, elastomeric element connects the layering, just right the layering produces the orientation the effort of the bottom motion of framework, so that the layering compresses tightly and is located the layering with the batten between the bottom of framework.
CN112207778A discloses a novel clamp for industrial electronic production and processing, which comprises a supporting mechanism, a taking mechanism, a clamping mechanism, a reinforcing mechanism and an adjusting mechanism; the clamping mechanism is connected with the supporting mechanism through the adjusting mechanism, and the angle of the clamping mechanism is adjusted by operating the adjusting mechanism when the angle of the chip to be processed needs to be adjusted, so that the chip can be processed conveniently; the two sides of the clamping mechanism are rotatably connected with the reinforcing mechanism, and the chip is fixed again through the reinforcing mechanism after the clamping mechanism clamps the mobile phone chip, so that the chip is fixed more comprehensively, and the PCB is prevented from being broken during processing; the bottom of fixture rotates and is connected with the mechanism of taking, adds the chip and adds man-hour closely when needs and dismantles fixture through adjustment mechanism, and closely processing in the hand is taken with fixture through the mechanism of taking, does benefit to the processing of the high spare part of accuracy.
SUMMERY OF THE UTILITY MODEL
For solving the technical problem that exists among the prior art, the utility model provides an automatic polishing clamp for semiconductor, automatic polishing clamp has high compatibility, can stabilize the centre gripping to the semiconductor spare part of multiple shape, has reduced the replacement repeatedly of multiple anchor clamps in the production process, practices thrift the cost, improves production efficiency, the management of being convenient for.
In order to achieve the technical effects, the utility model adopts the following technical scheme:
the utility model provides an automatic polishing clamp for semiconductor, automatic polishing clamp includes base and perpendicular to the at least three fixed subassembly that the base set up, fixed subassembly includes fixed block and support column, the fixed block with support column sliding connection, fixed subassembly pass through the support column with base sliding connection.
The utility model discloses in, the fixed block with support column sliding connection indicates the fixed block can with the support column can produce relative movement, promptly the fixed block can directly pass through slide mechanism with the support column and link to each other, also can the fixed block pass through other connecting pieces with the support column is connected, the fixed block with the connecting piece passes through slide mechanism and links to each other.
As the utility model discloses preferred technical scheme, the fixed block with support column parallel arrangement.
As the preferred technical scheme of the utility model, the shape of fixed block includes cylinder, prism or combination figure.
The utility model discloses in, the shape of fixed block can be regular cylinder, prism or the combination pattern that cylinder and prism are constituteed, also can be the cylinder that has irregular shape on the surface, or shapes such as round platform and terrace with edge.
As the utility model discloses preferred technical scheme, the fixed block with the support column passes through the crossbeam and connects.
As the utility model discloses preferred technical scheme, the crossbeam with support column fixed connection.
As the utility model discloses preferred technical scheme, the crossbeam with fixed block sliding connection.
As the utility model discloses preferred technical scheme, the crossbeam with the fixed block passes through guide rail sliding connection.
As the utility model discloses preferred technical scheme, the fixed block is followed guide rail perpendicular to the base removes.
The utility model discloses in, the support column is provided with the crossbeam structure of perpendicular its setting, crossbeam structure with fixed block sliding connection works as the guide rail is on a parallel with during the support column, can make the fixed block along the guide rail parallel with the support column removes, follows promptly the fixed block is removed along the direction of perpendicular and base.
As the utility model discloses preferred technical scheme, state the support column with the base passes through guide rail sliding connection.
As the utility model discloses preferred technical scheme, the support column is followed the guide rail is on a parallel with the base removes.
The utility model discloses in, through set up the guide rail on the base surface, can be so that fixed subassembly is in the base surface removes, the direction of guide rail can set up in the arbitrary direction on base surface, makes fixed subassembly can remove best fixed position. Simultaneously, the guide rail also can make fixed subassembly rotates at the plane direction of base, and turned angle adjusts according to the service behavior of anchor clamps. Fixed subassembly with be provided with between the base like the fixed subassembly of switch such as buckle to realize fixed subassembly and remove and spacing switching between.
Compared with the prior art, the utility model discloses following beneficial effect has at least:
the utility model provides an automatic polishing clamp for semiconductor, automatic polishing clamp has high compatibility, can stabilize the centre gripping to the semiconductor spare part of multiple shape, has reduced the replacement repeatedly of multiple anchor clamps in the production process, practices thrift the cost, improves production efficiency, the management of being convenient for.
Drawings
Fig. 1 is a top view of an automatic semiconductor polishing jig according to embodiment 1 of the present invention;
fig. 2 is a front view of an automatic semiconductor polishing jig according to embodiment 1 of the present invention;
fig. 3 is a top view of an automatic semiconductor polishing jig according to embodiment 2 of the present invention;
fig. 4 is a top view of an automatic semiconductor polishing jig according to embodiment 3 of the present invention;
in the figure: 1-fixing component, 11-fixing block, 12-supporting column, 13-beam, 14-beam and 2-base.
The present invention will be described in further detail below. However, the following examples are only simple examples of the present invention, and do not represent or limit the scope of the present invention, which is defined by the appended claims.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
To better illustrate the present invention, facilitating the understanding of the technical solutions of the present invention, typical but not limiting embodiments of the present invention are as follows:
example 1
The embodiment provides an automatic semiconductor polishing clamp, which is structurally shown in fig. 1 and 2, and comprises a quadrangular prism-shaped base 2 and three fixing components 1 arranged perpendicular to the base, wherein the fixing components 11 are positioned at the edge part of the base, the other two fixing components are positioned at the corner part of the base 2 opposite to the edge part fixing components 1, the fixing components 1 comprise fixing blocks 11 and supporting columns 12, the fixing blocks 11 are slidably connected with the supporting columns 12, the fixing components 1 are slidably connected with the base 2 through the supporting columns 12, the supporting columns 11 are slidably connected with the base through guide rails 14, and the supporting columns move along the guide rails and parallel to the base;
the shape of fixed block 11 is cylindrical, fixed block 11 with support column 12 parallel arrangement, fixed block 11 with support column 12 passes through crossbeam 13 and connects, crossbeam 13 with support column 12 fixed connection, crossbeam 13 with fixed block 11 sliding connection, crossbeam 13 with fixed block 11 passes through guide rail sliding connection, the fixed block is followed the guide rail perpendicular to the base removes.
Example 2
The embodiment provides an automatic semiconductor polishing clamp, which is structurally shown in fig. 3, and comprises a quadrangular prism-shaped base 2 and 4 fixing assemblies 1 arranged perpendicular to the base, wherein the fixing assemblies 1 are positioned at four corners of the base 2, the fixing assemblies 1 comprise fixing blocks 11 and supporting columns 12, the fixing blocks 11 are slidably connected with the supporting columns 12, the fixing assemblies 1 are slidably connected with the base 2 through the supporting columns 12, the supporting columns 11 are slidably connected with the base through guide rails 14, and the supporting columns move along the guide rails parallel to the base;
the shape of fixed block 11 is cylindrical, fixed block 11 with support column 12 parallel arrangement, fixed block 11 with support column 12 passes through crossbeam 13 and connects, crossbeam 13 with support column 12 fixed connection, crossbeam 13 with fixed block 11 sliding connection, crossbeam 13 with fixed block 11 passes through guide rail sliding connection, the fixed block is followed the guide rail perpendicular to the base removes.
Example 3
The embodiment provides an automatic semiconductor polishing clamp, which is structurally shown in fig. 4, and the automatic semiconductor polishing clamp includes a cylindrical base 2 and 4 fixing assemblies 1 arranged perpendicular to the base, the fixing assemblies 1 are distributed along the outer edge of the base 2 in a regular pentagon shape, the fixing assemblies 1 include fixing blocks 11 and supporting columns 12, the fixing blocks 11 are slidably connected with the supporting columns 12, the fixing assemblies 1 are slidably connected with the base 2 through the supporting columns 12, the supporting columns 11 are slidably connected with the base through guide rails 14, and the supporting columns move parallel to the base along the guide rails;
the shape of fixed block 11 is cylindrical, fixed block 11 with support column 12 parallel arrangement, fixed block 11 with support column 12 passes through crossbeam 13 and connects, crossbeam 13 with support column 12 fixed connection, crossbeam 13 with fixed block 11 sliding connection, crossbeam 13 with fixed block 11 passes through guide rail sliding connection, the fixed block is followed the guide rail perpendicular to the base removes.
As can be seen from the automatic semiconductor polishing jigs provided in embodiments 1 to 3, the fixing member can move along the guide rail provided on the base along the plane of the base, and the fixing block on the fixing member can move along the guide rail in the direction perpendicular to the base, so that the fixing member can fix semiconductor parts of different shapes, heights, lengths and widths by finding the most suitable clamping position.
The applicant states that the present invention is described by the above embodiments, but the present invention is not limited to the above detailed structural features, i.e. the present invention can be implemented only by relying on the above detailed structural features. It should be clear to those skilled in the art that any modifications to the present invention, to the equivalent replacement of selected parts and the addition of auxiliary parts, the selection of specific modes, etc., all fall within the scope of protection and disclosure of the present invention.
The above detailed description describes the preferred embodiments of the present invention, but the present invention is not limited to the details of the above embodiments, and the technical idea of the present invention can be within the scope of the present invention, and can be right to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and in order to avoid unnecessary repetition, the present invention does not need to describe any combination of the features.
In addition, various embodiments of the present invention can be combined arbitrarily, and the disclosed content should be regarded as the present invention as long as it does not violate the idea of the present invention.

Claims (10)

1. The utility model provides an automatic polishing clamp for semiconductor, its characterized in that, automatic polishing clamp includes base and perpendicular to the at least three fixed subassembly that the base set up, fixed subassembly includes fixed block and support column, the fixed block with support column sliding connection, fixed subassembly pass through the support column with base sliding connection.
2. The automatic polishing jig of claim 1, wherein the fixed block is disposed in parallel with the support column.
3. The automatic polishing jig of claim 1, wherein the shape of the fixing block comprises a cylinder, a prism, or a combined figure.
4. The automatic polishing jig of claim 1, wherein the fixed block is connected to the support column by a cross beam.
5. The automated polishing fixture of claim 4, wherein the beam is fixedly attached to the support column.
6. The automated polishing fixture of claim 4, wherein the beam is slidably coupled to the fixture block.
7. The automated polishing fixture of claim 6, wherein the beam is slidably coupled to the fixture block via a guide rail.
8. The automated polishing fixture of claim 7, wherein the fixture block moves along the guide rail perpendicular to the base.
9. The automated polishing fixture of claim 1, wherein the support column is slidably coupled to the base by a guide rail.
10. The automated polishing fixture of claim 9, wherein the support column moves along the guide parallel to the base.
CN202120378074.4U 2021-02-18 2021-02-18 Automatic polishing clamp for semiconductor Active CN214099600U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120378074.4U CN214099600U (en) 2021-02-18 2021-02-18 Automatic polishing clamp for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120378074.4U CN214099600U (en) 2021-02-18 2021-02-18 Automatic polishing clamp for semiconductor

Publications (1)

Publication Number Publication Date
CN214099600U true CN214099600U (en) 2021-08-31

Family

ID=77441079

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120378074.4U Active CN214099600U (en) 2021-02-18 2021-02-18 Automatic polishing clamp for semiconductor

Country Status (1)

Country Link
CN (1) CN214099600U (en)

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