CN214099592U

CN214099592U - Type of making an uproar diode processing silicon chip sand removal device falls

Info

Publication number: CN214099592U
Application number: CN202023319730.8U
Authority: CN
Inventors: 李想
Original assignee: Shenzhen Longweishengke Electronics Co ltd
Current assignee: Shenzhen Longweishengke Electronics Co ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-08-31
Anticipated expiration: 2030-12-31

Abstract

The utility model is suitable for a diode production facility technical field provides a type of making an uproar diode processing silicon chip desanding device falls, main body frame's inboard is provided with the horizontal pole, and the upper and lower both sides of horizontal pole all are provided with moving mechanism, moving mechanism's below is provided with the pneumatic cylinder, and the below of pneumatic cylinder is provided with the hydraulic lifting rod, the below of hydraulic lifting rod is provided with the cleft hand, and the inboard of cleft hand is provided with the rubber cushion, the below of cleft hand is provided with washs the pond, and washs the right-hand supersound appearance that is provided with in pond, the below of supersound appearance is provided with the operation panel, and the below of operation panel all is provided with firm stand, control platform sets up the left at main body frame. Be provided with well cavity and give sound insulation and fill up, can will be carrying out the produced noise of the in-process of desanding to the silicon chip through well cavity and the cooperation of giving sound insulation like this, completely cut off and subduct, avoid because of the noise is too big, cause the pollution to the surrounding environment, improve the feature of environmental protection.

Description

Type of making an uproar diode processing silicon chip sand removal device falls

Technical Field

The utility model belongs to the technical field of diode production facility, especially, relate to a type of making an uproar diode processing silicon chip sand removal device falls.

Background

The diode is one of the most commonly used electronic components, and the largest characteristic of the diode is unidirectional conduction, namely, current can only flow through the diode from one direction, the diode is provided with a rectifying circuit, a detection circuit, a voltage stabilizing circuit and various modulation circuits, which are mainly composed of the diode, before the diode processing production process, the silicon wafer needs to be subjected to desanding treatment to remove a surface oxide layer, and the traditional silicon wafer desanding device for diode processing has the following defects in the use process:

traditional silicon chip sand removal device for diode processing is in the use, and the noise that can't effectually produce is completely cut off, leads to causing noise pollution to the surrounding environment easily, has reduced the feature of environmental protection.

Therefore, it is desirable to provide a silicon wafer desanding device for processing a noise reduction type diode.

SUMMERY OF THE UTILITY MODEL

The utility model provides a type of making an uproar of falling silicon chip desanding device for diode processing aims at solving traditional diode processing silicon chip desanding device in the use, and the unable effectual noise that will produce completely cuts off, leads to causing noise pollution to the surrounding environment easily, has reduced the problem of feature of environmental protection.

The utility model discloses a realize like this, a type of making an uproar diode processing silicon chip desanding device falls, including main body frame and control platform, main body frame's inboard is provided with the horizontal pole, and the upper and lower both sides of horizontal pole all are provided with moving mechanism, moving mechanism's below is provided with the pneumatic cylinder, and the below of pneumatic cylinder is provided with the hydraulic lifting rod, the below of hydraulic lifting rod is provided with the cleft hand, and the inboard of cleft hand is provided with the rubber cushion, the below of cleft hand is provided with washs the pond, and washs the right-hand supersound appearance that is provided with in pond, the below of supersound appearance is provided with the operation panel, and the below of operation panel all is provided with firm stand, control platform sets up the left at main body frame, and control platform's left is provided with the rotary rod, the left of rotary rod is provided with the shield.

Preferably, the inside of main body frame is provided with well cavity, and the inside of well cavity still is provided with the pad that gives sound insulation to constitute the block structure between pad and the well cavity that gives sound insulation.

Preferably, the moving mechanism comprises a sliding rail, a sliding groove, a ball and a connecting block, the sliding groove is fixedly connected to one side of the sliding rail, and the ball is arranged outside the sliding groove.

Preferably, the internal diameter of slide rail is greater than the external diameter of spout, and the spout inlays in the inside of slide rail to constitute the block structure between slide rail and the spout.

Preferably, one end of the claw hand is fixedly connected with one end of the hydraulic lifting rod, and the claw hand is connected with the hydraulic cylinder in a lifting mode through the hydraulic lifting rod.

Preferably, the rubber cushion is tightly attached to the claw, and the rubber cushion is connected with the claw in an adhesion mode.

Preferably, a base is arranged below the main body frame, damping springs are arranged inside the base, and the damping springs are arranged in the base at equal intervals.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a type of making an uproar diode processing is with silicon chip desanding device is provided with well cavity and sound insulation pad, and the produced noise of in-process that will go on the desanding to the silicon chip can be isolated to subduct through well cavity and sound insulation pad cooperation like this, avoids too big because of the noise, causes the pollution to the surrounding environment, improves the feature of environmental protection.

The utility model discloses a type of making an uproar diode processing silicon chip desanding device falls, be provided with moving mechanism, the inside slide rail that has set gradually of moving mechanism, the spout, ball and connecting block, can connect the pneumatic cylinder to slide in the outside of horizontal pole through the connecting block like this, thereby it removes the silicon chip to the supersound appearance to drive the cleft hand, the ultrasonic wave that utilizes to send in the supersound appearance desands, be provided with spout and ball on the lateral wall of slide rail simultaneously, mutually support and reduced frictional resistance, moving mechanism's life has been increased.

The utility model discloses a type of making an uproar diode processing silicon chip sand removal device falls is provided with rubber cushion, can avoid the cleft hand to cause the damage when getting the silicon chip clamp like this, and rubber cushion can increase the frictional force between cleft hand and the silicon chip simultaneously, avoids at the in-process that removes, and the silicon chip drops, improves work efficiency.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention in front cross section;

FIG. 2 is a schematic view of the hollow cavity structure of the present invention;

fig. 3 is a schematic top view of the moving mechanism of the present invention;

FIG. 4 is an enlarged view of the gripper of the present invention;

in the figure: 1. a main body frame; 2. a hollow cavity; 3. a sound insulating pad; 4. a cross bar; 5. a moving mechanism; 501. a slide rail; 502. a chute; 503. a ball bearing; 504. connecting blocks; 6. a hydraulic cylinder; 7. a hydraulic lifting rod; 8. a claw hand; 9. a rubber cushion; 10. a cleaning tank; 11. an ultrasonic instrument; 12. an operation table; 13. stabilizing the upright post; 14. A base; 15. a damping spring; 16. a control platform; 17. rotating the rod; 18. and a dust cover.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments, it is to be understood that the specific embodiments described herein are only used for explaining the present invention, and are not used for limiting the present invention.

Referring to fig. 1, the utility model provides a silicon wafer desanding device for processing noise reduction type diodes, which comprises a main frame 1 and a control platform 16, wherein a cross bar 4 is arranged at the inner side of the main frame 1, and the upper and lower sides of the cross bar 4 are both provided with a moving mechanism 5, a hydraulic cylinder 6 is arranged below the moving mechanism 5, a hydraulic lifting rod 7 is arranged below the hydraulic cylinder 6, a claw 8 is arranged below the hydraulic lifting rod 7, and the inner side of the claw 8 is provided with a rubber cushion 9, a cleaning pool 10 is arranged below the claw 8, an ultrasonic instrument 11 is arranged on the right of the cleaning pool 10, an operation table 12 is arranged below the ultrasonic instrument 11, and the stable upright posts 13 are arranged below the operating platform 12, the control platform 16 is arranged at the left of the main body frame 1, and a rotating rod 17 is arranged at the left of the control platform 16, and a dust cover 18 is arranged at the left of the rotating rod 17.

In this embodiment, well cavity 2 and the cooperation of giving sound insulation and filling up 3 can completely cut off the noise that produces at the in-process that goes sand to the silicon chip, avoid because of the noise is too big, cause the pollution to the surrounding environment, improve the feature of environmental protection.

Referring to fig. 2, further, a hollow cavity 2 is disposed inside the main body frame 1, a sound insulation pad 3 is disposed inside the hollow cavity 2, and a fastening structure is formed between the sound insulation pad 3 and the hollow cavity 2.

In this embodiment, the inside of the moving mechanism 5 is sequentially provided with a sliding rail 501, a sliding groove 502, a ball 503 and a connecting block 504, so that the connecting block 504 can be connected with the hydraulic cylinder 6 to slide outside the cross bar 4, thereby driving the claw 8 to move the silicon wafer to the ultrasonic instrument 11, and removing sand by using ultrasonic waves emitted from the ultrasonic instrument 11, thereby improving the working efficiency.

Referring to fig. 3, further, the moving mechanism 5 includes a sliding rail 501, a sliding groove 502, balls 503 and a connecting block 504, wherein the sliding groove 502 is fixedly connected to one side of the sliding rail 501, and the balls 503 are disposed outside the sliding groove 502.

In this embodiment, the outer side wall of the slide rail 501 is provided with a slide groove 502 and a ball 503, which cooperate with each other to reduce frictional resistance and increase the service life of the moving mechanism 5.

Referring to fig. 3, further, the inner diameter of the sliding rail 501 is larger than the outer diameter of the sliding groove 502, and the sliding groove 502 is embedded in the sliding rail 501, and a clamping structure is formed between the sliding rail 501 and the sliding groove 502.

In this embodiment, when the silicon wafer needs to be desanded, the silicon wafer is placed in the cleaning tank 10 to be cleaned, then the hydraulic cylinder 6 is started, the claw 8 is lowered to a proper height through the cooperation of the hydraulic cylinder 6 and the hydraulic lifting rod 7, and then the silicon wafer is clamped out through the claw 8.

Referring to fig. 1, further, one end of the claw 8 is fixedly connected to one end of the hydraulic lifting rod 7, and the claw 8 is connected to the hydraulic cylinder 6 through the hydraulic lifting rod 7 in a lifting manner.

In this embodiment, the rubber cushion 9 can avoid the cleft hand 8 to cause the damage when getting the silicon chip clamp, and rubber cushion 9 can increase the frictional force between cleft hand 8 and the silicon chip simultaneously, avoids the in-process that removes, and the silicon chip drops, improves work efficiency.

Referring to fig. 4, further, the rubber cushion 9 is tightly attached to the claw 8, and the rubber cushion 9 is adhesively connected to the claw 8.

In this embodiment, the damping spring 15 can absorb and reduce the vibration generated by the device, so as to avoid shaking and improve the stability.

Referring to fig. 1, a base 14 is disposed below the main frame 1, and damping springs 15 are disposed inside the base 14, and the damping springs 15 are disposed at equal intervals inside the base 14.

In the embodiment, the purpose is to isolate and reduce the noise generated when the silicon wafer is desanded quickly and effectively, so as to avoid polluting the surrounding environment.

The utility model discloses a theory of operation and use flow: after the utility model is installed, the silicon wafer is firstly placed in the cleaning pool 10 for cleaning, then the hydraulic cylinder 6 is started through the control platform 16, the claw 8 is lowered to a proper height through the cooperation of the hydraulic cylinder 6 and the hydraulic lifting rod 7, then the silicon wafer is taken out through the claw 8, then the hydraulic cylinder 6 is connected through the connecting block 504 to slide outside the cross rod 4, thereby the claw 8 is driven to move the silicon wafer into the ultrasonic instrument 11, the ultrasonic wave sent out by the ultrasonic instrument 11 is utilized to desand the silicon wafer, then the hollow cavity 2 and the sound insulation pad 3 are mutually matched, the noise generated in the process of desanding the silicon wafer is isolated, the noise is prevented from being reduced, the pollution to the surrounding environment due to overlarge noise is avoided, finally the damping spring 15 can absorb and reduce the vibration generated by the device, the shaking is avoided, and the stability is improved, this completes the entire job.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a type of making an uproar diode processing silicon chip sand removing device falls, includes main body frame (1) and control platform (16), its characterized in that: the inner side of the main body frame (1) is provided with a cross rod (4), the upper side and the lower side of the cross rod (4) are provided with moving mechanisms (5), the lower side of each moving mechanism (5) is provided with a hydraulic cylinder (6), the lower side of each hydraulic cylinder (6) is provided with a hydraulic lifting rod (7), the lower side of each hydraulic lifting rod (7) is provided with a claw (8), the inner side of each claw (8) is provided with a rubber cushion (9), the lower side of each claw (8) is provided with a cleaning pool (10), the right side of each cleaning pool (10) is provided with an ultrasonic instrument (11), the lower side of each ultrasonic instrument (11) is provided with an operating table (12), the lower side of each operating table (12) is provided with a stable upright column (13), a control platform (16) is arranged at the left side of the main body frame (1), and the left side of the control platform (16) is provided with a rotating rod (17), and a dustproof cover (18) is arranged at the left of the rotating rod (17).

2. The silicon wafer desanding device for processing the noise reduction type diode as claimed in claim 1, wherein: the novel sound insulation structure is characterized in that a hollow cavity (2) is arranged in the main body frame (1), a sound insulation pad (3) is further arranged in the hollow cavity (2), and a clamping structure is formed between the sound insulation pad (3) and the hollow cavity (2).

3. The silicon wafer desanding device for processing the noise reduction type diode as claimed in claim 1, wherein: the moving mechanism (5) comprises a sliding rail (501), a sliding groove (502), a ball (503) and a connecting block (504), the sliding groove (502) is fixedly connected to one side of the sliding rail (501), and the ball (503) is arranged outside the sliding groove (502).

4. The silicon wafer desanding device for processing the noise reduction type diode as claimed in claim 3, wherein: the inner diameter of the sliding rail (501) is larger than the outer diameter of the sliding groove (502), the sliding groove (502) is embedded in the sliding rail (501), and a clamping structure is formed between the sliding rail (501) and the sliding groove (502).

5. The silicon wafer desanding device for processing the noise reduction type diode as claimed in claim 1, wherein: one end fixed connection of cleft hand (8) is in the one end of hydraulic pressure lifter (7), and cleft hand (8) are connected with pneumatic cylinder (6) lift through hydraulic pressure lifter (7).

6. The silicon wafer desanding device for processing the noise reduction type diode as claimed in claim 1, wherein: the rubber cushion (9) is tightly attached to the claw (8), and the rubber cushion (9) is connected with the claw (8) in an adhesion manner.

7. The silicon wafer desanding device for processing the noise reduction type diode as claimed in claim 1, wherein: the lower part of the main body frame (1) is provided with a base (14), damping springs (15) are arranged inside the base (14), and the damping springs (15) are arranged in the base (14) at equal intervals.