CN214099500U - Thermally activatable separating device for at least two electronic components and electronic device - Google Patents

Abstract

The invention relates to a thermally activatable separating device for at least two electronic components, wherein the separating device has at least one connecting element and a slider movably mounted in a plane E for each component, which is designed to mechanically separate the respective connecting element from the associated component in the event of a thermal overload in order to transfer the component from a current-carrying state to a current-interrupting state. The connecting element has a connecting region with a heat-sensitive connecting element, via which the connecting element is in electrical contact with the component in the current-carrying state. Each slider is loaded with a force in the direction of the connecting element, which force causes the shielding region of the slider to move between the assembly and the connecting region of the connecting element when the heat-sensitive connecting pieces are separated. In particular for a space-saving design, at least two slides are guided independently of one another in the direction of movement S of the slides by means of a common guide device.

Description

Thermally activatable separating device for at least two electronic components and electronic device

Technical Field

The utility model relates to a according to the utility model discloses a but, heat activated separator for two at least electronic component. The separating device has a separating unit for each component, each separating unit having a connecting element and a slider, respectively, which are designed to mechanically separate the connecting element from the electronic component in the event of a thermal overload.

The invention also relates to an electronic device, in particular an overvoltage protection device, having such a separating device.

Background

Excessive use and/or degradation of an electronic component can cause it to operate outside its rated operating range. Thus, power dissipation on the damaged component, for example, as a result of reduced component dielectric strength, can lead in particular to an inadmissible heating of the component. This is the case, for example, with surge arresters such as varistors.

Therefore, in order to protect the electronic components and the devices surrounding them, it is known to use thermal separation devices in order to convert the components from a current-carrying state to a current-interrupting state in the event of a thermal overload. In such thermal separation devices, the component is often contacted by a spring system, wherein the contact elements of the spring system are connected to the component by means of solder points. The solder joint provides a heat sensitive connection that melts in the event of an impermissible heating, so that the energy stored in the spring system releases the electrical contact with the component. The spring force then exceeds the holding force of the heat sensitive connection, thereby eliminating electrical contact.

However, when the thermally sensitive connection is separated, arcing can occur between the separated contacts, which must be avoided or eliminated as it can damage or even destroy the components. Furthermore, an arc on a component such as a surge arrester triggers an upstream fuse, thereby separating the equipment to be protected from the power supply.

Therefore, a disconnection device, in particular for surge arresters, is known from the prior art, which eliminates electrical arcs by inserting insulating protection elements. In many solutions, the sliding element is moved as an insulating protective element into the loose weld in order to mechanically separate the surge arrester from the contact element.

For example, DE 102015000329B 3 discloses an overvoltage protection device with a mechanical disconnection device which is activated in the event of a thermal overload. In this solution, the contact plates of the surge arrester are contacted on opposite sides by two metal brackets with low-temperature welding points, the ends of the metal brackets extending in parallel. The sliding element with the prestressing spring is located between the two supports, the prestressing force of the spring being directed in the direction of the contact plates of the surge arrester. Further, the shape of the slider has an M shape. If the solder joint on the contact strip is softened, the slider pushes the two metal brackets away from the contact strip in opposite directions and receives the contact strip into its M-shaped convex recess.

In such thermal separation devices, a signaling device is usually also provided, which signals the separation of the electronic components. If a plurality of components in the device are to be separated, it is necessary to design such a separation and signalization unit as simply and inexpensively as possible. The construction space should also be minimized.

SUMMERY OF THE UTILITY MODEL

The present invention is based on the object of providing a thermally activatable separating device for at least two electronic components which meets the stated requirements.

This object is achieved by a thermally activatable separating device according to the invention. Advantageous developments of the separating device emerge from the description. This object is also achieved by an electronic device according to the invention.

The thermally activatable separating device according to the invention for at least two electronic components has a separating unit for each component, wherein the two separating units are preferably of identical construction. Such a separating unit has at least one connecting element and a slide mounted movably in the plane E for each assembly. These components are provided for mechanically separating the respective connecting element from the associated component in the event of a thermal overload in order to transfer the component from a current-carrying state to a current-blocking state. The connecting element has a connecting region with a heat-sensitive connecting element, via which the connecting element is in electrical contact with the component in the current-carrying state. Each slider is loaded with a force in the direction of the connecting element, which force causes the shielding region of the slider to move between the assembly and the connecting region of the connecting element when the thermally sensitive connection is separated.

The connecting element is formed as a conductive element, for example by a metal plate or a metal bracket. The slider is formed as an insulating element, for example from plastic. The heat-sensitive connection is, for example, a solder joint using a low-melting solder. For example, alloys having melting points between 90 ℃ and 180 ℃ may be used as such low temperature solder joints. The separation temperature and the triggering characteristics of the respective separation unit can be influenced and set by the choice of solder.

The slider is loaded with a force in the direction of the corresponding connecting element, which force causes the shielding region of the slider to move between the connecting regions of the assembly and the connecting element when the thermally sensitive connection is separated. This force is generated, for example, by a spring force exerted on the slider.

With such a separating unit, electrical components, in particular surge arresters (for example varistors), can be integrated in a current-conducting manner into an electrical system via the connecting element and the further connecting element. The heat-sensitive connection is designed and arranged in such a way that it heats up when the electronic component heats up. If the heat-sensitive connection loosens due to melting in the event of a thermal overload, the slide can move between the connection areas of the component and the connecting element to prevent or eliminate arcing between these two contact points.

In the separating device according to the invention, a separating unit is provided for at least two electronic components, respectively, so that two movable slides are used. The two slides can be moved in a common plane E, wherein the movement is carried out in a direction of movement S. In the event of a thermal overload, the slides may move in the same direction or in opposite directions. According to the invention, the at least two sliding elements are guided independently of one another in their direction of movement S by means of a common guide device. Thus, no separate guide device is provided for each slide, which would otherwise take up considerable installation space. But a common guide means is provided which is designed for guiding the two slides in their direction of movement S. However, the two slides are guided independently of one another and can therefore be moved independently of one another if necessary.

In this way, a separating device can be provided which reliably separates at least one electronic component without allowing heating of the component, so that even in the case of a plurality of components, installation space can be saved. The common guide system provides an advantageous installation space saving possibility in relation to a plurality of guide systems. The number of slides in the common guide system can also be greater than two if the separating device is designed for separating more than two electronic components. More than two separate units with respective corresponding slides and connecting elements are then connected to a corresponding number of electronic components.

Here, the at least two slides are linearly movable in the plane E or pivotable about an axis perpendicular to the plane E. This movement then takes place within a suitable guide system in which the slides are guided so as to be movable independently of one another. Thus, linear guide systems are used in the case of linearly moving slides, and guide systems with curved guide rails are used in the case of pivotable slides.

Such a common guide system for at least two slides can be designed in different ways. In particular, the two slides each have a guide element, and the two guide elements are guided independently of one another in the direction of movement S of the slides by means of a common guide. A certain area of the slide is thus designed as a guide element, which may require a specific shape and size in order to connect the slide to the guide system. To achieve this, the guide elements of the two slides are preferably designed differently.

For example, receptacles are used for the guide system, which receptacles guide on fixed guides or, conversely, guide in fixed receptacles. In one embodiment of the invention, the two guide elements of the two slides each have a receptacle extending in the direction of movement S of the slide, and the guide elements are oriented relative to one another in such a way that a common guide is guided simultaneously in the two receptacles. The common guide is fixed and the slide is guided with its receptacle movably on the guide. The receptacle is in particular a slit, while the guide is a guide rib engaging into the slit.

In order to provide a particularly space-saving guide device, the two guide elements are formed plate-shaped and extend in substantially parallel planes. Which means that it can also move in substantially parallel planes. By "substantially parallel" is meant that the two plate-like guide elements do not necessarily have to be parallel to each other, but may also deviate somewhat from parallelism. The guide elements then overlap at least partially, in particular in the region of a common guide.

The advantage of the overlapping plate-like shape of the guide elements is that they can be arranged close to each other to save space. This makes it possible to achieve a very narrow design with correspondingly shaped further components. In one embodiment of the invention, this is particularly the case when two electronic components are mounted flat on a carrier plate which extends parallel to the plane E, wherein the slide is movable within the plane. The carrier plate, the assembly, the slide and the guide means which are as flat as possible can then be used to provide a combined structure which is relatively narrow overall. This is particularly advantageous in SMT manufacturing methods when using printed circuit boards as carrier boards.

However, other areas protruding from the plane of the respective plate may also be connected to the plate-shaped guide element. Only in the region of the guide can the two plates move flat over one another.

Preferably, the slider is already in contact with the corresponding connecting element and is in contact therewith by force when the respective separating unit is in the current-carrying state. This force can be generated in different ways, a spring force has proven to be advantageous. Thus, a spring mechanism with one or more springs acts on the slider and presses the slider in the direction of the connecting element. The connection element may also optionally be spring loaded, wherein the spring mechanism acts against the retaining force of the heat sensitive connection. If the connection melts, the spring mechanism moves the connecting element away from the assembly. In addition, it is also pushed away from the assembly by the slide and then also kept at a distance from the assembly.

In one embodiment of the invention, the connecting element is designed, for example, as a metal bracket which has a free end and is fastened to the opposite end. With such a metal bracket, the spring mechanism can optionally be realized if the metal bracket is connected to the component under pretension by means of a weld. If the connection melts, the pre-stressing of the metal bracket will cause the connection area with the heat sensitive connection to move away from the assembly.

In one embodiment of the invention, the connecting element of the separating unit is formed, for example, in a U-shape. The first leg of the U-shape is, for example, fixed to the carrier plate, while the second leg projects above the electronic component. The connecting area of the heat-sensitive connection is located on the second leg. In one embodiment of the invention, the distance between the connection area and the top side of the electronic component is smaller than in other areas of the connection element. This can be achieved, for example, by deforming the metal bracket, which deformation causes a depression or a curvature in the heat-sensitive connecting region. A heat-sensitive connection is then provided on the side of the recess/bend facing the electronic component.

The slide can be used not only as a separating element but also as a signaling element, so that the separation that has occurred is signaled. The slider is then designed as a separating and signalling slider. In one embodiment of the invention, it is therefore provided that at least one slide has a signal zone, which causes a signal when the slide is moved into a position between the connection zone of the respective component and the respective connection element. This signaling of the separation is caused by the movement of the slide, which leads to a corresponding signal in a different manner. For example, the slider may move another component by its movement, which then triggers a signal.

In another embodiment, the slide itself is used for signaling. For example, the signal area of the slider is moved to the area of the signal opening, so that the signal area can be optically detected. The optical detection can also be performed in different ways. For example, the signal area on the slide can be formed by at least one protruding signal element which is moved through the opening by the movement of the slide. The presence of the signalling element can now be detected optically on the opposite side of the opening, for example on the outside of the electronic device. If the signal elements of the plurality of slides differ in color, it is also possible to determine which component or components have been separated by the thermally activatable separating unit.

In a further possible embodiment, the signal field of the slide is moved in front of the opening, so that it can now be optically detected through the opening, since it at least partially covers the opening. This can be done, for example, by means of a grating. Color coding may also be used here.

However, these described possibilities of signal triggering should not be understood as limiting, but other types of signaling can also be provided. The signal region of the slide is formed, for example, in a region of the slide which is also used for guiding the slide in a common guide system. The signal region may for example protrude from the guide element.

In terms of signaling, it is preferably provided that it can be detected which slide has been moved, i.e. which electronic component has been separated. The signal regions on the slide are implemented accordingly and their movements can be detected independently of one another. In other embodiments, it is only detected that one or more components have been separated, and no distinction is made here as to which component is involved. In this way, for example, at least two slides each have a signal area, and the two signal areas are moved into the area of a common signal opening or into the area of different signal openings when the slide is moved between the respective assembly and the connecting area of the respective connecting element.

The invention also comprises an electronic device having at least two electronic components and a thermally activatable separating apparatus according to the invention, wherein each electronic component is assigned a separating unit with a slider. The electronic components are preferably in each case surge arresters, in particular varistors.

Drawings

Further advantages, features and advantageous refinements of the invention emerge from the description and the following description of a preferred embodiment with the aid of the drawings.

Wherein

Fig. 1 shows a schematic plan view of an embodiment of a separating device according to the invention, wherein two electronic components a and b are in a current-carrying operating state;

fig. 2 shows the separating device according to fig. 1 with a separated component a;

fig. 3 shows the separating device according to fig. 1 with a separating assembly b; and

fig. 4 shows the separating device according to fig. 1 with separated components a and b.

Detailed Description

Fig. 1 shows a plan view of a possible embodiment of a separating device 10 according to the invention in an operating state, i.e. in a current-carrying state. The main part of the separating device 10 and the two electronic components 20a and 20b are shown here, the separating device 10 being in flow-conducting contact with the two electronic components 20a and 20 b. The electronic components 20a and 20b are, for example, surge arresters such as varistors. These components 20a, 20b have the shape of a flat cuboid and are attached to a carrier plate 80. Here, the components are attached flatly to the carrier plate 80 such that they extend substantially parallel to the carrier plate.

The separating device 10 has two separating units 11a and 11b, each having a slide and a connecting element, respectively. The first separation unit 11a is described below with reference to the module 20a, wherein the configuration is similarly applied to the second separation unit 11b on the module 20 b. The same structural elements are indicated in the separation unit 11b by the additional letter b instead of the additional letter a.

The separating unit 11a has a slider 40a and a connecting member 30 a. The connecting element 30a is designed, for example, as a metal carrier with a plurality of bends, which has freely movable ends while being fixed by opposite ends. In this embodiment, the metal holder is, for example, firmly connected to the carrier plate 80, while the freely movable end is connected to the top side of the component 20a in the connecting region 31a via the heat-sensitive connection 50 a.

The connecting element 30a thus has a foot located above the assembly 20 a. The connection region 31a is formed by a recess or a bend in the direction of the electronic component 20 a. With the bottom side of the bend, the connecting element 30a is in electrical contact with the top side of the component 20a by a heat sensitive connection in the form of a cryo-solder joint 50 a. Therefore, in the plan view of fig. 1, the welding point 50a is shown only by a dotted line.

The slider 40a has a shielding region which is also located below the metal bracket 30 a. In addition, a force F is exerted on the slider 40a₁The force F₁The slider 40a is pressed in the direction of the welding point 50 a. The slide 40a is guided movably in the direction marked S. Force F₁Acting in this direction of movement S. The force F₁Preferably by a spring mechanism (not shown), but other types of force generators may be used.

If the heat-sensitive connection 50a melts in the event of a thermal overload, i.e. when an electronThe slider 40a due to the applied force F when the assembly 20a heats too strongly beyond a limit value₁In addition, theAssembly20a and the connecting element 30 a. Preferably, the slider 40a also lifts the connecting element 30a from the assembly 20a if the slider is formed accordingly. In addition, the attachment region 31a can optionally be brought into contact with the component 20a under pretension by means of the attachment bracket 30 a. If the pretension force exceeds the holding force of the heat-sensitive connection 50a, the connection area 31a is lifted from the component 20 a.

The slides 40a and 40b each have a guide element, with which the slides are guided in a common guide system in the direction of movement S. Fig. 1 shows a guide element 60b of the second slide 40b, which is formed substantially in the shape of a plate. Which extends parallel to the carrier plate 80, i.e. also parallel to the plane of movement E of the slide 40 b. The plate-shaped guide element 60b has a slit 61b in the direction of movement S. The guide element 60b is guided via this slit 61b on a fixed guide 81, wherein a guide rib 81 is provided as a guide, which protrudes at an angle of 90 ° from the carrier plate 80 (out of the plane of the drawing in fig. 1). If the slide 40b is due to force F₂Moving in the direction of the welding point 50b, it is guided on the guide rib 81 with the slit 61 b. Instead of guide ribs, for example, a row of a plurality of guide pins can also be used.

The same is true for the slide 40a, which slide 40a is also guided on the guide rib 81 by a plate-like guide element with slits. In the view of fig. 1, this guide element is located below the guide element 60b, i.e. between the carrier plate 80 and the guide element 60 b. The guide element 60b of the slide 40b projects in the direction of the slide 40a, while its guide element projects in the direction of the slide 40b, and the two guide elements overlap at least in the region of the guide rib 81. However, the two guide elements can move independently of each other on the guide rib 81. The guide ribs 81 protrude from the carrier plate 80 to such an extent that the guide ribs protrude through the slits of at least two slide members.

Fig. 2 shows the first separating device 11a according to fig. 1 in the disconnected state, i.e. after the heat-sensitive connection 50a has been released and the slide 40a has moved between the electronic component 20a and the connection region 31a with the solder residue 50 a'. The disconnection unit 11a is switched to the disconnection state as a result of the mechanical breaking of the electrical contact between the connection element 30a and the electronic component 20 a. Here, the guide element 60a of the slide 40a is guided with its slit 61a on the guide rib 81 in the direction of movement S and is moved out below the guide element 60 b. Fig. 3 shows a state in which the slider 40b of the separating apparatus 11b has been triggered to separate the assembly 20 b. The guide element 60b has slid over the lower guide element 60 of the other slide 40 a. Fig. 4 shows a state in which the two slides 40a, 40b have separated the respective corresponding assemblies 20a, 20 b.

The guide ribs 81 may limit the movement of the two slides in the direction of movement S relative to the length of the slots 60a, 60 b. For example, the illustration in fig. 3 shows that the slide 40b is moved in the direction of the assembly 20b only until the end of the slit 61b stops at the guide rib 81. In the state of fig. 2, the same applies to the stop of the slit 61a against the guide rib 81. However, other types of stops may also be provided for this purpose.

In order to signal the separation of one or more components, the figures show different embodiments by way of example, in which signal regions are provided in each of the slides 40a, 40b, which signal regions can be used for signaling. For example, the slide 40a has a signal region in the form of a protruding signal tongue 62a, while the other slide 40b has a signal region in the form of a protruding signal tongue 62 b. These signal areas may be formed at any position on the respective slide. In the embodiment shown in the figures, they are each located in the region of the guide elements 60a, 60b and project therefrom. Furthermore, a signal opening 82 is provided in the carrier plate 80, which signal opening is not covered by the electrically contacted components 20a, 20b in normal operation. If one of the slides 40a, 40b is triggered, its signal area 62a, 62b moves into the area of this signal opening 82 and covers it at least partially. This may be detected optically, for example to trigger remote and/or integrated messages. In particular, several electronic devices may be equipped with a separating device according to the invention, respectively. These electronic devices are mounted side-by-side such that their signal openings 82 are aligned with one another. The light beam from the grating can then be directed through all signal openings and triggered as soon as the light beam of the grating is interrupted by the signal tongue of the electronic device.

It can be provided here that only a detection is made whether at least one of the components has already been separated. This can be done by the signal opening 82 shown, which is optionally covered by one of the signal tongues 62a, 62b (fig. 2 and 3) or by both signal tongues 62a, 62b simultaneously (fig. 4). In order to be able to distinguish which component has been separated, the detection within the signal opening 82 can be personalized on the basis of the signal tongues 62a, 62 b. In alternative embodiments, other or further measures are provided. This includes, for example, other signal openings, color coding, etc.

The figures also show, for example, further signalling possibilities, which can be used in addition to or instead of the above-described signalling. Here, further signal regions 63a and 63b are provided at the ends of the guide elements 60a, 60 b. These signal regions are formed by the respective ends of the guide elements 60a, 60b or by a rod-shaped thickening of the guide elements in this region. In the embodiment of the figures, such a rod-shaped thickening is selected to show the corresponding signal region and is therefore referred to below as signal rod. Such thickening protrudes perpendicularly to the movement plane E from the respective plate- like guide element 60a, 60 b. However, only the area defined by color coding may be used.

A further signal opening 83 is then formed on the edge of the carrier plate 80, in the event of a thermal overload, the signal rods 63a and 63b of the two slides 40a and 40b being moved in front of them. The signal opening 83 is schematically shown in the drawings and may also take other suitable shapes. For example, if the slide 40a is triggered, as shown in fig. 2, the signal rod 63a is moved in front of the signal opening 83, so that the triggering of the slide 40a is detected here, for example optically. On the other hand, if the slider 40b is triggered, as shown in fig. 3, the signal lever 63b moves to the front of the signal opening 83, so that the triggering of the slider 40b is detected here. As shown in fig. 4, if both slides 40a, 40b are triggered, both signal rods 63a and 63b move in front of the signal opening 83 and can be detected here independently of one another.

This signaled embodiment has the advantage that the triggering of both slides can also be reliably determined. The signal bars 63a, 63b may also optionally be moved completely through the signal opening 83 and/or cause a signal by contact with another member.

In addition, the embodiment of the drawing can also be modified such that the force F is generated₁And F₂Acting in opposite directions, the two slides 40a and 40b move in opposite directions in the event of a thermal overload. In such an embodiment, the described common guide is also considered, wherein the size and shape of the individual components are adapted accordingly. The slides 40a, 40b are also not linearly movable, but can pivot about an axis extending at an angle of 90 ° to the carrier plate. The direction of movement of the slide will then be an arc to which the guidance in the co-guidance system must be adapted.

Description of the reference numerals

Separating device 10

Separation units 11a, 11b

The modules 20a, 20b

Connecting element, metal holder 30a, 30b

Connecting regions 31a, 31b

Sliding members 40a, 40b

Heat sensitive connection, solder joints 50a, 50b

Solder residue 51a ', 50 b'

Guide elements 60a, 60b

Receiving portions, slits 61a, 61b

Signal area, signal tongue 62a, 62b

Signal area, signal bars 63a, 63b

Carrier plate 80

Guide rib 81

Signal openings 82, 83.

Claims (12)

1. Thermally activatable separating device for at least two electronic components, wherein the separating device has at least one connecting element (30 a; 30b) and a slide (40 a; 40b) movably mounted in a plane E for each component, which is designed to mechanically separate the respective connecting element (30 a; 30b) from the associated component in the event of a thermal overload in order to transfer the component from a current-carrying state into a current-blocking state, the connecting element (30 a; 30b) having a connecting region (31 a; 31b) with a thermally sensitive connection (50 a; 50b) via which the connecting element is in electrical contact with the component in the current-carrying state, and the respective slide (40 a; 40b) is loaded with a force in the direction of the connecting element (30 a; 30b), which force, when the thermally sensitive connection (50 a; 50b) is separated, causes a shielding region of the slide (40 a; 40b) at the component and the connecting element (30 a; 30b) Between the connection areas (31 a; 31b),

it is characterized in that the preparation method is characterized in that,

at least two slides (40 a; 40b) are guided independently of one another in the direction of movement S of the slides (40 a; 40b) by means of a common guide device.

2. Separating device according to claim 1, characterized in that the at least two slides (40 a; 40b) are linearly movable in the plane E or pivotable about an axis perpendicular to the plane E.

3. Separating device according to claim 1 or 2, characterized in that the two slides (40 a; 40b) each have a guide element (60 a; 60b) and in that the two guide elements (60 a; 60b) are guided independently of one another in the direction of movement S of the slides (40 a; 40b) by means of a common guide (81).

4. Separating device according to claim 3, characterized in that the two guide elements (60 a; 60b) each have a receptacle (61 a; 61b) extending in the direction of movement S of the slide (40 a; 40b), and in that the guide elements (60 a; 60b) are oriented such that a common guide (81) is guided in the two receptacles (61 a; 61 b).

5. Separating device according to claim 4, characterized in that the two guide elements (60 a; 60b) are each formed plate-shaped and extend in parallel planes.

6. Separating device as claimed in claim 5, characterized in that the slide (40 a; 40b) is movable within the plane E when two electronic components are mounted on a carrier plate (80) extending parallel to the plane.

7. Separating device according to claim 6, characterized in that at least one slide (40 a; 40b) has a signal area (62 a; 62 b; 63 a; 63b) which causes a signal when the slide (40 a; 40b) is moved into between the corresponding component and the connecting area (31 a; 31b) of the corresponding connecting element (30 a; 30 b).

8. Separation device according to claim 7, characterized in that the signal area (62 a; 62 b; 63 a; 63b) is moved into the area of the signal opening (82; 83), so that the signal area (62 a; 62 b; 63 a; 63b) can be optically detected.

9. Separating device according to claim 8, characterized in that at least two slides (40 a; 40b) each have one signal area (62 a; 62 b; 63 a; 63b) and in that the two signal areas (62 a; 62 b; 63 a; 63b) are moved into the area of a common signal opening (82; 83) or into the area of different signal openings when the slide (40 a; 40b) is moved between the corresponding component and the connecting area (31 a; 31b) of the corresponding connecting element (30 a; 30 b).

10. Electronic device, characterized in that it has at least two electronic components and a separating apparatus according to any of claims 1 to 9.

11. The electronic device of claim 10, wherein the electronic component is a surge arrester.

12. The electronic device of claim 11, wherein the component is a voltage dependent resistor.

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