CN214068639U

CN214068639U - Thermally activatable separating device, electronic component and electronic apparatus

Info

Publication number: CN214068639U
Application number: CN202021807227.4U
Authority: CN
Inventors: 彼得·贝格; 丹尼尔·赫尔曼; 斯蒂芬·塞格布鲁赫; 斯特芬·菲尔特纳; 拉尔夫·兰格
Original assignee: Phoenix Contact GmbH and Co KG
Current assignee: Phoenix Contact GmbH and Co KG
Priority date: 2019-08-26
Filing date: 2020-08-26
Publication date: 2021-08-27
Anticipated expiration: 2030-08-26
Also published as: DE102020121591A1

Abstract

The invention relates to a thermally activatable separating device (10) for at least one electronic component (20), the separating device (10) having at least one connecting element (30) and a slider (40) movably mounted in a plane E, which is designed to mechanically separate the connecting element (30) from the component (20) in the event of a thermal overload in order to transfer the component (20) from a current-carrying state to a current-interrupting state. The connecting element (30) has a connecting region (31) with a heat-sensitive connecting piece (50), by means of which the connecting element is in electrical contact with the component (20) in the current-carrying state, and the slider (40) is loaded in the direction of the connecting element (30) with a force which, when the heat-sensitive connecting piece (50) is disconnected, moves the shielding region (42) of the slider (40) between the component (20) and the connecting region (31) of the connecting element (30). Wherein the force-loaded slider (40) moves the connection area (31) of the connection element (30) away from the assembly (20) by contact with the connection element (30) when the heat-sensitive connection (50) is broken, and the contact on the connection element (30) is located outside the connection area (31) with the heat-sensitive connection (50).

Description

Thermally activatable separating device, electronic component and electronic apparatus

Technical Field

The utility model relates to a separation device capable of being thermally activated according to the utility model. The separating device has at least a connecting element and a slider, which is designed to mechanically separate the connecting element from the electronic component in the event of a thermal overload.

The invention also relates to an electronic assembly and an electronic device, in particular an overvoltage protection device, having such a separating device.

Background

Excessive use and/or degradation of an electronic component can cause it to operate outside its rated operating range. Thus, for example, power dissipation at the damaged component, which is caused by a reduced dielectric strength of the component, can lead in particular to an inadmissible heating of the component. This is the case, for example, with surge arresters such as varistors.

Therefore, in order to protect the electronic components and the devices surrounding them, it is known to use thermal separation devices in order to convert the components from a current-carrying state to a current-interrupting state in the event of a thermal overload. In such thermal separation devices, the components are often contacted by a spring system, wherein the contact elements of the spring system are connected to the components by means of welding points. The solder joint provides a heat sensitive connection that melts in the event of an impermissible heating, so that the energy stored in the spring system releases the electrical contact with the component. The spring force then exceeds the holding force of the heat sensitive connection, thereby eliminating electrical contact.

However, when the thermally sensitive connection is separated, an arc may be generated between the separated contacts, which arc must be avoided or eliminated as it may damage or even destroy the components. Furthermore, an arc on a component such as a surge arrester triggers an upstream fuse, thereby separating the equipment to be protected from the power supply.

Therefore, a disconnection device, in particular for surge arresters, is known from the prior art, which eliminates electrical arcs by inserting insulating protection elements. In many solutions, the sliding element is moved as an insulating protective element into the loose weld in order to mechanically separate the surge arrester from the contact element.

For example, DE 102015000329B 3 discloses an overvoltage protection device with a mechanical disconnection device which is activated in the event of a thermal overload. In this solution, the contact plates of the surge arrester are contacted on opposite sides by two metal brackets with low-temperature welding points, the ends of the metal brackets extending in parallel. The sliding element with the prestressing spring is located between the two supports, the prestressing force of the spring being directed in the direction of the contact plates of the surge arrester. Further, the shape of the slider has an M shape. If the solder joint on the contact strip is softened, the slider pushes the two metal brackets away from the contact strip in opposite directions and receives the contact strip into its M-shaped convex recess.

This or similar solutions have various drawbacks. The thermally connected solder does not, for example, have yet completely softened for the duration of the separation or has immediately re-solidified after the separation. This results in the slider not being able to move between the contact elements of the spring system and the surge arrester. The consequence of this is an unsafe condition. Furthermore, the force exerted by the spring system on the solder joint, which is usually made of low-melting solder, cannot be increased at will.

SUMMERY OF THE UTILITY MODEL

The present invention is based on the object of providing a thermally activatable separating device for electronic components, which avoids the disadvantages mentioned.

This object is achieved by a thermally activatable separating device according to the invention. Advantageous developments of the separating device emerge from the description. This object is also achieved by an electronic assembly and an electronic device according to the invention.

The thermally activatable separating device for at least one electronic component according to the invention has at least one connecting element and a slider which is movably mounted in a plane E. The slide is linearly movable or pivotably mounted in the plane E. Preferably, this is done in a suitable guiding system in which the slide is movably guided.

The connecting element is formed as a conductive element, for example by a metal plate or a metal bracket. The slider is formed as an insulating element, for example from plastic. The connecting element and the slider are designed to mechanically separate the connecting element from the component in the event of a thermal overload in order to transfer the component from a current-carrying state to a current-blocking state. The connecting element has a connecting region with a thermally sensitive connection, via which the connecting element is in electrical contact with the component in the current-carrying state or can be brought into contact to form the current-carrying state. The heat-sensitive connection is for example a solder joint with a low-melting solder. For example, alloys having melting points between 90 ℃ and 180 ℃ may be used as such low temperature solder joints. The detachment temperature and the triggering characteristics of the detachment device can be influenced and set by the choice of solder.

The slider is loaded with a force in the direction of the connecting element, which force causes the shielding region of the slider to move between the assembly and the connecting region of the connecting element when the thermally sensitive connection is separated. This force is generated, for example, by a spring force exerted on the slider.

With such a separating device, electrical components, in particular surge arresters (for example varistors), can be integrated in a current-conducting manner into an electrical system via a connecting element and a further connecting element. The heat-sensitive connection is designed and arranged in such a way that it heats up when the electronic component heats up. If the heat-sensitive connection loosens due to melting in the event of a thermal overload, the slide can move between the connection areas of the component and the connecting element to prevent or eliminate arcing between these two contact points.

According to the invention, the force-loaded slider has a contact region which, when the heat-sensitive connection is broken, moves the connection region of the connection element away from the component by contact with the connection element. Thus, the slider pushes the connecting element away from the assembly. According to the invention, the contact of the slider on the connecting element is outside the connecting region with the heat-sensitive connection. The point of application of the force of the slider on the connecting element is therefore not directly in the region of the heat-sensitive connection as in the known solutions. Instead, the force of the slide acts on a different position.

Furthermore, when the shielding region of the slider is moved between the component and the connection region of the connection element, the contact region does not enter the space between the connection region and the component. Thus, the contact area also remains outside the critical space and does not pass through the critical space during the process. Thereby it is ensured that the contact area does not come into contact with solder residues on the connection area of the component and/or the connection element, which might otherwise prevent a reliable retraction of the slider and lead to unsafe conditions.

The contact area is not allowed to enter the critical space between the connection area and the component when the slider is retracted, in particular the connection area is allowed to pass by it. The connecting region preferably moves through the critical space in the plane of motion E of the slide. Here, the contact areas can pass directly adjacent to or at a distance from one another. However, it is also possible that its movement ends outside the critical space between the connection area and the component, without passing through the critical space.

The combination of these measures enables a thermally activatable separating device for the assembly, wherein the slide can be designed in a force-optimized and safe manner. This contact area between the slider and the connecting element can be suitably shaped, due to the distance from the point of application of the heat-sensitive connection, without causing restrictions due to, for example, the position of the heat-sensitive connection.

In one embodiment of the invention, the direction of movement S of the slider intersects a plane F in which the connecting region of the connecting element moves. In this way, the direction of movement S of the slide does not extend in or parallel to the plane F, but at an angle to the plane F. The direction of movement S of the slide extends, for example, perpendicularly to a plane F in which the connecting region of the connecting element can move. However, it may also run obliquely at different angles through the plane F. The connection zone with the heat-sensitive connection moves linearly in the plane F or pivots therein. Preferably about a pivot axis.

For the extension of the direction of movement S of the slide relative to the plane F, two angles α and β can be defined. The angle alpha is enclosed in a plane E between the direction of movement S of the slide and the plane F. The angle beta is enclosed between the two planes E and F.

The angles alpha and beta are both 90 deg. if the direction of movement S of the slide is orthogonal to the plane F in which the connecting region of the connecting element moves. However, the angles can also deviate from 90 ° in each case, to the extent that a reliable and effective lifting of the connecting element is ensured by the slider acting on the connecting element. A sufficiently large lever can thereby be realized which enables the connecting element to be lifted from the assembly quickly, reliably and efficiently. The direction of movement S of the slide transverse to the plane F in which the connection region with the heat-sensitive connection moves contributes to this.

In an alternative embodiment, the direction of movement S of the slider extends, for example, along the plane F, wherein the design of the connecting element and the slider is accordingly such that the contact region of the slider does not enter the space between the connecting region and the component when the shielding region of the slider moves between the component and the connecting region of the connecting element. This can be achieved, for example, by suitably bending the connecting element so as to arrange the contact point between the slider and the connecting element outside the plane F.

The contact point between the slide and the connecting element is preferably designed such that the force of the slide is deflected at least partially in the direction of separation, i.e. from plane E to plane F. In one embodiment of the invention, the connecting element and/or the slider each have, for example, a bevel, by means of which the force of the slider is guided from the plane E into the plane F when it comes into contact with the connecting element. The slide slides with its ramp like a wedge under the connecting element, which slides along the ramp and rises in the process. Alternatively, a ramp surface can be provided on the connecting element, under which the slider slides continuously and thus lifts the connecting element. Preferably, in each case a bevel is formed on the connecting element and the slide, which bevels slide against one another in order to reliably raise the connecting element.

In one embodiment of the invention, therefore, a bevel is formed on the connecting element and/or on the slider, respectively, the inclination of which, proceeding from the connecting element, is positive in the direction of the slider and in the direction away from the component. Such a bevel is preferably provided both on the connecting element and on the slider.

In the current-carrying state of the separating device, the slider is already in contact with the connecting element and is in contact therewith by force. This force can be generated in different ways, a spring force has proven to be advantageous. Thus, a spring mechanism with one or more springs acts on the slider and presses the slider in the direction of the connecting element. The connection element may also optionally be spring loaded, wherein the spring mechanism acts against the retaining force of the heat sensitive connection. If the connection melts, the spring mechanism moves the connecting element away from the assembly. In addition, it is also pushed away from the assembly by the slide and then also kept at a distance from the assembly.

In one embodiment of the invention, the connecting element is designed, for example, as a metal bracket which has a free end and is fastened to the opposite end. With such a metal bracket, the spring mechanism can optionally be realized if the metal bracket is connected to the component under pretension by means of a weld. If the connection melts, the pre-stressing of the metal bracket will cause the connection area with the heat sensitive connection to move away from the assembly.

In one embodiment of the invention, the connecting element is formed in a U-shape. The first leg of the U-shape is, for example, fixed to the carrier plate, while the second leg projects above the electronic component. The connecting area of the heat-sensitive connection is located on the second leg. In one embodiment of the invention, the distance between the connection area and the top side of the electronic component is smaller than in other areas of the connection element. This can be achieved, for example, by deforming the metal carrier, which deformation causes a depression in the heat-sensitive connecting region, by means of which the distance to the component is reduced relative to the remaining connecting elements. A heat-sensitive connection is then provided on the side of the recess facing the electronic component.

In one embodiment of the invention, the slider and the connecting element are designed such that the contact region of the slider causes a movement of the connecting region of the connecting element away from the component, after which its shielding region is located between the connecting regions of the component and the connecting element as a result of the movement of the slider. The slider is thus divided at least into a shielding region and a contact region, in which the point of action with the connecting element is located. This point of action of the slide and the connecting element is designed to be advanced. In this way, the connecting element can be raised before its shielding region enters the solder joint. This has the advantage that a sufficiently large distance can be created between the component and the connecting element before the slider is moved into the loosened weld point. Thereby, the heat-sensitive connection is reliably separated and the slider can be safely moved in.

In order to achieve this advanced point of action, contact regions are provided, for example, on the slider and/or on the connecting element, which contact regions project from the slider and/or from the connecting element in the direction of the respective further component. The protruding contact area is in particular provided with the aforementioned bevel. For example, a projecting, inclined tongue is provided on the connecting element, while a projecting nose is provided on the slider, which slides against each other when in contact.

In particular, a contact region projecting in the direction of the connecting element is provided on the slider, which contact region has a bevel that merges in the shielding region into an elongated web projecting relative to the shielding region. The tab extends in the direction of movement S of the slider. By means of this bevel, the connecting element is first lifted and then slid along the tab. In this way, when the shielding region of the slider enters the solder joint, the connecting element is held in the assembly at a distance from the assembly and thus from the solder residue. The connecting element is preferably raised to such an extent that the connecting region of the connecting element, to which the cooled solder residues can adhere, does not come into contact with the top side of the slider. The height of the tab is selected accordingly.

In other embodiments of the invention, further measures are provided to avoid unsafe situations when the slider is moved into the welding point. For example, the shielding region of the slider optionally has rounded edges on the side facing the connecting region of the connecting element. Therefore, the sliding member does not get stuck in the cooled solder. In addition, the shielding region has, for example, on the side of the slider opposite to the direction in which the connecting region of the connecting element moves when the thermally sensitive connection is broken, a recess which extends in the direction of movement S of the slider. When the slide is moved into between the component and the connection region of the connection element, this recess is located in the region of the connection region, i.e. in the region of possible solder residues on the component. The recess ensures that the bottom side of the sliding part is not in contact with the solder residue in this region.

Further, the shielding region is preferably formed in a channel shape on the side of the slider opposite to the direction in which the connecting region of the connecting member moves when the heat-sensitive connection is disconnected. The slide is then connected and guided such that the assembly is located in the channel. When the separating device is triggered, the slider slides over the component and not only covers the solder residue on the top side of the component, but also shields the sides of the component. The channel has a cover face and at least two side walls. However, three side walls may also be used to close the channel on one side. If the electronic components to be separated are connected to the carrier plate, this carrier plate can form, together with the channels of the slide, an arc extinguishing chamber. The above-mentioned recess, which extends in the direction of movement S of the slide and which is located in the region of the solder residue when the slide is moved in, is located in the bottom side of the cover face of such a channel-shaped shielding region.

The invention also comprises an electronic assembly with a separating device according to an embodiment of the invention. The electronic component is preferably a surge arrester, in particular a varistor.

The invention also comprises an electronic device with at least one electronic component according to an embodiment of the invention.

If the slide of the separating device is formed channel-shaped on one side, the electronic component is preferably located in the channel-shaped shielding region of the slide. However, the channel does not fully accommodate the assembly in the flow-conducting state, but only partially. In the exposed area of the electronic component, the connecting element is in electrical contact with the component by means of a heat-sensitive connection. Another connecting element makes other contact with the assembly to integrate it into an electrical system.

In one embodiment of the invention, the electronic components are mounted on a carrier plate which extends parallel to the plane of movement E of the slide. In this way, a very flat and compact device can be provided. This is especially true when the electronic component is designed as a flat cuboid. The carrier plate is for example a circuit board.

If a surge arrester is selected as the electronic component, the disconnection device according to the invention can provide a surge protection device with which a defective surge arrester can be disconnected.

Drawings

Further advantages, features and advantageous refinements of the invention emerge from the description and the following description of a preferred embodiment with the aid of the drawings.

Wherein

Fig. 1 shows a plan view of an embodiment of a separating device according to the invention in a flow-conducting state;

FIG. 2 shows a schematic representation of the direction of movement and the plane of movement of the individual components within the separating device according to FIG. 1;

fig. 3 shows a three-dimensional view of the separating device according to fig. 1 on a carrier plate;

fig. 4 shows a three-dimensional view of the separating device according to fig. 1 in a triggered, flow-interrupting state; and

fig. 5 shows a side view of the separating device according to fig. 4.

Detailed Description

Fig. 1 shows a plan view of a possible embodiment of a separating device 10 according to the invention in an operating state, i.e. in a current-carrying state. The main components of the separating device 10 and the electronic assembly 20 are shown here, the separating device 10 being in flow-conducting contact with the electronic assembly 20. The electronic component 20 is, for example, a surge arrester, such as a varistor. The electronic component 20 has the shape of a flat cuboid and is attached to a carrier plate 60, as can be seen in the three-dimensional view of fig. 3. Here it is attached flat to the carrier plate 60 so as to extend substantially parallel to the carrier plate.

The separating apparatus 10 has a slider 40 and a connecting element 30. The connecting element 30 is designed, for example, as a metal carrier which has freely movable ends and is fixed by opposite ends. In this embodiment, the metal bracket is firmly connected to the carrier plate 60, for example by means of the connecting plate 34, but other connection types can also be selected.

Furthermore, the connecting element 30 is U-shaped with one elongated leg. The shorter first leg merges into a web 34, by means of which the connecting element 30 is firmly connected to the carrier plate 60. In contrast, however, the longer second leg merges into the freely movable end. The connection plate 34 with the shorter leg is located beside the electronic component 20 and the longer leg is located above the electronic component 20. The longer leg has several differently shaped sections and regions. It has, in particular, a connection region 31 which is formed by a depression in the direction of the electronic component 20 (see also fig. 3). The connecting element 30 is electrically contacted with the top side of the electronic component 20 by means of a heat-sensitive connection in the form of a low-temperature solder joint 50 with the bottom side of the recess. Therefore, in the plan view of fig. 1, the welding points 50 are only shown in dashed lines.

The slider 40 has a shielding region 42 and a contact region 41. As can be seen in fig. 3, the shielded area 42 is formed as a channel 46 having a cover face and two opposing side walls. The electronic component 20 is partially received in the channel 46. In contrast, the contact region 41 is designed as a projecting nose projecting from the shielding region 42 in the direction of the connecting element 30. In particular, the contact area 41 is located at the side of the slider 40. The slider 40 is in contact with the connecting element 30 via a contact area 41, wherein the contact is locally outside the connection area 31 with the heat-sensitive connection 50. The contact is located in particular at the free end of the metal bracket 30, adjacent to the connection region 31 in the support region 35. At this free end of the metal bracket 30, a tongue 32 or tongue-shaped portion is formed on the support region 35, which projects as a contact region from the connecting element 30 in the direction of the slider 40.

The slide 40 is movably supported in the direction marked S. This is done, for example, by a guide structure, not shown, in which the slide is held movably and guided in the S direction. The slider may be connected to such a guide structure by means of a connection area 70 as shown. In addition, it is guided in the direction of movement S through the receptacle of the electronic component 20 in the channel 46. Furthermore, the slide 40 is loaded with a force in the direction of movement S, which force thus presses the slide against the connecting element 30. The force is preferably generated by a spring mechanism (not shown), but other types of force generators may be used.

As can be seen from fig. 3, the tongue 32 on the connecting element 30 and the nose 41 on the slider 40 are each designed with a bevel. The contact region 41 of the slider 40 has a ramp 43, against which ramp 43 the ramp 33 of the tongue 32 rests. These

bevels

33, 43 are chosen such that the contact area 41 of the slider 40 slides under the tongue 32 of the connecting element 30 due to the force in the direction S and pushes it away from the electronic assembly 20.

The nose 41 of the slider 40 merges in the region of the shielding region 42 into an elongate web 45 which projects relative to the shielding region 42. The tab 45 extends in the direction of movement S of the slider 40. The height of the webs 45 relative to the screening area 42 is greater than the depth of the recess of the connecting area 31 of the connecting element 30 relative to the support area 35.

If the heat-sensitive connection 50 melts in the event of a thermal overload, i.e. if the electronic component 20 heats up too strongly beyond a limit value, the slider 40 lifts the connecting element 30 from the electronic component 20. In addition, the connection region 31 can be brought into contact with the electronic component 20 by pretensioning of the connection mount 30. If this pretension force exceeds the retention force of the heat-sensitive connection 50, the connection area 31 is lifted from the electronic component 20. Here, the connecting area 31 is pivoted upward in the direction marked a in the drawing about the connecting plate 34 as a pivot axis.

The connecting region 31 then rotates in the plane F, while the slide 40 as a whole is mounted movably in the plane E. As can be seen from fig. 1, the angle α enclosed in plane E between the direction of movement S of the slide 40 and plane F is approximately 90 °. The direction of movement S of the slider 40 thus extends perpendicularly to the plane F in which the connection zone 31 moves when separated from the electronic component. However, the angle α can also be selected to be larger or smaller, whereby the slide 40 will act obliquely on the connecting element 30. The angle α is for example between 45 ° and 135 °.

Fig. 2 also shows a schematic representation of the direction of movement and the plane of the individual components in the separating device according to fig. 1 in a side view, which corresponds to the viewing direction in the three-dimensional view of fig. 3. The ramp 43 on the slider 40 and the ramp 33 on the connecting element 30 are schematically shown. The schematic view also shows that on the connecting element 30 and/or the slide 40, a

bevel

33, 43 is formed, respectively, the inclination of which, starting from the connecting element 30, is positive in the direction of the slide (i.e. to the right) and in the direction away from the electronic component 20 (i.e. upwards).

The slide 40 is movable in a direction of movement S in the plane E. After the disconnection of the heat-sensitive connection, the connecting element 30 can be moved in the direction a and thus in the plane F. These planes E and F intersect at an angle β, which in this embodiment is approximately 90 °. The force of the slide 40 is partially deflected towards the direction of movement a in the plane F. However, the angle β can also be chosen larger or smaller, so that the slide 40 will also act obliquely in this direction on the connecting element 30. The angle β is for example between 45 ° and 135 °.

Fig. 4 shows the first separating device according to fig. 1 in the disconnected state, i.e. after the heat-sensitive connection 50 has been released and the slide 40 has been moved with its shielding region 42 between the electronic component 20 and the connection region 31. The disconnecting device is switched to the off-state due to the mechanical breaking of the electrical contact between the connecting element 30 and the electronic component 20. Fig. 5 shows this state in a side view, in which the direction of observation is opposite to the moving direction S of the slider 40.

Due to the protruding nose 41, the slider 40 first lifts the connection element 30 above the tongue 32 before the shielding region 42 is moved between the electronic component 20 and the connection region 31. After being lifted over the tongue 32, the support region 35 of the connecting element 30 slides over the tab 45 and is located there. Possible solder residues of the heat-sensitive connection are indicated in fig. 4 and 5 by

reference numerals

51 and 52. Thus, the first solder residue 51 may be located at the bottom side of the connection area 31, while the second solder residue 52 may be located at the upper side of the electronic component 20. In order that the shielding region 42 of the slider 40 does not adhere to the cooled solder when it is moved into the soldering point, its front edge 44 is rounded. Furthermore, the shielding region 42 of the slide 40 optionally has a recess 47, which extends in the direction of movement S on the underside of the shielding region 42. The recess 47 is arranged and dimensioned in such a way that it is located in the area of the soldering point when the slider 40 is moved in, so that contact between the slider 40 and the solder residue 52 on the upper side of the electronic component 20 is avoided. Furthermore, the connecting element 30 is lifted by the nose 41 and the tab 45 to such an extent that the shielding region 42 does not come into contact with the underside of the connecting element 30 and therefore with the solder residue 51. As can be seen in particular from fig. 4, when the slide 40 is moved in, the contact region 41 of the slide 40 does not enter the space between the electronic component 20 and the connection region 31. Instead, it is beside and passes through this space. For this purpose, the contact region 41 is correspondingly arranged and formed on the slide 40 in order to structurally ensure this.

In contrast, in an alternative embodiment of the invention, the tongue length with the contact region 32 on the connecting element 30 can be designed such that it makes an initial contact with the contact region 41 on the slider 40. The contact area 41 of the slide 40 can then be arranged and dimensioned such that its movement ends outside the critical space between the connection area 31 and the electronic component 20, without it passing through the critical space.

In a further alternative embodiment of the invention, the plane F and the direction of movement S of the slide can also be placed on each other such that the direction of movement S extends along the plane F. However, the contact area of the slider does not move in the plane F, since otherwise the welding point would be entered. In contrast to this, the connecting element is shaped so that the point of contact between the slider and the connecting element lies outside the plane F. This can be achieved, for example, by suitably bending the connecting element outwards from the plane F.

Description of the reference numerals

Separating device 10

Electronic assembly 20

Connecting element, metal bracket 30

Connection region 31

Contact area, tongue 32

Bevel 33

Connecting plate 34

Support area 35

Sliding member 40

Contact area, nose 41

Shielded region 42

Inclined plane 43

Rounded edge 44

Projection, tab 45

Channel 46

Notch 47

Heat sensitive connection, weld 50

Solder residue

51, 52

Carrier plate 60

Connection area guide 70

Moving direction S of the slider

Direction of movement A of the connecting element

Plane of movement E of the slider

The plane of movement F of the connecting element.

Claims

1. Thermally activatable separating device, the separating device (10) being used for at least one electronic component (20), the separating device (10) having at least one connecting element (30) and a slide (40) which is movably mounted in a plane E and which is designed to mechanically separate the connecting element (30) from the electronic component (20) in the event of a thermal overload in order to transfer the electronic component (20) from a current-carrying state to a current-blocking state, the connecting element (30) having a connecting region (31) with a thermally sensitive connection (50) by means of which the connecting element is in electrical contact with the electronic component (20) in the current-carrying state, and the slide (40) being loaded in the direction of the connecting element (30) with a force which, when the thermally sensitive connection (50) is broken, moves a shielding region (42) of the slide (40) between the electronic component (20) and the connecting region (31) of the connecting element (30),

it is characterized in that the preparation method is characterized in that,

the slide (40) loaded with force has a contact area (41) which moves a connection area (31) of the connection element (30) away from the electronic component (20) by contact with the connection element (30) when the heat-sensitive connection (50) is broken, wherein the contact on the connection element (30) is located outside the connection area (31) with the heat-sensitive connection (50), and the contact area (41) does not enter the space between the connection area (31) and the electronic component (20) when the shielding area (42) of the slide (40) moves between the electronic component (20) and the connection area (31) of the connection element (30).

2. Separating device according to claim 1, characterized in that the direction of movement S of the slide (40) intersects a plane F in which the connecting region (31) of the connecting element (30) moves.

3. Separating device according to claim 1 or 2, characterized in that the connecting element (30) and/or the slide (40) each have a bevel (33; 43) by means of which the force of the slide (40) is at least partially deflected from the plane E into the plane F when coming into contact with the connecting element (30).

4. Separating device according to claim 3, characterized in that a bevel (33; 43) is formed on the connecting element (30) and on the slide (40), respectively, the inclination of which, proceeding from the connecting element (30), is positive in the direction of the slide (40) and in the direction away from the electronic component (20).

5. Separating device according to claim 1, characterized in that the slider (40) and the connecting element (30) are designed such that the contact region (41) of the slider (40) causes a movement of the connecting region (31) of the connecting element (30) away from the electronic component (20), after which its shielding region (42) is located between the electronic component (20) and the connecting region (31) of the connecting element (30) as a result of the movement of the slider (40).

6. Separating device according to claim 5, characterized in that a contact region is provided on the slider (40) and/or the connecting element (30), respectively, which contact region projects from the slider (40) and/or the connecting element (30) in the direction of the respective other component.

7. Separating device as in claim 6, characterized in that a contact region (41) projecting in the direction of the connecting element (30) is provided on the slider (40), which contact region has a bevel which transitions into an elongate web (45) in the region of the shielding region (42), said web projecting relative to the shielding region (42).

8. Separating device according to claim 1, characterized in that the shielding region (42) of the slider (40) has a rounded edge (44) on the side facing the connecting region (31) of the connecting element (30).

9. Separating device according to claim 1, characterized in that the shielding region (42) is formed in the shape of a channel on the side of the slider (40) opposite to the direction in which the connecting region (31) of the connecting element (30) moves when the heat-sensitive connection (50) is disconnected.

10. Separating device according to claim 1, characterized in that the shielding region (42) has a recess (47) extending in the direction of movement S of the slider (40) on the side of the slider (40) opposite to the direction of movement of the connecting region (31) of the connecting element (30) when the heat-sensitive connection (50) is disconnected, said recess being located in the region of the connecting region (31) when the slider (40) is moved into between the electronic component (20) and the connecting region (31) of the connecting element (30).

11. Separating device as in claim 1, characterized in that the connecting element (30) is configured as a metal bracket.

12. A separation device according to claim 11, wherein the connecting element is a pre-tensioned metal stent.

13. Electronic assembly, characterized in that it has a separating device according to any of claims 1 to 12.

14. The electronic component according to claim 13, characterized in that the electronic component (20) is a surge arrester.

15. The electronic component of claim 14, wherein the electronic component (20) is a varistor.

16. Electronic device, characterized in that it has at least one electronic component according to any of claims 13 to 15.

17. Electronic device according to claim 16, characterized in that the separating means are formed according to claim 9 and the electronic component (20) is at least partly located within a channel-shaped shielding region (42) of the slide (40).

18. Electronic device according to claim 16 or 17, characterized in that the electronic component (20) is mounted on a carrier plate (60) extending parallel to the plane of movement E of the slide (40).