CN214098354U - Server cooling system - Google Patents
Server cooling system Download PDFInfo
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- CN214098354U CN214098354U CN202120173322.1U CN202120173322U CN214098354U CN 214098354 U CN214098354 U CN 214098354U CN 202120173322 U CN202120173322 U CN 202120173322U CN 214098354 U CN214098354 U CN 214098354U
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- heat dissipation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model relates to the technical field of servers, and discloses a server heat dissipation system, which comprises a server case, wherein a mainboard and a plurality of PCI-e mixed heat dissipation board cards are arranged in the server case, each PCI-e mixed heat dissipation board card is provided with a plurality of fans of different types, the mainboard is provided with a central processing unit and a plurality of PCI-e slots, and the PCI-e mixed heat dissipation board cards are respectively inserted into the PCI-e slots; the PCI-e hybrid heat dissipation board cards are respectively connected with a plurality of fan PWM slots through first cables. The utility model discloses a with central processing unit's heat dissipation and the heat dissipation separation of a plurality of PCI-e mixed heat dissipation integrated circuit board, realized the nimble heat dissipation and the energy-conservation of whole server system, the rotational speed of adjusting corresponding fan through BMC control chip can realize the self-adaptation regulatory function, has guaranteed entire system's heat dissipation problem promptly, has reduced the loss of consumption again.
Description
Technical Field
The utility model relates to a server technical field specifically relates to a server cooling system.
Background
Various chips in the server generate a large amount of heat in the operation process, and the central processing unit is the largest component of the heat, so the traditional server is a heat dissipation system mainly designed for solving the heat of the central processing unit. With the wide application of Artificial Intelligence (AI) and the traditional requirements of graphics rendering, video decoding, scientific computing and the like, the existing server chassis carries away heat generated by the GPU by means of turbine heat dissipation of the GPU or positive pressure fan heat dissipation of the GPU, and because the volume and performance of the fans of the two heat dissipation modes depend on the design of the GPU, the two heat dissipation modes have great limitations, for example, when the GPU expansion card is used for floating point operation, the reduction of frequency is caused by the fact that the heat dissipation requirement of the GPU with high load cannot be met frequently, and therefore a more efficient heat dissipation mode needs to be found for the application scenes with high load of the PCI-e expansion cards such as the GPU.
SUMMERY OF THE UTILITY MODEL
The utility model provides a server cooling system to solve prior art's above-mentioned problem.
A server heat dissipation system comprises a server case, wherein a mainboard and a plurality of PCI-e mixed heat dissipation board cards are arranged in the server case, a plurality of fans of different types are arranged on each PCI-e mixed heat dissipation board card, a central processing unit and a plurality of PCI-e slots are arranged on the mainboard, and the plurality of PCI-e mixed heat dissipation board cards are respectively inserted into the plurality of PCI-e slots; the PCI-e hybrid heat dissipation board cards are respectively connected with a plurality of fan PWM slots through first cables.
Further, several different types of fans include aft-cooling turbo fans and positive-pressure-penetration cooling fans.
Furthermore, a plurality of fan PWM slots are respectively positioned on the mainboard.
Further, a BMC control chip is arranged on the mainboard, and the plurality of fan PWM slots are respectively connected with the BMC control chip through second cables; the BMC control chip is used for reading and adjusting the rotating speeds of a plurality of fans of different types through a plurality of fan PWM slots respectively, and the self-adaptive adjusting function of the fans of the different types is achieved.
Furthermore, the number of the PCI-e hybrid heat dissipation board cards corresponds to the number of the PCI-e slots.
Furthermore, the number of the PCI-e mixed heat dissipation board cards corresponds to the number of the PWM slots of the fan.
Furthermore, the server case is also provided with a power supply, the power supply and the mainboard are adjacently arranged in the server case, and the power supply is used for supplying power for the mainboard.
The utility model has the advantages that: the utility model discloses a whole server system's nimble heat dissipation and energy-conservation can realize the self-adaptation regulatory function through the rotational speed of BMC control chip regulation corresponding fan, has guaranteed entire system's heat dissipation problem promptly, has reduced the loss of consumption again.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed to be used in the embodiments are briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic diagram of a PCI-e hybrid heat sink card according to a first embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the invention, are given by way of illustration only. It is noted that the terms "comprises" and "comprising," and any variations thereof, in the description and claims of the present invention and the above-described drawings are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
In a first embodiment, as shown in fig. 1, a server heat dissipation system includes a server chassis, a motherboard and a plurality of PCI-e hybrid heat dissipation boards 1-3 are disposed in the server chassis, each PCI-e hybrid heat dissipation board 1-3 is provided with a plurality of fans of different types, the motherboard is provided with a central processing unit and a plurality of PCI-e slots, and the plurality of PCI-e hybrid heat dissipation boards are respectively inserted into the plurality of PCI-e slots; the PCI-e mixed heat dissipation board cards are respectively connected with a plurality of fan PWM slots through first cables 1-4.
Several different types of fans include a rear radiator turbofan 1-1 and a positive pressure penetration radiator fan 1-2.
The plurality of fan PWM slots are respectively positioned on the mainboard.
The number of the PCI-e mixed heat dissipation board cards corresponds to the number of the PCI-e slots.
The number of the PCI-e mixed heat dissipation board cards corresponds to the number of the PWM slots of the fan.
The server case is also provided with a power supply, the power supply and the mainboard are adjacently arranged in the server case, and the power supply is used for supplying power for the mainboard.
A BMC control chip is arranged on the mainboard, and the plurality of fan PWM slots are respectively connected with the BMC control chip through second cables; the BMC control chip is used for reading and adjusting the rotating speeds of a plurality of fans of different types through a plurality of fan PWM slots respectively, and the self-adaptive adjusting function of the fans of the different types is achieved. In this embodiment, different fans may select different speed control strategies. The PCI-e slots correspond to the PCI-e mixed radiating board cards one by one, the independent PCI-e mixed radiating board cards are connected with the fan PWM slots through the first cables, and the BMC (baseboard management controller) control chip automatically adjusts the rotating speed of the fan by reading the working states and power consumption of different chips of the central processing unit and other expansion slots, so that the self-adaptive adjusting function is realized, the radiating problem of the whole system is guaranteed, and the loss of the power consumption is reduced.
Through adopting the utility model discloses an above-mentioned technical scheme has obtained following profitable effect:
the utility model discloses a with central processing unit's heat dissipation and the heat dissipation separation of a plurality of PCI-e mixed heat dissipation integrated circuit board, realized the nimble heat dissipation and the energy-conservation of whole server system, the rotational speed of adjusting corresponding fan through BMC control chip can realize the self-adaptation regulatory function, has guaranteed entire system's heat dissipation problem promptly, has reduced the loss of consumption again.
The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be viewed as the protection scope of the present invention.
Claims (7)
1. A server heat dissipation system is characterized by comprising a server case, wherein a mainboard and a plurality of PCI-e mixed heat dissipation board cards are arranged in the server case, a plurality of fans of different types are arranged on each PCI-e mixed heat dissipation board card, a central processing unit and a plurality of PCI-e slots are arranged on the mainboard, and the PCI-e mixed heat dissipation board cards are respectively inserted into the PCI-e slots; the PCI-e hybrid heat dissipation board cards are respectively connected with a plurality of fan PWM slots through first cables.
2. The server heat dissipation system of claim 1, wherein the plurality of different types of fans comprises a rear-facing turbofan and a positive pressure thru radiator fan.
3. The server cooling system according to claim 1 or 2, wherein the plurality of fan PWM slots are respectively located on the motherboard.
4. The server cooling system according to claim 3, wherein a BMC control chip is disposed on the motherboard, and the plurality of fan PWM slots are respectively connected to the BMC control chip through a second cable; the BMC control chip is used for reading and adjusting the rotating speeds of the fans of the different types through the fan PWM slots respectively, and the self-adaptive adjusting function of the fans of the different types is achieved.
5. The server heatsink system of claim 1, wherein the number of the plurality of PCI-e hybrid heatsink boards corresponds to the number of the plurality of PCI-e slots.
6. The server heatsink system of claim 1, wherein the number of PCI-e hybrid heatsink boards corresponds to the number of fan PWM slots.
7. The server cooling system according to claim 1, wherein the server chassis is further provided with a power supply, the power supply is disposed in the server chassis adjacent to the motherboard, and the power supply is configured to supply power to the motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120173322.1U CN214098354U (en) | 2021-01-21 | 2021-01-21 | Server cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120173322.1U CN214098354U (en) | 2021-01-21 | 2021-01-21 | Server cooling system |
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| Publication Number | Publication Date |
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| CN214098354U true CN214098354U (en) | 2021-08-31 |
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| CN202120173322.1U Active CN214098354U (en) | 2021-01-21 | 2021-01-21 | Server cooling system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116382442A (en) * | 2023-04-25 | 2023-07-04 | 广东银昌科技股份有限公司 | Powerful heat dissipation device for PCI slot of server |
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2021
- 2021-01-21 CN CN202120173322.1U patent/CN214098354U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116382442A (en) * | 2023-04-25 | 2023-07-04 | 广东银昌科技股份有限公司 | Powerful heat dissipation device for PCI slot of server |
| CN116382442B (en) * | 2023-04-25 | 2024-01-09 | 广东银昌科技股份有限公司 | Powerful heat dissipation device for PCI slot of server |
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