CN214095934U

CN214095934U - Wafer high accuracy non-contact laser thickness measurement appearance

Info

Publication number: CN214095934U
Application number: CN202120334096.0U
Authority: CN
Inventors: 贾怀宇
Original assignee: Beijing Sanhe Teda Technology Co ltd
Current assignee: Beijing Sanhe Teda Technology Co ltd
Priority date: 2021-02-05
Filing date: 2021-02-05
Publication date: 2021-08-31
Anticipated expiration: 2031-02-05

Abstract

The utility model discloses a wafer high-precision non-contact laser thickness measuring instrument, which comprises a detector main body, wherein the top end of the detector main body is fixedly connected with a bottom plate, the top end of the bottom plate is fixedly connected with a fixing screw, and the fixing screw is fixedly connected to the outer side of a bracket through a side plate; through setting up the measuring rack on the top of detector main part, can place in the top of measuring rack with the measurand, carry out precision measurement to the thickness of measurand, the bottom of support is provided with first laser head, the inside of detector main part is provided with the second laser head, place in the top of measuring rack through the measurand, can scan the measurand through first laser head and second laser head respectively through the setting of measuring mouth and measure, through numerical value and the computational formula that has set up, carry out the precision calculation to the thickness of measurand, this device easy operation, high durability and convenient use, low power, no radiation, no pollution, no injury to environment and human body.

Description

Wafer high accuracy non-contact laser thickness measurement appearance

Technical Field

The utility model belongs to the technical field of the measuring apparatu, concretely relates to wafer high accuracy non-contact laser thickness measurement appearance.

Background

The laser measurement is the most widely applied measurement method in the field of precision measurement at present, the method is high in precision and high in measurement speed, and the laser measurement can be used for measuring the dimension error, the form and position error and the like of parts or components and plays an important role in ensuring the product quality.

The existing laser measuring instrument is complex in structure and high in price, easily causes injury to a user when operation is carried out for measurement, is only suitable for measuring partial metal and does not meet the use requirement of the laser measuring instrument, and therefore the wafer high-precision non-contact laser thickness measuring instrument is provided.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to overcome current defect, provide a wafer high accuracy non-contact laser thickness measurement appearance to solve the current laser measuring instrument structure that proposes in the above-mentioned background art complicated, the price is expensive, when the operation is measured, causes the injury to the user easily, and only be applicable to and measure partial metal, be not conform to the problem to laser measuring instrument's user demand.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a wafer high accuracy non-contact laser thickness measurement appearance, includes the detector main part, the top fixedly connected with bottom plate of detector main part, the top fixedly connected with fixed screw of bottom plate, the fixed screw passes through curb plate fixed connection in the outside of support, the both sides of support all are provided with the curb plate, the bottom of support is provided with first laser head, the top of detector main part is provided with measuring port and measuring rack, the measuring port sets up in one side of measuring rack, the outside of detector main part is provided with pilot lamp, keyboard and display, the pilot lamp sets up in the top of keyboard, the keyboard sets up in one side of display, the inside of detector main part is provided with the second laser head, second laser head fixed connection is in the inside bottom of detector main part.

Preferably, the two ends of the outer side of the detector main body are provided with measuring frames, and the measuring ports are arranged on the two sides between the measuring frames.

Preferably, the first laser head is arranged above the measuring port, and the second laser head is arranged below the measuring port.

Preferably, the indicator light comprises a power indicator light and a measurement indicator light.

Preferably, a singlechip arithmetic processing module is arranged in the detector main body and is electrically connected with the laser signal processor through a wire.

Preferably, the indicator light is electrically connected with the singlechip arithmetic processing center through a lead.

Preferably, the first laser head and the second laser head are both electrically connected with the laser signal processor through wires.

Compared with the prior art, the utility model provides a wafer high accuracy non-contact laser thickness measurement appearance possesses following beneficial effect:

1. the utility model discloses a set up the measuring stand on the top of detector main part, can place the measurand on the top of measuring stand, carry out the precision measurement to the thickness of measurand, the bottom of support is provided with first laser head, the inside of detector main part is provided with the second laser head, through placing the measurand on the top of measuring stand, can scan the measurand through first laser head and second laser head respectively through the setting of measurement mouth and measure, through numerical value and the computational formula that has set up, carry out the precision calculation to the thickness of measurand, the device easy operation, convenient to use, low power, radiationless, pollution-free, no injury to environment and human body;

2. the utility model discloses can carry out accurate thickness measurement to non-transparent body material, like semiconductor materials such as silicon, germanium, sapphire, gallium arsenide, carborundum or ceramic material wafer and precious metal material etc. this device still can be used to measure two-sided grinding or cutting surface workpiece, also can be used to measure single two-sided polishing surface workpiece, this device simple structure, and application scope is wide, is fit for carrying out the accurate measurement of thickness to various metals etc..

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description, do not constitute a limitation of the invention, in which:

fig. 1 is a schematic view of a main structure of a wafer high-precision non-contact laser thickness measuring instrument according to the present invention;

fig. 2 is a schematic structural view of a wafer high-precision non-contact laser thickness measuring instrument according to the present invention;

fig. 3 is a schematic view of an internal structure of a wafer high-precision non-contact laser thickness measuring instrument according to the present invention;

fig. 4 is the utility model provides a circuit structure schematic diagram of wafer high accuracy non-contact laser thickness measuring instrument.

In the figure: the detector comprises a detector main body 1, a bottom plate 2, a side plate 3, a fixing screw 4, a support 5, a first laser head 6, a measuring port 7, an indicator light 8, a keyboard 9, a display 10, a measuring frame 11 and a second laser head 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a wafer high-precision non-contact laser thickness measuring instrument comprises a detector main body 1, a bottom plate 2 is fixedly connected to the top end of the detector main body 1, a fixing screw 4 is fixedly connected to the top end of the bottom plate 2, the fixing screw 4 is fixedly connected to the outer side of a support 5 through a side plate 3, the side plates 3 are arranged on two sides of the support 5, a first laser head 6 is arranged at the bottom end of the support 5, a measuring port 7 and a measuring frame 11 are arranged at the top end of the detector main body 1, the measuring port 7 is arranged on one side of the measuring frame 11, an indicator light 8, a keyboard 9 and a display 10 are arranged on the outer side of the detector main body 1, the indicator light 8 is arranged above the keyboard 9, the keyboard 9 is arranged on one side of the display 10, a second laser head 12 is arranged inside the detector main body 1, the second laser head 12 is fixedly connected to, can place the measurand in the top of measuring rack 11, carry out the precision measurement to the thickness of measurand, the bottom of support 5 is provided with first laser head 6, the inside of detector main part 1 is provided with second laser head 12, through placing the measurand in the top of measuring rack 11, setting up through measuring mouth 7 can be respectively through first laser head 6 and second laser head 12 to the measurand scan the measurement, through numerical value and the computational formula that has set up, the thickness to the measurand carries out the precision calculation, this device easy operation, high durability and convenient use, power is little, no radiation, and is pollution-free, no harm to environment and human body.

The utility model discloses in, preferred, the outside both ends of detector main part 1 all are provided with measuring rack 11, and measuring port 7 sets up between measuring rack 11 in both sides, all is provided with measuring rack 11 through the outside both ends at detector main part 1, and measuring port 7 sets up between measuring rack 11 in both sides, can carry out laser surveying to the measured object lower extreme simultaneously at measuring port 7 for can obtain more accurate numerical value.

The utility model discloses in, preferred, first laser head 6 sets up in the top of measuring mouthful 7, and second laser head 12 sets up in the below of measuring mouthful 7.

The utility model discloses in, it is preferred, pilot lamp 8 includes power indicator and measurement pilot lamp.

The utility model discloses in, it is preferred, 1 inside singlechip operation processing module that is provided with of detector main part, singlechip operation processing module passes through wire and laser signal processor electric connection, through being provided with singlechip operation processing module in 1 inside of detector main part, singlechip operation processing module passes through wire and laser signal processor electric connection, after singlechip operation processing module sends the signal for laser signal processor, can the first laser head 6 of direct control and second laser head 12 start to carry out the measurement of thickness to the measurand.

The utility model discloses in, it is preferred, pilot lamp 8 passes through wire and singlechip arithmetic processing center electric connection, through passing through wire and singlechip arithmetic processing center electric connection with pilot lamp 8, when detector main part 1 starts, singlechip arithmetic processing center control pilot lamp 8 control power indicator lights, when detector main part 1 is measuring, singlechip arithmetic processing center control pilot lamp 8 control measurement indicator lights, can let the user observe the state of detector main part 1.

The utility model discloses in, preferred, first laser head 6 and second laser head 12 all pass through wire and laser signal processor electric connection, through all passing through wire and laser signal processor electric connection with first laser head 6 and second laser head 12, after singlechip operation processing module sends the signal for laser signal processor, can the direct control first laser head 6 and second laser head 12 start to carry out the measurement of thickness to the measurand.

The utility model discloses a theory of operation and use flow: during the use, the device is powered on, the detector main body 1 is started firstly, after the device is started, the display 10 displays LOGO and a contact mode of a display equipment manufacturer Beijing Tristanding grain Tedda technology Limited company for about a few seconds, then the LOGO enters a working interface, the display 10 automatically stops at the working interface after self-checking is completed, at the moment, a power indicator lamp in an indicator lamp 8 is turned on to represent that the device can normally operate, then a measured object is placed above a measuring frame 11, when manual lateral measurement is carried out, a control keyboard 9 turns on a first laser head 6 and a second laser head 12 to measure the measured object, at the moment, a measurement indicator lamp in the indicator lamp of the indicator lamp 8 is turned on to represent that measurement is being carried out, so that a user can not be injured by laser, and then accurate measurement is carried out on the thickness of the measured object through a set fixed numerical value and a calculation formula.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer high accuracy non-contact laser thickness measurement appearance, includes detector main part (1), its characterized in that: the top end of the detector main body (1) is fixedly connected with a bottom plate (2), the top end of the bottom plate (2) is fixedly connected with a fixing screw (4), the fixing screw (4) is fixedly connected to the outer side of a support (5) through a side plate (3), the two sides of the support (5) are respectively provided with the side plate (3), the bottom end of the support (5) is provided with a first laser head (6), the top end of the detector main body (1) is provided with a measuring port (7) and a measuring frame (11), the measuring port (7) is arranged on one side of the measuring frame (11), the outer side of the detector main body (1) is provided with an indicator lamp (8), a keyboard (9) and a display (10), the indicator lamp (8) is arranged above the keyboard (9), the keyboard (9) is arranged on one side of the display (10), the interior of the detector main body (1) is provided with a second laser head (12), and the second laser head (12) is fixedly connected to the bottom end inside the detector main body (1).

2. The wafer high-precision non-contact laser thickness measuring instrument according to claim 1, wherein: the outer side two ends of the detector main body (1) are provided with measuring frames (11), and the measuring ports (7) are arranged on two sides between the measuring frames (11).

3. The wafer high-precision non-contact laser thickness measuring instrument according to claim 1, wherein: first laser head (6) set up in the top of measuring mouth (7), second laser head (12) set up in the below of measuring mouth (7).

4. The wafer high-precision non-contact laser thickness measuring instrument according to claim 1, wherein: the indicator light (8) comprises a power indicator light and a measurement indicator light.

5. The wafer high-precision non-contact laser thickness measuring instrument according to claim 1, wherein: the detector is characterized in that a single-chip microcomputer operation processing module is arranged inside the detector main body (1) and is electrically connected with the laser signal processor through a lead.

6. The wafer high-precision non-contact laser thickness measuring instrument according to claim 5, wherein: the indicator light (8) is electrically connected with the singlechip arithmetic processing center through a lead.

7. The wafer high-precision non-contact laser thickness measuring instrument according to claim 1, wherein: first laser head (6) and second laser head (12) all pass through wire and laser signal processor electric connection.