CN214094931U - Assembled heater - Google Patents

Abstract

The utility model provides an assembled heater, comprising a water tank, the top of water tank has set gradually a plurality of heating modules, the heating module includes heat-conducting component and semiconductor heating piece, heat-conducting component includes heat-conducting sleeve and installed part, heat-conducting sleeve is welding integrated structure with the installed part, the inside of water tank is located in the heat-conducting sleeve is inserted, the installed part is installed in the outer wall of water tank arbitrary one side all around, the inside of locating heat-conducting sleeve is inserted to the semiconductor heating piece, the cover plate is installed on the top of heat-conducting sleeve, the locating hole has all been seted up at the both ends of installed part and cover plate, the both sides on water tank top evenly are connected with the corresponding screw thread post of a plurality of locating holes. The utility model discloses an insert the inside of locating the heat conduction cover with the semiconductor heating plate, reduced the risk that the semiconductor heating plate damaged or the electric leakage, water tank and heat conduction cover all adopt the copper simultaneously, have reduced the speed of corruption, have prolonged the life of device.

Description

Assembled heater

Technical Field

The utility model relates to a firing equipment's technical field specifically is an assembled heater.

Background

The heater is a common electric heating device, has high thermal power and wide application range, and people can not leave the heater more and more.

An assembled heater provided according to patent document (publication No. CN106871438B) includes a heating body; the outer shell is sleeved outside the heating body; and a connecting portion provided on the heating body; the shell body is detachably connected and fixed with the connecting part outside the heating body, the connecting part is matched with the heating body to form a closed liquid storage cavity, a liquid inlet communicated with the liquid storage cavity is formed in the connecting part, and a liquid outlet communicated with the liquid storage cavity is formed in the shell body. The heater provided by the invention has the advantages of simple and small structure and low cost, can be arranged in small and medium-sized devices, occupies small space while ensuring the heating effect, and provides more space for arranging other parts in the device.

At present, most of semiconductor heaters in the market are made of aluminum materials and have the defects of easy corrosion, and meanwhile, the heaters are directly contacted with water, so that certain hidden dangers exist.

SUMMERY OF THE UTILITY MODEL

The utility model mainly provides an assembled heater for solve the technical problem who proposes among the above-mentioned background art.

The utility model provides a technical scheme that above-mentioned technical problem adopted does:

an assembled heater comprises a water tank, wherein a plurality of heating modules are sequentially arranged at the top end of the water tank, the heating module comprises a heat conduction assembly and a semiconductor heating sheet, the heat conduction assembly comprises a heat conduction sleeve and a mounting piece, the heat conduction sleeve and the mounting part are of a welding integrated structure, the heat conduction sleeve is inserted in the water tank, the mounting piece is arranged on the outer wall of the water tank, the semiconductor heating sheet is inserted in the heat conduction sleeve, a cover plate is arranged at the top end of the heat conduction sleeve, positioning holes are formed at the two ends of the mounting part and the cover plate, a plurality of threaded columns corresponding to the positioning holes are uniformly connected with the two sides of the top end of the water tank, by inserting the semiconductor heating plate into the heat conducting sleeve, the risk of damage or electric leakage of the semiconductor heating plate is reduced, meanwhile, the water tank and the heat conducting sleeve are made of copper, so that the corrosion rate is reduced, and the service life of the device is prolonged.

Preferably, a gasket is installed between the mounting member and the water tank so as to prevent water inside the water tank from flowing out.

Preferably, the middle position of the cover plate is provided with a through hole, and the size of the through hole is smaller than that of the semiconductor heating sheet, so that the semiconductor heating sheet is prevented from sliding out of the heat conducting sleeve.

Preferably, the insulating layer is sleeved outside the semiconductor heating sheet, so that the possibility of electric leakage is further avoided, and potential safety hazards are reduced.

Preferably, a water inlet and a water outlet are arranged on the side wall of the water tank, mounting holes are formed in one side of the water tank close to the water inlet and the water outlet, and the water inlet and the water outlet are distributed in an inclined symmetrical mode or in the upper end and the lower end of the same side, so that the water inlet process and the water outlet process are separated, the heating efficiency is increased, meanwhile, a water level measurer and a temperature sensor are conveniently installed, and the requirement of real-time monitoring is met.

Preferably, the two ends of the two sides of the water tank are symmetrically connected with mounting pieces, so that the installation and the use of equipment are facilitated.

Preferably, the water tank is cylindrical or square, works as the water tank is cylindrical, the installed part mountable in the arbitrary one end at water tank both ends, works as the water tank is square, the installed part mountable is in the outer wall of water tank arbitrary one side all around to select the use according to different demands.

Compared with the prior art, the beneficial effects of the utility model are that:

insert the semiconductor heating plate inside the heat conduction cover, make its abundant laminating with the hydraulic press, cooperation through locating hole and screw post, install according to the gasket in the screw post outside, the order of installed part and cover plate, accomplish the installation to the water tank through installation piece and bolt, when heating, through hookup location's difference, carry out the resolution of water inlet and delivery port, water level measurement ware and the temperature-sensing ware of installation on the mounting hole simultaneously, satisfy real-time supervision's demand, thereby avoid semiconductor heating plate and water direct contact, make the risk greatly reduced that the semiconductor heating plate damaged or leaked electricity.

The present invention will be explained in detail with reference to the drawings and specific embodiments.

Drawings

FIG. 1 is a schematic view of the cylindrical overall structure of the water tank of the present invention;

fig. 2 is a schematic sectional view of the heating assembly of the present invention;

fig. 3 is a schematic structural view of the semiconductor heating sheet of the present invention;

FIG. 4 is an enlarged view of area A of FIG. 1;

fig. 5 is a schematic view of the square overall structure of the water tank of the present invention.

In the figure: 1. a water tank; 11. mounting holes; 12. a threaded post; 13. a gasket; 2. a water inlet; 3. a heating module; 31. a heat conducting component; 311. a heat conducting sleeve; 312. a mounting member; 32. a semiconductor heating sheet; 33. a cover sheet; 331. a through hole; 34. positioning holes; 35. an insulating layer; 4. a water outlet; 5. and (7) mounting the sheet.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully with reference to the accompanying drawings, in which several embodiments of the present invention are shown, but the present invention can be implemented in different forms, and is not limited to the embodiments described in the text, but rather, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may be present, and when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present, as the terms "vertical", "horizontal", "left", "right" and the like are used herein for descriptive purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the use of the term knowledge in the specification of the present invention is for the purpose of describing particular embodiments and is not intended to limit the present invention, and the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-5, an assembled heater includes a water tank 1, a plurality of heating modules 3 are sequentially disposed on a top end of the water tank 1, each heating module 3 includes a heat conducting assembly 31 and a semiconductor heating sheet 32, the heat conducting assembly 31 includes a heat conducting sleeve 311 and a mounting member 312, the heat conducting sleeve 311 and the mounting member 312 are integrally welded, the heat conducting sleeve 311 is inserted into the water tank 1, the mounting member 312 is mounted on an outer wall of the water tank 1, the water tank 1 is cylindrical or square, and when the water tank 1 is cylindrical, the mounting member 312 is mounted at any one of two ends of the water tank 1, and when the water tank 1 is square, the mounting member 312 is mounted on an outer wall of any one side of the periphery of the water tank 1, so as to be selectively used according to different requirements, a gasket 13 is mounted between the mounting member 312 and the water tank 1, so as to prevent water inside the water tank 1 from flowing out, the semiconductor heating sheet 32 is inserted into the heat conducting sleeve 311, the water tank 1 and the heat conducting sleeve 311 are made of copper, the insulating layer 35 is sleeved outside the semiconductor heating sheet 32, the insulating layer 35 can be a silicon oxide insulating film or an aluminum oxide ceramic plate, so that the possibility of electric leakage is further avoided, and the potential safety hazard is reduced, the cover plate 33 is installed at the top end of the heat conducting sleeve 311, the through hole 331 is formed in the middle position of the cover plate 33, the size of the through hole 331 is smaller than that of the semiconductor heating sheet 32, so that the semiconductor heating sheet 32 is prevented from sliding out of the heat conducting sleeve 311, the positioning holes 34 are formed at both ends of the installation part 312 and the cover plate 33, the threaded columns 12 corresponding to the positioning holes 34 are uniformly connected to both sides of the top end of the water tank 1, the semiconductor heating sheet 32 is inserted into the heat conducting sleeve 311, so that the semiconductor heating sheet 32 cannot be directly contacted with water, the risk of damage or electric leakage of the semiconductor heating sheet 32 is avoided, the water inlet 2 and the water outlet 4 are installed on the side wall of the water tank, mounting hole 11 has all been seted up to one side that water tank 1 is close to water inlet 2 and delivery port 4, is close to 11 mountable water level measurement wares of mounting hole of water inlet 2, is close to 11 mountable temperature-sensing wares of delivery port 4, water inlet 2 and delivery port 4 or the upper and lower end distribution of skew symmetric distribution or homonymy to separately intaking and going out the water process, increase heating efficiency, satisfy real-time supervision's demand simultaneously, the lower extreme of 1 one side of water tank is connected with water inlet 2, and the upper end of 1 opposite side of water tank is connected with delivery port 4, thereby conveniently distinguishes and utilizes the difference in height to intake and go out water.

The utility model discloses a concrete operation as follows:

insert semiconductor heating plate 32 inside heat conduction sleeve 311, make its abundant laminating with the hydraulic press, 12 outside according to gasket 13 at the screw post, installed part 312 and cover plate 33's order are installed, cooperation through locating hole 34 and screw post 12, accomplish the installation of a plurality of heating module 3 in proper order, accomplish the installation to water tank 1 through installation piece 5 and bolt, when heating, through hookup location's difference, carry out the resolution of water inlet 2 and delivery port 4, water level measurement ware and the temperature-sensing ware of installation on the mounting hole 11 simultaneously, satisfy real-time supervision's demand.

The present invention has been described above with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above-mentioned manner, if the method and the technical solution of the present invention are adopted, the present invention can be directly applied to other occasions without substantial improvement, and the present invention is within the protection scope of the present invention.

Claims (7)

1. An assembled heater comprises a water tank (1) and is characterized in that a plurality of heating modules (3) are sequentially arranged at the top end of the water tank (1), the heating module (3) comprises a heat conduction component (31) and a semiconductor heating sheet (32), the heat conducting component (31) comprises a heat conducting sleeve (311) and a mounting piece (312), the heat conduction sleeve (311) and the mounting piece (312) are in a welding integrated structure, the heat conduction sleeve (311) is inserted in the water tank (1), the mounting piece (312) is mounted on the outer wall of the water tank (1), the semiconductor heating sheet (32) is inserted into the heat conduction sleeve (311), a cover plate (33) is arranged at the top end of the heat conduction sleeve (311), positioning holes (34) are respectively arranged at the two ends of the mounting piece (312) and the cover plate (33), the two sides of the top end of the water tank (1) are uniformly connected with a plurality of threaded columns (12) corresponding to the positioning holes (34).

2. A modular heater as claimed in claim 1, characterised in that a gasket (13) is mounted between the mounting member (312) and the tank (1).

3. The assembly heater of claim 1, wherein the cover plate (33) has a through hole (331) formed at a middle position thereof, and the size of the through hole (331) is smaller than that of the semiconductor heating plate (32).

4. A modular heater as claimed in claim 1, characterised in that the outer jacket of the semiconductor heater chip (32) is provided with an insulating layer (35).

5. The assembly heater of claim 1, wherein the side wall of the water tank is provided with a water inlet (2) and a water outlet (4), one side of the water tank (1) close to the water inlet (2) and the water outlet (4) is provided with mounting holes (11), and the water inlet (2) and the water outlet (4) are distributed in an inclined symmetrical manner or distributed at the upper end and the lower end of the same side.

6. An assembled heater according to claim 1, characterised in that the two ends of the tank (1) are symmetrically connected with mounting pieces (5).

7. An assembly heater according to claim 1, characterised in that the tank (1) is either cylindrical or square and that the mounting member (312) is mountable at either end of the tank (1) when the tank (1) is cylindrical and that the mounting member (312) is mountable on the outer wall of the tank (1) on either side of its circumference when the tank (1) is square.

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