CN214093401U - Semiconductor cooling pipeline - Google Patents

Semiconductor cooling pipeline Download PDF

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CN214093401U
CN214093401U CN202022781474.8U CN202022781474U CN214093401U CN 214093401 U CN214093401 U CN 214093401U CN 202022781474 U CN202022781474 U CN 202022781474U CN 214093401 U CN214093401 U CN 214093401U
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aerogel
winding
metal
clockwise
net
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官承辉
吴庆岩
陈攀
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Zhejiang Weifu Technology Co ltd
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Zhejiang Weifu Technology Co ltd
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Abstract

The utility model relates to a semiconductor cooling pipeline and processing method thereof. The device solves the problem that the low-temperature state of the existing semiconductor pipeline is easy to cause condensate water. The semiconductor cooling pipeline comprises a metal flexible corrugated pipe body, wherein a metal net sleeve is sleeved on the metal flexible corrugated pipe body, reinforcing rings are fixed on end faces of two ends of the metal flexible corrugated pipe body, two ends of the metal net sleeve are respectively sleeved on the reinforcing rings, net pressing rings at two ends of the metal net sleeve are sleeved, an outer end face of each net pressing ring and an outer end face of each reinforcing ring are flushed, the inner ends of the net pressing rings are extended to the periphery of the metal flexible corrugated pipe body, the pipeline further comprises aerogel winding heat insulation layers wrapped on outer walls of the metal net sleeve and the two net pressing rings, and a heat shrinkage sheath wrapped on the aerogel winding heat insulation layers. This application advantage: utilize aerogel winding heat preservation it can play heat retaining effect, avoid leading to the pipeline outer wall to have the comdenstion water with external heat exchange.

Description

Semiconductor cooling pipeline
Technical Field
The utility model belongs to the technical field of the semiconductor equipment accessory, especially, relate to a semiconductor cooling pipeline.
Background
With the increasing nanometer (nm) level of semiconductor wafer chips, high precision and cleanliness environments are required. When the wafer is reacted in the reaction chamber of the semiconductor equipment, an environment with a specific temperature is required, and an external semiconductor cooling pipeline system is used for providing accurate temperature control for the whole system.
The semiconductor cooling pipeline system comprises a semiconductor cooling pipeline, the semiconductor cooling pipeline can also be called a vacuum corrugated pipe, the length of the semiconductor cooling pipeline is generally more than 10 meters, the semiconductor cooling pipeline is used for connecting semiconductor process equipment, then accurate temperature control is carried out, the common temperature of the existing semiconductor process equipment such as etching equipment is-10 ℃ to 60 ℃, and along with the promotion of chip level (nanometer), the corresponding semiconductor cooling pipeline level also needs to be promoted.
When the temperature of the existing semiconductor cooling pipeline (heat insulation cotton) is lower than minus 40 ℃, condensed water can be formed on the outer wall of the semiconductor cooling pipeline, so that the pipeline cannot meet the dust-free use requirement of semiconductor equipment and the requirement of accurate temperature control; secondly, when the temperature is high, the contact with the semiconductor cooling pipeline can cause scalding.
Secondly, it includes the corrugated metal pipe, the metal mesh cover of cover on the corrugated metal pipe of semiconductor cooling line to and the pressure net ring of cover at the metal mesh cover both ends, when welded connection, press the net ring need with the corresponding tip welding of corrugated metal pipe, and external pipeline need with the corresponding tip welding of corrugated metal pipe, at this in-process, because its wall thickness of corrugated metal pipe is thinner and twice welded position all is in the both ends outer fringe position of corrugated metal pipe, the defect of this kind of technology lies in: the front and back welding needs cooling waiting, the welding period is long, and the welding quality of the joint is reduced due to two times of welding at the same position.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to the above-mentioned problems, and provides a semiconductor cooling pipeline and a method for manufacturing the same.
In order to achieve the above purpose, the utility model adopts the following technical proposal:
the semiconductor cooling pipeline comprises a metal flexible corrugated pipe body, wherein a metal net sleeve is sleeved on the metal flexible corrugated pipe body, reinforcing rings are fixed on end faces of two ends of the metal flexible corrugated pipe body, two ends of the metal net sleeve are respectively sleeved on the reinforcing rings, net pressing rings at two ends of the metal net sleeve are sleeved, an outer end face of each net pressing ring and an outer end face of each reinforcing ring are flushed, the inner ends of the net pressing rings are extended to the periphery of the metal flexible corrugated pipe body, the pipeline further comprises aerogel winding heat insulation layers wrapped on outer walls of the metal net sleeve and the two net pressing rings, and a heat shrinkage sheath wrapped on the aerogel winding heat insulation layers.
The inner diameter of the reinforcing ring is equal to that of the metal flexible corrugated pipe body.
The end face of one end of the reinforcing ring, which is far away from the metal flexible corrugated pipe body, is flush with the end face of one end of the reinforcing ring sleeved with the net pressing ring.
The outer wall of the reinforcing ring and the inner wall of the net pressing ring form a gap, the metal net sleeve extends into the gap, and the end face of the metal net sleeve is located on the inner side of the outer end face of the reinforcing ring.
The outer end of the outer wall of the reinforcing ring, the outer end of the inner wall of the mesh pressing ring and the end surface of the metal mesh sleeve form an annular welding space, and a crater filled in the annular welding space.
The thickness of the reinforcing ring is larger than that of the wall of the metal flexible corrugated pipe body.
The strengthening ring include the tourus, two terminal surfaces of tourus are annular plane and two annular plane are parallel to each other, have seted up an annular grooving at the outer wall of tourus, annular grooving is cut into bellows welded connection portion and pressure net ring weld part with the outer wall branch of tourus, bellows welded connection portion's thickness is less than the thickness of pressure net ring weld part.
The annular cutting groove is a V-shaped groove.
The annular cutting groove comprises a circular ring vertical surface and a circular ring inclined surface, wherein the circular ring vertical surface is vertical to the axis of the circular ring body, the circular ring inclined surface forms an acute angle with the axis of the circular ring body, and the circular ring vertical surface and the circular ring inclined surface are connected to form the annular cutting groove.
The inner wall of the ring body is a cylindrical hole.
The inner wall of the annular body is a conical hole, and a large-diameter opening of the conical hole is positioned on one side of the corrugated pipe welding connection part.
In the semiconductor cooling pipeline, the number of layers of the aerogel winding heat-insulating layer is 2-12.
In foretell semiconductor cooling pipeline, aerogel winding heat preservation include clockwise aerogel winding area to and anticlockwise aerogel winding area, clockwise aerogel winding area winding is in press net ring and metal mesh cover outer wall, the gap cladding of clockwise aerogel winding area is taken in anticlockwise aerogel winding.
In the semiconductor cooling pipeline, the aerogel winding heat insulation layer comprises two layers of clockwise aerogel winding belts, one layer of clockwise aerogel winding belt is wound on the outer walls of the net pressing ring and the metal net sleeve, and the other layer of clockwise aerogel winding belt is wound along the wound layer of clockwise aerogel winding belt; or the aerogel winding heat preservation include two-layer anticlockwise aerogel winding area, the winding of one deck anticlockwise aerogel winding area is in press net ring and metal mesh cover outer wall, the one deck is along winding already the gap winding in one deck anticlockwise aerogel winding area.
In the above semiconductor cooling pipe, the clockwise aerogel winding band or the counterclockwise aerogel winding band is wound along the wave crest of the metallic flexible corrugated pipe body.
In the semiconductor cooling pipeline, the transverse section of the clockwise aerogel winding belt is rectangular; the transverse section of the anticlockwise aerogel winding belt is rectangular.
In the above semiconductor cooling pipeline, the clockwise aerogel winding belt is spirally wound to form a cylindrical structure, and the counterclockwise aerogel winding belt is spirally wound to form a cylindrical structure.
In the semiconductor cooling pipeline, the two layers of clockwise aerogel winding belts are distributed in a staggered mode inside and outside the clockwise aerogel winding belts.
As another scheme, the two layers of counterclockwise aerogel winding belts are arranged in a staggered mode inside and outside the two layers of counterclockwise aerogel winding belts.
The processing method for preventing the condensed water from generating the semiconductor cooling pipeline comprises the following steps:
s1, preparing a metal flexible corrugated pipe body, a metal net sleeve, two reinforcing rings, two net pressing rings, a heat-shrinkable sheath and at least two aerogel winding belts;
the end faces of the two ends of the metal flexible corrugated pipe body are extruded to form a welding plane;
the outer wall of the reinforcing ring is provided with an annular cutting groove, the annular cutting groove cuts the outer wall of the annular body into a corrugated pipe welding connection part and a net pressing ring welding part, and the thickness of the corrugated pipe welding connection part is smaller than that of the net pressing ring welding part;
the length of the net pressing ring is longer than that of the reinforcing ring, and the outer diameter of the reinforcing ring is smaller than the inner diameter of the net pressing ring;
s2, placing the metal flexible corrugated pipe body on a welding platform, attaching one end face of a reinforcing ring close to a welding connection part of the corrugated pipe body on a welding plane of the metal flexible corrugated pipe, wherein the axial lead of the metal flexible corrugated pipe body is superposed with the axial lead of the reinforcing ring, welding the outer edge of the welding plane and the outer edge of one side of the reinforcing ring close to the reinforcing ring, the outer wall of the reinforcing ring is flush with the outer wall of the metal flexible corrugated pipe body after the two reinforcing rings are welded in sequence, then sleeving the metal mesh on the metal flexible corrugated pipe body, and extending and sleeving two ends of the metal mesh on the reinforcing ring;
s3, sleeving two net pressing rings into corresponding ends of the metal net sleeve respectively, enabling the outer end faces of the net pressing rings on the corresponding ends of the metal net sleeve to be flush with the outer end face of the reinforcing ring, and connecting the outer ends of the inner walls of the net pressing rings and the outer walls of the reinforcing ring through welding;
s4, winding one aerogel winding belt on the outer walls of the net pressing ring and the metal net sleeve according to a clockwise spiral mode to form a clockwise aerogel winding belt, winding the other aerogel winding belt on a gap of the clockwise spirally wound aerogel winding belt according to an anticlockwise spiral mode to form an anticlockwise aerogel winding belt, and forming an aerogel winding heat insulation layer by the clockwise aerogel winding belt and the anticlockwise aerogel winding belt;
and S5, sleeving the thermal shrinkage sheath on the anticlockwise spirally wound aerogel winding belt to obtain a finished product of the semiconductor cooling pipeline.
In the above semiconductor cooling circuit, the two bonding planes are parallel to each other.
In the semiconductor cooling circuit, in the step S1, the thickness of the welded connection of the corrugated tube is equal to or slightly greater than the wall thickness of the flexible metal corrugated tube.
In the semiconductor cooling circuit, in the step S1, the inner wall of the reinforcing ring is a cylindrical hole, and the diameter of the cylindrical hole is equal to the inner diameter of the flexible metal bellows.
In the semiconductor cooling circuit, in the step S1, the inner wall of the reinforcing ring is a conical hole, and the large-diameter end of the conical hole is equal to the inner diameter of the flexible metal corrugated pipe.
In the semiconductor cooling pipeline, in the step S1, an inner chamfer is formed at one end of the inner wall of the mesh pressing ring, and when the mesh pressing ring is sleeved into the metal mesh, the end of the mesh pressing ring sleeved with the inner chamfer is sleeved first.
In the semiconductor cooling circuit, in the step S1, two end faces of the reinforcing ring are annular planes, and the two annular planes are parallel to each other.
In the semiconductor cooling pipeline, the linear distance formed by the end surface of the metal mesh sleeve and the corresponding outer end surface of the reinforcing ring is smaller than the thickness of the welding part of the mesh pressing ring.
In the semiconductor cooling circuit, in the step S1, the annular cutting groove has a depth of 1/2-1/3 of the distance from the inner diameter to the outer shape of the stiffener ring.
In the above semiconductor cooling circuit, in the above step S1, the inner diameter of the bonding plane is equal to or larger than the inner diameter of the reinforcement ring.
Compared with the prior art, the semiconductor cooling pipeline and the processing method thereof have the advantages that:
utilize aerogel winding heat preservation it can play heat retaining effect, avoid leading to the pipeline outer wall to have the comdenstion water with external heat exchange.
Secondly, the clockwise aerogel winding area and/or the anticlockwise aerogel winding area of design, it can realize nimble application to satisfy different accuse temperature requirements.
The aerogel is utilized, so that the pipeline has a smaller outer diameter, the later arrangement and installation are facilitated, and meanwhile, a very good heat insulation effect can be achieved.
The diameter of the external pipeline is equal to the small-caliber end of the conical hole, the conical hole can be used for guiding airflow, and the airflow can smoothly enter the external pipeline from the metal flexible corrugated pipe body through the conical hole.
The reinforcing rings are utilized to form welding connection at two different positions, so that the problem of poor quality caused by multiple times of welding at the same position can be solved, and the cooling waiting time of front and back welding can be shortened, so that the welding efficiency is improved.
The annular cutting groove is utilized for welding partitioning, and meanwhile, the added annular body can avoid the phenomena of poor welding quality and the like caused by one-point welding for many times; secondly, by adding the ring body, the welding processing in steps can be carried out, so that the welding efficiency is improved.
Drawings
Fig. 1 is a schematic view of a cross-sectional structure of an end portion of a semiconductor cooling pipeline provided by the present invention.
Fig. 2 is a schematic view of a reinforcing ring structure provided by the present invention.
Fig. 3 is a schematic structural diagram after the external pipeline is connected.
Fig. 4 is a schematic diagram of a third structure according to the present invention.
Fig. 5 is a schematic structural view of the inner design reaming of the reinforcement ring and the welded connection with the external pipeline provided by the present invention.
Fig. 6 is a flow chart of a method for processing a semiconductor cooling pipeline according to the present invention.
Fig. 7 is a schematic view of a semiconductor cooling pipeline structure provided by the present invention.
In the figure, the reinforcing ring 1a, the circular conical hole 1b, the cylindrical surface 1c, the torus 1, the annular plane 10, the annular cutting groove 11, the annular vertical surface 110, the toroidal inclined surface 111, the bellows welded connection portion 12, the mesh pressing ring welding portion 13, the flexible corrugated metal pipe body 2, the welding plane 20, the metal mesh sleeve 3, the mesh pressing ring 4, the aerogel winding heat preservation layer 5, the clockwise aerogel winding belt 50, the counterclockwise aerogel winding belt 51 and the heat-shrinkable sheath 6.
Detailed Description
The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.
Example one
As shown in fig. 1 and 7, the semiconductor cooling pipeline comprises a flexible metal corrugated pipe body 2, a metal mesh 3 sleeved on the flexible metal corrugated pipe body 2, and the flexible metal corrugated pipe body 2 and the metal mesh 3 are directly purchased.
As shown in fig. 1 and 2, welding planes 20 are respectively provided at both ends of the metal flexible bellows body 2, and the two welding planes are parallel to each other. The welding planes 20 are used for subsequent welding positioning, and the reinforcing rings 1a are fixed on the respective welding planes 20 by welding, and secondly, the thickness of the reinforcing ring 1a is larger than the wall thickness of the metal flexible corrugated pipe body 2.
In order to solve the problem of alternate rotation and wind bell, the inner wall of the reinforcing ring 1a of the embodiment is a conical hole 1b, the large-caliber end of the conical hole is equal to the inner diameter of the metal flexible corrugated pipe body 2, and the outer wall of the reinforcing ring 1a is a cylindrical surface 1 c.
Secondly, two end faces of the reinforcing ring are annular planes, and the two annular planes are parallel to each other.
As shown in fig. 3, the diameter of the external pipeline is equal to the small-diameter end of the conical hole, the conical hole 1b can guide the airflow, and the airflow can smoothly enter the external pipeline from the metallic flexible corrugated pipe body 2 through the conical hole 1 b.
Specifically, as shown in fig. 2, the reinforcing ring 1a of the present embodiment includes a circular ring body 1, and the circular ring body 1 is made of a metal material.
The two end surfaces of the circular ring body 1 are annular planes 10, the two annular planes 10 are parallel to each other, an annular cutting groove 11 is formed in the outer wall of the circular ring body 1, the depth of the annular cutting groove is 1/2-1/3 from the inner diameter to the shape distance of the reinforcing ring, the annular cutting groove 11 cuts the outer wall of the circular ring body 1 into a corrugated pipe welding connection portion 12 and a net pressing ring welding portion 13, and the thickness of the corrugated pipe welding connection portion 12 is smaller than that of the net pressing ring welding portion 13.
The thickness of the corrugated pipe welding connection part is equal to or slightly larger than the wall thickness of the metal flexible corrugated pipe body. The welding strength is ensured.
The outer width of the bellows weld joint 12 is equal to or slightly greater than the wall thickness of the metallic flexible bellows body. For example, the thickness is 0.1-0.2 mm.
Specifically, the annular cutting groove 11 of the present embodiment is a V-shaped groove.
As shown in fig. 1, the metal net cover further comprises two net pressing rings 4 respectively sleeved at two ends of the metal net cover 3, one end of each net pressing ring 4 far away from the metal net cover 3 is extended and sleeved outside the reinforcing ring 1a, and the net pressing rings 4 and the reinforcing ring 1a are connected through welding. The structure with the same diameter can prevent the airflow from forming obstruction in the walking process to cause turbulence and wind ring.
The pipeline further comprises an aerogel winding heat-insulating layer 5 coated on the outer walls of the metal mesh sleeve and the two net pressing rings, and a heat-shrinkable sheath 6 sleeved on the aerogel winding heat-insulating layer.
Preferably, the number of layers of the aerogel winding insulation layer in the embodiment is 2-12.
Specifically, aerogel winding heat preservation includes clockwise aerogel winding area 50, and this clockwise aerogel winding area transverse section is the rectangle and forms cylindric structure after clockwise aerogel winding takes the spiral winding, ensures thermal insulation performance to and anticlockwise aerogel winding area 51, this anticlockwise aerogel winding area transverse section is the rectangle and forms cylindric structure after anticlockwise aerogel winding takes the spiral winding, ensures thermal insulation performance, and clockwise aerogel winding area winding is in press net ring and metal mesh cover outer wall, the gap cladding of clockwise aerogel winding area is taken in anticlockwise aerogel winding.
Clockwise aerogel winding area 50 has to be one deck or two or four layers, anticlockwise aerogel winding area quantity equals with the quantity of clockwise aerogel winding area.
The aerogel is light in weight and can be manufactured to be thin in thickness, so that the installation space can be saved, and the aerogel also has very good heat insulation performance.
Clockwise and anticlockwise aerogel winding area of design, it can form not equidirectional and the reinforcement that keeps warm each other, ensures thermal insulation performance.
Further, the clockwise aerogel winding belt is wound along the wave crest of the metal flexible corrugated pipe body so as to ensure the structural strength.
The processing method for preventing the condensed water from generating the semiconductor cooling pipeline comprises the following steps:
s1, preparing a metal flexible corrugated pipe body, a metal net sleeve, two reinforcing rings, two net pressing rings, a heat-shrinkable sheath and at least two aerogel winding belts;
both end faces of the metal flexible corrugated tube body are pressed to form a welding plane 20; the inner diameter of the welding plane is equal to or greater than the inner diameter of the reinforcement ring. The length of the metal net sleeve is shorter than that of the metal flexible corrugated pipe body;
the outer wall of the reinforcing ring is provided with an annular cutting groove, the annular cutting groove cuts the outer wall of the annular body into a corrugated pipe welding connection part and a net pressing ring welding part, and the thickness of the corrugated pipe welding connection part is smaller than that of the net pressing ring welding part;
the length of the net pressing ring is longer than that of the reinforcing ring, and the outer diameter of the reinforcing ring is smaller than the inner diameter of the net pressing ring;
the outer wall of the reinforcing ring is provided with an annular cutting groove, the annular cutting groove cuts the outer wall of the annular body into a corrugated pipe welding connection part and a net pressing ring welding part, and the thickness of the corrugated pipe welding connection part is smaller than that of the net pressing ring welding part;
s2, placing the metal flexible corrugated pipe body on a welding platform, attaching one end face of a reinforcing ring close to a welding connection part of the corrugated pipe body on a welding plane of the metal flexible corrugated pipe, wherein the axial lead of the metal flexible corrugated pipe body is superposed with the axial lead of the reinforcing ring, welding the outer edge of the welding plane and the outer edge of one side of the reinforcing ring close to the reinforcing ring, the outer wall of the reinforcing ring is flush with the outer wall of the metal flexible corrugated pipe body after the two reinforcing rings are welded in sequence, then sleeving the metal mesh on the metal flexible corrugated pipe body, and extending and sleeving two ends of the metal mesh on the reinforcing ring;
further, an annular plane 10 at one end of the annular body 1 close to the corrugated pipe welding connection portion 12 is attached to a welding plane 20 at one end of the metal flexible corrugated pipe body, the metal flexible corrugated pipe body and the corrugated pipe welding connection portion 12 are welded in the circumferential direction by a welding gun (the outer edge of the attachment of the metal flexible corrugated pipe body and the corrugated pipe welding connection portion 12 is welded in the circumferential direction), the metal mesh sleeve 3 and the mesh pressing ring 4 sleeved on the metal mesh sleeve are welded in the outer end of the mesh pressing ring and the mesh pressing ring welding portion 13 (the outer edge of the attachment of the metal mesh pressing ring and the mesh pressing ring is welded in the circumferential direction), and finally an external connection pipe is welded on the other annular plane 10 of the annular body 1.
S3, sleeving two net pressing rings into corresponding ends of the metal net sleeve respectively, enabling the outer end faces of the net pressing rings on the corresponding ends of the metal net sleeve to be flush with the outer end face of the reinforcing ring, and connecting the outer ends of the inner walls of the net pressing rings and the outer walls of the reinforcing ring through welding;
s4, winding one aerogel winding belt on the outer walls of the net pressing ring and the metal net sleeve according to a clockwise spiral mode to form a clockwise aerogel winding belt, winding the other aerogel winding belt on a gap of the clockwise spirally wound aerogel winding belt according to an anticlockwise spiral mode to form an anticlockwise aerogel winding belt, and forming an aerogel winding heat insulation layer by the clockwise aerogel winding belt and the anticlockwise aerogel winding belt;
and S5, sleeving the thermal shrinkage sheath on the anticlockwise spirally wound aerogel winding belt to obtain a finished product of the semiconductor cooling pipeline.
When the welding is carried out, the welding head is in a welding state,
the annular cutting groove 11 is used for welding subareas, and meanwhile, the added annular body 1 can avoid the phenomena of poor welding quality and the like caused by one-point welding for many times; secondly, it can carry out the welding process of substep through increasing tourus 1 to improve welding efficiency (traditional external pipe, pressure net ring and bellows need fix a position and once weld together, inefficiency).
Further, the end surface of the reinforcing ring 1a far away from the metal flexible corrugated pipe body 2 and the end surface of the mesh pressing ring 4 sleeved on the reinforcing ring 1a are flush. The flush structure prevents interference in subsequent connections to the pipeline.
A gap is formed between the outer wall of the reinforcement ring 1a and the inner wall of the net pressing ring 4, the metal net 3 extends into the gap and the end face of the metal net 3 is located inside the outer end face of the reinforcement ring 1 a. Secondly, the outer end of the outer wall of the reinforcing ring 1a, the outer end of the inner wall of the net pressing ring 4 and the end surface of the metal net sleeve 3 form an annular welding space and a crater for filling the annular welding space.
When welding, the flexible corrugated metal pipe body 2 and the reinforcing ring 1a are welded firstly, after the welding is finished, the metal net sleeve 3 and the net pressing ring 4 are sleeved, as shown in figure 1, one end of the inner wall of the net pressing ring is provided with an inner chamfer 40, the inner chamfer can avoid sharp corners to damage the metal net sleeve, and the end, provided with the inner chamfer, of the net pressing ring is sleeved firstly when the metal net sleeve is sleeved by the net pressing ring. Then, in the welding of the metal flexible corrugated pipe body 2 and the mesh pressing ring 4, the black filled area in fig. 2 is the crater.
In addition, the linear distance formed by the end surface of the metal mesh sleeve and the corresponding outer end surface of the reinforcing ring is smaller than the thickness of the welding part of the mesh pressing ring. The crater generated in the annular cutting groove is avoided.
As shown in fig. 5, a cylindrical hole and a counterbore are sequentially formed from the inside to the outside at the end of the reinforcing ring away from the flexible metal corrugated pipe body 2, an external pipeline is inserted into the counterbore and welded to the reinforcing ring, and the internal diameter of the external pipeline is equal to the internal diameter of the cylindrical hole.
Figure BDA0002799705620000111
The detection can be carried out, so that the heat insulation performance of the heat insulation device is very good, and accurate temperature control can be realized to ensure the normal operation of equipment.
Example two
The working principle and structure of the embodiment are basically the same as those of the first embodiment, and the different structures are as follows: as shown in fig. 2, the annular cutting groove 11 includes a vertical annular surface 110 perpendicular to the axial line of the annular body 1, and an inclined annular surface 111 forming an acute angle with the axial line of the annular body 1, and the vertical annular surface 110 and the inclined annular surface 111 are connected to form the annular cutting groove 11.
EXAMPLE III
The working principle and structure of the embodiment are basically the same as those of the first embodiment, and the different structures are as follows: the inner wall of the reinforcing ring is a cylindrical hole, and the aperture of the cylindrical hole is equal to the inner diameter of the metal flexible corrugated pipe body.
Example four
The working principle and structure of the embodiment are basically the same as those of the first embodiment, and the different structures are as follows: aerogel winding heat preservation include two-layer clockwise aerogel winding area, the clockwise aerogel winding of one deck takes the winding to press net ring and metal mesh cover outer wall, the one deck is along winding the gap winding in the clockwise aerogel winding of one deck area in addition.
The two layers of clockwise aerogel winding belts are distributed in a staggered mode inside and outside the clockwise aerogel winding belts.
Or the clockwise aerogel winding belt is four layers or six layers.
Figure BDA0002799705620000121
The detection can be carried out, so that the heat insulation performance of the heat insulation device is very good, and accurate temperature control can be realized to ensure the normal operation of equipment.
EXAMPLE five
The working principle and structure of the embodiment are basically the same as those of the first embodiment, and the different structures are as follows: aerogel winding heat preservation include two-layer anticlockwise aerogel winding area, the winding of one deck anticlockwise aerogel winding area is in press net ring and metal mesh cover outer wall, the one deck is along winding already the gap winding in one deck anticlockwise aerogel winding area. The two layers of anticlockwise aerogel winding belts are arranged in a staggered mode from inside to outside.
Or the anticlockwise aerogel winding belt is four layers or eight layers.
Figure BDA0002799705620000122
Figure BDA0002799705620000131
The detection can be carried out, so that the heat insulation performance of the heat insulation device is very good, and accurate temperature control can be realized to ensure the normal operation of equipment.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Claims (9)

1. The semiconductor cooling pipeline comprises a metal flexible corrugated pipe body, wherein a metal net sleeve is sleeved on the metal flexible corrugated pipe body, and is characterized in that reinforcing rings are fixed on end faces of two ends of the metal flexible corrugated pipe body, two ends of the metal net sleeve are respectively sleeved on the reinforcing rings, net pressing rings at two ends of the metal net sleeve are sleeved, the outer end face of each net pressing ring and the outer end face of each reinforcing ring are flush, the inner ends of the net pressing rings are extended to the periphery of the metal flexible corrugated pipe body, the pipeline further comprises aerogel winding heat insulation layers wrapped on the outer walls of the metal net sleeve and the two net pressing rings, and a heat shrinkage sheath wrapped on the aerogel winding heat insulation layers.
2. The semiconductor cooling pipeline according to claim 1, wherein the number of layers of the aerogel winding insulation layer is 2-12.
3. The semiconductor cooling pipeline according to claim 1, wherein the aerogel winding insulation layer comprises a clockwise aerogel winding belt and a counterclockwise aerogel winding belt, the clockwise aerogel winding belt is wound on the outer wall of the net pressing ring and the metal net sleeve, and the counterclockwise aerogel winding belt wraps the gap of the clockwise aerogel winding belt.
4. The semiconductor cooling pipeline according to claim 1, wherein the aerogel winding insulation layer comprises two layers of clockwise aerogel winding belts, one layer of clockwise aerogel winding belt is wound on the outer wall of the net pressing ring and the metal net sleeve, and the other layer of clockwise aerogel winding belt is wound along the gaps of the wound layer of clockwise aerogel winding belt; or the aerogel winding heat preservation include two-layer anticlockwise aerogel winding area, the winding of one deck anticlockwise aerogel winding area is in press net ring and metal mesh cover outer wall, the one deck is along winding already the gap winding in one deck anticlockwise aerogel winding area.
5. The semiconductor cooling circuit according to claim 3 or 4, wherein the clockwise aerogel winding band or the counterclockwise aerogel winding band is wound along the wave crests of the metallic flexible corrugated pipe body.
6. The semiconductor cooling circuit according to claim 3 or 4, wherein the clockwise aerogel winding strip has a rectangular transverse cross-section; the transverse section of the anticlockwise aerogel winding belt is rectangular.
7. The semiconductor cooling pipeline according to claim 3 or 4, wherein the clockwise aerogel winding belt is spirally wound to form a cylindrical structure, and the counterclockwise aerogel winding belt is spirally wound to form a cylindrical structure.
8. The semiconductor cooling circuit according to claim 4, wherein said two layers of clockwise aerogel winding tapes are arranged with inner and outer offset positions.
9. The semiconductor cooling circuit according to claim 4, wherein said two layers of counterclockwise aerogel winding tapes are staggered inside and outside.
CN202022781474.8U 2020-11-25 2020-11-25 Semiconductor cooling pipeline Active CN214093401U (en)

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