CN214060629U - Evaporation electrode structure - Google Patents

Evaporation electrode structure Download PDF

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Publication number
CN214060629U
CN214060629U CN202021874469.5U CN202021874469U CN214060629U CN 214060629 U CN214060629 U CN 214060629U CN 202021874469 U CN202021874469 U CN 202021874469U CN 214060629 U CN214060629 U CN 214060629U
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Prior art keywords
conducting rod
evaporation
evaporation source
electrode structure
rod
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CN202021874469.5U
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鲁旭亮
郭琼
张少斌
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Changzhou Xingyu Automotive Lighting Systems Co Ltd
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Changzhou Xingyu Automotive Lighting Systems Co Ltd
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Abstract

The utility model relates to a car light coating film technical field, concretely relates to evaporation electrode structure, including first conducting rod, second conducting rod, evaporation source and retaining member, the first end of second conducting rod with the connection can be dismantled to first conducting rod, the second end screw hole of second conducting rod, just seted up the draw-in groove on the second conducting rod, the draw-in groove with the screw hole intercommunication, the evaporation source is disposed in the draw-in groove, the retaining member with screw hole cooperation locking the evaporation source. The utility model provides a pair of evaporation electrode structure, adjustable evaporation source position makes to be plated the part surface film thickness even to the installation of evaporation source is simple, convenient, swift with the dismantlement.

Description

Evaporation electrode structure
Technical Field
The utility model relates to a car light coating film technical field, concretely relates to evaporation electrode structure.
Background
At present, the vacuum evaporation coating technology is widely applied in the domestic and foreign automobile lamp industry to deposit metal film layers such as aluminum films and the like on the surfaces of parts to be coated, wherein the resistance evaporation coating is to heat an evaporation source (such as a tungsten filament) by using strong current under the vacuum condition so that the temperature of the evaporation source is raised to be capable of melting and evaporating film materials such as aluminum materials and the like hung on the evaporation source, then evaporation particles are scattered to all directions and attached to the parts to be coated, and the parts are cooled and crystallized to become the aluminum films.
An evaporation source in the prior art is generally installed on a conductive rod, the position and the length of the conductive rod are fixed, and cannot be adjusted, and for parts to be plated with complex structures and curved surfaces, the thicknesses of film layers on the surfaces of the parts to be plated are generally inconsistent due to linear motion of gas molecules generated by evaporation, and some special structural parts may not be deposited on the film layers, so that the thicknesses of the film layers of the parts to be plated at different positions and structures need to be adjusted by adjusting the position of the evaporation source during product film plating, and the film thickness of the parts to be plated is ensured to be within a required range.
Meanwhile, the length of the conducting rod of the coating machine for current production is fixed, evaporation sources such as tungsten filaments need to penetrate through holes formed in the conducting rod and then fixed through screwing screws, and the tungsten filament replacement and installation are long in time consumption.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve among the prior art evaporation source rigidity and lead to being plated the inhomogeneous technical problem of part surface film layer thickness, provided an evaporation electrode structure, adjustable evaporation source position makes and is plated the thick even of part surface film.
The technical scheme of the utility model:
an evaporation electrode structure comprising:
a first conductive rod;
the first end of the second conducting rod is detachably connected with the first conducting rod, the second end of the second conducting rod is provided with a threaded hole, the second conducting rod is provided with a clamping groove, and the clamping groove is communicated with the threaded hole;
an evaporation source configured within the card slot;
the retaining member, the retaining member with the screw hole cooperation locking the evaporation source.
The second conducting rod and the first conducting rod are detachably connected, so that when parts to be plated, which have complex structures and contain various curved surfaces, are plated, the second conducting rods with different lengths can be replaced according to needs, the positions of evaporation sources are changed, all parts on the surfaces of the parts to be plated can be attached with films, and the thicknesses of the films are uniform; simultaneously, this application sets up the draw-in groove and places the evaporation source to through retaining member locking, make the installation of evaporation source simple, convenient, swift.
Furthermore, the two sides of the first conducting rod are detachably connected with the second conducting rod, so that the two sides of the first conducting rod can be evaporated, the space is effectively utilized, and the film coating efficiency is improved.
Furthermore, the second conducting rods on two sides of the first conducting rod are arranged in a staggered mode, so that the thickness of the film layer is more uniform.
Furthermore, the number of the first conductive rods is two, at least one second conductive rod is connected to each of the two first conductive rods, and the evaporation source is disposed between the second conductive rods on the two first conductive rods, so that the evaporation source can be electrically heated by connecting the two first conductive rods to the positive and negative electrodes of the power supply.
Furthermore, the first conducting rod is in threaded connection with the second conducting rod, and the threaded connection mode enables the disassembly to be more convenient and faster.
Furthermore, the evaporation source is a tungsten filament, the tungsten has high melting point, low vapor pressure and stable chemical property, and is not easy to react with the film material.
Furthermore, the locking piece is a butterfly bolt, and the butterfly bolt is convenient for manual operation, and is convenient and fast.
Further, the clamping groove is arranged at the top of the second conducting rod, so that the evaporation source cannot fall off before being locked.
Furthermore, the cross section of the first conducting rod is rectangular, and the two sides of the rectangular cross section of the first conducting rod are convenient to connect with the second conducting rod.
Furthermore, the cross section of the second conducting rod is hexagonal, and the second conducting rod with the hexagonal cross section is convenient to hold and rotate.
After the technical scheme is adopted, the utility model provides a pair of evaporation electrode structure compares with prior art, has following beneficial effect: according to the invention, the second conducting rod is detachably connected with the first conducting rod, so that when a part to be plated with a complex structure and various curved surfaces is plated, the second conducting rods with different lengths can be replaced according to requirements, the position of an evaporation source is changed, all parts on the surface of the part to be plated can be adhered with films, and the film thickness is uniform; simultaneously, this application sets up the draw-in groove and places the evaporation source to through retaining member locking, make the installation of evaporation source simple, convenient, swift.
Drawings
FIG. 1 is a schematic structural view of an evaporation electrode structure according to a first embodiment;
fig. 2 is a schematic structural view of an evaporation electrode structure according to a second embodiment.
The device comprises a first conducting rod 1, a second conducting rod 2, a clamping groove 21, a threaded hole 22, an evaporation source 3 and a locking piece 4.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.
The first embodiment is as follows:
as shown in fig. 1, the evaporation electrode structure of this embodiment includes first conducting rod 1 and second conducting rod 2, and first conducting rod 1 and second conducting rod 2 detachably connect, specifically, set up a plurality of M12's internal thread hole on the first conducting rod 1, and the first end of second conducting rod 2 is equipped with M12's external screw thread, realizes detachably connecting through the connection of internal thread hole and external screw thread, and threaded connection mode makes dismantlement convenient and fast.
Further, the second end of the second conducting rod 2 is opened with a threaded hole 22, a locking groove 21 is disposed on the second conducting rod 2 near the threaded hole 22, the locking groove 21 is communicated with the threaded hole 22, and the evaporation source 3 is disposed in the locking groove 21, the embodiment further includes a locking member 4, the surface of the locking member 4 has a thread which is matched with the threaded hole 22, and the evaporation source 3 can be locked in the locking groove 21 by rotating the locking member 4 due to the communication between the threaded hole 22 and the locking groove 21.
As can be seen from the above, in the present embodiment, the first conducting rod 1 and the second conducting rod 2 are detachably connected, so that when a part to be plated, which has a complex structure and contains various curved surfaces, is plated, the second conducting rod 2 with different lengths can be replaced as required, thereby changing the position of the evaporation source 3, so that the film layer can be adhered to each part of the surface of the part to be plated, and the film thickness is uniform; simultaneously, this embodiment sets up draw-in groove 21 and places evaporation source 3 to through locking of retaining member 4, when the installation only need with evaporation source 3 place in draw-in groove 21 can, simple to operate, swift, when dismantling or changing evaporation source 3 equally, unscrew retaining member 4 and can conveniently take out evaporation source 3, so make evaporation source 3's installation and dismantlement simple, convenient, swift.
The evaporation source 3 of this embodiment can be selected from, but is not limited to, tungsten filament, which has high melting point, low vapor pressure and stable chemical property, and is not easy to react with the film material, although materials such as molybdenum and tantalum can be used in other embodiments; the retaining member 4 of this embodiment is optional but not limited to the butterfly bolt, and the butterfly bolt is convenient for manual rotatory locking and dismantlement tungsten filament, need not specialized tool, convenient and fast.
Further, the two first conducting rods 1 of the present embodiment are arranged in parallel, the two first conducting rods 1 are respectively connected with three second conducting rods 2, the two second conducting rods 2 located on different first conducting rods 1 form a group, the present embodiment has three groups of second conducting rods 2, and one or more tungsten filaments are disposed between each group of second conducting rods 2, so that the two first conducting rods 1 are respectively connected with the positive and negative electrodes of the power supply to form a conducting loop, and the tungsten filaments can be heated. The lateral wall contact of evaporation source 3 and draw-in groove 21 is made through retaining member 4 to this embodiment, and area of contact is great, and the electricity is connected more reliably.
Further, the draw-in groove 21 of this embodiment is set up at the top of second conducting rod 2, like this, when the installation tungsten filament, only need place the tungsten filament in draw-in groove 21, can not drop to the tungsten filament also can not drop when loosening retaining member 4, of course draw-in groove 21 also can set up in other positions of second conducting rod 2, through retaining member 4 locking tungsten filament can.
Preferably, the cross section of the first conducting rod 1 of the embodiment is rectangular, and the rectangular cross section of the first conducting rod 1 is convenient for connecting the second conducting rod 2 at two sides; further, the cross section of the second conductive rod 2 is hexagonal, and the second conductive rod 2 with the hexagonal cross section is convenient to hold and rotate for installation or disassembly.
In summary, the evaporation electrode structure provided by this embodiment can adjust the position of the evaporation source to make the surface film thickness of the plated part uniform, and the installation and the detachment of the evaporation source are simple, convenient and fast.
Example two:
as shown in fig. 2, the structure of the evaporation electrode of the present embodiment is substantially the same as that of the first embodiment, and the difference is that in the present embodiment, the second conductive rods 2 are detachably connected to both sides of the first conductive rod 1, so that both sides of the first conductive rod 1 can perform film evaporation, the space is effectively utilized, the film deposition efficiency is improved, and the second conductive rods 2 at both sides of the first conductive rod 1 are arranged in a staggered manner, so that the film evaporation particles are uniformly dispersed around the first conductive rod 1, and the film thickness of the part to be coated is more uniform.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (9)

1. An evaporation electrode structure, comprising:
a first conductive rod (1);
the first end of the second conducting rod (2) is in threaded connection with the first conducting rod (1), a threaded hole (22) is formed in the second end of the second conducting rod (2), a clamping groove (21) is formed in the second conducting rod (2), and the clamping groove (21) is communicated with the threaded hole (22);
an evaporation source (3), the evaporation source (3) being arranged within the card slot (21);
retaining member (4), retaining member (4) with screw hole (22) cooperation locking evaporation source (3).
2. An evaporation electrode structure according to claim 1, wherein the second conductive rod (2) is detachably attached to both sides of the first conductive rod (1).
3. An evaporation electrode structure according to claim 2, characterized in that the second conductive rods (2) on both sides of the first conductive rod (1) are arranged in a staggered manner.
4. The evaporation electrode structure of claim 1, wherein the number of the first conductive rods (1) is two, at least one of the second conductive rods (2) is connected to each of the two first conductive rods (1), and the evaporation source (3) is disposed between the second conductive rods (2) of the two first conductive rods (1).
5. An evaporation electrode structure according to claim 1, characterized in that the evaporation source (3) is a tungsten filament.
6. An evaporation electrode structure according to claim 1, characterized in that the locking member (4) is a butterfly bolt.
7. An evaporation electrode structure according to claim 1, characterized in that the clamping groove (21) is arranged at the top of the second conducting rod (2).
8. An evaporation electrode structure according to claim 1, characterized in that the first conducting rod (1) has a rectangular cross-section.
9. An evaporation electrode structure as claimed in claim 1, characterized in that the cross-section of the second conducting rod (2) is hexagonal.
CN202021874469.5U 2020-09-01 2020-09-01 Evaporation electrode structure Active CN214060629U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021874469.5U CN214060629U (en) 2020-09-01 2020-09-01 Evaporation electrode structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021874469.5U CN214060629U (en) 2020-09-01 2020-09-01 Evaporation electrode structure

Publications (1)

Publication Number Publication Date
CN214060629U true CN214060629U (en) 2021-08-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN214060629U (en)

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