CN214054656U

CN214054656U - High-precision surface grinding machine for wafer surface treatment

Info

Publication number: CN214054656U
Application number: CN202022911661.3U
Authority: CN
Inventors: 山本晓; 张海涛; 刘良宏; 许彬; 庞博
Original assignee: Wuxi Wuyue Semiconductor Co ltd
Current assignee: Wuxi Wuyue Semiconductor Co ltd
Priority date: 2020-12-07
Filing date: 2020-12-07
Publication date: 2021-08-27
Anticipated expiration: 2030-12-07

Abstract

The utility model relates to a wafer surface treatment correlation technique field just discloses a high accuracy surface grinding machine for wafer surface treatment, including lathe bed, lathe workstation, numerical control panel, stand, emery wheel operating system, wheel drive system, X-ray machine stand, emery wheel lift manual system, emery wheel hydraulic system and emery wheel manual system, the top of lathe workstation installation lathe bed, numerical control panel pass through the erection column and install in the front of lathe bed, and column mouting is in the top left side of lathe workstation, and emery wheel operating system installs on the stand. This a high accuracy flat grinder for wafer surface treatment, X-ray machine can effectually detect the wafer that flat grinder processed, avoids the wafer to appear unusual processing such as crack when adding man-hour, and the setting up of direction finder is effectual detects the wafer precision size under the processing state, improves the machining precision of product, and then the effectual production quality who improves the product.

Description

High-precision surface grinding machine for wafer surface treatment

Technical Field

The utility model relates to a wafer surface treatment correlation technique field specifically is a high accuracy flat grinder for wafer surface treatment.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular, various circuit element structures can be manufactured on the silicon wafer to form IC products with specific electrical functions, the original material of the wafer is silicon, and the surface of the earth crust has inexhaustible silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with the purity as high as 99.999999999 percent.

When the surface of the wafer is polished by the traditional surface grinder, the polishing precision requirement of a grinding wheel on the surface of the wafer is high, multiple times of repeated observation and measurement are generally needed, the processing precision of the wafer cannot be effectively controlled, and the production efficiency is low.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a high accuracy surface grinder for wafer surface treatment has solved surface grinder and can not effectively satisfy the problem of wafer surface machining treatment accuracy.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a high-precision surface grinding machine for wafer surface treatment comprises a machine tool body, a machine tool workbench, a numerical control panel, a stand column, a grinding wheel lifting system, a grinding wheel driving system, an X-ray machine stand column, a grinding wheel lifting manual system, a grinding wheel hydraulic system and a grinding wheel manual system, wherein the machine tool workbench is arranged at the top of the machine tool body, the numerical control panel is arranged at the front of the machine tool body through an installation column, the stand column is arranged at the left side of the top of the machine tool workbench, the grinding wheel lifting system is arranged on the stand column, the grinding wheel driving system is arranged on a lifting block of the grinding wheel lifting system, the X-ray machine stand column is arranged at the right side of the top of the machine tool workbench, the X-ray machine is arranged on the X-ray machine stand column, the grinding wheel hydraulic system and the grinding wheel lifting manual system are both arranged in the machine tool body, the grinding wheel manual system is arranged on the grinding wheel lifting system, and the X-ray machine stand column is provided with a positioning mechanism, the positioning mechanism is provided with a direction finder.

Positioning mechanism includes the posting, the inboard of posting is provided with two-way lead screw, the intermediate bearing is installed to the inboard intermediate position of posting, two-way lead screw runs through the bearing inner race of intermediate bearing and extends to the outside of posting, two-way lead screw's both ends fixed mounting has rotatory handle, two ball nut of threaded connection of both hands lead screw in the portion that is located the posting, set up two on the posting and run through the movable groove, equal fixedly connected with on two ball nut and the centre gripping extension rod that runs through movable groove looks adaptation, the end of centre gripping extension rod extends to the outside of posting through corresponding movable groove that runs through, the constant head tank with the terminal looks adaptation of centre gripping extension rod is installed to the used screw of direction finder, the end of two centre gripping extension rods is pegged graft in corresponding constant head tank inboardly.

Preferably, the numerical control panel is electrically connected with the grinding wheel lifting system, the grinding wheel driving system and the grinding wheel hydraulic system in a control manner, so that the numerical control panel can effectively operate each system of the surface grinding machine, and related operators can conveniently process products.

Preferably, the cooperation relation that centre gripping extension rod and corresponding run through between the movable groove inside wall is transition fit for the centre gripping extension rod can move about in corresponding running through movable groove, and the cooperation relation between centre gripping extension rod and the corresponding constant head tank inside wall is transition fit, ensures the positioning accuracy between centre gripping extension rod and the corresponding constant head tank, thereby ensures the installation accuracy of direction finder, and two centre gripping extension rods set up about the middle bearing symmetry.

Preferably, two sections of external threads on the bidirectional screw are symmetrically arranged relative to the middle bearing, the thread pitches of the two sections of external threads are equal, and two ball nuts on the bidirectional screw are symmetrically arranged relative to the middle bearing, so that the ball nuts are synchronously meshed with each other on the corresponding external threads of the bidirectional screw in a transmission manner, the clamping precision of the two clamping extending rods on the orientation instrument is guaranteed, and the installation precision of the orientation instrument is guaranteed.

Preferably, the diffraction angle of the orientation instrument is measured towards the wafer positioned by the machine tool workbench, the orientation instrument measures the dimensional accuracy of the processed wafer, the processing accuracy of the product is effectively improved, and the positioning mechanism and the orientation instrument are installed in a matched mode, so that the installation accuracy between structures is guaranteed.

Preferably, the X-ray of the X-ray machine faces to the wafer positioned by the machine tool workbench, the installation positions of the X-ray machine and the orientation instrument are staggered, the X-ray machine carries out X-ray detection on the wafer, the processing state of a product is detected in real time, and the processing defect in the processing process of the product is avoided.

(III) advantageous effects

The utility model provides a high accuracy flat grinder for wafer surface treatment. The method has the following beneficial effects:

(1) this a high accuracy flat grinder for wafer surface treatment, through installation X-ray machine and direction finder on the lathe workstation, be different from traditional flat grinder, the X-ray machine can effectually detect the wafer that flat grinder processed, avoids the wafer to appear unusual processing such as crack when adding man-hour, and the setting up of direction finder is effectual to the wafer precision size under the processing state detect, improves the machining precision of product, and then the effectual production quality who improves the product.

(2) This a high accuracy flat grinder for wafer surface treatment, fix a position the installation through positioning mechanism to the direction finder, the direction finder needs periodic maintenance after long-time the use, current direction finder generally is comparatively fixed mounting structure in order to ensure its measuring precision, and positioning mechanism directly rotates rotatory handle, it rotates to make rotatory handle drive two-way lead screw, it carries out synchronous relative or back of the body activity mutually to make two-way lead screw drive two ball nut, ball nut drives corresponding centre gripping extension rod centre gripping or breaks away from the inboard of corresponding constant head tank, thereby reach the purpose of carrying out centre gripping or dismantlement to the direction finder, and the accurate transmission of two-way lead screw and the sealed cooperation between centre gripping extension rod and the constant head tank, the dismouting precision of effectual assurance direction finder.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is the schematic view of the connection structure of the positioning mechanism and the orientation device of the present invention.

In the figure: 1 machine tool body, 2 machine tool workbench, 3 numerical control panel, 4 columns, 5 grinding wheel lifting systems, 6 grinding wheel driving systems, 7X-ray machine, 8X-ray machine columns, 9 grinding wheel lifting manual systems, 10 grinding wheel hydraulic systems, 11 grinding wheel manual systems, 12 orientation instruments, 13 positioning mechanisms, 131 positioning frames, 132 bidirectional screw rods, 133 intermediate bearings, 134 rotating handles, 135 ball nuts, 136 penetrating through movable grooves, 137 clamping extension rods and 138 positioning grooves.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-2, the utility model provides a technical solution: a high-precision surface grinding machine for wafer surface treatment comprises a machine tool body 1, a machine tool workbench 2, a numerical control panel 3, a stand column 4, a grinding wheel lifting system 5, a grinding wheel driving system 6, an X-ray machine 7, an X-ray machine stand column 8, a grinding wheel lifting manual system 9, a grinding wheel hydraulic system 10 and a grinding wheel manual system 11, wherein the machine tool workbench 2 is installed at the top of the machine tool body 1, the numerical control panel 3 is installed on the front side of the machine tool body 1 through an installation column, the stand column 4 is installed on the left side of the top of the machine tool workbench 2, the grinding wheel lifting system 5 is installed on the stand column 4, the grinding wheel driving system 6 is installed on a lifting block of the grinding wheel lifting system 5, the X-ray machine stand column 8 is installed on the right side of the top of the machine tool workbench 2, the X-ray machine 7 is installed on the X-ray machine stand column 8, the grinding wheel hydraulic system 10 and the grinding wheel lifting manual system 9 are both installed in the machine tool body 1, the grinding wheel manual system 11 is installed on the grinding wheel lifting system 5, the X-ray machine upright post 8 is provided with the positioning mechanism 13, the positioning mechanism 13 is provided with the orientation device 12, the numerical control panel 3 is electrically controlled and connected with the grinding wheel lifting system 5, the grinding wheel driving system 6 and the grinding wheel hydraulic system 10, so that the numerical control panel 3 can effectively operate each system of the surface grinding machine, related operators can conveniently process products, the measured diffraction angle of the orientation device 12 faces to a wafer positioned by the machine tool workbench 2, the orientation device 12 measures the dimensional accuracy of the processed wafer, the processing accuracy of the products is effectively improved, the positioning mechanism 13 and the orientation device 12 are installed in a matching mode, the installation accuracy between the structures is guaranteed, the X-ray of the X-ray machine 7 faces to the wafer positioned by the machine tool workbench 2, the installation positions of the X-ray machine 7 and the orientation device 12 are mutually staggered, the X-ray machine 7 carries out X-ray detection on the wafer, detects the processing state of the product in real time and avoids the processing defects in the processing process of the product.

The positioning mechanism 13 includes a positioning frame 131, a bidirectional screw 132 is disposed on the inner side of the positioning frame 131, a middle bearing 133 is disposed at the middle position of the inner side of the positioning frame 131, the bidirectional screw 132 penetrates through the bearing inner ring of the middle bearing 133 and extends to the outer side of the positioning frame 131, two ends of the bidirectional screw 132 are fixedly mounted with a rotating handle 134, two ball nuts 135 are connected to the double-hand screw 132 through threads on the inner side portion of the positioning frame 131, two through movable slots 136 are disposed on the positioning frame 131, two clamping extending rods 137 adapted to the through movable slots 136 are fixedly connected to the two ball nuts 135, the ends of the clamping extending rods 137 extend to the outer side of the positioning frame 131 through the corresponding through movable slots 136, positioning slots 138 adapted to the ends of the clamping extending rods 137 are mounted on the orientation instrument 12 by screws, the ends of the two clamping extending rods 137 are inserted into the corresponding positioning slots 138, the matching relationship between the clamping extending rod 137 and the inner side wall of the corresponding through movable groove 136 is transition matching, so that the clamping extending rod 137 can move in the corresponding through movable groove 136, the matching relationship between the clamping extending rod 137 and the inner side wall of the corresponding positioning groove 138 is transition matching, the positioning accuracy between the clamping extending rod 137 and the corresponding positioning groove 138 is guaranteed, and therefore the installation accuracy of the orientation instrument 12 is guaranteed, the two clamping extending rods 137 are symmetrically arranged relative to the middle bearing 133, the two sections of external threads on the bidirectional screw 132 are symmetrically arranged relative to the middle bearing 133, the thread pitches of the two sections of external threads in opposite thread directions are equal, the two ball nuts 135 on the bidirectional screw 132 are symmetrically arranged relative to the middle bearing 133, so that the ball nuts 135 are synchronously engaged on the external threads of the corresponding bidirectional screw 132 in a transmission manner, and therefore the clamping accuracy of the two clamping extending rods 137 on the orientation instrument 12 is guaranteed, the installation accuracy of the orientation device 12 is guaranteed.

In summary, when the orientation apparatus 12 is disassembled and assembled, the rotation handle 134 is directly rotated, so that the rotation handle 134 drives the two-way screw 132 to rotate, the two-way screw 132 drives the two ball nuts 135 to synchronously move toward or away from each other, and the ball nuts 135 drive the corresponding clamping extending rods 137 to clamp or separate from the inner sides of the corresponding positioning slots 138, thereby clamping or disassembling the orientation apparatus 12.

The utility model discloses a control mode comes automatic control through the controller, and the control circuit of controller can realize through the simple programming of technical staff in this field, and the supply also belongs to the common general knowledge in this field, and the utility model discloses mainly used protects mechanical device, so the utility model discloses no longer explain control mode and circuit connection in detail.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a reference structure" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high accuracy flat grinder for wafer surface treatment, includes lathe bed, machine tool table, numerical control panel, stand, emery wheel operating system, emery wheel actuating system, X-ray machine stand, emery wheel lift manual system, emery wheel hydraulic system and emery wheel manual system, its characterized in that: the numerical control system comprises a machine tool workbench, a numerical control panel, a grinding wheel lifting system, a grinding wheel driving system, an X-ray machine stand column, an X-ray machine, a grinding wheel hydraulic system, a grinding wheel lifting manual system, a positioning mechanism and a direction finder, wherein the top of the machine tool body is arranged on the machine tool workbench, the numerical control panel is arranged on the front of the machine tool body through an installation column, the stand column is arranged on the left side of the top of the machine tool workbench, the grinding wheel lifting system is arranged on the stand column, the grinding wheel driving system is arranged on a lifting block of the grinding wheel lifting system, the X-ray machine stand column is arranged on the right side of the top of the machine tool workbench, the X-ray machine is arranged on the stand column of the X-ray machine, the grinding wheel hydraulic system and the grinding wheel lifting manual system are both arranged in the machine tool body, the grinding wheel manual system is arranged on the grinding wheel lifting system, the X-ray machine stand column is provided with the positioning mechanism, and the direction finder is arranged on the positioning mechanism;

2. A high-precision surface grinder for surface treatment of wafers as set forth in claim 1, wherein: and the numerical control panel is electrically connected with the grinding wheel lifting system, the grinding wheel driving system and the grinding wheel hydraulic system in a control manner.

3. A high-precision surface grinder for surface treatment of wafers as set forth in claim 1, wherein: the clamping extension rod and the corresponding matching relationship between the inner side walls of the through movable grooves are in transition fit, the clamping extension rod and the corresponding inner side walls of the positioning grooves are in transition fit, and the two clamping extension rods are symmetrically arranged relative to the middle bearing.

4. A high-precision surface grinder for surface treatment of wafers as set forth in claim 1, wherein: two sections of external threads on the bidirectional screw rod are symmetrically arranged relative to the middle bearing, the thread directions of the two sections of external threads are opposite, the thread pitches are equal, and two ball nuts on the bidirectional screw rod are symmetrically arranged relative to the middle bearing.

5. A high-precision surface grinder for surface treatment of wafers as set forth in claim 1, wherein: the measuring diffraction angle of the orientation instrument faces to the wafer positioned by the machine tool workbench, and the positioning mechanism is installed with the orientation instrument in a matching mode.

6. A high-precision surface grinder for surface treatment of wafers as set forth in claim 1, wherein: the X-ray of the X-ray machine faces to the wafer positioned by the machine tool workbench, and the installation positions of the X-ray machine and the orientation instrument are staggered.