CN214054082U - Cutting and polishing integrated equipment convenient to adjust for computer chip processing - Google Patents

Abstract

The invention discloses a conveniently-adjusted cutting and polishing integrated device for processing a computer chip, which relates to the technical field of processing of computer chips and comprises a machine body, an adsorption fixing mechanism, a cutting mechanism and a polishing mechanism, wherein a workbench is fixed above the machine body, a cutting seat is fixed above the workbench, a rear plate is arranged on the rear side above the cutting seat, protective covers are fixed on two sides above the cutting seat, an installation frame is arranged above the protective covers, side sliding blocks are fixed at two ends of the installation frame, a side sliding groove is arranged on the inner side above the protective covers, and an electric push rod is arranged below the installation frame: the device adsorbs fixed establishment's miniature air pump can link to each other with the adsorption tank through breathing pipe and connecting pipe and make the inside negative pressure that produces of adsorption tank, and the adsorption tank that sets up through the equidistance is convenient for adsorb fixedly to the downside of chip main part to avoid the condition that the chip main part removed to appear in the in-process of processing.

Description

Cutting and polishing integrated equipment convenient to adjust for computer chip processing

Technical Field

The invention relates to the technical field of computer chip processing, in particular to a conveniently-adjusted cutting and polishing integrated device for computer chip processing.

Background

The computer chip is an electronic part, and comprises millions of resistors and capacitors and other small elements in one computer chip, a plurality of chips are arranged on a computer, a black strip on a memory strip is the chip, a plurality of chips are arranged on a mainboard, a hard disk, a display card and the like, a CPU is also a computer chip, and original parts of the computer chip are required to be cut in the processing process of the computer chip.

The existing cutting equipment for processing the computer chip generally cannot polish and polish the computer chip after the cutting is finished, needs to be sent to the next procedure for reprocessing, is relatively troublesome to use, cannot be movably adjusted, and is not flexible in use.

Disclosure of Invention

The invention aims to provide cutting and polishing integrated equipment for processing a computer chip, which is convenient to adjust and aims to solve the problems that the existing cutting equipment for processing the computer chip in the background art can not polish and polish the computer chip after the cutting is finished generally, needs to be sent to the next procedure for reprocessing, is troublesome to use, can not be movably adjusted and is not flexible to use.

In order to achieve the purpose, the invention provides the following technical scheme: a cutting and polishing integrated device convenient to adjust for processing a computer chip comprises a machine body, an adsorption fixing mechanism, a cutting mechanism and a polishing mechanism, wherein a workbench is fixed above the machine body, a cutting seat is fixed above the workbench, a rear plate is installed on the rear side above the cutting seat, protective covers are fixed on two sides above the cutting seat, a mounting frame is arranged above the protective covers, side sliding blocks are fixed at two ends of the mounting frame, side sliding grooves are formed in the inner side above the protective covers, an electric push rod is installed below the mounting frame, a positioning mechanism is fixed on the lower side of the electric push rod, the adsorption fixing mechanism is arranged above the cutting seat, a chip main body is arranged on the upper side of the adsorption fixing mechanism, a top plate is fixed above the rear plate, a motor mounting seat is installed below the middle of the top plate, and a linear motor is installed below the inner side of the motor mounting seat, the cutting machine is characterized in that a connecting block is fixed below the linear motor, fixed connecting plates are fixed on two sides of the connecting block, the cutting mechanism is installed below the connecting block, and the polishing mechanism is installed on the outer side of the lower portion of the fixed connecting plates.

Preferably, positioning mechanism is including posting, miniature telescopic link, locating plate, rubber pad, spring, epipleural and skid resistant course, miniature telescopic link is installed to the both sides inboard of posting, and the top of miniature telescopic link is fixed with the locating plate, the inboard face of locating plate has glued the rubber pad, the middle part below of posting is fixed with the spring, and installs the epipleural below of spring, the downside of epipleural has glued the skid resistant course.

Preferably, the positioning plates are symmetrical about the vertical center line of the positioning frame, the positioning plates form a telescopic structure through the miniature telescopic rods and the positioning frame, and springs are arranged between the positioning frame and the upper side plate at equal intervals.

Preferably, the adsorption fixing mechanism comprises an outer frame, a miniature air pump, an air suction pipe, a connecting pipe and an adsorption groove, the miniature air pump is installed on two sides of the outer frame, the air suction pipe is connected to the inner side, close to the outer frame, of the miniature air pump, the connecting pipe is fixed above the air suction pipe, and the adsorption groove is formed in the upper side of the connecting pipe.

Preferably, the adsorption tanks are equidistantly arranged on the upper side of the outer frame, and the adsorption tanks are communicated with the interior of the miniature air pump through connecting pipes and air suction pipes.

Preferably, cutting mechanism is including electric telescopic handle, lifter plate, laser cutting head, nozzle, holding ring, locating lever, first slider and first spout, electric telescopic handle's below is fixed with the lifter plate, the laser cutting head is installed to the downside of lifter plate, and the bottom of laser cutting head is fixed with the nozzle, the holding ring is installed in the outside of laser cutting head, and the both ends of holding ring are connected with the locating lever, the end of locating lever is fixed with first slider, the inner wall inboard of fixed even board is provided with first spout.

Preferably, the laser cutting head passes through electric telescopic handle and constitutes elevation structure, and the holding ring in the laser cutting head outside and locating lever constitute sliding construction through between first slider and the first spout.

Preferably, grinding machanism is including sliding seat, second slider, second spout, rotating electrical machines, rotation axis, the district of polishing, first polishing district and second polishing district, one side that the sliding seat is close to fixed even board is fixed with the second slider, and the outer wall inboard of fixed even board is provided with the second spout, rotating electrical machines is installed to outside one side of sliding seat, and rotating electrical machines's the outside is provided with the rotation axis, the polishing dish is installed in the outside of rotation axis, and the outer lane of polishing dish has first polishing district and second to polish the district by outer to interior distribution in proper order, the hydraulic stem is installed to the upside of rotating electrical machines, and the hydraulic stem is fixed in the top outside of fixed even board.

Preferably, the polishing disc forms a rotating structure through a rotating motor and a rotating shaft, and the rotating motor and the movable seat form a sliding structure through the second sliding block and the second sliding groove.

The invention provides a conveniently-adjusted cutting and polishing integrated device for processing a computer chip, which has the following beneficial effects:

1. according to the invention, the positioning frame of the positioning mechanism can be conveniently lifted and adjusted through the electric push rod, so that the positioning frame can be positioned at the outer side above the chip main body, two symmetrical positioning plates are used for conveniently positioning two sides of the chip main body, the position of the positioning plate is conveniently adjusted in a telescopic manner through the micro telescopic rod, so that the rubber pads at the inner sides of the positioning plates can be tightly attached to the outer side surface of the chip main body, and the upper side plate can elastically fix the upper side surface of the chip main body through the arrangement of the spring.

2. According to the invention, the micro air pump can be connected with the adsorption groove through the air suction pipe and the connecting pipe, so that negative pressure is generated in the adsorption groove, and the adsorption groove arranged at equal intervals is convenient for adsorbing and fixing the lower side surface of the chip main body, thereby avoiding the situation that the chip main body moves in the processing process.

3. The laser cutting head lifting device is convenient for lifting and adjusting the position height of the laser cutting head through the electric telescopic rod, the use is more flexible, the positioning ring is fixed on the outer side of the laser cutting head, and the positioning ring and the positioning rod slide up and down on the inner side of the fixed connecting plate through the mutual matching between the first sliding block and the first sliding chute, so that the lifting of the laser cutting head is more stable.

4. The chip grinding machine is convenient to drive the grinding disc to rotate through the rotating motor and the rotating shaft, so that the first grinding area and the second grinding area on the outer side of the grinding disc can grind the cutting position of the chip main body, the rotating motor and the movable seat are convenient to slide up and down on the outer side of the fixed connecting plate through the mutual matching between the second sliding block and the second sliding groove, and the rotating motor and the movable seat can lift more stably.

5. According to the invention, the linear motor moves in the motor mounting seat to drive the cutting mechanism to perform displacement cutting, and the side sliding block and the side sliding groove are matched with each other to move and adjust the position of the mounting frame, so that the mounting frame, the electric push rod and the positioning mechanism on the lower side of the mounting frame can be moved, and the positioning mechanism can drive the chip main body to move and display the cutting position.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1 according to the present invention;

FIG. 3 is a schematic side view of the present invention;

FIG. 4 is a schematic diagram of a chip main body structure according to the present invention;

FIG. 5 is an enlarged view of the cutting mechanism of the present invention;

FIG. 6 is an enlarged view of the structure of FIG. 5B according to the present invention;

fig. 7 is a side view of the polishing disc of the present invention in an enlarged configuration.

In the figure: 1. a body; 2. a work table; 3. a cutting seat; 4. a back plate; 5. a protective cover; 6. a mounting frame; 7. a side slider; 8. a side chute; 9. an electric push rod; 10. a positioning mechanism; 1001. a positioning frame; 1002. a miniature telescopic rod; 1003. positioning a plate; 1004. a rubber pad; 1005. a spring; 1006. an upper side plate; 1007. an anti-slip layer; 11. an adsorption fixing mechanism; 1101. an outer frame; 1102. a micro air pump; 1103. an air intake duct; 1104. a connecting pipe; 1105. an adsorption tank; 12. a chip body; 13. a top plate; 14. a motor mounting seat; 15. a linear motor; 16. connecting blocks; 17. fixing the connecting plate; 18. a cutting mechanism; 1801. an electric telescopic rod; 1802. a lifting plate; 1803. a laser cutting head; 1804. a nozzle; 1805. a positioning ring; 1806. positioning a rod; 1807. a first slider; 1808. a first chute; 19. a polishing mechanism; 1901. a movable seat; 1902. a second slider; 1903. a second chute; 1904. a rotating electric machine; 1905. a rotating shaft; 1906. grinding disc; 1907. a first polishing zone; 1908. a second polishing area; 1909. a hydraulic rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus are not to be construed as limiting the present invention, and furthermore, the terms "first", "second", "third", and the like are only used for descriptive purposes and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate, and those skilled in the art will understand the specific meaning of the above terms in the present invention in specific situations.

Referring to fig. 1-7, the present invention provides a technical solution: the utility model provides a computer chip processing is with integration equipment of cutting of being convenient for adjust, includes organism 1, workstation 2, cutting seat 3, back plate 4, protection casing 5, mounting bracket 6, side slider 7, side spout 8, electric putter 9, positioning mechanism 10, locating frame 1001, miniature telescopic link 1002, locating plate 1003, rubber pad 1004, spring 1005, last side plate 1006, skid resistant course 1007, adsorb fixed establishment 11, outer frame 1101, miniature air pump 1102, breathing pipe 1103, connecting pipe 1104, adsorption tank 1105, chip main body 12, roof 13, motor mount 14, linear electric motor 15, connecting block 16, fixed even board 17, cutting mechanism 18, electric telescopic link 1801, lifter plate 1802, laser cutting head 1803, nozzle 1804, locating ring 1805, locating lever 1806, first slider 1807, first spout 1808, grinding mechanism 19, sliding seat 1901, second slider 1902, second spout 1903, rotating electric motor 1904, rotation axis 1905, the dish 1906 of polishing, first region 1907 of polishing, second region 1908 and hydraulic stem 1909 of polishing, organism 1's top is fixed with workstation 2, and workstation 2's top is fixed with cutting seat 3, back plate 4 is installed to cutting seat 3's top rear side, and the top both sides of cutting seat 3 are fixed with protection casing 5, top between protection casing 5 is provided with mounting bracket 6, and the both ends of mounting bracket 6 are fixed with side slider 7, the top inboard of protection casing 5 is provided with side spout 8, electric putter 9 is installed to the below of mounting bracket 6, and electric putter 9's downside is fixed with positioning mechanism 10.

The positioning mechanism 10 comprises a positioning frame 1001, a micro telescopic rod 1002, positioning plates 1003, rubber pads 1004, springs 1005, an upper side plate 1006 and anti-slip layers 1007, wherein the micro telescopic rod 1002 is installed on the inner sides of two side walls of the positioning frame 1001, the positioning plates 1003 are fixed at the top ends of the micro telescopic rods 1002, the rubber pads 1004 are glued on the inner side surfaces of the positioning plates 1003, the springs 1005 are fixed below the middle parts of the positioning frame 1001, the upper side plate 1006 is installed below the springs 1005, the anti-slip layers 1007 are glued on the lower side surfaces of the upper side plates 1006, the positioning plates 1003 are symmetrical with respect to the vertical center line of the positioning frame 1001, the positioning plates 1003 form a telescopic structure through the micro telescopic rods 1002 and the positioning frame 1001, the springs are arranged at equal intervals between the positioning frame 1001 and the upper side plate 1006, the two symmetrical positioning plates 1003 are convenient for positioning two sides of the chip main body 12, and the positions of the positioning plates 1003 are convenient for telescopic adjustment through the micro telescopic rods 1002, the rubber pad 1004 inside the positioning plate 1003 can be closely attached to the outer side surface of the chip body 12, and the upper plate 1006 can elastically fix the upper side surface of the chip body 12 by the spring 1005.

The adsorption fixing mechanism 11 is arranged above the cutting seat 3, the chip main body 12 is arranged on the upper side of the adsorption fixing mechanism 11, the adsorption fixing mechanism 11 comprises an outer frame 1101, a micro air pump 1102, an air suction pipe 1103, a connecting pipe 1104 and an adsorption groove 1105, the micro air pump 1102 is arranged on two sides of the outer frame 1101, and the inner side of the micro air pump 1102 close to the outer frame 1101 is connected with an air suction pipe 1103, a connection pipe 1104 is fixed above the air suction pipe 1103, and suction grooves 1105 are formed on the upper side of the connection pipe 1104, the suction grooves 1105 are equidistantly formed on the upper side of the outer frame 1101, and the suction groove 1105 communicates with the inside of the micro air pump 1102 through the connection pipe 1104 and the suction pipe 1103, the micro air pump 1102 can be connected with the suction groove 1105 through the suction pipe 1103 and the connection pipe 1104 to generate a negative pressure inside the suction groove 1105, the suction grooves 1105 are formed at equal intervals to facilitate suction fixing of the lower side surface of the chip body 12.

A top plate 13 is fixed above the rear plate 4, a motor mounting seat 14 is installed below the middle part of the top plate 13, a linear motor 15 is installed below the inner side of the motor mounting seat 14, a connecting block 16 is fixed below the linear motor 15, fixed connecting plates 17 are fixed on two sides of the connecting block 16, a cutting mechanism 18 is installed below the connecting block 16, the cutting mechanism 18 comprises an electric telescopic rod 1801, a lifting plate 1802, a laser cutting head 1803, a nozzle 1804, a positioning ring 1805, a positioning rod 1806, a first slider 1807 and a first sliding groove 1808, the lifting plate 1802 is fixed below the electric telescopic rod 1801, the laser cutting head 1803 is installed below the lifting plate 1802, the nozzle 1804 is fixed at the bottom of the laser cutting head 1803, the positioning ring 1805 is installed on the outer side of the laser cutting head 1803, the positioning rod 1806 is connected with two ends of the positioning ring 1805, the first slider 1807 is fixed at the tail end of the positioning rod 1806, the first sliding groove 1808 is arranged on the inner side of the inner wall of the fixed connecting plate 17, laser cutting head 1803 constitutes liftable structure through electric telescopic handle 1801, and holding ring 1805 and locating lever 1806 in the laser cutting head 1803 outside constitute sliding construction through between first slider 1807 and the first spout 1808, be convenient for lift adjustment laser cutting head 1803's position height through electric telescopic handle 1801, it is more nimble to use, holding ring 1805 is fixed in the outside of laser cutting head 1803, holding ring 1805 and locating lever 1806 slide from top to bottom at the inboard of fixed even board 17 through the mutually supporting between first slider 1807 and the first spout 1808, make laser cutting head 1803's lift more steady.

The grinding mechanism 19 is installed at the lower outer side of the fixed connecting plate 17, the grinding mechanism 19 comprises a movable seat 1901, a second slider 1902, a second chute 1903, a rotating motor 1904, a rotating shaft 1905, a grinding disc 1906, a first grinding area 1907 and a second grinding area 1908, one side of the movable seat 1901, which is close to the fixed connecting plate 17, is fixed with the second slider 1902, the inner side of the outer wall of the fixed connecting plate 17 is provided with the second chute 1903, one side of the outside of the movable seat 1901 is provided with the rotating motor 1904, the outer side of the rotating motor 1904 is provided with the rotating shaft 1905, the outer side of the rotating shaft 1905 is provided with the grinding disc 1906, the outer ring of the grinding disc 1906 is sequentially provided with the first grinding area 1907 and the second grinding area 1908 from outside to inside, the upper side of the rotating motor 1904 is provided with a hydraulic rod 1909, the hydraulic rod 1909 is fixed at the upper outer side of the fixed connecting plate 17, the grinding disc 1906 forms a rotating structure by the rotating motor 1904 and the rotating shaft 1905, and the rotating motor 1904 forms a sliding structure by Construct, be convenient for drive the rotation of the dish 1906 of polishing through rotating electrical machines 1904 and rotation axis 1905, make the first district 1907 and the second of polishing in the dish 1906 outside of polishing polish and polish the district 1908 and can polish the cutting position of chip main part 12, rotating electrical machines 1904 with through the movable seat 1901 through the second slider 1902 with the second spout 1903 between mutually support be convenient for slide from top to bottom in the outside of fixed even board 17, make rotating electrical machines 1904 and through the lift of movable seat 1901 more steady.

In summary, when the cutting and polishing integrated device for processing a computer chip is used, firstly, the chip main body 12 can be placed on the upper side of the outer frame 1101 of the adsorption fixing mechanism 11, then the micro air pump 1102 can be started, the micro air pump 1102 is connected with the adsorption groove 1105 through the air suction pipe 1103 and the connecting pipe 1104, so that negative pressure is generated inside the adsorption groove 1105, the lower side surface of the chip main body 12 is adsorbed and fixed through the adsorption grooves 1105 arranged at equal intervals, then the positioning frame 1001 of the positioning mechanism 10 can be lowered through the electric push rod 9, so that the positioning frame is positioned on the outer side 1001 above the chip main body 12, and finally, the position of the positioning plate 1003 can be conveniently adjusted in a telescopic manner through the micro telescopic rod 1002, so that the rubber pads 1004 on the inner side of the positioning plate 1003 can be tightly attached to the outer side surface of the chip main body 12, and thus two sets of symmetrical positioning plates 1003 can position two sides of the chip main body 12, at the same time, the spring 1005 is provided so that the upper plate 1006 can elastically fix the upper surface of the chip body 12.

After finishing fixing, the position height of the laser cutting head 1803 can be adjusted through the lifting of the electric telescopic rod 1801, in the process, the positioning ring 1805 is fixed at the outer side of the laser cutting head 1803, the positioning ring 1805 and the positioning rod 1806 slide up and down at the inner side of the fixed connecting plate 17 through the mutual matching between the first sliding block 1807 and the first sliding groove 1808, so that the lifting of the laser cutting head 1803 is more stable, then the laser cutting can be carried out on the chip main body 12 through the nozzle 1804 of the laser cutting head 1803, and the displacement cutting of the cutting mechanism 18 can be driven by the linear motor 15 in the internal moving of the motor mounting seat 14 in the cutting process.

After the cutting is finished, the mounting frame 6 can be moved to two sides through the mutual matching of the side sliding block 7 and the side sliding groove 8, so as to move the mounting frame 6 and the electric push rod 9 and the positioning mechanism 10 on the lower side thereof, so that the positioning mechanism 10 drives the chip main body 12 to move and display the cutting position, the lowering of the movable holder 1901 and the rotating electric machine 1904 can then be pushed by the hydraulic rod 1909, and, in the process, the rotating motor 1904 and the movable seat 1901 are convenient to slide up and down on the outer side of the fixed connecting plate 17 through the mutual matching between the second slider 1902 and the second sliding slot 1903, so that the lifting of the rotating motor 1904 and the movable seat 1901 is more stable, the sanding disc 1906 may then be rotated by a rotary motor 1904 and a rotary shaft 1905, the first grinding area 1907 and the second grinding area 1908 outside the grinding disc 1906 can grind the cutting position of the chip main body 12, so that the whole computer chip processing is completed by the use of the cutting and grinding integrated equipment convenient to adjust.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.

Claims (9)

1. The utility model provides a computer chip processing is with cutting integration equipment of polishing convenient to adjust, includes organism (1), adsorbs fixed establishment (11), cutting mechanism (18) and grinding machanism (19), its characterized in that: the machine body is characterized in that a workbench (2) is fixed above the machine body (1), a cutting seat (3) is fixed above the workbench (2), a rear plate (4) is installed on the rear side of the upper portion of the cutting seat (3), protective covers (5) are fixed on two sides of the upper portion of the cutting seat (3), a mounting frame (6) is arranged above the protective covers (5), side sliding blocks (7) are fixed at two ends of the mounting frame (6), a side sliding groove (8) is arranged on the inner side of the upper portion of the protective cover (5), an electric push rod (9) is installed below the mounting frame (6), a positioning mechanism (10) is fixed on the lower side of the electric push rod (9), an adsorption fixing mechanism (11) is arranged above the cutting seat (3), a chip main body (12) is arranged on the upper side of the adsorption fixing mechanism (11), a top plate (13) is fixed above the rear plate (4), motor mount pad (14) are installed to the middle part below of roof (13), and install linear electric motor (15) to the inboard below of motor mount pad (14), the below of linear electric motor (15) is fixed with connecting block (16), and the both sides of connecting block (16) are fixed with fixed board (17) even, cutting mechanism (18) are installed in the below of connecting block (16), grinding machanism (19) are installed in the fixed below outside of even board (17).

2. The cutting and grinding integrated device convenient to adjust for computer chip processing according to claim 1, characterized in that: positioning mechanism (10) is including locating frame (1001), miniature telescopic link (1002), locating plate (1003), rubber pad (1004), spring (1005), go up curb plate (1006) and skid resistant course (1007), miniature telescopic link (1002) are installed to the both sides inboard of locating frame (1001), and the top of miniature telescopic link (1002) is fixed with locating plate (1003), the inboard side veneer of locating plate (1003) has glued joint rubber pad (1004), the middle part below of locating frame (1001) is fixed with spring (1005), and installs curb plate (1006) in the below of spring (1005), the downside veneer of curb plate (1006) has glued joint skid resistant course (1007).

3. The cutting and grinding integrated device convenient to adjust for computer chip processing according to claim 2, characterized in that: the positioning plates (1003) are symmetrical about a vertical center line of the positioning frame (1001), the positioning plates (1003) form a telescopic structure through the miniature telescopic rods (1002) and the positioning frame (1001), and springs (1005) are arranged between the positioning frame (1001) and the upper side plate (1006) at equal intervals.

4. The cutting and grinding integrated device convenient to adjust for computer chip processing according to claim 1, characterized in that: adsorb fixed establishment (11) including outer frame (1101), miniature air pump (1102), breathing pipe (1103), connecting pipe (1104) and adsorption tank (1105), miniature air pump (1102) are installed to the both sides of outer frame (1101), and the inboard that miniature air pump (1102) are close to outer frame (1101) is connected with breathing pipe (1103), the top of breathing pipe (1103) is fixed with connecting pipe (1104), and the upside of connecting pipe (1104) is provided with adsorption tank (1105).

5. The cutting and grinding integrated device convenient to adjust for computer chip processing according to claim 4, wherein: the adsorption tanks (1105) are equidistantly arranged on the upper side of the outer frame (1101), and the adsorption tanks (1105) are communicated with the interior of the micro air pump (1102) through the connecting pipe (1104) and the air suction pipe (1103).

6. The cutting and grinding integrated device convenient to adjust for computer chip processing according to claim 1, characterized in that: cutting mechanism (18) are including electric telescopic handle (1801), lifter plate (1802), laser cutting head (1803), nozzle (1804), holding ring (1805), locating lever (1806), first slider (1807) and first spout (1808), the below of electric telescopic handle (1801) is fixed with lifter plate (1802), laser cutting head (1803) are installed to the downside of lifter plate (1802), and the bottom of laser cutting head (1803) is fixed with nozzle (1804), holding ring (1805) are installed in the outside of laser cutting head (1803), and the both ends of holding ring (1805) are connected with locating lever (1806), the end of locating lever (1806) is fixed with first slider (1807), the inner wall inboard of fixed even board (17) is provided with first spout (1808).

7. The cutting and grinding integrated device convenient to adjust for computer chip processing according to claim 6, wherein: the laser cutting head (1803) forms a lifting structure through an electric telescopic rod (1801), and a positioning ring (1805) and a positioning rod (1806) on the outer side of the laser cutting head (1803) form a sliding structure between a first sliding block (1807) and a first sliding groove (1808).

8. The cutting and grinding integrated device convenient to adjust for computer chip processing according to claim 1, characterized in that: the grinding mechanism (19) comprises a movable seat (1901), a second slide block (1902), a second chute (1903), a rotating motor (1904), a rotating shaft (1905), a grinding disc (1906), a first grinding area (1907) and a second grinding area (1908), a second sliding block (1902) is fixed on one side of the movable seat (1901) close to the fixed connecting plate (17), a second chute (1903) is arranged on the inner side of the outer wall of the fixed connecting plate (17), a rotating motor (1904) is arranged on one side of the outer part of the movable seat (1901), a rotating shaft (1905) is arranged outside the rotating motor (1904), a polishing disc (1906) is arranged outside the rotating shaft (1905), and a first polishing area (1907) and a second polishing area (1908) are sequentially distributed on the outer ring of the polishing disc (1906) from outside to inside, a hydraulic rod (1909) is mounted on the upper side of the rotating motor (1904), and the hydraulic rod (1909) is fixed to the upper outer side of the fixed connecting plate (17).

9. The cutting and grinding integrated device convenient to adjust for computer chip processing according to claim 8, wherein: the polishing disc (1906) forms a rotating structure through a rotating motor (1904) and a rotating shaft (1905), and the rotating motor (1904) and a movable seat (1901) form a sliding structure through a second sliding block (1902) and a second sliding groove (1903).

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