CN214046196U - Novel circuit board printing ink structure of windowing - Google Patents
Novel circuit board printing ink structure of windowing Download PDFInfo
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- CN214046196U CN214046196U CN202022806153.9U CN202022806153U CN214046196U CN 214046196 U CN214046196 U CN 214046196U CN 202022806153 U CN202022806153 U CN 202022806153U CN 214046196 U CN214046196 U CN 214046196U
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Abstract
The utility model discloses a novel circuit board printing ink windowing structure, which relates to the technical field of printed circuit boards, and comprises a circuit board substrate and a lamp bead bonding pad arranged on the circuit board substrate, wherein the lamp bead bonding pad comprises a substrate layer, an upper connecting layer and a lower connecting layer, the substrate layer is bonded between the upper connecting layer and the lower connecting layer, and the substrate layer is coated with black matte printing ink; two the interval D of lamp pearl pad is less than or equal to 0.075mm, and two it hinders the welding bridge to remain black between the lamp pearl pad. The utility model discloses a hinder the technological preparation flow of processing-printing ink infiltration-toasting-polishing before welding, the structure of windowing that the method that uses ceramic polishing technique to get rid of printed circuit board pad surface printing ink formed can realize that finished product circuit pad interval is less than or equal to 0.075mm hinders bridge preparation ability, has guaranteed that the printing ink bridge does not have the undercut between the pad simultaneously, does not have the crackle cavity.
Description
Technical Field
The utility model relates to a printed circuit board technical field, concretely relates to novel circuit board printing ink structure of windowing.
Background
The solder mask is the part of the printed circuit board which needs the green oil, and the main function of the solder mask is to protect the surface conductor from being exposed in the air to cause oxidation and scratch, and prevent the short circuit caused by tin connection when the solder paste is used for printing a pad, and the solder bridge is the green oil between one window and the other window of the element, namely the solder bridge, and mainly prevents the short circuit risk caused by the flowing of the adjacent IC tin.
For PCB (printed circuit board) factories, the manufacturing capability of the solder mask bridge is to control the ink side etching amount, the manufacturing difficulty and capability requirement of different ink colors are different, the black matte ink side etching amount with the greatest difficulty is obtained, the best parameter of the current industry control is less than 0.04mm, and the finished circuit pad distance at least needs 0.2 mm. And the booth apart from LED lamp pearl circuit board, circuit pad finished product interval is only 0.075 mm. Therefore, the ink bridge between the bonding pads cannot be ensured by using the traditional manufacturing process flow.
SUMMERY OF THE UTILITY MODEL
For solving the prior art problem, the utility model discloses specifically adopt following technical scheme:
a novel circuit board ink windowing structure comprises a circuit board substrate and a lamp bead pad arranged on the circuit board substrate;
the lamp bead bonding pad comprises a substrate layer, an upper connecting layer and a lower connecting layer, the substrate layer is bonded between the upper connecting layer and the lower connecting layer, and the substrate layer is coated with black matte ink;
two the interval D of lamp pearl pad is less than or equal to 0.075mm, and two it hinders the welding bridge to remain black between the lamp pearl pad.
The further scheme is that the distance between the black solder bridge and the two bead pads is equal.
The further proposal is that the recess of the bead pad on the surface of the circuit board substrate is less than or equal to 10 um.
According to a further scheme, the lamp bead welding pad further comprises a heat insulation layer, and the heat insulation layer is wrapped on the middle of the outer surface of the upper connecting layer and the middle of the outer surface of the lower connecting layer.
Further, the heat insulation layer is filled with heat insulation resin.
The utility model has the advantages that:
the utility model discloses a process manufacturing flow of resistance welding pretreatment-ink infiltration-baking-polishing, the windowing structure formed by the method of using the ceramic polishing technology to remove the ink on the surface of the pad of the printed circuit board can realize the resistance welding bridge manufacturing capacity that the distance between the pads of the finished circuit is less than or equal to 0.075mm, and simultaneously ensures that the ink bridge between the pads has no side etching and no crack cavity;
through setting up the insulating layer can effectively isolated heat, avoid the circuit board substrate to lead to the pad to drop owing to the expansion of being heated.
Drawings
Fig. 1 is a schematic view of a novel circuit board ink windowing structure according to an embodiment of the present invention;
fig. 2 is a flowchart of a windowing method for a novel circuit board ink windowing structure according to an embodiment of the present invention;
the attached drawings are marked as follows: 1-lamp bead welding plate; 10-a substrate layer; 11-upper tie layer; 12-a lower tie layer; 13-a thermally insulating layer; 2-circuit board substrate.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1, one embodiment of the present invention discloses a novel circuit board ink windowing structure, which comprises a circuit board substrate 2 and a lamp bead pad 1 disposed on the circuit board substrate 2;
the lamp bead bonding pad 1 comprises a substrate layer 10, an upper connecting layer 11 and a lower connecting layer 12, wherein the substrate layer 10 is bonded between the upper connecting layer 11 and the lower connecting layer 12, and the substrate layer 10 is coated with black matte ink;
the distance D between the two lamp bead bonding pads 1 is less than or equal to 0.075mm, and a black solder bridge is reserved between the two lamp bead bonding pads 1.
In this embodiment, the interval of black solder mask bridge is equal to the interval of two lamp pearl pads 1.
In this embodiment, the recess of the bead pad 1 on the surface of the circuit board substrate 2 is less than or equal to 10 um.
In this embodiment, lamp pearl pad 1 is still including insulating layer 13, and insulating layer 13 has all been wrapped up in the middle of upper connecting layer 11 and lower connecting layer 12 surface. Through setting up the insulating layer can effectively isolated heat, avoid the circuit board substrate to lead to the pad to drop owing to the expansion of being heated.
In the present embodiment, the heat insulating layer 13 is filled with a heat insulating resin. The heat insulation performance of the heat insulation layer is improved by utilizing the good heat insulation performance of the heat insulation resin.
As shown in fig. 2, the utility model also provides a novel circuit board printing ink windowing structure based on the above-mentioned embodiment discloses a novel circuit board printing ink windowing method, includes following steps:
s1: resistance welding pretreatment: enabling the lamp surface of the circuit substrate to face downwards, and feeding the circuit substrate along the length direction, and grinding the circuit substrate by using volcanic ash, wherein the grinding parameter is 2.5 m/min; controlling the grinding mark to be 6 mm; spraying pressure is 1.2/bar, pollutants on the board surface and copper surface oxidation are removed, and the copper surface is roughened synchronously to enhance the ink binding force;
s2: soaking with ink: respectively soaking the two sides of the substrate with ink to finish ink printing;
s3: baking: baking the substrate surface which is well soaked by the ink on the two sides respectively to realize the solidification of the ink;
s4: polishing: and (3) confirming the ink thickness of the two sides of the substrate, respectively polishing the two sides of the substrate once along the length direction of the substrate by adopting two groups of 600-mesh ceramic brush wheels, two groups of 800-mesh thermosetting resin foamed non-woven fabric brush rolls and a group of 1200-mesh non-woven fabric brush rolls, and confirming the polished ink cracks and the polished expansion and contraction value after polishing.
In S1, the volcanic ash is adopted to carry out acid washing and overflow water washing on the substrate before the substrate is ground, the substrate is carried out high-pressure and ultrasonic water washing after the substrate is ground, and the substrate is dried after the water washing is finished.
And in the step S2, after the ink is completely soaked on one surface of the substrate, pre-baking the surface.
In S2, it was confirmed that the difference in ink thickness between both sides of the substrate was controlled to be 8 μm to 15 μm after both sides of the substrate were each wetted with the ink.
In S2, the two sides of the substrate are respectively soaked with ink, so that the blank paper is placed on the bottom surface of the automatic single-sided printing machine, the substrate is placed above the blank paper, and the blank paper is replaced after each printing is completed.
In S3, the substrate surface that has been wetted with the ink is baked three times, and the baking time and the baking temperature for each time are respectively: baking at 78-82 deg.C for 28-31 min, baking at 120-122 deg.C for 27-32 min, and baking at 150-155 deg.C for 80-90 min.
In the S4, two groups of 600-mesh ceramic brush wheels and two groups of 800-mesh thermosetting resin foamed non-woven fabric brush rolls are additionally provided with a high-pressure spraying and washing mechanism which is arranged 45 degrees above the ceramic brush wheels.
The grinding cutting amount in the grinding processing in the S4 is controlled not to exceed 7um plus or minus 2um each time; the width of a grinding trace of the 600-mesh ceramic brush wheel is 3mm +/-1 mm; the width of the mark of the 800-mesh thermosetting resin foamed non-woven fabric is 6mm +/-0.5 mm.
And after the polishing process in the S4, the depression of the pad on the surface of the substrate is less than or equal to 10 um.
The detailed implementation process comprises the following steps:
resistance welding pretreatment: enabling the lamp surface of the circuit substrate to face downwards, feeding the circuit substrate along the length direction, carrying out acid washing and overflow water washing on the circuit substrate, and grinding the circuit substrate by using volcanic ash, wherein the grinding parameter is 2.5 m/min; controlling the grinding mark to be 6 mm; spraying pressure is 1.2/bar, pollutants on the board surface and copper surface oxidation are removed, and the copper surface is roughened synchronously to enhance the ink binding force; and (4) carrying out high-pressure and ultrasonic washing on the substrate after the plate is ground, and drying the substrate after the washing is finished.
Soaking with ink: the ink soaking process comprises the following steps: soaking the surface A of the substrate with ink, pre-baking, and soaking the surface B of the substrate with ink; the specific operation process comprises the following steps:
the method comprises the steps of measuring the copper thickness of a substrate to be 33-36 um at an early stage, adjusting the viscosity of ink according to the copper plating thickness, controlling the oil-water ratio to be 80dpa.s, selecting black matte ink, selecting an automatic single-sided printing machine by the machine, and using 38T printing screen.
White paper is padded on the bottom surface of the machine table, a base plate is arranged above the white paper, a 38T lower oil screen plate is used on the base plate, and the angle of a scraper is synchronously adjusted by 70 degrees; printing ink pressure 1.8kg/cm2(ii) a The printing speed was 180 mm/sec.
After printing the surface A, whether the ink completely fills the etched gaps between the lines needs to be confirmed, the thickness of the surface oil is not controlled, and the red phenomenon of the wires and the large copper surface is allowed.
And vertically placing the printed A-surface substrate in an iron frame, and pre-baking after all the substrates are coplanar.
And the pre-baking temperature is 75 ℃, the baking time is 25 minutes, and the pre-baking is to solidify the printing ink on the A surface.
The A face base plate that will solidify in advance uses the printing ink infiltration parameter of last step, carries out printing ink printing to the B face, confirms in step that the range of B face printing ink thickness and A face printing ink thickness is controlled between 8-15um, and A, B face printing ink thickness range is the utility model discloses polish the first guarantee parameter of windowing. Meanwhile, white paper padded on the table top of the printing machine is replaced every pnl, so that the purpose of ensuring the cleanness of the plate surface and the uniform thickness of the A, B surface of the printing ink is achieved.
And vertically placing the substrate with the printed B surface in an iron frame, so that the ink is conveniently cured.
Baking: and an ink curing link, which aims to bake and cure the ink on the surface of the substrate soaked with the A, B double-sided ink, wherein the baking is carried out in three sections, and the baking time and the baking temperature of each section are respectively as follows: baking at 78-82 deg.C for 28-31 min, baking at 120-122 deg.C for 27-32 min, and baking at 150-155 deg.C for 80-90 min. 80 ℃/30min, 120 ℃/30min, 150 ℃/80 min.
Polishing: arranging the A, B-surface ink baking solidified substrates in the same direction in the last step, and using an automatic plate collecting and releasing manipulator, wherein the plate collecting and releasing direction is unified into a long-direction plate feeding direction, the A surface is upward, and the point is that the substrates are prevented from shifting and expanding in the irregular direction in the polishing process; meanwhile, the grinding frequency is controlled, the grinding frequency of A, B two surfaces is not more than one time, and the grinding effect is realized by adjusting the grinding parameters.
Selecting two groups of 600-mesh ceramic brush wheels, two groups of 800-mesh thermosetting resin foamed non-woven fabric brush rollers and one group of 1200-mesh non-woven fabric brush rollers;
confirming A, B the thickness of the ink on both sides and adjusting the polishing parameters, confirming that the thickness of the ink on both sides is between 15um and 21um by the ink immersion slice in the previous step, wherein the polishing parameters are as follows:
two groups of 600-mesh ceramic brush wheels: the current is 2.0A, and the speed is 2.0 m/min;
two sets of 800 mesh thermosetting resin foamed nonwoven fabrics: the current is 1.5A, and the speed is 1.8 m/min;
a group of 1200 mesh nonwoven brush rolls: the current is 1.5A, and the speed is 1.5 m/min;
the polishing parameters can be finely adjusted according to the thickness of the ink, but the whole control method is consistent. Meanwhile, after polishing, the first piece confirms whether the printing ink on the bonding pad is completely removed, and the polishing cutting amount is controlled to be not more than 7um plus or minus 2um each time; the width of a grinding trace of the 600-mesh ceramic brush wheel is 3mm +/-1 mm; the width of the mark of the 800-mesh thermosetting resin foamed non-woven fabric is 6mm plus or minus 0.5 mm; the grinding times are A, B, and the grinding directions are all long-direction plate feeding.
The 1200-mesh non-woven fabric brush roller mainly aims at polishing and finely grinding the surface of the welding disc, ensuring that the depression of the welding disc is less than 10 mu m, and meanwhile, adjusting polishing parameters according to surface dents.
Two groups of 600-mesh ceramic brush wheels and two groups of 800-mesh thermosetting resin foamed non-woven fabric polishing sections are additionally provided with high-pressure washing sections, the high-pressure washing sections are sprayed 45 degrees obliquely above the ceramic brush wheels, the main purpose is to clean and remove polished copper powder and printing ink, meanwhile, ultrasonic immersion washing sections are additionally arranged behind the washing sections, and the board surface is further cleaned.
The first piece confirms that the back printing ink crackle of polishing, and the production of polishing crackle is mainly in the adjustment of printing lower sword angle and pressure of printing ink infiltration stage, sets up the baking parameter according to the printing ink characteristic simultaneously, and the electric current of polishing link sets up three aspects and carries out the management and control adjustment finally. And finally, confirming the expansion and contraction value after polishing, wherein the process is applied to an LED lamp bead circuit board, each pcs substrate is internally composed of tens of thousands of small lamp beads, and a client binds the solid crystal lamp beads according to the coordinates of each lamp bead during assembly, so that the expansion and contraction of the substrate mainly controls the offset of each pcs positioning point, and the control parameter is less than 25 um.
Controlling the expansion and contraction change value of the polished substrate through the step; polishing parameters are controlled, no printing ink residue is left on the bonding pad, and meanwhile, the polishing cutting amount needs to be controlled, so that the lead is prevented from being polished off; the polished ink bridge between the bonding pads has no holes, the ink has no cracks, the ink filling between the bonding pads is full, and the polished substrate surface has no copper powder residue; the depression of the bonding pad is less than or equal to 10um after polishing;
the utility model discloses a "hinder and weld the processing-printing ink and soak-toast-the process preparation flow who polishes", use the ceramic technique of polishing to get rid of the method of printing ink on printed circuit board pad surface. The solder bridge manufacturing capacity of the finished product circuit solder pad space not more than 0.075mm can be realized, and no side etching and no crack cavity of the ink bridge between the solder pads are ensured.
Finally, only the specific embodiments of the present invention have been described in detail. The invention is not limited to the specific embodiments described above. Equivalent modifications and substitutions by those skilled in the art to the present invention are also within the scope of the present invention. Accordingly, variations and modifications in equivalents may be made without departing from the spirit and scope of the invention, which is intended to be covered by the following claims.
Claims (5)
1. The utility model provides a novel circuit board printing ink structure of windowing, includes circuit board base material (2) and sets up lamp pearl pad (1) on the circuit board base material (2), its characterized in that:
the lamp bead bonding pad (1) comprises a substrate layer (10), an upper connecting layer (11) and a lower connecting layer (12), the substrate layer (10) is bonded between the upper connecting layer (11) and the lower connecting layer (12), and the substrate layer (10) is coated with black matte ink;
two the interval D of lamp pearl pad (1) is less than or equal to 0.075mm, and two it hinders the welding bridge to remain black between lamp pearl pad (1).
2. The novel circuit board ink windowing structure according to claim 1, wherein:
the distance between the black solder bridge and the distance between the two bead pads (1) are equal.
3. The novel circuit board ink windowing structure according to claim 1, wherein:
the circuit board substrate (2) surface lamp pearl pad (1) is sunken to be less than or equal to 10 um.
4. The novel circuit board ink windowing structure according to claim 1, wherein:
the lamp bead pad (1) further comprises a heat insulation layer (13), and the heat insulation layer (13) is wrapped in the middle of the outer surface of the upper connecting layer (11) and the outer surface of the lower connecting layer (12).
5. The novel circuit board ink windowing structure according to claim 4, wherein:
the heat insulation layer (13) is filled with heat insulation resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022806153.9U CN214046196U (en) | 2020-11-26 | 2020-11-26 | Novel circuit board printing ink structure of windowing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022806153.9U CN214046196U (en) | 2020-11-26 | 2020-11-26 | Novel circuit board printing ink structure of windowing |
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| Publication Number | Publication Date |
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| CN214046196U true CN214046196U (en) | 2021-08-24 |
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| CN202022806153.9U Active CN214046196U (en) | 2020-11-26 | 2020-11-26 | Novel circuit board printing ink structure of windowing |
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