CN214043693U

CN214043693U - Jig, detection device and laser doping equipment

Info

Publication number: CN214043693U
Application number: CN202022940417.XU
Authority: CN
Inventors: 蔡皓; 陈超; 何江玲; 高云峰
Original assignee: Shenzhen Han's Photovoltaic Equipment Co ltd; Han s Laser Technology Industry Group Co Ltd
Current assignee: Shenzhen Han's Photovoltaic Equipment Co ltd; Han s Laser Technology Industry Group Co Ltd
Priority date: 2020-12-10
Filing date: 2020-12-10
Publication date: 2021-08-24
Anticipated expiration: 2030-12-10

Abstract

The utility model relates to a tool, detection device and laser doping equipment. This tool includes: a support plate in which a vacuum passage is formed; and the transparent cover plate is arranged on the support plate, the cross sectional area of the transparent cover plate is larger than that of the support plate, the transparent cover plate is provided with a plurality of adsorption holes, and the adsorption holes are communicated with the vacuum passage. Above-mentioned tool designs the cross section size of transparent cover plate for being greater than the cross section size of backup pad, can strengthen the suitability of tool for this tool can be applicable to fixed not unidimensional silicon chip. When the size of waiting to process the silicon chip surpassed the backup pad size, the accessible transparent cover plate formed effective support to the silicon chip to transparent cover plate can not shelter from and influence the formation of image to the light formation that the light source sent.

Description

Jig, detection device and laser doping equipment

Technical Field

The utility model relates to a photovoltaic industry silicon chip processing technology field especially relates to a tool, adopts detection device and laser doping equipment of this tool.

Background

The silicon wafer is used as a substrate of a solar cell, and the size of the silicon wafer is gradually transited from 166mm to 180mm and 210mm due to the advantages of large-size silicon wafers in the aspects of saving energy and reducing cost. During the transition period, a silicon wafer manufacturer requires that processing equipment can be compatible with silicon wafers with various sizes ranging from 166mm to 210mm, and the existing jig cannot meet the requirement.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a jig, a detection device and a laser doping apparatus for solving the problem that the existing jig is not compatible with silicon wafers of different sizes.

A jig, comprising:

a support plate in which a vacuum passage is formed; and

the transparent cover plate is arranged on the supporting plate, the cross sectional area of the transparent cover plate is larger than that of the supporting plate, the transparent cover plate is provided with a plurality of adsorption holes, and the adsorption holes are communicated with the vacuum passage.

Above-mentioned tool adds a transparent cover plate in the backup pad top to with the cross section size design of transparent cover plate for being greater than the cross section size of backup pad, can strengthen the suitability of tool, make this tool can be applicable to fixed not unidimensional silicon chip. When the jig is used for fixing the silicon wafer with a smaller size, the edge of the silicon wafer slightly exceeds the support plate for convenient imaging, in other words, the size of the silicon wafer is slightly larger than the support plate. When the size of waiting to process the silicon chip surpassed the support plate size far away, the accessible transparent cover plate formed effective support to the silicon chip, avoided the silicon chip to produce the crackle under self action of gravity. In addition, the transparent cover plate can transmit light, so that the light emitted by the light source is not shielded to influence imaging.

In one embodiment, the vacuum passage includes a first vacuum passage and a second vacuum passage isolated from each other, the second vacuum passage being located at a periphery of the first vacuum passage.

In one embodiment, one side of the transparent cover plate, which is far away from the support plate, is provided with a plurality of adsorption grooves, and the adsorption grooves are communicated with the adsorption holes.

In one embodiment, the surface of the supporting plate facing the transparent cover plate is provided with a plurality of strip-shaped grooves, and the strip-shaped grooves are communicated with the vacuum passage and the adsorption holes.

In one embodiment, the transparent cover plate is provided with a step groove, and the jig further comprises a connecting piece, wherein the connecting piece penetrates through the step groove and is connected to the supporting plate.

In one embodiment, the jig further comprises a gasket, and the gasket is arranged between the connecting piece and the transparent cover plate.

In one embodiment, the jig further comprises an adhesive layer arranged between the transparent cover plate and the support plate.

In one embodiment, the jig further comprises an air valve, the vacuum passage is connected to the vacuum pumping device through a pipeline, and the air valve is arranged on the pipeline and used for controlling the connection or disconnection of the pipeline.

The detection device comprises the jig, a light source and a camera unit, wherein the light source is arranged at the bottom of the supporting plate and used for illuminating a workpiece placed on the transparent cover plate, so that the camera unit can acquire an image of the workpiece.

A laser doping device comprises the detection device.

Drawings

FIG. 1 is a schematic diagram of a detection apparatus according to an embodiment;

FIG. 2 is a schematic structural diagram of a fixture and a carrier in the detecting device shown in FIG. 1;

FIG. 3 is a schematic view of an embodiment of a fixture;

FIG. 4 is an exploded view of the jig shown in FIG. 3;

FIG. 5 is a side view of the supporting plate of the jig shown in FIG. 4;

FIG. 6 is a cross-sectional view of the support plate of FIG. 5 taken along line A-A;

fig. 7 is a top view of the transparent cover plate in the fixture shown in fig. 4.

The following detailed description of the invention will be made in conjunction with the above drawings.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Polycrystalline silicon chips or monocrystalline silicon chips are substrate materials for solar cell production in a photovoltaic industry chain, and rapid development of the photovoltaic industry in recent years greatly promotes rapid development of silicon chip manufacturing technology and equipment. The laser doping technology is adopted to process the silicon wafer to form an SE (Selective Emitter) structure, and the method is an important means for improving the conversion efficiency of the solar cell.

An embodiment of the utility model provides a laser doping equipment for carry out laser doping to the silicon chip and handle.

The laser doping equipment comprises a detection device and a laser doping device. The detection device is used for acquiring an image of a silicon wafer to be processed so as to detect whether defects such as defects, cracks and the like exist at corners of the silicon wafer and measure the size of the silicon wafer. Before the laser doping operation is carried out, whether the corners of the silicon wafer have defects or not is detected, and the silicon wafer with the defects is removed in time, so that the silicon wafer is prevented from flowing into the next production link, and the yield of final products is improved. And transferring the qualified silicon wafer to a laser doping device for laser doping treatment. In addition, the image of the silicon wafer is analyzed and processed by adopting software, so that the size of the silicon wafer can be obtained, and the subsequent processing parameters can be conveniently set.

Referring to fig. 1, the inspection apparatus includes a fixture 100, a light source 300, and a camera unit 400. The light source 300 is disposed below the jig 100, and light emitted from the light source 300 can be emitted to the silicon wafer from the back surface to illuminate the silicon wafer placed on the jig 100, so that the image of the silicon wafer can be obtained by the camera unit 400. The camera unit 400 is located above the jig 100 and can acquire an image of a silicon wafer. It can be understood that the light emitted from the light source 300 can penetrate the edge of the fixture 100 and irradiate the silicon wafer, i.e. illuminate the periphery of the silicon wafer, and since the silicon wafer is opaque, there is a significant boundary between the area shielded by the silicon wafer and the peripheral area, so that the silicon wafer image obtained by the camera unit 400 can clearly display the defects existing at the corners of the silicon wafer.

In some embodiments, referring to fig. 2, the detection apparatus further includes a carrier 200 and a motor (not shown), and the carrier 200 can be driven by the motor to rotate according to the beat. The carrier 200 includes a body 210 and a plurality of support arms 220 disposed on the periphery of the body 210, and each support arm 220 is provided with one fixture 100. Under the drive of the carrier 200, the plurality of jigs 100 can rotate to different stations in sequence, which is beneficial to realizing automation. Set up a plurality of tools 100 for the action of different stations is gone on in step, is favorable to improving production efficiency. For example, the carrier 200 rotates by a certain angle, so that one of the jigs 100 reaches the detection station, the detection device detects the silicon wafer placed on the jig 100, the other jig 100 reaches the doping station, and the laser doping device performs laser doping processing on the silicon wafer qualified through detection, that is, the detection action and the laser doping action can be performed synchronously, thereby saving time.

Referring to fig. 3 and 4, the fixture 100 includes a supporting plate 10 and a transparent cover plate 20. The transparent cover plate 20 is disposed on the support plate 10, and further, the transparent cover plate 20 is stacked on the support plate 10, and the cross-sectional area of the transparent cover plate 20 is larger than that of the support plate 10. It should be noted that the cross section of the transparent cover plate 20 is perpendicular to the thickness direction of the transparent cover plate 20, and similarly, the cross section of the support plate 10 is perpendicular to the thickness direction of the support plate 10.

The support plate 10 is formed with a vacuum passage 11 therein, and the transparent cover plate 20 is formed with a plurality of suction holes 21, the suction holes 21 being communicated with the vacuum passage 11. One end of the vacuum passage 11, which is far away from the adsorption hole 21, is connected to a vacuum pumping device, and when the silicon wafer is placed on the jig 100, the vacuum pumping device is started to pump away air in the vacuum passage 11, so that vacuum is formed in the vacuum passage 11. Because the adsorption holes 21 are communicated with the vacuum passage 11, vacuum is formed in the adsorption holes 21, the gas pressure on the two side surfaces of the silicon wafer corresponding to the adsorption holes 21 is different, wherein the atmospheric pressure on the surface of one side of the silicon wafer, which is far away from the transparent cover plate 20, is higher, and the intuitive expression is that the silicon wafer is firmly adsorbed on the transparent cover plate 20. In general, the fixture 100 functions to fix the silicon wafer and ensure that the position of the silicon wafer does not move during the inspection process and the processing process.

Specifically, referring to fig. 4, 5 and 6, the supporting plate 10 is a flat plate, the vacuum channel 11 includes a vertical portion 111 extending along the thickness direction of the supporting plate 10 and a horizontal portion 112 extending perpendicular to the thickness direction of the supporting plate 10, and the vertical portion 111 is disposed corresponding to the suction hole 21 of the transparent cover plate 20 to communicate the vacuum channel 11 with the suction hole 21. The horizontal portion 112 communicates with the vertical portion 111. Further, the horizontal portion 112 penetrates a side surface of the support plate 10 in a direction parallel to the upper surface of the support plate 10, or penetrates a bottom surface of the support plate 10 in a direction parallel to the thickness direction of the support plate 10, and a gas pipe joint is provided at a penetration B, C so as to be connected to an external vacuum pumping device.

To ensure the structural strength of the fixture 100, the material of the supporting plate 10 is one of aluminum and stainless steel, which is generally opaque. Since the light source 300 is located at the bottom of the support plate 10, the light emitted from the light source 300 is emitted from the support plate 10 to the silicon wafer, and the size of the opaque support plate 10 should be smaller than that of the silicon wafer, i.e. the projection of the silicon wafer on the upper surface of the support plate 10 should exceed the upper surface of the support plate 10 to avoid the support plate 10 blocking the light emitted to the edge of the silicon wafer. Further, the cross sectional dimension that designs transparent cover plate 20 for being greater than the cross sectional dimension of backup pad 10 can strengthen the utility model discloses tool 100's suitability for this tool 100 can be applicable to the great silicon chip of fixed dimension. When the size of the silicon wafer to be processed far exceeds the size of the support plate 10, the silicon wafer can still be effectively supported by the transparent cover plate 20, and the transparent cover plate 20 cannot shield the light emitted by the light source 300 to influence imaging.

To facilitate understanding of the technical solution, the jig 100 suitable for the silicon wafer with the side length of 166 mm-210 mm is taken as an example for description, and it should be understood that the protection scope of the present invention is not limited thereto. The size of the support plate 10 is less than 166mm and the size of the transparent cover plate 20 is slightly less than 210 mm. When a 166 mm-long silicon wafer is placed on the jig 100, the edge of the silicon wafer can be seen to be exposed out of the support plate 10 from the lower side of the jig 100, so that the edge of the silicon wafer can be illuminated by the light source 300 located at the bottom of the jig 100, and the camera unit 400 located above the jig 100 can acquire a clear image of the silicon wafer. The thickness of the silicon wafer is only 0.2 mm or even less than 0.15 mm, and if the silicon wafer cannot provide enough support, the silicon wafer can be cracked under the action of self gravity. When a silicon wafer with the side length of 210mm is placed on the jig 100, the edge of the silicon wafer slightly exceeds the transparent cover plate 20, so that the transparent cover plate 20 is ensured to effectively support the silicon wafer, the whole weight of the jig 100 is not too large, the jig can rotate at a high speed along with the carrying platform 200, and the load of the motor is reduced to the greatest extent.

It is understood that the transparent cover plate 20 may be made of tempered glass or polymethyl methacrylate (also called acrylic or plexiglass).

There are various ways of connecting the support plate 10 and the transparent cover plate 20. In one embodiment, referring to fig. 3 or 4, the transparent cover plate 20 is fixed to the supporting plate 10 by a connecting member 30. Specifically, the transparent cover plate 20 is provided with a stepped groove 22, and the connecting member 30 is inserted into the stepped groove 22 and connected to the support plate 10. The end of the connecting member 30 is received in the stepped groove 22, and the arrangement mode can prevent the connecting member 30 from protruding out of the upper surface of the transparent cover plate 20, so that the silicon wafer and the transparent cover plate 20 cannot be completely attached. It can be understood that, in order to connect the support plate 10 and the transparent cover plate 20 more firmly, two stepped grooves 22 may be formed at opposite corners of the transparent cover plate 20, or four stepped grooves 22 may be formed at four corners of the transparent cover plate 20, respectively, and a corresponding number of connecting members 30 may be provided to connect the support plate 10 and the transparent cover plate 20. The connecting member 30 may be a screw or a bolt.

Further, referring to fig. 7, the fixture 100 further includes a spacer 31, and the spacer 31 is disposed between the connecting member 30 and the transparent cover plate 20. Because the transparent cover plate 20 has certain fragility, set up gasket 31 between connecting piece 30 and transparent cover plate 20, gasket 31 can play the cushioning effect, greatly reduced transparent cover plate 20 by the probability of fracturing. The gasket 31 may be made of a soft material such as rubber or plastic.

In another embodiment, the support plate 10 and the transparent cover plate 20 are bonded together using an adhesive, i.e., an adhesive layer is formed between the transparent cover plate 20 and the support plate 10. It should be noted that the adhesive layer should avoid the area where the adsorption holes 21 are located, so as to avoid the adhesive entering the adsorption holes 21 and causing the blockage of the adsorption holes 21.

In other embodiments, magnets may also be used to connect the support plate 10 and the transparent cover plate 20. For example, a plurality of first magnets are fixed to the support plate 10, and a plurality of second magnets are fixed to corresponding positions of the transparent cover plate 20, the first magnets and the second magnets having opposite polarities and having magnetic attraction to each other. When assembled, the first magnet on the support plate 10 and the second magnet on the transparent cover plate 20 are aligned, and the magnetic attraction between the first magnet and the second magnet causes the support plate 10 and the transparent cover plate 20 to be coupled.

The utility model discloses tool 100 is applicable to the absorption of not unidimensional silicon chip. When a silicon wafer with a smaller size is adsorbed, part of the adsorption holes 21 on the transparent cover plate 20 are exposed to the outside of the silicon wafer, and at this time, in order to avoid vacuum leakage, the adsorption holes 21 exposed to the outside of the silicon wafer need to be covered, for example, a shielding sheet is placed in a region of the transparent cover plate 20 exposed to the silicon wafer, and the shielding sheet can shield the adsorption holes 21 in the region. The adsorption hole 21 may be covered with an adhesive tape.

In some embodiments, referring to fig. 6, to accommodate the suction attachment of silicon wafers of different sizes, the vacuum passages 11 in the support plate 10 are divided into first vacuum passages 11a and second vacuum passages 11b, and the first vacuum passages 11a and the second vacuum passages 11b are isolated from each other. The second vacuum path 11b is located at the periphery of the first vacuum path 11a, and for the sake of understanding, the first vacuum path 11a is encircled by a dotted line frame in fig. 6, and the portion other than the dotted line frame is the second vacuum path 11 b.

Referring to fig. 7, the upper surface of the transparent cover plate 20 may be divided into a first adsorption area 20a and a second adsorption area 20 b. The first adsorption region 20a is located at the middle of the transparent cover plate 20, and for convenience of understanding, the first adsorption region 20a is circled by a dotted line frame in fig. 7, and the portion other than the first adsorption region 20a is the second adsorption region 20 b. The suction holes 21 located in the first suction region 20a communicate with the upright portion 111 of the first vacuum passage 11a, and the suction holes 21 located in the second suction region 20b communicate with the upright portion 111 of the second vacuum passage 11 b.

When a silicon wafer with the smallest size is placed on the jig 100, the silicon wafer can cover the whole first adsorption area 20a and a small part of the second adsorption area 20b, and the silicon wafer can be adsorbed and fixed only by starting the first vacuum passage 11 a. While a larger size silicon wafer may exceed the first adsorption area 20a and cover more of the second adsorption area 20b, it is necessary to activate the first vacuum path 11a and the second vacuum path 11b simultaneously. The first vacuum passage 11a and the second vacuum passage 11b can be independently controlled to adapt to the adsorption and fixation of silicon wafers with different sizes, and the vacuum leakage caused by starting the whole vacuum passage 11 when small-size silicon wafers are adsorbed is avoided. When the silicon wafer is small in size, only a part of the second adsorption region 20b can be covered, and at this time, the adsorption holes 21 in the second adsorption region 20b are exposed to the outside of the silicon wafer, and in order to prevent vacuum leakage, when the silicon wafer is adsorbed and fixed, only the first vacuum passage 11a may be activated.

Referring to fig. 4, the surface of the supporting plate 10 facing the transparent cover plate 20 is formed with a plurality of grooves 12, and the grooves 12 are connected to the vertical portion 111 of the vacuum passage 11 and connected to the suction holes 21.

Referring to fig. 7, a plurality of absorption grooves 23 are formed on a side of the transparent cover plate 20 away from the support plate 10, and the absorption grooves 23 are communicated with the absorption holes 21. The arrangement of the adsorption groove 23 is beneficial to increasing the vacuum adsorption area, improving the stable adsorption effect on large-size silicon wafers and improving the processing yield.

The supporting plate 10 and/or the transparent cover plate 20 are provided with a plurality of hollow portions to reduce the weight of the jig 100.

The first and

second vacuum paths

11a and 11b of the support plate 10 are provided with air pipe joints B, C penetrating the side or bottom surface of the support plate 10, and the air pipe joints are connected to the vacuum extractor through pipes. The jig 100 further comprises an air valve, wherein the air valve is arranged on the pipeline and used for controlling the connection or disconnection of the pipeline. The air valve can be a manual air valve or an electromagnetic valve.

The utility model discloses tool 100 designs the cross section size of transparent cover plate 20 for being greater than the cross section size of backup pad 10, can strengthen the utility model discloses tool 100's suitability for this tool 100 can be applicable to fixed not unidimensional silicon chip. When the size of the silicon wafer to be processed far exceeds the size of the support plate 10, the silicon wafer can still be effectively supported through the transparent cover plate 20, and the transparent cover plate 20 cannot shield the light emitted by the light source 300 to influence the detection of the silicon wafer.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A jig, comprising:

a support plate in which a vacuum passage is formed; and

2. The jig of claim 1, wherein the vacuum passages comprise a first vacuum passage and a second vacuum passage isolated from each other, the second vacuum passage being located at a periphery of the first vacuum passage.

3. The fixture according to claim 1, wherein a plurality of adsorption grooves are formed in one side of the transparent cover plate facing away from the support plate, and the adsorption grooves are communicated with the adsorption holes.

4. The fixture according to claim 1, wherein the surface of the supporting plate facing the transparent cover plate is provided with a plurality of grooves, and the grooves are communicated with the vacuum passage and the suction holes.

5. The jig according to claim 1, wherein the transparent cover plate is provided with a stepped groove, and the jig further comprises a connecting member, wherein the connecting member is inserted into the stepped groove and connected to the supporting plate.

6. The jig of claim 5, further comprising a spacer disposed between the connecting member and the transparent cover plate.

7. The fixture according to claim 1, further comprising an adhesive layer disposed between the transparent cover plate and the support plate.

8. The jig according to claim 1, further comprising an air valve, wherein the vacuum passage is connected to the vacuum extractor through a pipeline, and the air valve is disposed on the pipeline and used for controlling connection or disconnection of the pipeline.

9. A detection device, comprising the jig according to any one of claims 1 to 8, further comprising a light source and a camera unit, wherein the light source is disposed at the bottom of the support plate and is used for illuminating a workpiece placed on the transparent cover plate, so that the camera unit can acquire an image of the workpiece.

10. A laser doping apparatus comprising the detecting device of claim 9.