CN214043668U - Organic light emitting display panel and organic light emitting display device - Google Patents
Organic light emitting display panel and organic light emitting display device Download PDFInfo
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- CN214043668U CN214043668U CN202023084105.XU CN202023084105U CN214043668U CN 214043668 U CN214043668 U CN 214043668U CN 202023084105 U CN202023084105 U CN 202023084105U CN 214043668 U CN214043668 U CN 214043668U
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Abstract
The present application provides an organic light emitting display panel and an organic light emitting display device, wherein the organic light emitting display panel includes: the array substrate, the color film substrate and the packaging structure are arranged; the packaging structure comprises a sealing frame and/or a sealing layer, wherein the sealing frame and the sealing layer are arranged between the array substrate and the color film substrate, and the array substrate and the color film substrate are bonded and fixed through the sealing frame and/or the sealing layer; the sealing frame is formed by curing frame sealing glue, the sealing frame is located in the frame areas of the array substrate and the color film substrate, the sealing layer is formed by curing filling glue, and the sealing layer is located in the display areas of the array substrate and the color film substrate. In the organic light-emitting display panel and the organic light-emitting display device provided by the application, the sealing frame and/or the sealing layer are/is respectively arranged between the array substrate and the color film substrate, so that the packaging effect of the array substrate and the color film substrate can be improved, and the narrow frame can be realized.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to an organic light emitting display panel and an organic light emitting display device.
Background
Compared with many Display devices, an Organic Light Emitting Display (OLED for short) has many advantages of being solid-state, self-luminous, wide in viewing angle, wide in color gamut, fast in reaction speed, high in luminous efficiency, high in brightness, high in contrast, ultra-thin, ultra-Light, low in power consumption, wide in working temperature range, capable of manufacturing large-sized and flexible panels, simple in manufacturing process and the like, can achieve flexible Display in a real sense, and can meet the requirements of people on future displays.
In order to improve the contrast ratio of the display device and achieve the integral black effect, the OLED device generally employs a Polarizer (POL), and the POL can effectively reduce the reflection intensity of the external ambient light on the screen. However, the light transmittance of POL is generally only about 44%, and more power consumption is required to achieve higher light output. Moreover, the polarizer has large thickness and brittle material, which is not favorable for the development of dynamic bending products. In order to develop dynamic bending products based on the OLED display technology, a new technology and a new process must be introduced to replace the polarizer.
For this reason, PFS (POL Free Solution) technology with a Color Filter (CF) is generally used in the industry instead of the polarizer. The CF structure generally includes red (R), green (G), and blue (B) color-resisting units and a Black Matrix (BM), and the red (R), green (G), and blue (B) color-resisting units need to correspond to the red, green, and blue pixel units of the OLED device, respectively. By adopting the PFS technology, the thickness of the functional layer is greatly reduced, the light extraction rate can be improved from 44% to 80%, the light extraction brightness is greatly increased, and therefore the power consumption of the OLED device is reduced.
It is known that the electrodes and organic layers of the OLED device are easily attacked by water and oxygen, which results in a reduction in the lifetime of the OLED device. However, in the actual production and use process, the problem that the encapsulation effect of the OLED display device manufactured by adopting the PFS technology is poor is found, and water and oxygen easily enter the interior of the OLED device to cause the failure of the organic light emitting layer.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present application provides an organic light emitting display panel and an organic light emitting display apparatus to solve the problem in the prior art that an organic light emitting display device adopting the PFS technology has a poor packaging effect.
In order to solve the above technical problem, the utility model provides a pair of organic light emitting display panel, organic light emitting display panel includes: the array substrate, the color film substrate and the packaging structure are arranged;
the array substrate and the color film substrate both comprise a display area and a frame area surrounding the display area, a plurality of OLED pixel units are arranged in the display area of the array substrate, a plurality of color resistor units are arranged in the display area of the color film substrate, the array substrate and the color film substrate are arranged oppositely, and the plurality of OLED pixel units and the plurality of color resistor units are arranged in a one-to-one correspondence manner;
the packaging structure comprises a sealing frame and/or a sealing layer, the sealing frame and the sealing layer are arranged between the array substrate and the color film substrate, and the array substrate and the color film substrate are bonded and fixed through the sealing frame and/or the sealing layer;
the sealing frame is formed by curing frame sealing glue, the sealing frame is located in the frame areas of the array substrate and the color film substrate, the sealing layer is formed by curing filling glue, and the sealing layer is located in the display areas of the array substrate and the color film substrate.
Optionally, in the organic light emitting display panel, the frame region of the array substrate sequentially includes, from inside to outside, a first transition region, an edge defining region, a second transition region, and a cutting region;
and a thin film packaging layer is arranged on the plurality of OLED pixel units, extends to the frame area of the array substrate, and has the edge consistent with the outer edge of the second transition area.
Optionally, in the organic light emitting display panel, the sealing frame is disposed in the second transition region and located on the thin film encapsulation layer.
Optionally, in the organic light emitting display panel, the sealing frame is disposed in the second transition region and the edge defining region, and is located on the thin film encapsulation layer.
Optionally, in the organic light emitting display panel, the sealing frame is disposed in the second transition region, the edge defining region and the first transition region, and is located on the thin film encapsulation layer.
Optionally, in the organic light emitting display panel, the sealing frame is made of a transparent material, and the sealing frame is disposed in the second transition region, the edge defining region, the first transition region, and a portion of the display region, and is located on the film encapsulation layer.
Optionally, in the organic light emitting display panel, the frame region of the array substrate further includes a frame sealing region, the frame sealing region is located between the second transition region and the cutting region, and the sealing frame is disposed in the frame sealing region.
Optionally, in the organic light emitting display panel, a plurality of cushion balls are disposed in the frame sealing adhesive, and the cushion balls are used for maintaining the thickness of the frame of the organic light emitting display panel.
Optionally, in the organic light emitting display panel, the sealing frame has four sides, one of the four sides corresponds to a crimping side of the organic light emitting display panel, the other three sides are provided with a plurality of beads, and the side corresponding to the crimping side of the organic light emitting display panel is not provided with a bead or is provided with a bead having a smaller size than the other three sides.
Optionally, in the organic light emitting display panel, one side of the sealing layer corresponds to a crimping side of the organic light emitting display panel, and the side is provided with a blocking structure, where the blocking structure is located at an edge of the filling glue and is used for blocking the filling glue from overflowing to the crimping area of the organic light emitting display panel.
Correspondingly, the utility model provides a pair of organic light emitting display device, organic light emitting display device includes as above organic light emitting display panel.
The utility model provides an among organic light emitting display panel and the organic light emitting display device, through set up sealed frame and/or sealing layer respectively between array substrate and various membrane base plate, not only can improve array substrate and various membrane base plate's encapsulation effect is favorable to realizing narrow frame moreover.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a cross-sectional view of an organic light emitting display panel according to a first embodiment of the present invention;
fig. 2 is a cross-sectional view of an edge of an organic light emitting display panel according to a first embodiment of the present invention;
fig. 3 is a top view of an array substrate according to a first embodiment of the present invention;
fig. 4 is a cross-sectional view of an organic light emitting display panel according to a second embodiment of the present invention;
fig. 5 is a cross-sectional view of an edge of an organic light emitting display panel according to a second embodiment of the present invention;
fig. 6 is a cross-sectional view of an organic light emitting display panel according to a third embodiment of the present invention;
fig. 7 is a cross-sectional view of an organic light emitting display panel according to a third embodiment of the present invention when the organic light emitting display panel is pressed against a COP;
fig. 8 is a top view of an array substrate according to a fourth embodiment of the present invention;
fig. 9 is a cross-sectional view of an edge of an organic light emitting display panel according to a fourth embodiment of the present invention;
fig. 10 is a cross-sectional view illustrating an edge of an organic light emitting display panel according to another embodiment of the present invention;
fig. 11 is a cross-sectional view illustrating an edge of an organic light emitting display panel according to still another embodiment of the present invention;
fig. 12 is a cross-sectional view illustrating an edge of an organic light emitting display panel according to another embodiment of the present invention;
fig. 13 is a schematic view illustrating a structure of an organic light emitting display panel in a manufacturing process according to the related art;
fig. 14 is a schematic structural diagram of an organic light emitting display panel according to another embodiment of the present invention in a manufacturing process.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted.
[ EXAMPLES one ]
Please refer to fig. 1 to fig. 3, which are schematic structural diagrams of an organic light emitting display panel according to a first embodiment of the present invention. As shown in fig. 1 to 3, the organic light emitting display panel 100 includes: the array substrate comprises an array substrate 10, a color film substrate and an encapsulation structure; the array substrate 10 and the color film substrate both comprise a display area AA and a frame area surrounding the display area AA, a plurality of OLED pixel units 12 are arranged in the display area AA of the array substrate 10, a plurality of color resistor units 22 are arranged in the display area of the color film substrate, the array substrate 10 is arranged opposite to the color film substrate, and the plurality of OLED pixel units 12 and the plurality of color resistor units 22 are arranged in a one-to-one correspondence manner; the packaging structure comprises a sealing frame 31, the sealing frame 31 is arranged between the array substrate 10 and the color film substrate, and the array substrate 10 and the color film substrate are bonded and fixed through the sealing frame 31; the sealing frame 31 is formed by curing a frame sealing adhesive, and the sealing frame 31 is located in the frame areas of the array substrate 10 and the color film substrate.
Specifically, the array substrate 10 includes a substrate 11, a Thin Film Transistor (TFT) array (reference numeral not shown in the figure), a plurality of OLED pixel units 12, and a Thin Film Encapsulation layer (TFE) 13, which are sequentially stacked. The substrate 11 may be a hard substrate or a flexible substrate, the hard substrate may be transparent glass, and the flexible substrate may be transparent plastic. The TFT array comprises a plurality of TFTs arranged in an array mode, each TFT comprises a source/drain electrode (not shown in the figure) and a grid electrode (not shown in the figure), and the TFTs can be any one of amorphous silicon TFTs, polycrystalline TFTs or metal oxide TFTs. The plurality of OLED pixel units 12 include a red pixel unit R, a green pixel unit G, and a blue pixel unit B, and the red pixel unit R, the green pixel unit G, and the blue pixel unit B are arranged in an array manner. The film packaging layer 13 is a continuous film layer and completely covers the plurality of OLED pixel units 12, and can prevent water vapor and oxygen from entering the OLED pixel units 12.
The color film substrate comprises a cover plate 21, a color filter layer and an organic protective layer (i.e., an OC layer) 23 which are sequentially stacked, wherein the color filter layer comprises a plurality of color resistance units 22 and a black matrix (reference numerals in the figure are not shown), the plurality of color resistance units 22 comprise a red color resistance unit R, a green color resistance unit G and a blue color resistance unit B, the red color resistance unit R, the green color resistance unit G and the blue color resistance unit B are all arranged in an array manner, the black matrix (also called a light shielding layer or a BM layer) is arranged between the adjacent color resistance units 22, and the organic protective layer 23 covers the black matrix and the color resistance units 22. Wherein the light transmittance of the black matrix is almost 0, and the light emitted from the OLED pixel unit 12 can only transmit through the plurality of color resistance units 22.
The array substrate 10 and the color film substrate are arranged oppositely, and both the film layer (including a plurality of OLED pixel units 12 and a thin film encapsulation layer 13) on the substrate 11 and the film layer (a plurality of color resistance units 22 and an organic protection layer 23) on the cover plate 21 are located between the substrate 11 and the cover plate 21. The color filter substrate has a plurality of color resistor units 22 corresponding to the plurality of OLED pixel units 12 of the array substrate 10. Preferably, the orthographic projection of the color resistance unit 22 on the substrate 11 is located in the orthographic projection of the OLED pixel unit 12 on the substrate 11.
Referring to fig. 2 and 3, the frame region of the array substrate 10 sequentially includes a first transition region 10a, an edge defining region 10b, a second transition region 10c, a frame sealing region 10d, and a cutting region 10e from inside to outside, the first transition region 10a is located between the display region AA and the edge defining region 10b, the second transition region 10c is located between the edge defining region 10b and the frame sealing region 10d, an edge of the thin film encapsulation layer 13 is consistent with an outer edge of the second transition region 10c, an edge defining structure (i.e., Bank)14 is disposed in the edge defining region 10b, and the edge defining structure 14 is used for determining a boundary between the display region and the non-display region, i.e., the display region and the non-display region can be separated from each other by the edge defining structure 14.
The width of the first transition region 10a is a, the width of the edge defining region 10B is B, the width of the second transition region 10C is C, the width of the frame sealing region 10D is D, the width of the cutting region 10E is E, and the overall width D1 of the frame region of the array substrate 10 is equal to a + B + C + D + E.
With continued reference to fig. 1 to fig. 3, the package structure is a sealing frame 31, the sealing frame 31 is disposed in the sealing frame region 10d and stands on the TFT array, the sealing frame 31 is a fully-enclosed frame-shaped structure, that is, the frame edges of the sealing frame 31 are sequentially connected end to form a circle, and the specific shape of the sealing frame 31 is adapted to the shape of the organic light emitting display panel 100.
In this embodiment, the sealing frame 31 stands on the TFT array. In other embodiments, the sealing frame 31 may also stand on the substrate 11 where the TFT array is not disposed.
In this embodiment, the sealing frame 31 is formed by curing a frame sealing adhesive (Dam adhesive). The Dam glue is an acrylic or epoxy resin glue material, and the Dam glue can be cured by ultraviolet irradiation or by heating.
Preferably, a plurality of spacers (i.e., spacer particles) are disposed in the Dam glue, and the spacer particles are used for maintaining the frame thickness of the organic light emitting display panel 100, so that the frame thickness of the organic light emitting display panel 100 is uniformly maintained.
Correspondingly, the utility model also provides a manufacturing approach of organic light emitting display panel. With continued reference to fig. 1 to fig. 3, the method for manufacturing the organic light emitting display panel 100 includes:
step one, respectively providing a substrate 11 and a cover plate 21, sequentially forming a TFT array, a plurality of OLED pixel units 12 and a thin film encapsulation layer 13 on the substrate 11 to obtain an array substrate 10, and sequentially forming a black matrix, a plurality of color resistance units 22 and an organic protection layer 23 on the cover plate 21 to obtain a color film substrate;
step two, arranging a circle of frame sealing glue in the edge area of the color film substrate or the array substrate 10;
aligning and attaching the color film substrate and the array substrate 10;
and step four, curing the frame sealing glue to form a sealing frame 31, and packaging the organic light-emitting display panel 100 through the sealing frame 31.
Specifically, the array substrate 10 manufactured in the first step includes a display area AA and a frame area surrounding the display area AA, the plurality of OLED pixel units 12 are located in the display area AA, the thin film encapsulation layer 13 covers the plurality of OLED pixel units 12 and extends into the frame area of the array substrate 10, the frame area sequentially includes a first transition area 10a, an edge defining area 10b, a second transition area 10c, a frame sealing area 10d and a cutting area 10e from inside to outside, and an edge of the thin film encapsulation layer 13 is consistent with an outer edge of the second transition area 10 c.
In the second step, a coating position of the frame sealing adhesive (i.e., DAM adhesive) is selected according to specific positions of the color film substrate and the array substrate 10 in the bonding process. In this embodiment, since the color film substrate is located below the array substrate 10 during the lamination process, the DAM glue is coated on the color film substrate, and the coating position corresponds to the frame sealing region 10d of the array substrate 10. If the color film substrate is located above the array substrate 10 when the color film substrate is attached to the array substrate 10, the DAM paste should be coated on the array substrate 10 and located in the frame sealing area 10d of the frame area.
In the third step, the array substrate 10 and the color film substrate are arranged oppositely, and the plurality of OLED pixel units 12 and the plurality of color resistance units 22 are in one-to-one correspondence when being attached.
In the fourth step, the DAM paste is cured by ultraviolet irradiation or heating, and a sealing frame 31 is formed after the DAM paste is cured, thereby completing the encapsulation of the organic light emitting display panel 100.
After the encapsulation is completed, cutting is performed along a predetermined cutting path (located at the outer edge of the cutting region 10 e), and the organic light emitting display panel 100 is finally obtained.
Accordingly, the present invention also provides an organic light emitting display device including the organic light emitting display panel 100 as described above. Please refer to the above, which is not described herein.
In the prior art, the array substrate and the color film substrate of the organic light-emitting display panel are generally fixed and encapsulated by adhesive, so that the encapsulation reliability is poor, and water and oxygen easily enter the interior of an OLED device to cause the failure of an organic light-emitting layer. In this embodiment, the seal frame 31 formed by curing Dam glue is used to connect the edge of the array substrate 10 and the edge of the color film substrate, so that effective packaging can be achieved, and not only is adhesive glue not needed, but also the process is simpler, the production efficiency is higher, and the cost is lower.
[ example two ]
Please refer to fig. 3 to fig. 5, which are schematic structural diagrams of an organic light emitting display panel according to a second embodiment of the present invention. As shown in fig. 3 to 5, the organic light emitting display panel 200 includes: the array substrate comprises an array substrate 10, a color film substrate and an encapsulation structure; the array substrate 10 and the color film substrate both comprise a display area AA and a frame area surrounding the display area AA, a plurality of OLED pixel units 12 are arranged in the display area AA of the array substrate 10, a plurality of color resistor units 22 are arranged in the display area of the color film substrate, the array substrate 10 is arranged opposite to the color film substrate, and the plurality of OLED pixel units 12 and the plurality of color resistor units 22 are arranged in a one-to-one correspondence manner; the packaging structure comprises a sealing frame 31 and a sealing layer 32, wherein the sealing frame 31 and the sealing layer 32 are both arranged between the array substrate 10 and the color film substrate, and the array substrate 10 and the color film substrate are bonded and fixed through the sealing frame 31 and the sealing layer 32; the sealing frame 31 is formed by curing a frame sealing adhesive, the sealing frame 31 is located in the frame areas of the array substrate 10 and the color film substrate, the sealing layer 32 is formed by curing a filling adhesive, and the sealing layer 32 is located in the display area AA of the array substrate 10 and the color film substrate.
Specifically, the array substrate 10 is arranged opposite to the color filter substrate, and the plurality of color resistor units 22 of the color filter substrate correspond to the plurality of OLED pixel units 12 of the array substrate one to one. The package structure comprises a sealing frame 31 and a sealing layer 32, wherein the sealing frame 31 and the sealing layer 32 are arranged between the array substrate 10 and the color film substrate during stretching. The seal frame 31 is disposed in the frame regions of the array substrate 10 and the color filter substrate, and the seal layer 32 is disposed in the display regions AA of the array substrate 10 and the color filter substrate.
As shown in fig. 4, the sealing layer 32 is filled between the thin film encapsulation layer 13 of the array substrate 10 and the organic protection layer 23 of the color filter substrate, and is located within the range defined by the sealing frame 31. As shown in fig. 5, the frame region of the array substrate 10 includes a first transition region 10a, an edge defining region 10B, a second transition region 10C, a frame sealing region 10D and a cutting region 10E, the overall width D2 of the frame region of the array substrate 10 is equal to a + B + C + D + E, and the sealing frame 31 is disposed in the frame sealing region 10D and stands on the TFT array.
In this embodiment, the sealing layer 32 is formed by curing filling glue (i.e., fill glue), the sealing frame 31 is formed by curing Dam glue, and the Dam glue and the fill glue may be cured by ultraviolet irradiation or by heating.
In this embodiment, the Dam glue and the fill glue are both acrylic or epoxy glue materials. Preferably, the optical refractive index of the fill gel is between 1.2 and 1.8. Preferably, a plurality of spacers are disposed in the Dam paste, and the spacers are used to ensure that the overall height of the bezel of the organic light emitting display panel 100 is maintained uniform.
The difference between this embodiment and the first embodiment is that the package structure includes not only the sealing frame 31 but also the sealing layer 32. Therefore, the array substrate 10 and the color film substrate are not only bonded and fixed through the sealing frame 31, but also attached and fixed together through the sealing layer 32, so that the packaging reliability is higher.
Correspondingly, the utility model also provides a manufacturing approach of organic light emitting display panel. With continued reference to fig. 3 to fig. 5, the method for manufacturing the organic light emitting display panel 200 includes:
step one, respectively providing a substrate 11 and a cover plate 21, sequentially forming a TFT array, a plurality of OLED pixel units 12 and a thin film encapsulation layer 13 on the substrate 11 to obtain an array substrate 10, and sequentially forming a black matrix, a plurality of color resistance units 22 and an organic protection layer 23 on the cover plate 21 to obtain a color film substrate;
step two, arranging a circle of frame sealing glue in the edge area of the color film substrate or the array substrate 10, and coating filling glue in the display area AA of the color film substrate or the array substrate 10 to form a sealing layer 32;
aligning and attaching the color film substrate and the array substrate 10;
and step four, curing the frame sealing glue to form a sealing frame 31, and jointly packaging the organic light-emitting display panel 200 through the sealing frame 31 and the sealing layer 32.
Specifically, in the second step, according to the position of the color film substrate and the array substrate 10 when they are bonded, the Dam glue and the fill glue are selectively coated on the organic protective layer 23 of the color film substrate, or coated on the thin film encapsulation layer 13 of the array substrate 10.
Accordingly, the present invention also provides an organic light emitting display device including the organic light emitting display panel 200 as described above. Please refer to the above, which is not described herein.
[ EXAMPLE III ]
Please refer to fig. 3, fig. 6 and fig. 7, which are schematic structural diagrams of an organic light emitting display panel according to a third embodiment of the present invention. As shown in fig. 3, 6 and 7, the organic light emitting display panel 300 includes: the array substrate comprises an array substrate 10, a color film substrate and an encapsulation structure; the array substrate 10 and the color film substrate both comprise a display area AA and a frame area surrounding the display area AA, a plurality of OLED pixel units 12 are arranged in the display area AA of the array substrate 10, a plurality of color resistor units 22 are arranged in the display area of the color film substrate, the array substrate 10 is arranged opposite to the color film substrate, and the plurality of OLED pixel units 12 and the plurality of color resistor units 22 are arranged in a one-to-one correspondence manner; the packaging structure comprises a sealing layer 32, the sealing layer 32 is arranged between the array substrate 10 and the color film substrate, and the array substrate 10 and the color film substrate are bonded and fixed through the sealing layer 32; the sealing layer 32 is formed by curing a filling adhesive, and the sealing layer 32 is located in the display areas of the array substrate 10 and the color film substrate.
Specifically, one side of the sealing layer 32 corresponds to a crimping side (facing the COF) of the organic light emitting display panel, and the side is provided with a blocking structure 33, where the blocking structure 33 is used for blocking the underfill from overflowing to a crimping region of the organic light emitting display panel.
Since the fill paste is easy to overflow before curing, and a poor pressure welding problem is caused when the fill paste overflows to the pressure welding area, a blocking structure 33 needs to be disposed on the side of the sealing layer 32 facing the COF to prevent the fill paste from overflowing to the bonding area of the COF (i.e., the pressure welding area of the organic light emitting display panel 300).
The present embodiment is different from the first embodiment in that the encapsulation structure is not the sealing frame 31 but the sealing layer 32, and the edge of the sealing layer 32 is further provided with a blocking structure 33, where the blocking structure 33 can block the filling adhesive (i.e., the sealing layer 32) from overflowing.
The barrier structure 33 may be formed by curing Dam glue, or may be formed by a chemical vapor deposition process in the process of manufacturing the array substrate 10 or the color film substrate. The Dam glue and the fill glue are both acrylic or epoxy resin glue materials. Preferably, the optical refractive index of the fill gel is between 1.2 and 1.8.
Correspondingly, the utility model also provides a manufacturing approach of organic light emitting display panel. With continued reference to fig. 3, fig. 6, and fig. 7, the method for manufacturing the organic light emitting display panel 300 includes:
step one, respectively providing a substrate 11 and a cover plate 21, sequentially forming a TFT array, a plurality of OLED pixel units 12 and a thin film encapsulation layer 13 on the substrate 11 to obtain an array substrate 10, and sequentially forming a black matrix, a plurality of color resistance units 22 and an organic protection layer 23 on the cover plate 21 to obtain a color film substrate;
step two, arranging a blocking structure 33 in the edge region of the color film substrate or the array substrate 10, and coating a filling adhesive in the display region of the color film substrate or the array substrate 10 to form a sealing layer 32;
and thirdly, aligning and attaching the color film substrate and the array substrate 10 to realize the encapsulation of the organic light-emitting display panel 300.
Accordingly, the present invention also provides an organic light emitting display device including the organic light emitting display panel 300 as described above. Please refer to the above, which is not described herein.
[ EXAMPLE IV ]
Please refer to fig. 4, fig. 8 and fig. 9, which are schematic structural diagrams of an organic light emitting display panel according to a fourth embodiment of the present invention. As shown in fig. 4, 8 and 9, the organic light emitting display panel includes: the array substrate 20, the color film substrate and the packaging structure; the array substrate 20 and the color film substrate both comprise a display area AA and a frame area surrounding the display area AA, a plurality of OLED pixel units 12 are arranged in the display area AA of the array substrate 20, a plurality of color resistor units 22 are arranged in the display area of the color film substrate, the array substrate 20 is arranged opposite to the color film substrate, and the plurality of OLED pixel units 12 and the plurality of color resistor units 22 are arranged in a one-to-one correspondence manner; the packaging structure comprises a sealing frame 31 and a sealing layer 32, wherein the sealing frame 31 and the sealing layer 32 are both arranged between the array substrate 20 and the color film substrate, and the array substrate 20 and the color film substrate are bonded and fixed through the sealing frame 31 and the sealing layer 32; the sealing frame 31 is formed by curing a frame sealing adhesive, the sealing frame 31 is located in the frame areas of the array substrate 20 and the color film substrate, the sealing layer 32 is formed by curing a filling adhesive, and the sealing layer 32 is located in the display area AA of the array substrate 20 and the color film substrate.
Specifically, the frame region of the array substrate 20 includes a first transition region 10a, an edge defining region 10B, a second transition region 10c and a cutting region 10E, and the overall width D3 of the frame region of the array substrate 20 is equal to a + B + D + E.
The difference between this embodiment and the second embodiment is that a frame sealing area is not disposed between the second transition area 10c and the cutting area 10e, the sealing frame 31 is not disposed in the frame sealing area but disposed in the second transition area 10c, and since the film encapsulation layer 13 is disposed in the second transition area 10c, the sealing frame 31 stands on the film encapsulation layer 13 instead of the substrate 11 or the TFT array. Thus, the frame sealing area of the frame area of the array substrate 20 can be omitted, and the purpose of narrow frame is achieved.
In the manufacturing process of the organic light emitting display panel provided in this embodiment, the coating position of the frame sealing adhesive corresponds to the second transition region 10c of the array substrate 20.
In another embodiment, the sealing frame 31 may also be disposed in the edge-defining region 10b and the second transition region 10c to further reduce the overall width of the bezel region. Correspondingly, in the manufacturing process of the organic light emitting display panel, the coating position of the frame sealing glue corresponds to the edge defining region 10b and the second transition region 10c of the array substrate. As shown in fig. 10, the frame region of the array substrate 20 includes a first transition region 10a, an edge defining region 10b, a second transition region 10c and a cutting region 10E, the sealing frame 31 is disposed on the edge defining region 10b and the second transition region 10c, a sum of widths of the edge defining region 10b and the second transition region 10c is D, a width of the first transition region 10a is a, a width of the cutting region 10E is E, and an overall width D4 of the frame region of the array substrate 20 is equal to a + D + E.
In yet another embodiment, the sealing frame 31 may also be disposed in the first transition region 10a, the edge defining region 10b and the second transition region 10c to further reduce the overall width of the bezel region. Accordingly, in the manufacturing process of the organic light emitting display panel, the coating position of the frame sealing adhesive corresponds to the first transition region 10a, the edge defining region 10b and the second transition region 10c of the array substrate. As shown in fig. 11, the frame region of the array substrate 20 includes a first transition region 10a, an edge defining region 10b, a second transition region 10c and a cutting region 10E, the sealing frame 31 is disposed on the first transition region 10a, the edge defining region 10b and the second transition region 10c, a sum of widths of the first transition region 10a, the edge defining region 10b and the second transition region 10c is D, a width of the cutting region 10E is E, and an overall width D5 of the frame region of the array substrate 20 is equal to D + E.
In addition, the sealing frame 31 may be made of a transparent material. Thus, the sealing frame 31 may also be disposed in the first transition area 10a, the second transition area 10c, the edge defining area 10b and the middle display area AA, and further reduce the overall width of the frame area and the width limitation of the sealing frame 31. Accordingly, in the manufacturing process of the organic light emitting display panel, the coating position of the frame sealing adhesive corresponds to the first transition region 10a, the edge defining region 10b, the second transition region 10c and the partial display region AA close to the frame region of the array substrate. In this embodiment, since the Dam glue is disposed in a part of the display area AA, in order not to affect the display effect, both the optical refractive index of the Dam glue and the optical refractive index of the fill glue are between 1.2 and 1.8. In other embodiments, the Dam bar is disposed in the non-display region, and thus the Dam bar has no limitation on the optical refractive index.
In the above embodiment, since the film encapsulation layers 13 extend to the outer edges of the second transition regions 10c, the sealing frames 31 stand on the film encapsulation layers 13. The frame region of the array substrate 20 can not only omit the frame region to achieve the purpose of narrow frame, but also the width of the sealing frame 31 is less limited, i.e. the width of the sealing frame 31 can be increased to the sum of the widths of the first transition region 10a, the edge defining region 10b and the second transition region 10c of the array substrate 20, or even wider. Therefore, the process difficulty of manufacturing the sealing frame 31 is reduced, and the influence on the packaging effect caused by too narrow width can be avoided.
In the above embodiments, the scribe lines of the organic light emitting display panel are all disposed at the edge of the scribe region 10 e. In other embodiments, the scribe lines of the organic light emitting display panel may be disposed on the sealing frame 31 formed by curing Dam glue. As shown in fig. 12, a cutting street (indicated by a vertical dotted line in the figure) is disposed on the sealing frame 31, and the frame width of the organic light emitting display panel obtained by cutting along the cutting street is further reduced, where the reduced width includes the width E of the cutting region 10E and a part of the width D (i.e., a partial width of the sealing frame 31).
It should be noted that the position and the width of the sealing frame 31 are merely examples and not limitations, and those skilled in the art can set the position and the width of the sealing frame 31 according to actual requirements. In the above-described embodiments, the sealing frame 31 is located in the second transition region 10c and has a width corresponding to the width of the second transition region 10c, or is located in the edge-defining region 10b and the second transition region 10c and has a width corresponding to the sum of the widths of the edge-defining region 10b and the second transition region 10c, or is located in the first transition region 10a, the edge-defining region 10b, and the second transition region 10c and has a width corresponding to the sum of the widths of the first transition region 10a, the edge-defining region 10b, and the second transition region 10 c. In other embodiments, the sealing frame 31 may have a width that is different from the width of the second transition region 10c when the sealing frame 31 is located in the second transition region 10c, the sealing frame 31 may have a width that is different from the sum of the widths of the edge defining region 10b and the second transition region 10c when the sealing frame 31 is located in the edge defining region 10b and the second transition region 10c, and the sealing frame 31 may have a width that is different from the sum of the widths of the first transition region 10a, the edge defining region 10b, and the second transition region 10c when the sealing frame 31 is located in the first transition region 10a, the edge defining region 10b, and the second transition region 10 c.
In other embodiments, the sealing frame 31 may further be expanded outward to increase the distance between the sealing frame 31 and the display area AA, so that the Dam paste is applied at a position away from the display area AA to prevent overflow to the display area AA. The following description will take an example in which 6 organic light emitting display panels are fabricated on one substrate.
Please refer to fig. 13, which is a schematic structural diagram of an organic light emitting display panel in the manufacturing process of the prior art. As shown in fig. 13, in the prior art, the organic light emitting display panel is generally rectangular, and accordingly, each sealing frame 31 generally has four sides, and the four sides of the sealing frame 31 are all connected to the edge of the display area AA, that is, the Dam paste is applied very close to the edge of the display area AA, and at the corner position G, the Dam paste risks overflowing to the display area AA.
Please refer to fig. 14, which is a schematic structural diagram of an organic light emitting display panel according to another embodiment of the present invention in a manufacturing process. As shown in fig. 14, the entire pattern of Dam adhesive is extended, one side of the extended pattern is connected to the adjacent frame sealant pattern, and the other three sides of the extended pattern are extended to a dummy area (not shown), so that the coating position (including the corner position G) of each Dam adhesive is kept at a certain distance from the corresponding display area AA, and thus the risk of overflow of Dam adhesive to the display area AA is reduced.
Preferably, no spacer particles are disposed on one side of the sealing frame 31 corresponding to the crimping side T or the size of the spacer particles is smaller than the other three sides. For example, the spacer grain size of the other three sides of the sealing frame 31 is 10 to 17 μm, and the size of the bead in one side corresponding to the pressure-bonding side T is 1 to 5 μm smaller than that of the other three sides.
In this embodiment, since the encapsulation is realized only by the sealing layer 32, the degree of freedom of the cutting position is better, and the cutting position can be selected according to the actual requirement of the narrow frame design. With continued reference to fig. 12, the scribe line AB of the oled panel may be disposed at an edge of the thin film encapsulation layer (TFE).
Correspondingly, the utility model also provides an organic light emitting display device, organic light emitting display device includes as above organic light emitting display panel. Please refer to the above, which is not described herein.
It should be noted that, in the present specification, the embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
The above drawings only schematically illustrate the organic light emitting display panel provided by the present invention. For the sake of clarity, the shapes of the elements and the number of the elements in the above figures are simplified and some elements are omitted, so that those skilled in the art can make changes according to actual needs, and the changes are all within the protection scope of the present invention and will not be described herein.
To sum up, the utility model provides an organic light emitting display panel and organic light emitting display device through set up sealed frame and/or sealing layer respectively between array substrate and various membrane base plate, not only can improve array substrate and the encapsulation effect of various membrane base plate are favorable to realizing narrow frame moreover.
The foregoing is a more detailed description of the present application in connection with specific preferred embodiments and it is not intended that the present application be limited to these specific details. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.
Claims (11)
1. An organic light emitting display panel, comprising: the array substrate, the color film substrate and the packaging structure are arranged;
the array substrate and the color film substrate both comprise a display area and a frame area surrounding the display area, a plurality of OLED pixel units are arranged in the display area of the array substrate, a plurality of color resistor units are arranged in the display area of the color film substrate, the array substrate and the color film substrate are arranged oppositely, and the plurality of OLED pixel units and the plurality of color resistor units are arranged in a one-to-one correspondence manner;
the packaging structure comprises a sealing frame and/or a sealing layer, the sealing frame and the sealing layer are arranged between the array substrate and the color film substrate, and the array substrate and the color film substrate are bonded and fixed through the sealing frame and/or the sealing layer;
the sealing frame is formed by curing frame sealing glue, the sealing frame is located in the frame areas of the array substrate and the color film substrate, the sealing layer is formed by curing filling glue, and the sealing layer is located in the display areas of the array substrate and the color film substrate.
2. The organic light emitting display panel according to claim 1, wherein the frame region of the array substrate comprises, in order from inside to outside, a first transition region, an edge defining region, a second transition region, and a cutting region;
and a thin film packaging layer is arranged on the plurality of OLED pixel units, extends to the frame area of the array substrate, and has the edge consistent with the outer edge of the second transition area.
3. The organic light emitting display panel of claim 2, wherein the sealing frame is disposed in the second transition region and on the thin film encapsulation layer.
4. The organic light emitting display panel of claim 2, wherein the sealing frame is disposed in the second transition region and the edge defining region and on the thin film encapsulation layer.
5. The organic light emitting display panel of claim 2, wherein the sealing frame is disposed in the second transition region, the edge defining region, and the first transition region and on the thin film encapsulation layer.
6. The organic light emitting display panel of claim 5, wherein the sealing frame is made of a transparent material, and the sealing frame is disposed in the second transition region, the edge defining region, the first transition region and a portion of the display region and on the thin film encapsulation layer.
7. The organic light emitting display panel of claim 2, wherein the frame region of the array substrate further comprises a frame sealing region, the frame sealing region is located between the second transition region and the cutting region, and the sealing frame is disposed in the frame sealing region.
8. The organic light emitting display panel according to claim 1, wherein a plurality of beads are disposed in the frame sealing adhesive, and the plurality of beads are used for maintaining a frame thickness of the organic light emitting display panel.
9. The organic light emitting display panel according to claim 8, wherein the sealing frame has four sides, one of the sides corresponds to the press-bonding side of the organic light emitting display panel, the other three sides are each provided with a plurality of beads, and the side corresponding to the press-bonding side of the organic light emitting display panel is provided with no bead or is provided with a bead having a smaller size than the other three sides.
10. The organic light emitting display panel of claim 1, wherein one side of the sealing layer corresponds to a crimping side of the organic light emitting display panel, and the side is provided with a blocking structure at an edge of the filling glue for blocking the filling glue from overflowing to a crimping region of the organic light emitting display panel.
11. An organic light emitting display device, comprising: an organic light emitting display panel according to any one of claims 1 to 10.
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| CN202023084105.XU CN214043668U (en) | 2020-12-18 | 2020-12-18 | Organic light emitting display panel and organic light emitting display device |
| US17/551,316 US20220199693A1 (en) | 2020-12-18 | 2021-12-15 | Organic light emitting display panel, method for manufacturing the same and organic light emitting display apparatus |
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| CN202023084105.XU CN214043668U (en) | 2020-12-18 | 2020-12-18 | Organic light emitting display panel and organic light emitting display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023155266A1 (en) * | 2022-02-18 | 2023-08-24 | 深圳市华星光电半导体显示技术有限公司 | Oled display panel and preparation method for oled display panel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023155266A1 (en) * | 2022-02-18 | 2023-08-24 | 深圳市华星光电半导体显示技术有限公司 | Oled display panel and preparation method for oled display panel |
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