CN214040425U - Wire temperature monitoring device - Google Patents

Wire temperature monitoring device Download PDF

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Publication number
CN214040425U
CN214040425U CN202120295421.7U CN202120295421U CN214040425U CN 214040425 U CN214040425 U CN 214040425U CN 202120295421 U CN202120295421 U CN 202120295421U CN 214040425 U CN214040425 U CN 214040425U
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China
Prior art keywords
temperature monitoring
data
module
monitoring device
wire temperature
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CN202120295421.7U
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Chinese (zh)
Inventor
谢新政
黄少强
马戊海
银联拓
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Shenzhen Telecom Scientific & Technology Co ltd
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Shenzhen Telecom Scientific & Technology Co ltd
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Abstract

The utility model discloses a wire temperature monitoring device, including dismantled and assembled device body, this internal solar cell panel, battery and the PCB mainboard that links to each other including the electrical property of device, the PCB mainboard includes MCU module, chip module, temperature monitoring sensor module, charge management circuit and buck converter, solar cell panel still data connection has the LORA module, the temperature data that temperature monitoring sensor module gathered is received to the MCU module, and will data after the temperature data variation reaches settlement numerical value pass through the host computer and upload to cloud service platform. The utility model can be disassembled rapidly when the wire temperature monitoring device breaks down, and the module which breaks down is replaced, thereby improving the maintenance efficiency; and secondly, the collection and monitoring of the on-line power data are used as the core part of the on-line monitoring system of the power transmission line, stable and reliable monitoring data can be provided for the power part, and detailed data resources are provided for normal power dispatching of a power department.

Description

Wire temperature monitoring device
Technical Field
The utility model relates to a wire temperature measurement field especially relates to a wire temperature monitoring device.
Background
The electric power is an essential part in life, and along with the increasing demand of various industry departments on the electric power in the economic development, the requirements of people on the stability, continuity and accompanying service of power supply and the operation stability of the ultra-high voltage transmission line are correspondingly improved.
At present, related equipment on a power transmission line adopts a high-capacity battery as a main power supply, the power is supplied by a high-energy battery, the service life of the battery is short, the battery needs to be replaced periodically, the maintenance cycle of a general line is 1 year, if a battery fault exists in the cycle, the equipment can be maintained until the next cycle, especially for the line above 220KV, the battery fault exists in the cycle, the equipment can be maintained until the next cycle, even if the operation on the line can be performed under the condition of no power outage, the danger of live working is high, and the operation is quite complicated; secondly, the monitoring equipment acquires temperature data of the wires at regular time, and the acquired data cannot be uploaded to a corresponding platform in time when the temperature of the wires changes; moreover, the on-line electric power data acquisition equipment is a core part of the power transmission line monitoring, and the on-line electric power data acquisition equipment adopts an integrated structure and a one-time design mode based on the protection of the line, so that the equipment cannot be maintained except when the equipment is in a problem, and the equipment is damaged when the equipment is disassembled.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a wire temperature monitoring device.
The utility model discloses a following technical measure realizes, including dismantled and assembled device body, this internal solar cell panel, battery and the PCB mainboard that links to each other including the electrical property of device, the PCB mainboard includes MCU module, chip module, temperature monitoring sensor module, charge management circuit and step-down converter, solar cell panel still data connection has the LORA module, the temperature data that temperature monitoring sensor module gathered is received to the MCU module, and will data after the temperature data variation reaches the settlement numerical value pass through the host computer and upload to cloud service platform.
As a preferred mode, the device body comprises an upper shell and a lower shell which are mutually covered, temperature monitoring sensor modules are arranged on the side parts of the upper shell and the lower shell which are mutually covered, and a lead temperature probe of each temperature monitoring sensor module is fixed through a fixing plate.
As a preferred mode, the chip module includes a real-time chip, a storage chip and a temperature acquisition chip.
As a preferred mode, a metal groove is formed in the lower shell, and heat-conducting silica gel is fixed in the metal groove.
As a preferable mode, the upper shell is provided with a mounting hole, and the solar panel is arranged in the mounting hole.
Preferably, the system further comprises an antenna, wherein the antenna is integrated in the LORA module.
Preferably, the lead temperature probe sends temperature acquisition data to the host computer in a timing mode.
As a preferred mode, the MCU module collects data detected by the temperature collecting chip every 30 seconds, the temperature data received by the MCU is uploaded to the host through the LORA module after the change of the temperature data is larger than a set value, and otherwise, the data is uploaded after 10 minutes.
As a preferable mode, the inner side of the upper shell is also provided with a glue pouring hole.
As a preferred mode, the lower casing passes through the screw fixation wire temperature monitoring device, the screw is the copper nail and is connected with heat conduction silica gel.
The utility model provides a pair of wire temperature monitoring device, including dismantled and assembled device body, the device body includes epitheca and the inferior valve that the looks lid closed, can be rapid when wire temperature monitoring device breaks down unpacks the epitheca from top to bottom, changes the module that will break down, improves maintenance efficiency. Meanwhile, the device adopts an on-line electric power data acquisition and monitoring mode, the MCU module receives the temperature data acquired by the temperature monitoring sensor module and uploads the data with the temperature data change value reaching a set value to the cloud service platform through the host, stable and reliable monitoring data can be provided for an electric power part, and detailed data resources are provided for normal electric power scheduling of an electric power department.
Drawings
Fig. 1 is an overall schematic view of a lead temperature monitoring device according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a solar power-taking principle of the embodiment of the present invention;
fig. 3 is a schematic view of solar power supply according to an embodiment of the present invention;
fig. 4 is a schematic view of solar power supply according to an embodiment of the present invention;
fig. 5 is a topological diagram of the wire temperature probe software according to the embodiment of the present invention.
Number and name in the figure: 1. the solar cell panel comprises a lower shell 2, a battery 3, a PCB main board 4, an upper shell 5, a solar cell panel 6, a fixing plate 7, a screw 8, a glue filling hole 9 and a metal groove.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The utility model provides a wire temperature monitoring device, refers to fig. 1 to fig. 5, including dismantled and assembled device body, this internal solar cell panel 5, battery 2 and the PCB mainboard 3 that link to each other of electrical property that includes of device, PCB mainboard 3 includes MCU module, chip module, temperature monitoring sensor module, charge management circuit and step-down converter, solar cell panel 5 still data connection has the LORA module, the temperature data that temperature monitoring sensor module was gathered is received to the MCU module, and will data after the temperature data variation reaches the settlement numerical value pass through the host computer and upload to cloud service platform. The device body is oval, including epitheca 4 and inferior valve 1 two parts, and whole shell length is 77mm, wide 60mm, high 25mm, and is whole frivolous, has improved weight and space ratio than the design in the past. The LORA module adopts a 2.4GHz frequency band for wireless transmission, the receiving power consumption of the 2.4G LORA module is 8MA, the receiving sensitivity is as high as-130 dB, the power consumption can be reduced to 0.2uA in a sleep state, the bandwidth of the module can reach 202K when the module works in the 2.4G frequency band, and the LORA module has the characteristics of high transmission speed and low energy consumption; in the second embodiment, the LORA module further has a ranging function, the distance between the two 2.4G LORA modules is calculated according to the communication time between the two modules, and the wireless module has a wide application scene; in addition, the module is small in size, 23MM in overall length, 14.3MM in width and 2.7MM in height, a mounting hole with the diameter being 46.5MM is formed in the upper cover and used for mounting the LORA module, interference on the LORA module can be reduced, and data can be transmitted better by the LORA.
In an embodiment, referring to fig. 2 and 3, the solar panel 5 is a single crystal silicon cell 2 plate, and the utility model discloses a combination of solar panel and battery 2 provides stable power for the equipment. After the monocrystalline silicon cell 2 plate absorbs sunlight, solar radiation energy is directly converted into electric energy through a photoelectric effect, and then the electric energy is led out through an anode and a cathode wire to supply power to a post-stage circuit, and the power with 4.5V voltage and 0.2W can be generally provided. In the daytime, the solar panel stores electric energy for the battery 2 when supplying power for the wire temperature monitoring sensor, and is supplied power for the battery 2 alone at night.
In an embodiment, referring to fig. 1 and 2, the device body comprises an upper shell 4 and a lower shell 1 which are mutually covered, a temperature monitoring sensor module is arranged on the side parts of the upper shell 4 and the lower shell 1 which are mutually covered, and a lead temperature probe of the temperature monitoring sensor module is fixed through a fixing plate 6.
The chip module comprises a real-time chip, a storage chip and a temperature acquisition chip. In one embodiment, referring to fig. 5, the real-time chip provides a real-time calibration model for the MCU, and the memory chip module can store data into the chip during remote upgrade; the real-time chip and the storage chip automatically enter a dormant state when not working.
The metal slot 9 has been seted up on inferior valve 1, the metal slot 9 internal fixation has heat conduction silica gel, fixed heat conduction silica gel that metal slot 9 can be better prevents to shake on the way in the transportation, leads to heat conduction silica gel to drop.
The solar cell panel is characterized in that a mounting hole is formed in the upper shell 4, the solar cell panel 5 is arranged in the mounting hole, and the diameter of the mounting hole is 51MM and is matched with the size of the solar cell panel.
Still include the antenna, the antenna is integrated in the LORA module, can directly use the integrated antenna in the LORA module, can reduce equipment work load, raises the efficiency.
The wire temperature probe sends temperature acquisition data to the host at regular time; the MCU module collects data detected by the temperature collecting chip once every 30 seconds, the temperature data received by the MCU is uploaded to the host through the LORA module after the change of the temperature data is larger than a set value, and otherwise, the data is uploaded once after 10 minutes. In one embodiment, referring to fig. 3 and 4, the lead temperature probe device is timed to collect and transmit data once in about 10 minutes, the transmit data consumes about 9mA for a duration of about 100mS, and when a temperature change on the lead is monitored to exceed 1 ℃ for one minute, the transmit data consumes about 9mA for a duration of about 100 mS. In an embodiment, referring to fig. 5, if the variation of the collected temperature data is greater than or equal to 1 ℃ and the duration is 1 minute, the MCU uploads the collected temperature data to the host computer through the LORA module after 1 minute, and the MCU uploads the data every 10 minutes if the variation of the collected temperature data every 30 seconds is less than 1 ℃.
In an embodiment, referring to fig. 1 and 2, the inside of the upper shell 4 is further provided with a glue filling hole 8, the glue filling hole 8 is arranged on the upper cover, the diameter of the glue filling hole 8 is 56.5mm, and the glue filling hole 8 enables glue to flow in along the hole, so that the functions of preventing water and fixing the solar panel are achieved.
Inferior valve 1 passes through screw 7 fixed wire temperature monitoring device, screw 7 is the copper nail and is connected with heat conduction silica gel. The lower shell 1 is further provided with a mounting hole for fixing the equipment shell, and in addition, the temperature of the wire is transmitted to the heat-conducting silica gel and then to the temperature acquisition chip by the screw 7 arranged in the mounting hole. The screw 7 is made of copper, has good heat-conducting property, and can quickly and stably transfer the temperature on the lead to the temperature acquisition chip.
It is right above the utility model discloses explanation that wire temperature monitoring device goes on for help understands the utility model discloses, nevertheless the utility model discloses an embodiment does not receive the restriction of above-mentioned embodiment, and any does not deviate from the utility model discloses change, modification, substitution, combination, simplification made under the principle all should be equivalent replacement mode, all contain within the protection scope of the utility model.

Claims (10)

1. The utility model provides a wire temperature monitoring device, includes dismantled and assembled device body, its characterized in that, this internal solar cell panel, battery and the PCB mainboard that links to each other of electrical property of including of device, the PCB mainboard includes MCU module, chip module, temperature monitoring sensor module, charge management circuit and buck converter, solar cell panel still data connection has the LORA module, the temperature data that temperature monitoring sensor module gathered is received to the MCU module, and will the data after the temperature data change value reaches the settlement numerical value are uploaded to cloud service platform through the host computer.
2. The wire temperature monitoring device according to claim 1, wherein the device body comprises an upper shell and a lower shell which are mutually covered, a temperature monitoring sensor module is arranged on the side parts of the upper shell and the lower shell which are mutually covered, and a wire temperature probe of the temperature monitoring sensor module is fixed through a fixing plate.
3. The wire temperature monitoring device of claim 1, wherein the chip module comprises a real-time chip, a memory chip, and a temperature acquisition chip.
4. The wire temperature monitoring device of claim 2, wherein a metal groove is formed on the lower shell, and heat-conducting silica gel is fixed in the metal groove.
5. The wire temperature monitoring device of claim 2, wherein the upper housing is provided with a mounting hole, and the solar panel is disposed in the mounting hole.
6. The wire temperature monitoring device of claim 1, further comprising an antenna integrated within the LORA module.
7. The wire temperature monitoring device of claim 2, wherein the wire temperature probe periodically transmits temperature acquisition data to a host computer.
8. The lead wire temperature monitoring device according to claim 1 or 7, wherein the MCU module collects data detected by the temperature collection chip once every 30 seconds, the temperature data received by the MCU is uploaded to the host through the LORA module after the change of the temperature data is larger than a set value, and otherwise, the data is uploaded once after 10 minutes.
9. The wire temperature monitoring device of claim 1, wherein the upper shell is further provided with a glue filling hole inside.
10. The wire temperature monitoring device of claim 1, wherein the lower shell fixes the wire temperature monitoring device by a screw, and the screw is a brass nail and is connected with the heat-conducting silica gel.
CN202120295421.7U 2021-02-02 2021-02-02 Wire temperature monitoring device Active CN214040425U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120295421.7U CN214040425U (en) 2021-02-02 2021-02-02 Wire temperature monitoring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120295421.7U CN214040425U (en) 2021-02-02 2021-02-02 Wire temperature monitoring device

Publications (1)

Publication Number Publication Date
CN214040425U true CN214040425U (en) 2021-08-24

Family

ID=77348490

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120295421.7U Active CN214040425U (en) 2021-02-02 2021-02-02 Wire temperature monitoring device

Country Status (1)

Country Link
CN (1) CN214040425U (en)

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