CN214011841U - Electronic mainboard for electronic component that water-proof effects is good - Google Patents
Electronic mainboard for electronic component that water-proof effects is good Download PDFInfo
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- CN214011841U CN214011841U CN202023085810.1U CN202023085810U CN214011841U CN 214011841 U CN214011841 U CN 214011841U CN 202023085810 U CN202023085810 U CN 202023085810U CN 214011841 U CN214011841 U CN 214011841U
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Abstract
The utility model discloses an electronic motherboard for electronic component that water-proof effects is good, including the mainboard body, the mainboard body includes surface protection layer, welding locating plate, PCB base plate, bottom plate and water proof membrane, the top fixedly connected with PCB base plate of bottom plate, the top fixedly connected with welding locating plate of PCB base plate, the top fixedly connected with surface protection layer of welding locating plate, surface protection layer includes waterproof layer, oxidation resisting layer and corrosion resistant layer, the bottom fixedly connected with oxidation resisting layer of corrosion resistant layer, the bottom fixedly connected with waterproof layer of oxidation resisting layer, the thickness of waterproof layer is 0.25mm, oxidation resisting layer's thickness is 0.30 mm. The utility model discloses a set up the welding locating plate, can make the surface of device be convenient for weld electronic component, effectively promoted the practicality of device, through setting up the surface protection layer, can reach waterproof corrosion-resistant effect, effectively promoted the barrier propterty on device surface.
Description
Technical Field
The utility model relates to an electronic motherboard technical field specifically is a good electronic component of water-proof effects uses electronic motherboard.
Background
The mainboard, also called mainboard, system board or mother board, is installed in the machine box, is one of the most basic and important components of the microcomputer, the mainboard is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally has elements of BIOS chip, I/O control chip, keyboard and panel control switch interface, indicator lamp plug-in unit, expansion slot, mainboard and direct current power supply plug-in unit of plug-in card, etc., and the existing electronic mainboard has poor waterproof effect, is easy to generate short circuit when meeting water or being affected with damp, and is easy to cause heat accumulation and poor heat dissipation effect after long-time operation.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic mainboard for electronic component that water-proof effects is good, possess waterproof corrosion-resistant, the radiating effect is good, the advantage of the installation of being convenient for, it is relatively poor to have solved current electronic mainboard water-proof effects, meets water or the phenomenon of the short circuit that very easily appears that wets to long-time operation leads to the heat gathering easily, the relatively poor problem of radiating effect.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an electronic motherboard for electronic component that water-proof effects is good, includes the mainboard body, the mainboard body includes surface protection layer, welding locating plate, PCB base plate, bottom plate and water proof membrane, the top fixedly connected with PCB base plate of bottom plate, the top fixedly connected with welding locating plate of PCB base plate, the top fixedly connected with surface protection layer of welding locating plate, surface protection layer includes waterproof layer, oxidation resisting layer and corrosion resistant layer.
Preferably, the bottom of the corrosion-resistant layer is fixedly connected with an anti-oxidation layer, and the bottom of the anti-oxidation layer is fixedly connected with a waterproof layer.
Preferably, the thickness of the waterproof layer is 0.25mm, the thickness of the oxidation-resistant layer is 0.30mm, and the thickness of the corrosion-resistant layer is 0.32 mm.
Preferably, the bottom of the bottom plate is fixedly connected with a waterproof membrane, and the thickness of the waterproof membrane is 0.85 mm.
Preferably, the equal fixedly connected with erection column in both sides of mainboard body, the mounting groove has been seted up to the lower extreme of erection column.
Preferably, the bottom of the mainboard body is fixedly connected with a heat-conducting plate, and the surface of the heat-conducting plate is fixedly connected with radiating fins.
Preferably, the thickness of the bottom plate is smaller than that of the PCB substrate, and the thickness of the bottom plate is 1.5 mm.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up the welding locating plate, can make the surface of device be convenient for weld electronic component, effectively promoted the practicality of device, through setting up the surface protection layer, can reach waterproof corrosion-resistant effect, effectively promoted the barrier propterty on device surface.
2. The utility model can avoid the phenomenon of short circuit caused by the moisture of the upper surface of the device by using the waterproof layer, effectively improve the waterproof performance of the device, avoid the phenomenon of accelerated aging caused by the oxidation of the surface of the device by using the oxidation resistant layer, effectively improve the oxidation resistance of the device, avoid the device from being damaged by the corrosion of acid and alkali substances by using the corrosion resistant layer, effectively improve the corrosion resistance of the device, avoid the moisture of the bottom of the device by using the waterproof film, further improve the waterproof performance of the device, ensure that the device can achieve the effect of convenient installation and fixation by arranging the installation column and the installation groove, effectively improve the convenience of the installation of the device, increase the contact area between the device and the air by arranging the heat conducting plate and the radiating fins, effectively improve the radiating effect of the device, and through arranging the bottom plate, can play the effect of insulating high temperature resistance, effectively promote the life of device.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a partial cross-sectional view of the main board body of the present invention;
fig. 3 is a partial cross-sectional view of the surface protection layer of the present invention.
In the figure: 1. a main board body; 2. mounting a column; 3. a heat conducting plate; 4. a heat sink; 5. a surface protective layer; 6. welding a positioning plate; 7. a PCB substrate; 8. a base plate; 9. a water-resistant film; 10. a waterproof layer; 11. an anti-oxidation layer; 12. a corrosion resistant layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses a mainboard body 1, erection column 2, heat-conducting plate 3, fin 4, surface protection layer 5, welding position board 6, PCB base plate 7, bottom plate 8, water proof membrane 9, waterproof layer 10, oxidation resisting layer 11 and corrosion resistant layer 12 part are the parts that general standard spare or field technical personnel know, and its structure and principle all are this technical personnel all can learn through the technical manual or learn through conventional experimental approach.
Referring to fig. 1-3, an electronic motherboard for electronic components with good waterproof effect comprises a motherboard body 1, wherein the motherboard body 1 comprises a surface protective layer 5, a welding positioning plate 6, a PCB substrate 7, a bottom plate 8 and a waterproof membrane 9, mounting posts 2 are fixedly connected to both sides of the motherboard body 1, mounting grooves are formed at the lower ends of the mounting posts 2, the device can be conveniently mounted and fixed by arranging the mounting posts 2 and the mounting grooves, the convenience of the device mounting is effectively improved, a heat conducting plate 3 is fixedly connected to the bottom of the motherboard body 1, a radiating fin 4 is fixedly connected to the surface of the heat conducting plate 3, the contact area between the device and the air can be increased by arranging the heat conducting plate 3 and the radiating fin 4, the radiating effect of the device is effectively improved, the PCB substrate 7 is fixedly connected to the top of the bottom plate 8, and the waterproof membrane 9 is fixedly connected to the bottom of the bottom plate 8, the thickness of the waterproof membrane 9 is 0.85mm, through the use of the waterproof membrane 9, the bottom of the device can be prevented from being wetted, the waterproofness of the device is further improved, the top fixedly connected with welding positioning plate 6 of the PCB substrate 7, the top fixedly connected with surface protection layer 5 of the welding positioning plate 6, the surface protection layer 5 comprises a waterproof layer 10, an oxidation resistant layer 11 and an corrosion resistant layer 12, the bottom fixedly connected with oxidation resistant layer 11 of the corrosion resistant layer 12, the bottom fixedly connected with waterproof layer 10 of the oxidation resistant layer 11, the thickness of the waterproof layer 10 is 0.25mm, the thickness of the oxidation resistant layer 11 is 0.30mm, the thickness of the corrosion resistant layer 12 is 0.32mm, through the use of the waterproof layer 10, the phenomenon that the upper surface of the device is wetted to cause short circuit can be avoided, the waterproofness of the device is effectively improved, through the use of the oxidation resistant layer 11, the phenomenon that the surface of the device is oxidized and accelerated to age can be avoided, effectively promoted the antioxidant capacity of device, use through corrosion resistant layer 12, can avoid the device to receive the corruption of acid-base material and damage, the corrosion resistance of device has effectively been promoted, bottom plate 8's thickness is less than PCB base plate 7's thickness, bottom plate 8's thickness is 1.5mm, through setting up bottom plate 8, can play insulating high temperature resistance's effect, the life of device has effectively been promoted, through setting up welding locating plate 6, the surface that can make the device is convenient for weld electronic component, the practicality of device has effectively been promoted, through setting up surface inoxidizing coating 5, can reach waterproof corrosion resistant effect, the barrier propterty on device surface has effectively been promoted.
When the waterproof device is used, the waterproof layer 10 is made of amino polyvinyl alcohol emulsified asphalt waterproof paint, the phenomenon of short circuit caused by the fact that the upper surface of the device is wetted can be avoided through the waterproof layer 10, the waterproof performance of the device is effectively improved, the oxidation-resistant layer 11 is made of high-temperature sealing oxidation-resistant nano composite ceramic paint, the phenomenon that the surface of the device is oxidized and accelerated to age can be avoided through the oxidation-resistant layer 11, the oxidation resistance of the device is effectively improved, the corrosion-resistant layer 12 is made of polyurethane anti-corrosion paint, the device can be prevented from being corroded and damaged by acid and alkali substances through the corrosion-resistant layer 12, the corrosion resistance of the device is effectively improved, the bottom plate 8 is made of a ceramic plate, the bottom plate 8 is arranged, the effects of insulation and high temperature resistance can be achieved, the service life of the device is effectively prolonged, and the waterproof film 9 is made of a polyethylene waterproof composite film, through the use of water proof membrane 9, can avoid the device bottom to wet, further promote the waterproof nature of device, through the cooperation of above-mentioned structure, can make the device reach waterproof corrosion-resistant, the radiating effect is good, the advantage of the installation of being convenient for, is fit for using widely.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a good electronic component of water-proof effects uses electronic motherboard, includes mainboard body (1), its characterized in that: mainboard body (1) includes surface protection layer (5), welding locating plate (6), PCB base plate (7), bottom plate (8) and water proof membrane (9), the top fixedly connected with PCB base plate (7) of bottom plate (8), the top fixedly connected with welding locating plate (6) of PCB base plate (7), the top fixedly connected with surface protection layer (5) of welding locating plate (6), surface protection layer (5) include waterproof layer (10), oxidation resistance layer (11) and corrosion resistant layer (12).
2. The electronic motherboard for electronic components with good waterproof effect according to claim 1, wherein: the bottom of the corrosion-resistant layer (12) is fixedly connected with an oxidation-resistant layer (11), and the bottom of the oxidation-resistant layer (11) is fixedly connected with a waterproof layer (10).
3. The electronic motherboard for electronic components with good waterproof effect according to claim 1, wherein: the thickness of the waterproof layer (10) is 0.25mm, the thickness of the oxidation resistant layer (11) is 0.30mm, and the thickness of the corrosion resistant layer (12) is 0.32 mm.
4. The electronic motherboard for electronic components with good waterproof effect according to claim 1, wherein: the bottom of bottom plate (8) fixedly connected with waterproof membrane (9), waterproof membrane (9)'s thickness is 0.85 mm.
5. The electronic motherboard for electronic components with good waterproof effect according to claim 1, wherein: the equal fixedly connected with erection column (2) in both sides of mainboard body (1), the mounting groove has been seted up to the lower extreme of erection column (2).
6. The electronic motherboard for electronic components with good waterproof effect according to claim 1, wherein: the bottom fixedly connected with heat-conducting plate (3) of mainboard body (1), the fixed surface of heat-conducting plate (3) is connected with fin (4).
7. The electronic motherboard for electronic components with good waterproof effect according to claim 1, wherein: the thickness of bottom plate (8) is less than the thickness of PCB base plate (7), the thickness of bottom plate (8) is 1.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023085810.1U CN214011841U (en) | 2020-12-18 | 2020-12-18 | Electronic mainboard for electronic component that water-proof effects is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023085810.1U CN214011841U (en) | 2020-12-18 | 2020-12-18 | Electronic mainboard for electronic component that water-proof effects is good |
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| CN214011841U true CN214011841U (en) | 2021-08-20 |
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| CN202023085810.1U Active CN214011841U (en) | 2020-12-18 | 2020-12-18 | Electronic mainboard for electronic component that water-proof effects is good |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116501141A (en) * | 2023-06-26 | 2023-07-28 | 深圳市鼎盛智能技术有限公司 | Waterproof and moistureproof industrial control host, installation device and installation method |
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2020
- 2020-12-18 CN CN202023085810.1U patent/CN214011841U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116501141A (en) * | 2023-06-26 | 2023-07-28 | 深圳市鼎盛智能技术有限公司 | Waterproof and moistureproof industrial control host, installation device and installation method |
| CN116501141B (en) * | 2023-06-26 | 2024-01-19 | 深圳市鼎盛智能技术有限公司 | Waterproof and moistureproof industrial control host, installation device and installation method |
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