CN214010615U

CN214010615U - Pressure detection module and electronic equipment

Info

Publication number: CN214010615U
Application number: CN202120367240.0U
Authority: CN
Inventors: 冯林
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2021-02-09
Filing date: 2021-02-09
Publication date: 2021-08-20
Anticipated expiration: 2031-02-09
Also published as: CN217084025U

Abstract

Provided are a pressure detection module and an electronic device. The pressure detection module sets up in the internal surface of electronic equipment's shell and includes: the device comprises a first electrode, a second electrode, a first circuit board, a second circuit board, a fixing piece and a force transmission piece; the first surface of the first electrode is fixed on the first circuit board, the second surface of the first electrode is opposite to the first surface of the second electrode, and the first electrode and the second electrode form a capacitor; the second surface of the second electrode is fixed on the second circuit board; the first circuit board is fixedly connected with the second circuit board through a fixing piece; the force transmission piece is located between the force input area of the shell and the first circuit board and used for transmitting the external pressure received by the force input area to the first circuit board and driving the first electrode on the first circuit board to move towards the second electrode, so that the capacitance between the first electrode and the second electrode changes, and the pressure detection result of the external pressure is determined according to the capacitance change. The scheme has simple design, production and assembly process and low cost.

Description

Pressure detection module and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of electronics, especially, relate to a pressure detection module and electronic equipment.

Background

The electronic equipment such as the earphone can detect whether the electronic equipment is pressed through the pressure detection module arranged in the electronic equipment, so that the operation control corresponding to the pressing is carried out. For example, whether the earphone is pressed is judged by a pressure detection module arranged in the earphone, so that the earphone is controlled to play music.

In the correlation technique, in order to make the pressure detection module install in electronic equipment's inside and realize above-mentioned function, the pressure detection module generally need be provided with two electrodes that special support comes the support pressure detection module, however, electronic equipment's inner space is very narrow and small usually, sets up special support and can lead to the pressure detection module production and assembly process complicacy to the application and the popularization of pressure detection module at electronic equipment have been restricted.

Therefore, it is an urgent technical problem to provide a pressure detecting module with simple production and assembly processes.

SUMMERY OF THE UTILITY MODEL

In view of the above, an embodiment of the present invention provides a pressure detection module and an electronic device, so as to solve some or all of the technical problems in the prior art.

In a first aspect, the pressure detection module is disposed on an inner surface of a housing of an electronic device, the pressure detection module comprising: the device comprises a first electrode, a second electrode, a first circuit board, a second circuit board, a fixing piece and a force transmission piece;

the first surface of the first electrode is fixed on the first circuit board, the second surface of the first electrode is opposite to the first surface of the second electrode, and the first electrode and the second electrode form a capacitor;

the second surface of the second electrode is fixed on the second circuit board;

the first circuit board is fixedly connected with the second circuit board through a fixing piece;

the force transmission piece is located between a force input area of the shell and the first circuit board and used for transmitting the external pressure received by the force input area to the first circuit board and driving the first electrode on the first circuit board to move towards the second electrode, so that the capacitance between the first electrode and the second electrode changes, and the pressure detection result of the external pressure is determined according to the change of the capacitance.

In a second aspect, an embodiment of the present application provides an electronic device, where a pressure detection module as described in any one of the first aspect is disposed inside a housing of the electronic device.

According to the pressure detection module and the electronic device provided by the embodiment of the application, the first surface of the first electrode of the pressure detection module is fixed on the first circuit board, the second surface of the first electrode is opposite to the first surface of the second electrode, and the first electrode and the second electrode form a capacitor; the second surface of the second electrode is fixed on the second circuit board; the first circuit board is fixedly connected with the second circuit board through a fixing piece; and the force transmitter is located between the force input region of the housing and the first circuit board. When the force input area of the shell receives external pressure, the external pressure is transmitted to the first circuit board, the first electrode on the first circuit board is driven to move towards the second electrode, and a pressure detection result of the external pressure is determined through capacitance change between the first electrode and the second electrode. Therefore, the pressure detection module of the embodiment of the application relies on the first circuit board provided with the first electrode and the second circuit board provided with the second electrode, and accurate pressure detection can be realized by matching with the simple force transmission piece without a support and additional other parts, so that the design, production and assembly processes of the pressure detection module are simplified, the cost is low, the processes are more conventional processes, and the influence of the processes on the yield and consistency of products can be reduced.

Drawings

Some specific embodiments of the present application will be described in detail hereinafter by way of illustration and not limitation with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

fig. 1 is a schematic structural diagram of a pressure detection module according to an embodiment of the present disclosure;

fig. 2 is a schematic view illustrating an operation principle of a pressure detection module according to an embodiment of the present disclosure;

fig. 3 and 4 are a top view and a cross-sectional view respectively illustrating an exemplary arrangement position of a first electrode in a pressure detection module provided in an embodiment of the present application;

fig. 5 and fig. 6 are a top view and a cross-sectional view respectively illustrating an exemplary arrangement position of a first electrode in a pressure detection module provided in an embodiment of the present application;

fig. 7 and fig. 8 are schematic diagrams illustrating arrangement positions of a first welding portion and a second welding portion in a pressure detection module according to an embodiment of the present disclosure;

fig. 9 and fig. 10 are schematic diagrams illustrating arrangement positions of a first welding portion and a second welding portion in a pressure detection module according to an embodiment of the present disclosure;

fig. 11 and 12 are a schematic structural diagram and a cross-sectional view of an electronic device with a pressure detection module according to an embodiment of the present application.

Detailed Description

Miniaturization and intellectualization of electronic devices have become a trend, and human-computer interaction experience of electronic devices is also receiving attention from more and more users. Generally, a pressure detection module may be disposed inside the electronic device, and the electronic device may be controlled to perform operation control corresponding to pressing by detecting whether the electronic device is pressed by the pressure detection module. To the pressure detection module, because the forced induction detection scheme has the advantage of touching by mistake for touch and strike the detection scheme, interactive experience is better, receives user's favor more and more. Capacitive pressure sensing schemes and resistive pressure sensing schemes are currently the predominant pressure sensing schemes. However, the resistive pressure sensing scheme requires an additional metal strain gauge or a semiconductor pressure sensor, which is expensive and can only be applied in high-end markets. The capacitive pressure detection scheme in the related art has high requirements on the design, production and assembly processes of the sensor and high production difficulty. For example, a bracket is usually required to be disposed in a narrow internal space of the electronic device to support two electrodes of the pressure detection module, which results in a complex production and assembly process of the pressure detection module, thereby limiting the application and popularization of the pressure detection module in the electronic device; moreover, even if the bracket is provided, the electrode for detecting the capacitor is very susceptible to the influence of the related assembly process, thereby affecting the performance of capacitor detection and affecting the yield of products.

In order to solve the above problem, this application embodiment provides a pressure detection module and electronic equipment, combines below the utility model discloses embodiment drawing further explains the utility model discloses the embodiment specifically realizes.

An embodiment of the present application provides a pressure detection module, as shown in fig. 1, fig. 1 is a structural diagram of the pressure detection module provided in the embodiment of the present application. The pressure detection module 10 is disposed on an inner surface of the housing 20 of the electronic device, and the pressure detection module 10 includes: a first electrode 101, a second electrode 103, a first circuit board 102, a second circuit board 104, a fixing member 105, and a force transmission member 106.

The first surface of the first electrode 101 is fixed to the first circuit board 102, the second surface of the first electrode 101 is opposite to the first surface of the second electrode 103, and the first electrode 101 and the second electrode 103 form a capacitor.

A second surface of the second electrode 103 is fixed to a second circuit board 104. The first circuit board 102 and the second circuit board 104 are fixedly connected by a fixing member 105.

The force transmission member 106 is located between the force input area of the housing and the first circuit board 102, and is used for transmitting the external pressure received by the force input area to the first circuit board 102 and driving the first electrode 101 on the first circuit board 102 to move toward the second electrode 103, so that the capacitance between the first electrode 101 and the second electrode 103 changes, and the pressure detection result of the external pressure is determined according to the capacitance change.

In this embodiment, the fixing member 105 forms an air gap between the first electrode and the second electrode, so that the first electrode and the second electrode form a capacitor, and when the pressure detection module is not pressed, the distance between the first electrode and the second electrode is the height of the fixing member.

In this embodiment, the force input area of the housing is an area of any shape, and the force input area may employ any indicia to indicate that a user may apply pressure to the area. This makes the force transmission member 106 transmit pressure to the first circuit board 102 along with the deformation of the housing when the force input area of the housing receives external pressure, so that the first circuit board 102 drives the first electrode 101 to move in the direction close to the second electrode 103. The first electrode 101 moves to a direction close to the second electrode 103, so that the distance between the first electrode 101 and the second electrode 103 is reduced, thereby changing the capacitance between the first electrode 101 and the second electrode 103, and determining the pressure detection result of the external pressure according to the change of the capacitance.

Specifically, as shown in fig. 2, the first electrode 101 and the second electrode 103 form a capacitance for pressure detection. The pressure sensing capacitor has a base capacitance value Cbase when no external pressure is applied to the force input area of the housing. When pressure is applied to the force input area of the housing, the force input area of the housing deforms, such that the force transmission member 106 transmits the external pressure to the first circuit board 102, causing the first circuit board 102 to deform. The deformation of the first circuit board 102 decreases the distance between the first electrode 101 and the second electrode 103, so that the capacitance value of the pressure detection capacitor formed by the first electrode 101 and the second electrode 103 is increased, for example, by Δ C, where the capacitance value of the pressure detection capacitor is Cbase + Δ C. By providing the capacitance detection controller 40 to detect the amount of capacitance change between the first electrode 101 and the second electrode 103 and comparing the amount of capacitance change with a preset capacitance change threshold value indicating a press, it is possible to accurately recognize whether there is a press operation with respect to the force input region of the housing.

Therefore, the pressure detection module of the embodiment of the application relies on the first circuit board provided with the first electrode and the second circuit board provided with the second electrode, through fixedly connecting the first circuit board with the second circuit board, accurate pressure detection can be realized by matching with the simple force transmission piece, a support and other additional components are not needed, the design, production and assembly processes of the pressure detection module are simplified, the cost is low, the processes are all more conventional processes, and the influence of the processes on the yield and consistency of products can be reduced.

In this embodiment, the first electrode 101 and the second electrode 103 may be sized according to the size of the internal cavity of the housing of the electronic device, for example, in a specific mode of the embodiment of the present application, the lengths of the first electrode 101 and the second electrode 103 are both less than or equal to 5mm, and the widths of the first electrode 101 and the second electrode 103 are both less than or equal to 1.5 mm. Illustratively, the first electrode 101 and the second electrode 103 each have a size of 1.5mm by 5mm in order to fully utilize the internal cavity of the electronic device (e.g., headset) while improving the sensitivity of pressure detection.

It should be understood that in other types of electronic devices, the first electrode 101 and the second electrode 103 may be adjusted according to the size of the installation space inside the electronic device, which is not limited in this embodiment.

In this embodiment, the first Circuit Board 102 may be a Printed Circuit Board (PCB) or a Flexible Printed Circuit Board (FPC).

In order to ensure the sensing sensitivity of the pressure detection module, in a specific implementation of the embodiment of the present application, the first circuit board 102 has a preset thickness, and the preset thickness is set to deform when the first circuit board 102 is subjected to the external pressure transmitted by the force transmission member 106.

In a specific implementation of this embodiment, the thickness of the first circuit board is greater than or equal to 0.6 mm and less than or equal to 1.2 mm. Illustratively, the predetermined thickness may be 0.8 mm. Therefore, the first circuit board can reliably support the first electrode, and meanwhile, the first circuit board is greatly deformed when receiving the external pressure transmitted by the force transmission piece, so that the sensitivity of pressure detection is improved.

It should be understood that the thickness of the first circuit board 102 may be selected according to the size of the first circuit board 102. For example, when the size of the first circuit board 102 is large, a relatively thick first circuit board 102 may be selected. When the size of the first circuit board 102 is smaller, the first circuit board 102 may be selected to be relatively thinner, which is not limited in the embodiment.

In this embodiment, the second Circuit Board 104 may be a Printed Circuit Board (PCB) or a Flexible Printed Circuit Board (FPC). The second circuit board 104 may be any suitable circuit board that is disposed inside the housing of the electronic device and does not move within the electronic device when a user presses the housing of the electronic device. For example, the second circuit board 104 may be fixed to a housing of the electronic device, and the second circuit board 104 may also be fixed to other components in the electronic device, which is not limited in this embodiment. Because first circuit board 102 and second circuit board 104 fixed connection, this makes second circuit board 104 can support first circuit board 102, and then can support first electrode 101 and second electrode 103, need not to set up the support that is used for supporting the pressure detection module in electronic equipment's narrow and small space from this, has simplified the production and the assembly degree of difficulty of pressure detection module, has greatly improved electronic equipment's production efficiency. In addition, the pressure detection module can adopt the first circuit board and the second circuit board which are conventional and low in cost, so that the cost of the pressure detection module is low, and the pressure detection module can be directly installed in the electronic equipment as a whole, so that the assembly process is further reduced, and the yield and the cost caused by the assembly process are reduced; in addition, the circuit board where the electrode for detecting the capacitance is located can reuse the existing circuit board of the electronic device, so as to simplify the electric connection mode between the electrode and the capacitance detection circuit, even the main control board, and reduce the arrangement of the related electric connecting pieces, thereby reducing the space of the electronic device and reducing the electric interference on the electronic device.

Specifically, use electronic equipment to set up in earphone pole portion for the example as earphone and pressure detection module, because after above-mentioned pressure detection module assembly was accomplished, to the condition of earphone pole non-detachable piece (promptly, the shell of earphone pole portion is a whole non-detachable), can fill in earphone pole portion with pressure detection module from the earphone afterbody, be favorable to the installation/equipment. Meanwhile, under the condition that the earphone rod part comprises an upper shell and a lower shell, the pressure detection module can be installed behind the lower shell (or the upper shell) of the earphone rod part, and the upper shell (or the lower shell) of the earphone rod part is covered on the lower shell (or the upper shell) of the earphone rod part to realize the assembly of the pressure detection module in the earphone. In addition, the circuit board where the electrode for detecting the capacitor is located can reuse the existing circuit board in the earphone, so that the electric connection mode between the electrode and the capacitor detection circuit and even between the electrode and the main control board is simplified, the arrangement of related electric connectors is reduced, the internal space of the earphone is saved, convenience is provided for the installation of other electronic components such as an antenna of the earphone, and the interference of a pressure detection module on the electronic components is avoided.

In one implementation of the embodiment of the present application, as shown in fig. 3 and 4, the second circuit board 104 is disposed on the circuit board main board 30 of the electronic device. Specifically, the second circuit board 104 may be fixedly connected to the circuit board main board 30 through a pad and a glue layer, so that the second circuit board 104 does not need to be fixed to a housing of the electronic device, and a support component does not need to be arranged for the second circuit board 104, thereby simplifying the assembly process and reducing the space of the electronic device occupied by the pressure detection module.

Alternatively, in a specific implementation of the embodiment of the present application, as shown in fig. 5 and fig. 6, the second circuit board 104 is a circuit board main board 30 of an electronic device. The circuit board main board 30 is fixedly connected to the housing by screws, glue and snaps, for example. The circuit board main board 30 is provided with a sensor area 301, and the second electrode 103 is provided in the sensor area 301. Specifically, a second surface of the second electrode 103 is fixed to the sensor region 301, and a first surface of the second electrode 103 is opposed to the first electrode 101 to form a capacitance for pressure detection. Since the second electrode 103 is directly disposed on the main board of the circuit board, the occupied space of the electronic device can be maximally reduced.

In this embodiment, the first circuit board 102 and the second circuit board 104 are fixedly connected by a fixing member 105. Specifically, the ends, corners, edges, or the like of the first circuit board 102 and the second circuit board 104 may be fixed by the fixing member 105 so that the second surface of the first electrode 101 and the first surface of the second electrode 103 have a predetermined distance therebetween, forming a capacitance for pressure detection.

In one implementation of the embodiment of the present application, the first circuit board 102 and the second circuit board 104 are fixedly connected by a solder. The welding piece is a specific implementation mode of the fixing piece. For example, a bonding pad may be disposed at an edge position of the first circuit board 102 or the first electrode 101, and a pad matching the bonding pad may be disposed at an edge position of the second circuit board 104 or the second electrode 102, and the bonding pad may be bonded together by Surface Mount Technology (SMT), thereby fixing the first circuit board 102 and the second circuit board 104 as a single body. The matching of the welding points and the positions of the bonding pads can ensure that the first electrode 101 is opposite to the second electrode 103 during assembly, and the assembly precision of the pressure detection module is improved.

For example, in a specific implementation, four corners of the first electrode 101 are provided with soldering points, four corners of the second electrode 102 are provided with pads matching with the soldering points, and the first circuit board 102 and the second circuit board 104 are fixed as a whole by the soldering points and the pads. A solder joint is provided at each corner of the first circuit board 102, and when the force transmission member 106 transmits the same external pressure to the first circuit board 102, the first circuit board 102 can be largely deformed in a direction toward the second circuit board 104 with the four corners of the first electrode 101 as supporting points, thereby improving the sensitivity of pressure detection.

For another example, in a specific implementation, two opposite ends of the first electrode 101 are provided with a soldering point, two opposite ends of the second electrode 103 are provided with a pad matching with the soldering point, and the first electrode 101 and the second electrode 103 are fixedly connected through the pad and the soldering point, so that the first circuit board 102 and the second circuit board 104 are fixed as a whole. For example, a solder joint is provided at each corner of the first circuit board 102, and when the force transmission member 106 transmits the same external pressure to the first circuit board 102, the first circuit board 102 may be largely deformed in a direction toward the second circuit board 104 with both ends of the first electrode 101 as supporting points, whereby the sensitivity of pressure detection may be improved.

It should be understood that the soldering points and the soldering pads may be disposed on the first circuit board 103 and the second circuit board 104, respectively, and the specific locations and the number of the soldering points and the soldering pads may be similar to those of the soldering points and the soldering pads disposed on the first electrode 101 and the second electrode 102, and therefore, for avoiding redundancy, the detailed description thereof is omitted.

Preferably, in one implementation of the present application, the solder joint is disposed on the first circuit board 102 at the periphery of the first electrode 101, and the solder joint is disposed on the second circuit board 104 at a position matching the solder joint at the periphery of the second electrode 103. Thereby, it is possible to achieve the miniaturization of the sizes of the first circuit board 102 and the second circuit board 104 while improving the sensitivity of the pressure detection.

For example, as shown in fig. 7 and 8, the number of the pads 105a and the pads 105b is 4 each. The 4 soldering points 105a are respectively disposed on the first circuit board 102 and near the four corners of the first electrode 101, correspondingly, the 4 bonding pads 105b are respectively disposed on the second circuit board 104 and near the four corners of the second electrode 103, and the 4 bonding pads correspond to the 4 soldering points respectively. In the examples of fig. 6 and 7, when the force transmission member transmits the same external pressure to the first circuit board 102, the first circuit board 102 may be largely deformed in a direction toward the second circuit board 104, so that the sensitivity of pressure detection may be improved while achieving a minimization in the size of the first circuit board 102 and the second circuit board 104.

For example, as shown in fig. 9 and 10, the number of the soldering points 105a and the number of the soldering pads 105b are 2, 2 soldering points 105a are respectively disposed on the first circuit board at positions close to the two opposite ends of the first electrode, and 2 soldering pads 105b are disposed on the second circuit board at positions close to the two opposite ends of the second electrode. Specifically, 2 pads and 2 pads are respectively located near both ends of the first electrode and the second electrode having a shorter side length. The 2 pads correspond to the 2 welding points respectively. When the force transmission member 106 transmits the same external pressure to the first circuit board 102, the first circuit board 102 may be largely deformed in a direction toward the second circuit board 104 with 2 supporting points at both ends having a shorter side length, so that the sensitivity of pressure detection may be improved while the size minimization of the first circuit board 102 and the second circuit board 104 may be achieved.

It should be understood that the number and the positions of the pads 105a and the pads 105b are only examples, and in other implementations, more pads 105a and pads 105b may be provided as needed, which is not limited by the embodiment.

In this embodiment, the pad forms an air gap between the first electrode and the second electrode, so that the first electrode and the second electrode form a capacitor, and when the pressure detection module is not pressed, the distance between the first electrode and the second electrode is the height of the pad. In the embodiment, the first electrode and the second electrode are reliably supported through the bonding pad and the welding point by a simple process, the first electrode and the second electrode are separated by a certain distance, and the first electrode and the second electrode are electrically insulated, so that the first electrode and the second motor form an electrode for pressure detection.

Since the distance between the first electrode and the second electrode is the height of the pad, the distance between the first electrode and the second electrode can be adjusted by controlling the height of the pad. For example, the thickness of the solder paste applied to the pad 105b is controlled by controlling the size of the steel mesh at the time of SMT, thereby controlling the height of the pad, thereby controlling the distance between the first electrode 101 and the second electrode 103 through a simple process.

It should be understood that the gap between the first electrode 101 and the second electrode 103 may be an air gap or may be filled with a soft filler, which is not limited in this embodiment.

In order to realize that the capacitance formed by the first electrode 101 and the second electrode 103 can reflect the external pressure and minimize the distance between the first electrode 101 and the second electrode 103, thereby occupying a smaller internal space of the electronic device, in a specific implementation of the present application, the distance between the first electrode 101 and the second electrode 103 is greater than or equal to 0.1 mm and less than or equal to 0.4 mm. Therefore, a certain semaphore of the detected pressure signal can be ensured, the accuracy that the detected pressure is influenced due to the fact that the signal cannot be detected or the detected signal is weak is avoided, and the size and the thickness of the pressure detection module can be reduced.

In one implementation of the embodiment of the present application, the fixing member 105 includes at least two first adhesive members having a predetermined height. The first adhesive member may be gelatin, or may be a double-sided tape having adhesive force on both upper and lower surfaces thereof.

In one specific implementation of the present application, a first adhesive member is disposed between the first circuit board 102 and the second circuit board 104 for fixing the ends of the first circuit board 102 and the second circuit board 104, and a preset height is set such that the first electrode 101 and the second electrode 103 form a capacitance. Preferably, the first adhesive member is disposed between the first circuit board 102 and the second circuit board 104 and at the periphery of the first electrode 101 and the second electrode 103. For example, the first adhesive member is disposed between the first circuit board 102 and the second circuit board 104 and at the periphery of the first electrode 101 and the second electrode 103.

It is to be understood that a first adhesive member may be disposed between the first electrode 101 and the second electrode 103 for fixing the ends of the first electrode 101 and the second electrode 103. In this embodiment, the number and the arrangement position of the first adhesion parts are similar to those of the welding points 105a, and therefore, detailed description is omitted here for avoiding redundancy.

It should be understood that the distance between the first electrode 101 and the second electrode 103 can be adjusted accordingly by adjusting the preset height of the first adhesive member, so that the distance between the first electrode 101 and the second electrode 103 can ensure a certain signal amount of the detected pressure signal, thereby avoiding the influence on the accuracy of the detected pressure due to the fact that the signal is not detected or the detected signal is weak, and reducing the volume and thickness of the pressure detection module.

In this embodiment, the force transmission member 106 is located between the force input area of the housing and the first circuit board, specifically, between the inner surface of the force input area of the housing and the surface of the first circuit board 102 far from the first electrode 101, so as to accurately transmit the external pressure applied to the force input area of the housing 20 to the first circuit board 102. For convenience of description, hereinafter, a surface of the first circuit board 102 on which the first electrode 101 is disposed is referred to as a first surface of the first circuit board 102, and a surface of the first circuit board 102 away from the first electrode 101 is referred to as a second surface of the first circuit board 102. The present embodiment does not limit the manner in which the force transmission member is disposed between the force input region of the housing and the first circuit board. For example, both ends of the force transmission member 106 may be fixed to the first circuit board and the inner surface of the force input area of the housing, respectively, by means of bonding, soldering, or the like.

Alternatively, in another specific implementation of the present application, one end of the force transmitter 106 is fixed to the first circuit board and the other end of the force transmitter abuts against the force input area of the housing. Specifically, one end of the force transmission member 106 may be fixed on the second surface of the first circuit board 102 by means of adhesion or welding, etc., while the other end abuts against the inner surface of the force input area of the housing and is rigidly connected with the inner surface of the force input area of the housing, which makes it possible to mount the pressure detection module as a whole in the housing of the electronic device, which is convenient for mounting and/or assembling, and is suitable for the case of a housing detachable or non-detachable piece of the electronic device.

Specifically, for example, the electronic device is used as an earphone and the pressure detection module is arranged on the rod part of the earphone, the force transmission piece abuts against the shell of the rod part of the earphone instead of not fixing the shell of the rod part of the earphone, so that the pressure detection module can be plugged into the rod part of the earphone as a whole after the assembly is completed, and the installation/assembly is facilitated. In addition, because need not fix the internal surface of the casing of earphone pole portion with force transmission piece, consequently can be as a whole (for example from the afterbody of earphone) the pole portion of plugging in the earphone after accomplishing the pressure detection module assembly, also can cover the epitheca and the inferior valve of earphone pole portion after accomplishing the pressure detection module assembly, set up the pressure detection module in earphone pole portion, make the pressure detection module be applicable to the condition that earphone pole is not detachable (i.e., the shell of earphone pole portion is a whole undetachable) and the condition that earphone pole is detachable (i.e., earphone pole portion includes epitheca and inferior valve).

In one specific implementation of the present application, the force transmission member 106 is located at a central position of the force input area, i.e. the position where the force transmission member 106 is in contact with the force input area of the housing is the central position of the force input area. Therefore, when the force input area of the housing is deformed by receiving the external pressure, the center position of the force input area is deformed most, which can maximally transmit the received external pressure to the first circuit board 102.

In one embodiment of the present application, the force transfer member 106 is an elastic member, and when the force input region is unstressed, the elastic member is in a compressed state such that the elastic member abuts against the force input region of the housing by tension. This allows the force transmission member 106 to absorb assembly tolerance and/or material tolerance when the pressure detection module is assembled with the housing of the electronic device, thereby further improving the accuracy and consistency of pressure detection.

For example, in an assembly design, the distance between the second surface of the first circuit board 102 (i.e., the surface on which the force transmission member 106 is located) in the pressure detection module and the force input area of the housing should be 1.5 mm. However, in the actual assembly process, the distance of the second surface of the first circuit board 102 from the force input area of the housing is only 1.2mm due to assembly tolerances and/or material tolerances. At this time, due to a certain elastic strength of the force transmission member 106, the force transmission member 106 can be installed between the second surface of the first circuit board 102 and the force input area of the housing, and will not cause deformation of the first circuit board 102, i.e. absorb assembly tolerance and/or material tolerance of the pressure detection module and the housing of the electronic device.

It will be appreciated that the force transmitter 106 should also have some rigidity, thereby ensuring that ambient pressure applied by a user to the force input area of the housing is accurately transmitted to the first circuit board 102.

To achieve a simpler and lower cost mounting, the force transmission member 106 may be a spring, a thimble, or a silicone pad. It should be understood that this is merely an example, and in other embodiments, the force transmission member 106 may be another member having similar elasticity and rigidity, which is not limited by this embodiment.

The embodiment of the application provides electronic equipment, and a pressure detection module provided by any one of the embodiments is arranged in a shell of the electronic equipment.

In this embodiment, the electronic device may be any suitable electronic device that requires pressure detection. For example, the electronic device may be a headset, such as a True Wireless Stereo (TWS) headset, a neck-headphones, or a headset. For another example, the electronic device may also be a wearable device, such as a smart watch, smart glasses, or the like. For example, the electronic device may be an electric toothbrush, a remote controller, an electronic cigarette, or the like.

The pressure detection module of the present embodiment may be disposed at any suitable position inside the housing of the electronic device. For example, when the electronic device is a headset, the pressure detection module may be located in the stem of the headset. When electronic equipment is intelligent glasses, the pressure detection module can be located the pole portion of being connected with the lens on the intelligent glasses. It should be understood that this is only an example, and the present embodiment is not limited thereto.

For easy understanding, the setting position and the assembling process of the pressure detection module will be described in detail below with reference to fig. 11 and 12 by taking an electronic device as an example. In this example, the pressure detection module 10 is arranged inside the housing of the stem 21 of the headset.

Specifically, as shown in fig. 11 and 12, a first surface of the first electrode is fixed to the first circuit board 102, a second surface of the first electrode is opposite to a first surface of the second electrode, and the first electrode and the second electrode form a capacitance. The second surface of the second electrode is fixed to the second circuit board 104. The first circuit board 102 and the second circuit board 104 are fixedly connected by a fixing member 105. The force transmission member 106 is disposed on a surface of the first circuit board 102 away from the first electrode. After the pressure detection module is assembled, the earphone stem can be directly inserted from the rear of the earphone, so that the force transmission member 106 is disposed between the first circuit board and the inner surface of the force input area of the earphone stem housing. For the uncovering type earphone, after the pressure detection module is installed on the lower shell (or the upper shell) of the earphone rod part, the upper shell (or the lower shell) of the earphone rod part is covered on the lower shell (or the upper shell) of the earphone rod part, and the force transmission part is ensured to be rigidly connected with the inner surface of the rod part shell.

The installation and assembly processes are conventional production processes, the assembly is simple, the steps are few, and the production efficiency is greatly improved. In addition, because two electrodes are arranged on the second circuit board and the first circuit board in the pressure detection module, accurate pressure detection can be realized by matching with a simple force transmission piece, a support and other extra components are not needed, and the design, the production and the assembly process of the pressure detection module are simplified. Meanwhile, the pressure detection module adopts the first circuit board and the second circuit board which are low in cost, so that the cost of the pressure detection module is low.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. The utility model provides a pressure detection module, is applied to electronic equipment, its characterized in that, pressure detection module sets up on electronic equipment's the internal surface of shell, pressure detection module includes: the device comprises a first electrode, a second electrode, a first circuit board, a second circuit board, a fixing piece and a force transmission piece;

the force transmission piece is located between a force input area of the shell and the first circuit board and used for transmitting the external pressure received by the force input area to the first circuit board and driving the first electrode on the first circuit board to move towards the second electrode, so that the capacitance between the first electrode and the second electrode changes, and the pressure detection result of the external pressure is determined according to the capacitance change.

2. The pressure sensing module of claim 1, wherein the force transmitter is located in a central location of the force input region.

3. The pressure sensing module of claim 1, wherein one end of the force transmitter is fixed to the first circuit board and the other end of the force transmitter abuts against the force input area of the housing.

4. The pressure detection module of any one of claims 1 to 3, wherein the force transmission member is an elastic member, and when the force input region is not stressed, the elastic member is in a compressed state, so that the elastic member abuts against the force input region of the housing by tension.

5. The pressure detection module of claim 4, wherein the force transmitter is a spring, a thimble, or a silicone pad.

6. The pressure detection module of any one of claims 1 to 3, wherein the first circuit board and the second circuit board are fixedly connected by a weld.

7. The pressure detection module of claim 6, wherein a solder joint is disposed on the first circuit board and around the first electrode, a pad matching the solder joint is disposed on the second circuit board and around the second electrode, and the first circuit board and the second circuit board are fixed together by the solder joint and the pad.

8. The pressure detection module of claim 6, wherein four corners of the first electrode or the first circuit board are provided with solder joints, and four corners of the second circuit board or the second electrode are provided with pads matching the solder joints; alternatively, the first and second electrodes may be,

welding points are arranged at two opposite end parts of the first electrode or the first circuit board, and welding pads matched with the welding points are arranged at two opposite end parts of the second circuit board or the second electrode;

the first circuit board and the second circuit board are fixed into a whole through the welding points and the welding pads.

9. The pressure detection module of claim 8, wherein the pad forms an air gap between the first electrode and the second electrode to form a capacitance between the first electrode and the second electrode, and the distance between the first electrode and the second electrode is the height of the pad when the pressure detection module is not under pressure.

10. The pressure detection module of claim 1, wherein the fixing member comprises at least two first adhesive members having a predetermined height, the first adhesive members being disposed between the first circuit board and the second circuit board for fixing the ends of the first circuit board and the second circuit board, or the first adhesive members being disposed between the first electrode and the second electrode for fixing the ends of the first electrode and the second electrode;

the preset height is set such that the first electrode forms a capacitance with the second electrode.

11. The pressure detection module of claim 10, wherein the first adhesive member is disposed between the first circuit board and the second circuit board and around the first electrode and the second electrode.

12. Pressure detection module according to any one of claims 1 to 3, characterized in that the second circuit board is a circuit board main board of the electronic device, or

The second circuit board is fixed on a circuit board main board of the electronic equipment.

13. The pressure detection module of any one of claims 1-3, wherein a distance between the first electrode and the second electrode is greater than or equal to 0.1 mm and less than or equal to 0.4 mm.

14. The pressure detection module of any one of claims 1-3, wherein the first circuit board has a thickness greater than or equal to 0.6 mm and less than or equal to 1.2 mm.

15. The pressure sensing module of claim 14, wherein the first circuit board has a thickness of 0.8 mm.

16. The pressure detection module of any of claims 1-3, wherein the length of each of the first and second electrodes is less than or equal to 5 millimeters and the width of each of the first and second electrodes is less than or equal to 1.5 millimeters.

17. An electronic device, wherein the pressure detection module set according to any one of claims 1-16 is disposed inside a housing of the electronic device.

18. The electronic device of claim 17, wherein the electronic device is a headset, and the pressure detection module is disposed inside a housing of a stem of the headset.