CN214008872U

CN214008872U - LED lamp

Info

Publication number: CN214008872U
Application number: CN202022319104.2U
Authority: CN
Inventors: 戴朋
Original assignee: Guizhou Jiahe Lighting Technology Co ltd
Current assignee: Guizhou Jiahe Lighting Technology Co ltd
Priority date: 2020-10-16
Filing date: 2020-10-16
Publication date: 2021-08-20
Anticipated expiration: 2030-10-16

Abstract

The utility model provides a LED lamp, which comprises a transparent glass shell, LED luminous sheets, pins, an end cover and a packaging substrate; the packaging substrate comprises an LED driving chip, the pin is connected to the packaging substrate, the LED light-emitting sheet is enclosed into a heat insulation cavity with an opening, the packaging substrate is arranged in the heat insulation cavity, and the pin penetrates through the end cover and is electrically connected with an external power supply; the end cover is abutted against the LED light-emitting sheet to seal the opening; the glass shell and the end cover enclose the LED light-emitting sheet. Through the split type ground processing mode, the risk brought by high-temperature processing is avoided, and the technical effect of improving the yield can be realized.

Description

LED lamp

Technical Field

The utility model relates to a LED lamp.

Background

Chinese patent (CN201921329955.6) discloses a full-surface lighting G9 LED lamp, which uses a glass housing with good thermal conductivity, and because the glass housing is integrally formed, the LED lighting sheet is packaged by blow molding or hot melting. Because the processing temperature of glass hot melting or blow molding is higher, and the spare part of encapsulation in the glass shell is not high temperature resistant, therefore easy damage pin and the spare part of going to encapsulate in the glass shell because of high temperature in the course of working, so have the problem that the yields is lower.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model discloses a LED lamp, the technical scheme of the utility model is implemented like this:

an LED lamp comprises a transparent glass shell, an LED light-emitting sheet, pins, an end cover and a packaging substrate; the packaging substrate comprises an LED driving chip, the plug pin is connected to the packaging substrate, the LED light-emitting sheet is enclosed into a heat insulation cavity with an opening, the packaging substrate is arranged in the heat insulation cavity, and the plug pin penetrates through the end cover and is electrically connected with an external power supply; the end cover is abutted against the LED light-emitting sheet to close the opening; the glass shell and the end cover enclose the LED light-emitting sheet.

Preferably, the glass shell is provided with an adhesive at the position where the glass shell is sleeved on the end cover, so as to fix the glass shell and the end cover.

Preferably, the plug pin penetrates through the end cover and is bent back to be connected with the plug pin in parallel.

Preferably, the package substrate includes a constant current chip, a bridge rectifier and a voltage stabilizing capacitor.

Preferably, the LED light emitting sheet includes a light emitting chip and phosphor encapsulated in a packaging adhesive in a COB manner.

Preferably, the LED light emitting sheet includes a rectangular aluminum substrate formed by bending and folding, the folded portion has two groups of connecting portions folded inwards, and the connecting portions are provided with wire welding spots.

Preferably, the connection portion includes a first connection portion and a second connection portion, and the light emitting chips are arranged on an outer surface of the aluminum substrate and connected in series, so that after the aluminum substrate is electrically conductive, a current can sequentially pass through the wire solder joint of the first connection portion, the light emitting chips, and the wire solder joint of the second connection portion.

Preferably, the wall of the glass shell is provided with a vent hole.

Preferably, the end cover is provided with protruding structures, and the LED light-emitting sheet is clamped between the protruding structures.

Preferably, the protruding structure is an integrally formed annular boss, the glass housing is sleeved on the annular boss, and the end cover abuts against the glass housing.

By implementing the technical scheme of the utility model, the technical problem of low yield in the prior art can be solved; according to the technical scheme of the utility model, the LED lamp comprises a transparent glass shell, an LED luminous sheet, pins, an end cover and a packaging substrate; the packaging substrate comprises an LED driving chip, the plug pin is connected to the packaging substrate, the LED light-emitting sheet is enclosed into a heat insulation cavity with an opening, the packaging substrate is arranged in the heat insulation cavity, and the plug pin penetrates through the end cover and is electrically connected with an external power supply; the end cover is abutted against the LED light-emitting sheet to close the opening; the glass shell and the end cover enclose the LED light-emitting sheet. Through the split type ground processing mode, the risk brought by high-temperature processing is avoided, and the technical effect of improving the yield can be realized.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only one embodiment of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic view of a disassembled structure according to an embodiment of the present invention;

fig. 2 is a schematic view of an assembly structure according to an embodiment of the present invention;

FIG. 3 is a schematic view of a glass housing according to an embodiment of the present invention;

fig. 4 is a schematic structural view of an LED lighting sheet according to an embodiment of the present invention;

fig. 5 is a schematic structural view of an end cap according to an embodiment of the present invention;

fig. 6 is a schematic structural view of an LED lighting sheet according to another embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through the communication between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1 to 5, an LED lamp includes a transparent glass housing 10, an LED light emitting sheet 20, pins 40, an end cap 50 and a package substrate 30; the packaging substrate comprises an LED driving chip, the pin is connected to the packaging substrate, the LED light-emitting sheet is enclosed into a heat insulation cavity with an opening, the packaging substrate is arranged in the heat insulation cavity, and the pin penetrates through the end cover and is electrically connected with an external power supply; the end cover is abutted against the LED light-emitting sheet to seal the opening; the glass shell and the end cover enclose the LED light-emitting sheet. The pins may be installed through pin holes 520 as shown in fig. 5 of the drawings. Owing to be different from directly carrying out whole encapsulation with glass, the utility model discloses carry out the components of a whole that can function independently production with glass shell and end cover, the end cover part is owing to not undertake the scattered light effect, therefore can adopt plastics, resin, rubber or integrated to PCB, FCB isotructure to not be subject to the glass material, therefore have more nimble material option, control cost more nimble. Because the processing through hot melt glass is not required, other parts can not be damaged due to high temperature in the assembling process. The end cover and the glass shell can be sealed in various modes such as a buckle, a clamping connection and a sealing rubber ring.

In one embodiment, an adhesive is disposed on the glass shell and around the end cap to secure the glass shell and the end cap. The adhesive can be hot melt adhesive, sealing glue made of a glass-compatible material or glass glue, and can achieve a strong connecting effect and a certain airtight effect.

In one embodiment, the pins are bent and bent back to connect the pins in parallel after passing through the end cap. The bent structure can increase the contact area and facilitate the fixation of the pins through other structures, and the pins after being connected in parallel have lower resistance and provide more sufficient contact area.

In a specific embodiment, the package substrate includes a constant current chip, a bridge rectifier and a voltage stabilizing capacitor. The constant current chip can select EG2000A or other chips for use, thereby different constant direct currents of output send out the light of different colour temperatures, and then make the light of sending be torch luminous state through different colour temperatures. The rectifier bridge stack can select four diodes to form a full-bridge rectifier bridge stack, and the input end of the rectifier bridge stack is connected with alternating current through a power switch and used for rectifying the input alternating current to output pulsating direct current voltage, so that LED related components are driven to emit light. Voltage stabilizing capacitor can provide certain steady voltage effect to absorb instantaneous surge to a certain extent, other components and parts among the protection circuit.

In a specific embodiment, the LED light emitting sheet includes a light emitting chip 220 and phosphor encapsulated in an encapsulation adhesive in a COB manner. The LED lamp is packaged on the outer circumferential surface and the top surface of the packaging substrate in a COB mode, so that the comprehensive light-emitting effect is realized, the application scenes are greatly increased, and the integral size of the LED lamp can be effectively reduced. The fluorescent powder can scatter the light scattered by the point light source, so that more uniform and soft light is formed, and the use is convenient. Meanwhile, the COB packaging is used for packaging a plurality of light-emitting chips in a centralized manner at one time, so that the packaging efficiency is high, the thermal resistance control is good, and the service life is long. Chip On Board (COB) package is a process in which a bare chip is adhered to an interconnection substrate by conductive or non-conductive adhesive and then wire-bonded to achieve electrical connection. COB packaging is a support-free technology, a welding PIN foot of a support is not provided, each lamp bead and each welding lead are tightly packaged in the glue by epoxy resin glue, and no exposed element exists.

In a specific embodiment, the LED light emitting sheet includes a rectangular aluminum substrate 210 formed by bending and folding, the folded portion has two sets of connection portions folded inwards, and the connection portions are provided with wire solder points. As shown in fig. 4, the first connecting portion 230 and the second connecting portion 240 are respectively folded inwards to connect the positive and negative power supply wires led out from the package substrate, and the light-emitting side surfaces are enclosed into a barrel-shaped light-emitting sheet; or as shown in fig. 6, the first connection portion 230 and the second connection portion 240 are respectively folded inwards to connect the positive power connection and the negative power connection led out from the package substrate, the aluminum substrate is rolled into a cylinder, and then the top of the aluminum substrate is turned to the opening of the cylinder to form a cylinder shape. The fluorescent powder and the packaging adhesive can be added or secondarily added after the aluminum substrate is surrounded and molded so as to enhance the sealing effect of the heat insulation cavity. The aluminum substrate can be formed in one step and has good plasticity, and the production cost can be effectively reduced.

In a specific embodiment, the connection portion includes a first connection portion and a second connection portion, and the light emitting chips are arranged on the outer surface of the aluminum substrate and connected in series, so that after the aluminum substrate is electrically conductive, current can sequentially pass through the wire solder joint of the first connection portion, the light emitting chips and the wire solder joint of the second connection portion. The layout of the light emitting chips may be integrally connected in series as shown in fig. 4, and the light emitting chips are distributed on two sides of the aluminum substrate, and after the power is switched on by the first connecting portion 230 and the second connecting portion 240, all the light emitting chips can emit light; or as shown in fig. 6, a plurality of light emitting chips are arranged in series on one side of the aluminum substrate; multiple sections of light emitting chips connected in series can be introduced into the circuit, and one pair of connecting parts or multiple pairs of connecting parts are electrified, so that after part of the LED light emitting chips are broken down, the rest parts can still provide brightness and the whole LED light emitting chips are not scrapped.

In one embodiment, the glass enclosure wall is provided with vents 110. As shown in the attached drawing and figure 3, the vent holes can be used for gas exchange heat conduction, so that the overall temperature in the glass shell is reduced, and meanwhile, the vent holes can be used for positioning and grabbing the glass shell in the machining process, so that the arrangement of the machining process is facilitated.

In a specific embodiment, the end caps are provided with protruding structures, and the LED light emitting sheet is sandwiched between the protruding structures 530. As shown in fig. 5, the annular protrusion 510 is a protrusion structure, and a protrusion structure disposed in a sectional manner or an independent protrusion structure may also be used for limiting and fixing the LED light-emitting sheet.

In one embodiment, the protrusion is an integrally formed annular boss 510, the glass housing is sleeved on the annular boss, and the end cap abuts against the glass housing. As shown in fig. 5, the glass housing is sleeved on the outer surface of the annular boss, the LED light emitting sheet is disposed in the inner wall of the annular boss, and the annular boss region 540 of the end cover abuts against the glass housing, so as to achieve relative fixation of the structure.

In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is a more detailed description of the present invention that is presented in conjunction with specific embodiments, and it is not to be understood that the specific embodiments of the present invention are limited to these descriptions. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement.

It should be noted that the above-mentioned embodiments are only preferred embodiments of the present invention, and should not be construed as limiting the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a LED lamp, includes transparent glass shell, LED luminescent sheet, participates in its characterized in that: the packaging structure also comprises an end cover and a packaging substrate; the packaging substrate comprises an LED driving chip, the plug pin is connected to the packaging substrate, the LED light-emitting sheet is enclosed into a heat insulation cavity with an opening, the packaging substrate is arranged in the heat insulation cavity, and the plug pin penetrates through the end cover and is electrically connected with an external power supply; the end cover is abutted against the LED light-emitting sheet to close the opening; the glass shell and the end cover enclose the LED light-emitting sheet.

2. An LED lamp as claimed in claim 1, wherein: and the position of the glass shell sleeved with the end cover is provided with an adhesive for fixing the glass shell and the end cover.

3. An LED lamp as claimed in claim 1, wherein: the plug pins penetrate through the end cover and are bent back to be connected with the plug pins in parallel.

4. An LED lamp as claimed in claim 1, wherein: the packaging substrate comprises a constant current chip, a rectifier bridge stack and a voltage stabilizing capacitor.

5. An LED lamp as claimed in claim 1, wherein: the LED light-emitting sheet comprises a light-emitting chip and fluorescent powder which are packaged in packaging glue in a COB mode.

6. An LED lamp as claimed in claim 5, wherein: the LED light-emitting sheet is formed by bending and folding a rectangular aluminum substrate, two groups of inwards-concave folded connecting parts are arranged at the folding part, and lead welding spots are arranged on the connecting parts.

7. An LED lamp as claimed in claim 6, wherein: the connecting parts comprise a first connecting part and a second connecting part, and the light-emitting chips are arranged on the outer surface of the aluminum substrate and are connected in series, so that after the aluminum substrate is conductive, current can sequentially pass through the wire welding spots of the first connecting part, the light-emitting chips and the wire welding spots of the second connecting part.

8. An LED lamp as claimed in claim 1, wherein: the wall of the glass shell is provided with a vent hole.

9. An LED lamp as claimed in claim 1, wherein: the end cover is provided with protruding structures, and the LED light-emitting sheet is clamped between the protruding structures.

10. An LED lamp as claimed in claim 9, wherein: the protruding structure is an integrally formed annular boss, the glass shell is sleeved on the annular boss, and the end cover abuts against the glass shell.