CN213991214U

CN213991214U - SMT chip mounter

Info

Publication number: CN213991214U
Application number: CN202120219064.6U
Authority: CN
Inventors: 谢能勇
Original assignee: Fujian Nuocheng Electronic Technology Co ltd
Current assignee: Fujian Nuocheng Electronic Technology Co ltd
Priority date: 2021-01-27
Filing date: 2021-01-27
Publication date: 2021-08-17
Anticipated expiration: 2031-01-27

Abstract

The utility model discloses a SMT chip mounter, it relates to SMT chip mounter technical field. It contains the chip mounter body, dust removal mechanism, damper, be equipped with the paster room in the chip mounter body, the fixed lighting lamp strip that sets up of paster room both sides inner wall, paster roof portion fixed connection cooling fan, be provided with dust removal mechanism in the chip mounter body, dust removal mechanism includes the dust collection box, the dust collection box sets up in the cavity that the chip mounter body was seted up, the inside vertical a plurality of filter screens that set up of dust collection box, the fan is connected to the dust collection box, the outlet duct is connected to fan one end, the dust collection box sets up with the intake pipe intercommunication, the suction hood is connected through the connecting pipe to the intake pipe, chip mounter body bottom sets up damper. After the technical scheme is adopted, the utility model discloses an this beneficial effect does: the dust can be effectively reduced, the shock absorption performance is improved, the lighting and cooling shaping functions are further realized, the patch quality is improved, the rejection rate is reduced, the production cost of enterprises is reduced, and the novel vibration-damping rubber belt is convenient and practical.

Description

SMT chip mounter

Technical Field

The utility model relates to a SMT chip mounter technical field, concretely relates to SMT chip mounter.

Background

SMT chip mounter: the SMT system is a circuit mounting technology for mounting surface mounted components without pins or short leads on the surface of a printed circuit board or other substrates and then soldering and assembling the components by means of reflow soldering, dip soldering and the like, and is a device for accurately placing the surface mounted components on PCB pads by moving a mounting head. Although there are many SMT pick & place machines on the market, there are some problems with the existing SMT pick & place machine technology:

1. some dust is inevitably generated in the production and processing process, the poor dustproof effect can influence the paster, and the quality of the paster is reduced;

2. the damping patch does not have good damping performance, and the position of the patch can be deflected due to vibration in the process of patching, so that the quality of the patch is influenced;

3. the lighting device does not have the lighting function, and is not convenient for operators to check the working condition in the environment with weak light;

4. the paster generally adopts the welded mode, and current chip mounter lacks cooling mechanism, can't in time cool off after the paster is accomplished, leads to the deformation with accident or transportation operation easily, leads to the rejection rate high.

In conclusion, the SMT chip mounter in the prior art has the defects of poor dustproof effect and poor damping performance, does not have the functions of illumination and cooling shaping, reduces the quality of the chip, has high rejection rate, leads to the improvement of the production cost of enterprises, has poor practicability, and cannot meet the use requirements.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to prior art's defect and not enough, provide a SMT chip mounter can reduce the dust effectively to having improved the shock attenuation performance, still having illumination and the moulding function of cooling, having improved the paster quality, the reduction in the number of rejects reduces the manufacturing cost of enterprise, convenient and practical can satisfy people's use needs better, has very big economic value and use value, is worth promoting.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the chip mounter comprises a chip mounter body, a dust removing mechanism and a damping mechanism, wherein a chip mounter is arranged in the chip mounter body, lighting lamp strips are fixedly arranged on the inner walls of the two sides of the chip mounter body, a cooling fan is fixedly connected to the top of the chip mounter body, the dust removing mechanism is arranged in the chip mounter body and comprises a dust collecting box, the dust collecting box is arranged in a cavity formed in the chip mounter body, a plurality of filter screens are vertically arranged in the dust collecting box, the dust collecting box is connected with a fan, one end of the fan is connected with an air outlet pipe, the dust collecting box is communicated with an air inlet pipe, the air inlet pipe is connected with a dust hood through a connecting pipe, the damping mechanism is arranged at the bottom of the chip mounter body and comprises a base plate, a buffer column vertically penetrates through the base plate, a movable pressing plate is fixedly welded and fixed to the bottom of the buffer column, a first spring is sleeved on the upper portion of the buffer column, supporting legs are fixedly arranged at the bottom of the base plate, a buffer slot is formed in the supporting legs, and the bottom of the buffer column extends into the buffer slot, the buffer slot is internally embedded with a second spring, one end of the second spring is connected with the bottom of the buffer slot, and the other end of the second spring is connected with the movable pressing plate.

The illuminating lamp strip is an LED illuminating lamp.

The filter screen set up two sets at least.

The base plate is provided with a through hole for the buffer column to pass through, and the inner diameter of the through hole is larger than the outer diameter of the buffer column.

The bottom of the supporting leg is fixedly bonded with an anti-abrasion pad.

After adopting above-mentioned technical scheme, compare in prior art and have following beneficial effect:

1. the arrangement of a dust hood, a dust collection box, a filter screen, a fan and the like in the dust removal mechanism can effectively reduce dust, thereby improving the quality of the paster;

2. the base plate, the first spring, the second spring, the movable pressing plate and the like in the damping mechanism have multiple damping effects, so that the damping force can be effectively absorbed, the damping effect is enhanced, the operation of a machine is more stable, the surface mounting effect is improved, the surface mounting component can be more accurately aligned to the position to be mounted of the PCB bonding pad, and the surface mounting error is avoided;

3. the machine body has an illuminating function through the arrangement of the illuminating lamp strips, so that workers can conveniently check the working condition of the patch;

4. the workpiece after the surface mounting is finished can be cooled and shaped through the cooling fan, deformation caused by shaking or taking out is avoided, and the rejection rate is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is a schematic view of a partial structure of the middle damping mechanism 3 of the present invention.

Description of reference numerals: the chip mounter comprises a chip mounter body 1, a chip mounting chamber 11, an illuminating lamp strip 111, a cooling fan 112, a cavity 12, a dust removal mechanism 2, a dust collection box 21, a filter screen 211, a fan 22, an air outlet pipe 221, an air inlet pipe 23, a connecting pipe 24, a dust hood 241, a damping mechanism 3, a base plate 31, a through hole 311, a buffer column 32, a first spring 321, a movable pressing plate 322, a supporting leg 33, a buffer groove 331, a second spring 332 and an anti-abrasion pad 333.

Detailed Description

Referring to fig. 1 to 2, the technical solution adopted by the present embodiment is: the chip mounter comprises a chip mounter body 1, a dust removing mechanism 2 and a damping mechanism 3, wherein a chip mounter 11 is arranged in the chip mounter body 1, lighting lamp strips 111 are fixedly arranged on two walls of the inner side of the chip mounter 11, a cooling fan 112 is arranged on the top of the chip mounter 11, the dust removing mechanism 2 is arranged in the chip mounter body 1, the dust removing mechanism 2 comprises a dust collecting box 21, the dust collecting box 21 is arranged in a cavity 12 formed in the chip mounter body 1, a plurality of filter screens 211 are vertically arranged in the dust collecting box 21, an air outlet of the dust collecting box 21 is connected with a fan 22, one end of the fan 22 is connected with an air outlet pipe 221, an air inlet of the dust collecting box is connected with an air inlet pipe 23, the air inlet pipe 23 is connected with a dust hood 241 through a connecting pipe 24, the dust hood 241 is arranged on the top of the chip mounter body 11, the damping mechanism 3 is arranged at the bottom of the chip mounter body 1, the damping mechanism 3 comprises a base plate 31, supporting legs 33 are fixedly arranged at the bottom of the base plate 31, supporting legs 33 are provided with a buffer slot 331 therein, the buffer column 32 vertically penetrates through the base plate 31, the base plate 31 extends into the buffer slot 331, the upper portion of the buffer column 32 is sleeved with a first spring 321, the bottom of the buffer column 32 is welded with a movable pressure plate 322, a second spring 332 is embedded and mounted in the buffer slot 331, one end of the second spring 332 is connected with the bottom of the buffer slot 331, and the other end of the second spring 332 is fixedly connected with the movable pressure plate 322.

The lighting lamp strip 111 is an LED lighting lamp.

The filter screen 211 is provided with at least two groups.

The base plate 31 is provided with a through hole 311 for the buffer post 32 to pass through, and the inner diameter of the through hole 311 is slightly larger than the outer diameter of the buffer post 32.

The bottom of the supporting leg 33 is bonded with an anti-wear pad 333.

The utility model discloses a theory of operation: in chip mounter body course of work, start the fan, the fan drives the suction hood and inhales the dust in the dust collecting box, get into the inside back of dust collecting box and filter through the filter screen, filter the dust, the air after the purification passes through the outlet duct and discharges, under the relatively poor condition of ambient light, the staff can open lighting lamp strip and realize the illumination work, the paster back that finishes, it is moulding to start the cooling fan to blow the cooling to the work piece, the chip mounter body produces when vibrations in work, the cushion column receives decurrent vibrations power, first spring provides partial cushion power, during the downstream of cushion column, the movable press plate pushes down, the second spring also provides partly cushion power.

The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solutions of the present invention.

Claims

1. An SMT chip mounter is characterized in that: the chip mounter comprises a chip mounter body, a dust removing mechanism and a damping mechanism, wherein a chip mounter is arranged in the chip mounter body, lighting lamp strips are fixedly arranged on the inner walls of the two sides of the chip mounter body, a cooling fan is fixedly connected to the top of the chip mounter body, the dust removing mechanism is arranged in the chip mounter body and comprises a dust collecting box, the dust collecting box is arranged in a cavity formed in the chip mounter body, a plurality of filter screens are vertically arranged in the dust collecting box, the dust collecting box is connected with a fan, one end of the fan is connected with an air outlet pipe, the dust collecting box is communicated with an air inlet pipe, the air inlet pipe is connected with a dust hood through a connecting pipe, the damping mechanism is arranged at the bottom of the chip mounter body and comprises a base plate, a buffer column vertically penetrates through the base plate, a movable pressing plate is fixedly welded and fixed to the bottom of the buffer column, a first spring is sleeved on the upper portion of the buffer column, supporting legs are fixedly arranged at the bottom of the base plate, a buffer slot is formed in the supporting legs, and the bottom of the buffer column extends into the buffer slot, the buffer slot is internally embedded with a second spring, one end of the second spring is connected with the bottom of the buffer slot, and the other end of the second spring is connected with the movable pressing plate.

2. An SMT chip mounter according to claim 1, wherein: the illuminating lamp strip is an LED illuminating lamp.

3. An SMT chip mounter according to claim 1, wherein: the filter screen set up two sets at least.

4. An SMT chip mounter according to claim 1, wherein: the base plate is provided with a through hole for the buffer column to pass through, and the inner diameter of the through hole is larger than the outer diameter of the buffer column.

5. An SMT chip mounter according to claim 1, wherein: the bottom of the supporting leg is fixedly bonded with an anti-abrasion pad.