CN215500339U - Pasting suction nozzle of automatic chip mounter for mobile phone - Google Patents
Pasting suction nozzle of automatic chip mounter for mobile phone Download PDFInfo
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- CN215500339U CN215500339U CN202121245054.6U CN202121245054U CN215500339U CN 215500339 U CN215500339 U CN 215500339U CN 202121245054 U CN202121245054 U CN 202121245054U CN 215500339 U CN215500339 U CN 215500339U
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- mobile phone
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Abstract
The utility model discloses a surface mounting suction nozzle of an automatic chip mounter for a mobile phone, which belongs to the technical field of mobile phone surface mounting equipment and comprises a device main body and a suction nozzle main body arranged in the device main body, wherein fixed frames are fixedly arranged on two sides of the device main body, a first spring is arranged in each fixed frame, one end of each first spring is connected with a limiting rod, and clamping grooves matched with the limiting rods are formed in two sides of the suction nozzle main body, which are positioned in the device main body. According to the suction nozzle, the fixing frame, the first spring, the limiting rod and the clamping groove are arranged, so that the suction nozzle main body is elastically fixed by using the elasticity of the first spring, the suction nozzle main body is convenient to disassemble and replace and install, and after components are adsorbed, the buffer board can buffer and protect the components by using the elasticity of the second spring through the arrangement of the fixing plate, the buffer board and the second spring, so that the damage of the components is reduced.
Description
Technical Field
The utility model relates to a mounting suction nozzle, in particular to a mounting suction nozzle of an automatic mobile phone chip mounter, and belongs to the technical field of mobile phone chip mounting equipment.
Background
The chip mounter is also called a mounter, and is a device for accurately placing surface mounted components on a PCB (printed Circuit Board) pad by moving a mounting head, and the full-automatic chip mounter is a device for realizing full-automatic component mounting at high speed and high precision, and is the most critical and complex device in the whole SMT production.
When the existing chip mounter mounts components on a mobile phone, different suction nozzles are needed to adsorb the components due to different types of the components, but the suction nozzles are usually fixedly mounted on clamping blocks of the device, so that the suction nozzles are troublesome and inconvenient to disassemble and replace.
How to research out a mounting suction nozzle of an automatic chip mounter for a mobile phone is a problem to be solved urgently at present.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to solve the problems that the suction nozzle of the existing chip mounter is inconvenient to disassemble and replace and the components are not protected in a buffering manner, and provides the mounting suction nozzle of the automatic chip mounter for the mobile phone.
The purpose of the utility model can be achieved by adopting the following technical scheme:
the utility model provides an automatic chip mounter of cell-phone pastes dress suction nozzle, includes the device main part to and install at the inside suction nozzle main part of device main part, the equal fixed mounting in both sides of device main part has fixed frame, the inside of fixed frame is provided with first spring, the one end of first spring is connected with the gag lever post, the suction nozzle main part is located the inside both sides of device main part all seted up with the draw-in groove that the gag lever post mutually supported, the fixed plate is installed to the bottom of suction nozzle main part, the below of fixed plate is provided with the buffer board, the buffer board pass through the second spring with swing joint between the fixed plate.
Preferably, a plurality of fixing rods are installed on the limiting rod, and pull rings are installed on one sides of the fixing rods.
Preferably, the fixed rod and the pull ring respectively penetrate through the fixed frame and are located above and below the fixed frame.
Preferably, the bottom of fixed plate is installed the link, install the mounting box on the link, the inside of mounting box is provided with the fan.
Preferably, one side of the suction nozzle main body is provided with a fixing block located below the fixing frame, and the bottom of the fixing block is provided with an infrared sensor.
Preferably, the infrared sensor is a RE200B type sensor.
Preferably, the bottom of the buffer plate is provided with a protective pad.
Preferably, a plurality of electric slide rails are installed on the suction nozzle main body, the bottom of each electric slide rail is connected with a connecting rod, and a clamping block is installed on one side of each connecting rod.
Preferably, the plurality of electric slide rails are uniformly arranged on the front and back of the suction nozzle main body.
Preferably, one end of the limiting rod is arc-shaped.
The utility model has the beneficial technical effects that: according to the mobile phone automatic chip mounter surface mounting suction nozzle, the elasticity of the first spring is utilized through the arrangement of the fixing frame, the first spring, the limiting rod and the clamping groove, so that the suction nozzle main body is elastically fixed, the suction nozzle main body is convenient to disassemble and replace, and through the arrangement of the fixing plate, the buffer plate and the second spring, after components are adsorbed, the buffer plate can buffer and protect the components through the elasticity of the second spring, so that the damage of the components is reduced.
Drawings
Fig. 1 is a schematic view of an internal structure of a preferred embodiment of a mounting nozzle of an automatic chip mounter for a mobile phone according to the present invention;
fig. 2 is a schematic view of the overall structure of a preferred embodiment of a mounting nozzle of an automatic chip mounter for a mobile phone according to the present invention;
fig. 3 is a schematic view of an internal structure of a fixing plate of a preferred embodiment of a mounting nozzle of an automatic chip mounter for mobile phones according to the present invention;
fig. 4 is a schematic structural view of an electric slide rail of a preferred embodiment of a mounting nozzle of an automatic chip mounter for a mobile phone according to the present invention;
fig. 5 is a schematic structural view of a buffer plate of a preferred embodiment of a mounting nozzle of an automatic chip mounter for a mobile phone according to the present invention;
fig. 6 is a schematic structural view of a fixing frame of a preferred embodiment of a mounting nozzle of an automatic chip mounter for mobile phones according to the present invention.
In the figure: 1-device body, 2-suction nozzle body, 3-fixing frame, 4-first spring, 5-limiting rod, 6-clamping groove, 7-fixing rod, 8-pull ring, 9-fixing plate, 10-buffer plate, 11-second spring, 12-connecting frame, 13-mounting box, 14-fan, 15-fixing block, 16-infrared sensor, 17-protective pad, 18-electric sliding rail, 19-connecting rod and 20-clamping block.
Detailed Description
In order to make the technical solutions of the present invention more clear and definite for those skilled in the art, the present invention is further described in detail below with reference to the examples and the accompanying drawings, but the embodiments of the present invention are not limited thereto.
As shown in fig. 1-6, the suction nozzle for mounting a mobile phone automatic chip mounter provided by the present embodiment includes a device main body 1, and a suction nozzle main body 2 installed inside the device main body 1, fixed frames 3 are fixedly installed on both sides of the device main body 1, a first spring 4 is arranged inside the fixed frames 3, one end of the first spring 4 is connected with a limit rod 5, and clamping grooves 6 matched with the limit rod 5 are respectively formed on both sides of the suction nozzle main body 2 located inside the device main body 1. Through the arrangement of the fixing frame 3, the first spring 4, the limiting rod 5 and the clamping groove 6, the suction nozzle main body 2 is elastically fixed by utilizing the elasticity of the first spring 4, so that the suction nozzle main body 2 is convenient to disassemble and replace and install; the fixed plate 9 is installed to the bottom of suction nozzle main part 2, and the below of fixed plate 9 is provided with buffer board 10, and swing joint between buffer board 10 and the fixed plate 9 through second spring 11. Through the setting of fixed plate 9, buffer board 10 and second spring 11, after adsorbing components and parts, buffer board 10 utilizes the elasticity of second spring 11 can cushion the protection to components and parts to reduce the impaired condition of components and parts appearance.
In the present embodiment, as shown in fig. 1, 2, 3 and 6, a plurality of fixing rods 7 are mounted on the limiting rod 5, a pull ring 8 is mounted on one side of each fixing rod 7, the fixing rods 7 and the pull ring 8 respectively penetrate through the fixing frame 3 and are located above and below the fixing frame 3, a connecting frame 12 is mounted at the bottom of the fixing plate 9, a mounting box 13 is mounted on the connecting frame 12, and a fan 14 is disposed inside the mounting box 13. Through the setting of dead lever 7 and pull ring 8, stimulate gag lever post 5 during convenient to detach, through the setting of link 12, mounting box 13 and fan 14, can remove dust with components and parts, avoid the dust to inhale the inside of suction nozzle main part 2.
In the present embodiment, as shown in fig. 1, 2 and 5, a fixing block 15 is installed at one side of the nozzle body 2 below the fixing frame 3, an infrared sensor 16 is provided at the bottom of the fixing block 15, the infrared sensor 16 is a RE200B type sensor, and a protection pad 17 is provided at the bottom of the buffer plate 10. Through the setting of fixed block 15 and infrared sensor 16, can play the effect of location, make the more accurate that components and parts pasted the dress, through the setting of protection pad 17, can play the effect of protection.
In the present embodiment, as shown in fig. 1, 2, 4 and 6, a plurality of electric slide rails 18 are installed on the suction nozzle main body 2, a connecting rod 19 is connected to the bottom of the electric slide rail 18, a clamping block 20 is installed on one side of the connecting rod 19, the plurality of electric slide rails 18 are uniformly installed on the front and back of the suction nozzle main body 2, and one end of the limiting rod 5 is arc-shaped. Through the setting of electronic slide rail 18, connecting rod 19 and grip block 20, to components and parts absorption back, electronic slide rail 18 drives grip block 20 through connecting rod 19 and carries out the centre gripping to components and parts, and when the unstable is adsorbed to effectual suction nozzle main part 2 that prevents, components and parts take place to drop, sets up to the arc through the one end with gag lever post 5, can be convenient for directly insert the inside of installing in device main part 1 with suction nozzle main part 2.
In this embodiment, as shown in fig. 1 to fig. 6, a working process of a mounting nozzle of an automatic chip mounter for a mobile phone provided by this embodiment is as follows:
step 1: when the suction nozzle main body 2 is replaced, firstly, the limiting rod 5 is pulled outwards through the fixed rod 7 and the pull ring 8, so that one end of the limiting rod 5 is far away from the clamping grooves 6 formed in the two sides of the suction nozzle main body 2, and the suction nozzle main body 2 can be detached from the device main body 1 without fixing the suction nozzle main body 2;
step 2: then aligning the replaced suction nozzle main body 2 to the mounting opening of the device main body 1, directly inserting the suction nozzle main body 2 into the device main body 1 by utilizing the arc shape at one end of the limiting rod 5, clamping the limiting rod 5 with the clamping groove 6, and finishing mounting the suction nozzle main body 2;
and step 3: in the process of mounting the components, the fan 14 is started through an operation panel on the device, dust on the components is removed by the fan 14, and then after the components are adsorbed by the suction nozzle main body 2, the electric slide rail 18 drives the connecting rod 19 to move, so that the clamping blocks 20 clamp two sides of the components, and the components are prevented from falling off.
In summary, in the embodiment, according to the suction nozzle for mounting the mobile phone automatic chip mounter according to the embodiment, through the arrangement of the fixing rod 7 and the pull ring 8, the limiting rod 5 is conveniently pulled during detachment, through the arrangement of the connecting frame 12, the mounting box 13 and the fan 14, components can be dedusted, dust is prevented from being sucked into the suction nozzle main body 2, through the arrangement of the fixing block 15 and the infrared sensor 16, a positioning effect can be achieved, the component mounting is more accurate, through the arrangement of the protection pad 17, a protection effect can be achieved, through the arrangement of the electric slide rail 18, the connecting rod 19 and the clamping block 20, after the components are adsorbed, the electric slide rail 18 drives the clamping block 20 through the connecting rod 19 to clamp the components, so that the components are effectively prevented from falling when the suction nozzle main body 2 is unstably adsorbed, and through arranging one end of the limiting rod 5 into an arc shape, it is possible to facilitate direct insertion-mounting of the suction nozzle body 2 inside the apparatus body 1.
The above description is only for the purpose of illustrating the present invention and is not intended to limit the scope of the present invention, and any person skilled in the art can substitute or change the technical solution of the present invention and its conception within the scope of the present invention.
Claims (10)
1. The utility model provides an automatic chip mounter of cell-phone pastes dress suction nozzle, a serial communication port, including device main part (1) to and install in inside suction nozzle main part (2) of device main part (1), the equal fixed mounting in both sides of device main part (1) has fixed frame (3), the inside of fixed frame (3) is provided with first spring (4), the one end of first spring (4) is connected with gag lever post (5), suction nozzle main part (2) are located the inside both sides of device main part (1) all seted up with draw-in groove (6) that gag lever post (5) mutually supported, fixed plate (9) are installed to the bottom of suction nozzle main part (2), the below of fixed plate (9) is provided with buffer board (10), buffer board (10) through second spring (11) with swing joint between fixed plate (9).
2. The suction nozzle of claim 1, wherein the limiting rod (5) is provided with a plurality of fixing rods (7), and one side of each fixing rod (7) is provided with a pull ring (8).
3. The suction nozzle of claim 2, wherein the fixing rod (7) and the pull ring (8) respectively penetrate through the fixing frame (3) and are located above and below the fixing frame (3).
4. The suction nozzle of the mobile phone automatic chip mounter according to claim 1, wherein a connecting frame (12) is installed at the bottom of the fixing plate (9), a mounting box (13) is installed on the connecting frame (12), and a fan (14) is arranged inside the mounting box (13).
5. The suction nozzle for mounting the mobile phone automatic chip mounter according to claim 1, wherein a fixing block (15) positioned below the fixing frame (3) is installed at one side of the suction nozzle main body (2), and an infrared sensor (16) is arranged at the bottom of the fixing block (15).
6. The pick-and-place nozzle of a mobile phone pick-and-place machine of claim 5, wherein the infrared sensor (16) is a sensor of RE200B type.
7. The suction nozzle of the mobile phone automatic chip mounter according to claim 1, wherein a protection pad (17) is disposed at the bottom of the buffer plate (10).
8. The pick-and-place nozzle of the mobile phone automatic pick-and-place machine according to claim 1, wherein the nozzle body (2) is provided with a plurality of electric slide rails (18), the bottom of each electric slide rail (18) is connected with a connecting rod (19), and one side of each connecting rod (19) is provided with a clamping block (20).
9. The pick-and-place nozzle for a mobile phone pick-and-place machine according to claim 8, wherein a plurality of said electric slide rails (18) are uniformly mounted on the front and back surfaces of said nozzle body (2).
10. The suction nozzle of the mobile phone automatic chip mounter according to claim 1, wherein one end of the limiting rod (5) is arc-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121245054.6U CN215500339U (en) | 2021-06-04 | 2021-06-04 | Pasting suction nozzle of automatic chip mounter for mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121245054.6U CN215500339U (en) | 2021-06-04 | 2021-06-04 | Pasting suction nozzle of automatic chip mounter for mobile phone |
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| Publication Number | Publication Date |
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| CN215500339U true CN215500339U (en) | 2022-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121245054.6U Active CN215500339U (en) | 2021-06-04 | 2021-06-04 | Pasting suction nozzle of automatic chip mounter for mobile phone |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114786460A (en) * | 2022-05-25 | 2022-07-22 | 深圳市菲昂机电有限公司 | Full-automatic SMT chip mounter loading attachment |
-
2021
- 2021-06-04 CN CN202121245054.6U patent/CN215500339U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114786460A (en) * | 2022-05-25 | 2022-07-22 | 深圳市菲昂机电有限公司 | Full-automatic SMT chip mounter loading attachment |
| CN114786460B (en) * | 2022-05-25 | 2023-05-30 | 深圳市菲昂机电有限公司 | Full-automatic SMT chip mounter loading attachment |
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