CN213986586U - Test fixture of chip capacitor - Google Patents
Test fixture of chip capacitor Download PDFInfo
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- CN213986586U CN213986586U CN202120536256.XU CN202120536256U CN213986586U CN 213986586 U CN213986586 U CN 213986586U CN 202120536256 U CN202120536256 U CN 202120536256U CN 213986586 U CN213986586 U CN 213986586U
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Abstract
The utility model relates to a test fixture of piece formula electric capacity. The utility model discloses a test fixture of chip capacitor, which comprises a first PCB board, wherein the first PCB board is provided with a conductive fixed column, a conductive metal sheet and a plug connector; the upper laminated board is provided with a conductive cross beam and a plurality of electric contact type elastic probes which are electrically connected, and the conductive cross beam is provided with a first mounting hole for the conductive fixing column to pass through and is fixed with the conductive fixing column through a conductive fixing piece; and the insulating gasket is arranged between the first PCB and the upper laminated board, a second mounting hole and a plurality of fixing holes which correspond to the elastic probes and are used for fixing the chip capacitor are formed in the insulating gasket, when the chip capacitor is placed in the fixing holes, a first electrode of the chip capacitor is abutted to the conductive metal sheet, and a second electrode of the capacitor is abutted to the elastic probes. Piece formula electric capacity's test fixture, need not to carry out the welding of electric capacity and PCB board, repeatedly usable, material saving.
Description
Technical Field
The utility model relates to a technical field of electric capacity test especially relates to a test fixture of piece formula electric capacity.
Background
MLCC (Multi-layer Ceramic Capacitors) is an english abbreviation of chip multilayer Ceramic capacitor. Ceramic dielectric films with printed electrodes (inner electrodes) are overlapped in a staggered mode, a ceramic chip is formed through one-time high-temperature sintering, and metal layers (outer electrodes) are sealed at two ends of the chip, so that a structural body similar to a monolithic body is formed.
The moisture load test of the chip type multilayer ceramic capacitor requires that certain working voltage is applied to the chip type capacitor under certain temperature and humidity conditions, so as to evaluate the reliability of the chip type capacitor. The chip capacitor is generally mounted on a PCB by reflow soldering, the PCB is inserted into an aging board with a corresponding slot, and finally the aging board is inserted into a moisture load test box, so that the ceramic capacitor is added into a complete circuit loop, and then appropriate moisture load test conditions are provided by setting appropriate temperature, temperature and voltage for the moisture load box.
The PCB-based approach has 3 disadvantages: (1) the PCB board can only be used once, can not be recycled, and has large consumption and high material cost. (2) Reflow soldering paster has high technical requirement, long time consumption for paster and high labor cost. (3) Each aging plate can only satisfy a small amount of chip capacitors at most once.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model provides a test fixture of piece formula electric capacity need not to carry out the welding of electric capacity and PCB board, still repeatedly usable to the wasting of resources and consumptive material cost problem have been solved.
The utility model provides a test fixture of chip capacitor, including a first PCB board, the first PCB board is provided with a conductive fixing column, a conductive metal sheet and a plug connector, the conductive fixing column and the conductive metal sheet are respectively connected with the plug connector;
the insulating gasket is arranged on the upper laminated board, a conductive cross beam and a plurality of electric contact type elastic probes which are electrically connected are arranged on the upper laminated board, a first mounting hole for the conductive fixing column to pass through is formed in the conductive cross beam, and the conductive cross beam is fixed with the conductive fixing column through a conductive fixing piece;
between the first PCB board and the upper laminated board, a second mounting hole for the conductive fixing column to pass through and a plurality of fixing holes corresponding to the elastic probes and used for fixing the chip capacitor are arranged on the insulating gasket, when the chip capacitor is placed in the fixing holes, a first electrode of the chip capacitor is abutted to the conductive metal sheet, and a second electrode of the capacitor is abutted to the elastic probes.
Optionally, when the chip capacitor is placed in the fixing hole, the height of the chip capacitor is greater than the height of the insulating spacer.
Optionally, when the chip capacitor is placed in the fixing hole, the height of the chip capacitor is at least 1mm greater than the height of the insulating spacer.
Optionally, the first PCB is a double-sided PCB, the conductive fixing column and the conductive metal sheet are disposed on a first side of the first PCB, and a first conductive element and a second conductive element respectively connected to the plug connector are disposed on a second side of the first PCB;
the conductive fixing column is connected with the first conductive element through a first guide hole arranged on the first PCB, and the conductive metal sheet is connected with the second conductive element through a second guide hole arranged on the first PCB.
Optionally, the first conductive element is a conductive metal strip, and the second conductive element is a wire.
Optionally, a fuse is further arranged on the second surface of the first PCB, and the fuse is arranged between the first conductive element and the plug connector, or the fuse is arranged between the second conductive element and the plug connector.
Optionally, the upper laminate further includes a second PCB, the probe is disposed on a first surface of the second PCB, the conductive beam is disposed on a second surface of the second PCB, and the probe and the conductive beam are connected through a conductive circuit disposed on the second PCB.
Optionally, the upper laminate further includes a conductive buffer member disposed between the elastic probe and the first surface of the second PCB.
Optionally, the conductive buffer is conductive foam or a conductive film.
Optionally, the conductive beam is disposed in the middle of the second PCB, and the probes are distributed on two sides of the conductive beam.
The utility model discloses a test fixture of piece formula electric capacity, through the elastic probe in the last lamination board and the fixed orifices that sets up in the insulating gasket will await measuring the piece formula electric capacity and fix on first PCB board, need not to carry out the welding of piece formula electric capacity and PCB board, each component of anchor clamps can also used repeatedly to solve the wasting of resources and consumptive material cost problem, simultaneously, the elastic probe still is favorable to reducing the pressure that the piece formula electric capacity receives; the utility model further reduces the pressure on the chip capacitor by arranging a buffer device; simultaneously, highly setting up insulating pad to be less than the height of piece formula electric capacity, the conducting metal piece on elastic probe and the first PCB board can not switched on through the fixed orifices to the condensate water on the messenger insulating pad, has eliminated the unusual risk of short circuit that the condensate water caused.
For better understanding and implementation, the technical solutions of the present invention are described in detail below with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic view of a test fixture for a chip capacitor according to an embodiment of the present invention;
fig. 2 is a schematic vertical sectional view of a test fixture for a chip capacitor according to an embodiment of the present invention;
fig. 3 is a schematic back view of a first PCB board of a test fixture for chip capacitors according to an embodiment of the present invention;
fig. 4 is a schematic diagram of an upper clamping plate of a test fixture of a chip capacitor according to an embodiment of the present invention;
fig. 5 is a schematic view of an insulating spacer of a test fixture of a chip capacitor according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a partially enlarged conductive metal sheet of a test fixture of a chip capacitor according to an embodiment of the present invention.
In the figure, 1 — first PCB board; 101-conductive fixing columns; 102-a conductive metal sheet; 103-plug connector; 104-a first via; 105-a second via; 106-a first conductive element; 107-a second conductive element; 108-a fuse; 2-upper laminate; 201-conductive beam; 202-an elastic probe; 203-a first mounting hole; 204-a conductive mount; 205-a second PCB board; 206-a conductive buffer; 3-an insulating spacer; 301-a second mounting hole; 302-fixation holes; 4-chip capacitor.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the relevant portions of the present invention are shown in the drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
In the following, several specific embodiments are given for describing the technical solution of the present application in detail. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
As shown in fig. 1 and 2, in one embodiment, a test fixture for a chip capacitor includes a first PCB 1, an upper laminate 2, and an insulating spacer 3, wherein the insulating spacer 3 is disposed between the first PCB 1 and the upper laminate 2 when assembled.
The first PCB board 1 is provided with a conductive fixing column 101, a conductive metal sheet 102 and a connector 103, wherein the conductive fixing column 101 and the conductive metal sheet 102 are used for respectively connecting two different electrodes of the chip capacitor. The plug connector 103 is provided with a plurality of conductive contact pieces, part of the conductive contact pieces are used for being connected with the conductive fixing columns 101, the other part of the conductive contact pieces are used for being connected with the conductive metal sheets 102, and the plug connector 103 is also used for being inserted into an aging board with corresponding slots and connected with a test circuit on the aging board.
The upper laminated board 2 is arranged above the first PCB board 1, the upper laminated board 2 is provided with a conductive cross beam 201 and a plurality of electric contact type elastic probes 202 which are electrically connected, the conductive cross beam 201 is further provided with a first mounting hole 203 for the conductive fixing column 101 to pass through, the conductive fixing column 101 passes through the first mounting hole 203, and the upper laminated board 2 is fixed on the first PCB board 1 through a conductive fixing piece 204. In the above embodiment, the conductive fixing element 204 may be a nut, and the outer surface of the conductive fixing column 101 is a threaded structure, in other examples, the conductive fixing element 204 may also be other structures that are fixedly connected to the conductive fixing column 101, such as a pin, a snap structure, and the like.
The insulating spacer 3 is disposed between the first PCB 1 and the upper laminate 2, and the insulating spacer 3 is provided with a plurality of fixing holes 302 corresponding to the elastic probes 202 for fixing the chip capacitors 4.
In one embodiment, the chip capacitor 4 is a chip multilayer ceramic capacitor.
When the chip capacitor 4 to be tested is placed in the fixing hole 302 of the insulating gasket 3, a first electrode of the chip capacitor 4 abuts against the conductive metal sheet 102 and is connected with a part of conductive contact pieces of the plug connector 103 through the conductive metal sheet 102, and a second electrode of the chip capacitor 4 abuts against the elastic probe 202 and is connected with another part of conductive contact pieces of the plug connector 103 through the elastic probe 202, the conductive cross beam 201 and the conductive fixing column 101.
In the example of fig. 1, 5 mounting areas are provided on the first PCB 1, and in the first, fourth, and fifth mounting areas, from the left direction, there are scenes in which the upper laminate 2 and the insulating gasket 3 are mounted on the first PCB 1, the second mounting area is a scene in which the insulating gasket 3 is mounted on the first PCB 1, and the third mounting area is a scene in which neither the upper laminate 2 nor the insulating gasket 3 is mounted on the first PCB 1.
In the embodiment shown in fig. 1, 3 and 6, the first PCB 1 is a double-sided PCB, the front surface of the first PCB 1 is provided with a conductive fixing post 101 and a conductive metal sheet 102, the back surface of the first PCB 1 is provided with a first conductive element 106 and a second conductive element 107, preferably, the first conductive element 106 is a conductive metal strip, the second conductive element 107 is a conductive wire, the first PCB 1 is further provided with a first via 104 and a second via 105, the conductive fixing post 101 is connected with the first conductive element 106 on the back surface of the first PCB 1 through the conductive wire passing through the first via 104, the conductive metal sheet 102 is connected with the second conductive element 107 on the back surface of the first PCB 1 through the conductive wire passing through the second via 105, part of the conductive contacts of the connector 103 are connected to the first conductive element 106 and another part of the conductive contacts of the connector 103 are connected to the second conductive element 107 via the first conductive element 106 and the second conductive element 107.
Preferably, the front surface of the first PCB 1 is further provided with a fuse 108, and in this embodiment, the fuse 108 is disposed between the first conductive element 106 and the conductive contact of the connector 103 for fusing the circuit when an overcurrent occurs. In other examples, the fuse 108 may also be disposed between the second conductive element 107 and the plug 103.
As shown in fig. 1, 2 and 5, in an embodiment, the insulating pad 3 is disposed on the front surface of the first PCB 1, the insulating pad 3 is provided with a second mounting hole 301, the conductive fixing post 101 penetrates through the second mounting hole 301 to fix the insulating pad 3 on the first PCB 1, when the chip capacitor 4 is placed in the fixing hole 301, the height of the chip capacitor 4 is greater than the height of the insulating pad 3, preferably, the height of the chip capacitor 4 is greater than the height of the insulating pad 3 by at least 1mm, so that the condensed water on the insulating pad 3 cannot conduct the elastic probe 202 and the conductive metal sheet 102 on the first PCB 1 through the fixing hole 301, thereby eliminating the abnormal risk of short circuit caused by the condensed water.
As shown in fig. 1, 2 and 4, the upper laminated board 2 is disposed above the insulating pad 3, in an embodiment, the upper laminated board 2 further includes a second PCB 205, the second PCB 205 is also a double-sided PCB, the conductive beam 201 is disposed on the front side of the second PCB 205, specifically located in the middle of the front side of the second PCB 205, the elastic probes 202 are disposed on the back side of the second PCB 205, the elastic probes 202 are distributed on two sides of the conductive beam 201, and the elastic probes 202 are connected to the conductive beam 201 through conductive traces disposed on the second PCB 205.
In the above embodiment, the conductive buffer 206 is further disposed on the reverse side of the second PCB 205, specifically, the conductive buffer 206 is located between the elastic probe 202 and the reverse side of the second PCB, so as to reduce the pressure of the chip capacitor 4 on the elastic probe 202.
When the test is started, the chip capacitor 4 is installed in the second installation hole 301 on the insulation pad 3, the insulation pad 3 is arranged above the first PCB board 1, the first electrode of the chip capacitor 4 is abutted to the conductive metal sheet 102, the upper laminated board 2 is installed above the insulation pad 3, the second electrode of the chip capacitor 4 is abutted to the elastic probe 102, the conductive fixing column 101 penetrates through the first installation hole 203 and the second installation hole 301 respectively, and the whole structure is fastened through the conductive fixing piece 204.
Inserting the plug-in unit 103 on the first PCB board 1 into the corresponding slot on the aging board, inserting the aging board into the moisture load test box, and setting the appropriate temperature, temperature and voltage for the moisture load test box to provide the appropriate moisture load test condition.
After the power is turned on, the current is conducted to the conductive fixing column 101 through the first conductive element 106, then flows to the conductive beam 201 through the conductive fixing column 101, is conducted to the elastic probe 102 through the conductive circuit arranged on the second PCB 205, and finally returns to the plug connector 103 from the conductive metal sheet 102 and the second conductive element 107 through the chip capacitor 4 to form a closed loop, and the reliability of the chip capacitor 4 is judged through testing the voltage and current changes.
The utility model discloses sheet capacitor's test fixture has following technological effect:
1. the parts can be repeatedly used, and the cost of consumable materials is reduced. Need not to carry out the welding of electric capacity and PCB board, through last laminated board 2 and first PCB board 1 fixed electric capacity to the centre gripping of electric capacity, each part of test fixture repeatedly usable.
2. The capacitor is simple and efficient to install. And the capacitor is installed without a reflow soldering mode, so that the technical requirement for installing the capacitor is greatly reduced, and the efficiency for installing the capacitor is improved.
3. The test efficiency is improved, the test fixture is connected with the aging board through the plug connectors 103, the number of capacitors contained in a single PCB is increased, and the test efficiency is improved.
4. And the short circuit abnormal risk caused by the condensed water is eliminated. The height of the insulating pad 3 is set to be lower than that of the chip capacitor 4, so that the condensed water on the insulating pad 3 can not conduct the elastic probe 202 and the conductive metal sheet 102 on the first PCB 1 through the fixing hole 301.
5. The pressure on the chip capacitor 4 is reduced. Through elastic probe 202 and 4 butts of chip capacitor, avoid the too big damage electric capacity of centre gripping pressure, and elastic probe 202 top still is provided with electrically conductive bolster 206, further reduces the pressure that the electric capacity received.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention.
Claims (10)
1. The utility model provides a test fixture of chip capacitor which characterized in that includes:
the PCB comprises a first PCB, a second PCB and a third PCB, wherein the first PCB is provided with a conductive fixing column, a conductive metal sheet and a plug connector, and the conductive fixing column and the conductive metal sheet are respectively connected with the plug connector;
the upper laminated board is provided with a conductive cross beam and a plurality of electric contact type elastic probes which are electrically connected, the conductive cross beam is provided with a first mounting hole for the conductive fixing column to pass through, and the conductive cross beam is fixed with the conductive fixing column through a conductive fixing piece;
and the insulating gasket is arranged between the first PCB and the upper laminated board, a second mounting hole for the conductive fixing column to pass through and a plurality of fixing holes corresponding to the elastic probes and used for fixing the chip capacitor are formed in the insulating gasket, when the chip capacitor is placed in the fixing holes, a first electrode of the chip capacitor is abutted against the conductive metal sheet, and a second electrode of the capacitor is abutted against the elastic probes.
2. The test fixture of chip capacitor as claimed in claim 1, wherein:
when the chip capacitor is placed in the fixing hole, the height of the chip capacitor is larger than that of the insulating gasket.
3. The test fixture of chip capacitor as claimed in claim 2, wherein:
when the chip capacitor is placed in the fixing hole, the height of the chip capacitor is at least 1mm greater than that of the insulating spacer.
4. The test fixture of chip capacitor as claimed in claim 1, wherein:
the first PCB is a double-sided PCB, the conductive fixing column and the conductive metal sheet are arranged on the front side of the first PCB, and a first conductive element and a second conductive element which are respectively connected with the plug connector are arranged on the back side of the first PCB;
the conductive fixing column is connected with the first conductive element through a first guide hole arranged on the first PCB, and the conductive metal sheet is connected with the second conductive element through a second guide hole arranged on the first PCB.
5. The test fixture of chip capacitor as claimed in claim 4, wherein:
the first conductive element is a conductive metal strip, and the second conductive element is a wire.
6. The test fixture of chip capacitor as claimed in claim 5, wherein:
the front of first PCB board still is equipped with the fuse, the fuse set up in first conductive element with between the plug connector, perhaps, the fuse set up in second conductive element with between the plug connector.
7. The test fixture of chip capacitor as claimed in claim 1, wherein:
the upper laminated board further comprises a second PCB, the elastic probe is arranged on the reverse side of the second PCB, the conductive cross beam is arranged on the front side of the second PCB, and the elastic probe is connected with the conductive cross beam through a conductive circuit arranged on the second PCB.
8. The test fixture of chip capacitor as claimed in claim 7, wherein:
the upper laminated board further comprises a conductive buffer piece, and the conductive buffer piece is arranged between the elastic probe and the reverse side of the second PCB.
9. The test fixture of chip capacitor as claimed in claim 8, wherein:
the conductive buffer piece is conductive foam or a conductive film.
10. The test fixture of chip capacitor as claimed in claim 7, wherein:
the conductive cross beam is arranged in the middle of the second PCB, and the probes are distributed on two sides of the conductive cross beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120536256.XU CN213986586U (en) | 2021-03-15 | 2021-03-15 | Test fixture of chip capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120536256.XU CN213986586U (en) | 2021-03-15 | 2021-03-15 | Test fixture of chip capacitor |
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| Publication Number | Publication Date |
|---|---|
| CN213986586U true CN213986586U (en) | 2021-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120536256.XU Active CN213986586U (en) | 2021-03-15 | 2021-03-15 | Test fixture of chip capacitor |
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| CN (1) | CN213986586U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113552419A (en) * | 2021-09-18 | 2021-10-26 | 广东微容电子科技有限公司 | Method for indirectly detecting MLCC medium ceramic lattice defect |
-
2021
- 2021-03-15 CN CN202120536256.XU patent/CN213986586U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113552419A (en) * | 2021-09-18 | 2021-10-26 | 广东微容电子科技有限公司 | Method for indirectly detecting MLCC medium ceramic lattice defect |
| CN113552419B (en) * | 2021-09-18 | 2022-06-14 | 广东微容电子科技有限公司 | Method for indirectly detecting MLCC medium ceramic lattice defect |
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