CN213983106U - Double-loop flexible lamp strip for four-color switching - Google Patents
Double-loop flexible lamp strip for four-color switching Download PDFInfo
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- CN213983106U CN213983106U CN202023349313.8U CN202023349313U CN213983106U CN 213983106 U CN213983106 U CN 213983106U CN 202023349313 U CN202023349313 U CN 202023349313U CN 213983106 U CN213983106 U CN 213983106U
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Abstract
The utility model relates to the field of LED lamp belts, and provides a double-loop flexible lamp belt for four-color switching, which is used for solving the defect of too wide width of the four-color lamp belt in the prior art; a double-loop flexible lamp strip for four-color switching comprises a flexible circuit board, and a lamp bead unit and/or a resistor unit welded on the flexible circuit board, wherein the flexible circuit board comprises a top insulating film layer, a top conductive circuit layer, an insulating base layer, a bottom conductive circuit layer and a bottom insulating film layer which are sequentially arranged, and the top conductive circuit layer comprises an end metal electrode unit, an upper conductive circuit layer and a lower conductive circuit layer; the upper and lower conductive circuit layers and the end metal electrode unit form a double-loop in parallel; the utility model discloses a two return circuits flexible lamp area that is used for four-color to switch can realize through two return circuits and only three electrode lines that four-color lamp pearl give off light in turn or give off light simultaneously, and the whole width in lamp area is compared in current four-color lamp area narrowly, and overall structure is compact reasonable.
Description
Technical Field
The utility model relates to a LED lamp area field, more specifically relates to a two return circuit flexible light area for four-color switching.
Background
The LED (light emitting diode) strip is a strip that is formed by assembling LEDs on a strip-shaped FPC (flexible printed circuit) or PCB (printed circuit board) hard board, and is named as a strip because the shape of the product is like a strip. Because the service life is long (the normal service life is generally 8-10 ten thousand hours), the energy is saved, the environment is protected, and the method gradually exposes the corners in various decoration industries.
According to the requirements of the existing decoration industry, the single-color LED lamp strip is difficult to meet the requirements of practical application, so that a plurality of LED lamp strips with double colors, three colors, four colors and five colors appear in the market.
In the existing four-color lamp strip, or lamp beads with four colors are connected in series in a row, so that the whole lamp strip is very wide and only can simultaneously light the four colors, and the four colors cannot alternately light; or at least five lines are arranged on the flexible circuit board to form four loops, and the lamp beads with one color are connected in series on each loop, so that the width of the whole lamp strip is very wide, and the requirements of the market on the thin lamp strip are difficult to meet.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at overcoming above-mentioned prior art at least one kind defect (not enough), provide a two return circuit flexible light strip for four-color switches for solve prior art four-color light strip width too wide defect.
The utility model adopts the technical scheme that a double-loop flexible lamp belt for four-color switching comprises a flexible circuit board, and a lamp bead unit and/or a resistance unit welded on the flexible circuit board, wherein the flexible circuit board comprises a top insulating film layer, a top conductive circuit layer, an insulating base layer, a bottom conductive circuit layer and a bottom insulating film layer which are sequentially arranged, and the top conductive circuit layer comprises a tip metal electrode unit, an upper conductive circuit layer and a lower conductive circuit layer; the end metal electrode unit comprises a first metal electrode plate, a second metal electrode plate and a third metal electrode plate, wherein the first metal electrode plate and the second metal electrode plate are arranged at one end and are arranged up and down, and the third metal electrode plate is arranged at the other end; the bottom conducting circuit layer comprises a first electrode, a second electrode and a third electrode; electrode holes are formed in the first metal electrode plate, the second metal electrode plate and the third metal electrode plate of the top conducting circuit layer and penetrate through the insulating base layer to reach the first electrode, the second electrode and the third electrode respectively; the first electrode and the second electrode are of the same polarity, and the third electrode is of opposite polarity; the upper and lower conductive circuit layers and the end metal electrode unit form a double-loop in parallel; the top insulating film layer is provided with a plurality of groups of lamp bead bonding pad through holes and/or a plurality of groups of resistance bonding pad through holes, and a plurality of groups of lamp bead bonding pads and/or resistance bonding pads are formed after the top insulating film layer is attached to the top conducting circuit layer; a lamp bead bonding pad at one end of the upper conductive circuit layer corresponds to a lamp bead bonding pad on the first metal electrode plate, and a lamp bead bonding pad at the other end of the upper conductive circuit layer corresponds to a lamp bead bonding pad on the third metal electrode plate; a lamp bead bonding pad at one end of the lower conductive circuit layer corresponds to a lamp bead bonding pad on the second metal electrode plate, and a lamp bead bonding pad at the other end of the lower conductive circuit layer corresponds to a lamp bead bonding pad on the third metal electrode plate; the lamp bead unit comprises a first double-chip lamp bead welded on a lamp bead bonding pad in the upper conductive circuit layer and a second double-chip lamp bead welded on a lamp bead bonding pad in the lower conductive circuit layer; the first double-chip lamp bead comprises a first color chip and a second color chip, and the second double-chip lamp bead comprises a third color chip and a fourth color chip; the first color chip, the second color chip, the third color chip and the fourth color chip have different chip colors; the resistance unit is welded on the resistance pad in the upper conductive circuit layer and the lower conductive circuit layer.
The utility model discloses in, upper and lower conducting wire layer forms parallelly connected double circuit with tip metal electrode unit in the double circuit flexible line way board, and tip metal electrode unit includes three metal electrode piece, and wherein two metal electrode pieces are same polarity, and another metal electrode piece is the opposite polarity, and its essence has three lines in the double circuit flexible line way board, and one of them line for sharing can effectually reduce the space that double circuit flexible line way board occupied like this, reduces the width in lamp area.
The lamp bead pad through hole or the resistance pad through hole is formed in the top insulating film layer, and after the top insulating film layer is attached to the top conducting circuit layer, exposed metal with the size of the lamp bead pad through hole or the resistance pad through hole can be formed on the top conducting circuit layer, so that the lamp bead pad through hole or the resistance pad through hole is formed and is used for welding the lamp bead or the resistance.
The chip colors of the first color chip, the second color chip, the third color chip and the fourth color chip are generally selected from one of red, green, blue and white, and each chip corresponds to one color; the upper conductive circuit layer and the lower conductive circuit layer are respectively a loop, the upper conductive circuit layer can emit light with two different colors, the lower conductive circuit layer can emit light with two other different colors, the combination of the upper conductive circuit layer and the lower conductive circuit layer can emit light with four different colors, and the three-wire and two-loop circuit can be realized only. Of course, the chips of the first color chip, the second color chip, the third color chip and the fourth color chip may also be selected from other colors, as long as the chips are four different colors.
Furthermore, the upper conductive circuit layer is formed by connecting a plurality of conductive units in series to form a conductive circuit with a concave-convex structure, and the concave-convex structure faces to the center; the lower conductive circuit layer is also a conductive circuit with a concave-convex structure, is distributed in a central symmetry way relative to the upper conductive circuit layer, staggers the concave-convex structure on the upper conductive circuit layer, and is embedded with the concave-convex structure on the upper conductive circuit layer.
The upper electric circuit layer is a concave-convex structure conductive circuit, and the concave-convex structure faces to the center; the lower conducting circuit layer is also a conducting circuit with a concave-convex structure, the concave-convex structure of the lower conducting circuit layer faces the center, the centers of the upper conducting circuit layer and the lower conducting circuit layer are symmetrically distributed, the concave-convex structure on the upper conducting circuit layer is staggered, and the concave-convex structure on the upper conducting circuit layer is embedded with the concave-convex structure on the upper conducting circuit layer, so that the whole double-loop flexible circuit board structure is more compact, and the width of the flexible circuit board is reduced.
The utility model discloses in, go up the conducting wire layer and establish ties by a plurality of electrically conductive units, the conducting wire layer can be established ties by a plurality of electrically conductive units the same with last conducting wire layer and forms down, also can form the unit series connection by the electrically conductive constitution unit of other differences and form, only need make last conducting wire layer and lower conducting wire layer be concave-convex structure and central symmetric distribution, can make the protruding recess on last conducting wire layer correspond with the recess on lower conducting wire layer after the staggered arrangement, the recess on last conducting wire layer corresponds with the arch on lower conducting wire layer, forms the compact two return circuit flexible line way board of overall structure.
Further, the conductive unit includes a first metal sheet; the first metal sheet is composed of a lower end part, a connecting part and an upper end part, and the upper end part is provided with a downward convex unit; the lower end part of the front metal sheet corresponds to the upper end part of the rear first metal sheet; after the top insulating film layer is attached to the top conducting circuit layer, the bead welding disc through holes fall on the corresponding parts of the two adjacent first metal sheets.
The conductive unit comprises a first metal sheet, namely the upper conductive circuit layer consists of a plurality of first metal sheets; the first metal sheet is composed of a lower end part, a connecting part and an upper end part, and the upper end part is provided with a downward convex unit; the distance between the lower end part and the upper edge of the upper conductive circuit layer is longer than the distance between the bottom of the protruding unit on the upper end part and the upper edge of the upper conductive circuit layer, so that the lower end part of the first metal sheet and the protruding unit form downward protrusions with different heights, and an upward groove is formed between the two protrusions; the lower tip of preceding first sheetmetal corresponds with the upper end of a back first sheetmetal, and after two adjacent first sheetmetals establish ties like this, the space of following first sheetmetal's lower tip to last conducting wire layer upper edge has just been filled to the upper end of preceding sheetmetal, also makes the protruding parallel and level that all first sheetmetals formed after establishing ties, and the sunken parallel and level that forms also utilizes the space of two return circuit flexible line way board more fully.
After the top insulating film layer is attached to the top conductive circuit layer, the bead pad through holes fall on the corresponding parts of the two adjacent first metal sheets, and at the moment, only the beads are arranged on the power utilization element of the upper conductive circuit layer.
Further, the protrusion unit includes a trapezoidal protrusion and/or a parallelogram protrusion.
No matter the protruding unit is trapezoidal arch or parallelogram arch, the bottom of two kinds of bellyings is all flat, and this is that can be faster more convenient tear off leftover bits after the cutting for top conducting wire layer. In the conductive circuit layer, the protrusion units of the first metal sheet may be all trapezoidal protrusions or parallelogram protrusions, or a mixture of the trapezoidal protrusions and the parallelogram protrusions.
Furthermore, the conductive unit further comprises a second metal sheet and a third metal sheet; the second metal sheet is a metal sheet with two ends protruding downwards and the middle sinking upwards, and the third metal sheet is strip-shaped; a second metal sheet and a first metal sheet are arranged at intervals of two first metal sheets, and a third metal sheet is arranged below the upper end part of each first metal sheet and the left end protrusion of each second metal sheet to form a repeating unit; in the repeating unit, the upper end part of a front first metal sheet corresponds to the lower end part of a rear first metal sheet, the upper end part of the rear first metal sheet and the left end of a second metal sheet both correspond to a third metal sheet below, and the right end of the second metal sheet corresponds to the lower end part of the first metal sheet; the repeating units comprise 5 bulges arranged at intervals and a groove arranged between every two adjacent bulges, wherein the bulges at two ends and the two adjacent repeating units are shared bulges; after the top conductive circuit layer is attached to the top conductive insulating film layer, the bead pad through hole falls on the protrusion, and the resistance pad through hole falls on the right end of the third protrusion.
The conductive unit can also comprise a second metal sheet and a third metal sheet besides the first metal sheet; the first metal sheets, the second metal sheets and the third metal sheets are combined to form a repeating unit, and the repeating unit is also another composition and arrangement mode of the upper conducting circuit layer and the lower conducting circuit layer. The repeating unit comprises two first metal sheets, a third metal sheet, a first metal sheet which is arranged in sequence and a second metal sheet which is arranged below the serial connection position of the first metal sheet and the third metal sheet; and connecting a plurality of repeating units in series to form an upper conductive circuit layer, wherein the last repeating unit does not comprise the first metal sheet on the right side of the third metal sheet. The second metal sheet is provided with two downward bulges at two ends and an upward recess in the middle, the two bulges are flush with the bulge units in the first metal sheet, and the bottoms of the recesses are flush with the bottoms of the recesses formed in the first metal sheet; the bottom of the serial connection part of the first metal sheet and the second metal sheet is also parallel and level, corresponds to the strip-shaped third metal sheet, and the bottom of the third metal sheet is also parallel and level with the lower end part of the first metal sheet. The repeating units form 5 bulges and 4 grooves which are arranged at intervals, wherein the bulges at two ends and two adjacent repeating units are shared bulges. After the top conducting circuit layer is attached to the top insulating film layer, the lamp bead pad through hole falls on the bulge to form a lamp bead pad, the third bulge is large, and the resistance pad through hole falls on the right end of the third bulge.
Furthermore, the corners of the first metal sheet, the second metal sheet, the third metal sheet, the first metal electrode sheet, the second metal electrode sheet and the third metal electrode sheet are chamfers; the connecting part is arranged obliquely.
No matter the corners of the first metal sheet, the second metal sheet, the third metal sheet, the first metal electrode sheet, the second metal electrode sheet and the third metal electrode sheet are chamfered or the connecting part of the first metal sheet is obliquely arranged, the redundant metal rim charge in the top conducting circuit layer is conveniently torn off in the production process; in the production process, the raw material that top conducting wire led is a smooth sheetmetal, and through cutting on the sheetmetal, unnecessary metal rim charge links together, can get rid of unnecessary metal rim charge through once tearing off, and the slope design of chamfer design and connecting portion is being torn off the in-process and is being difficult to relatively tearing off, improves the efficiency of tearing off greatly.
Further, the first color chip and the second color chip are connected in series or in parallel; the third color chip and the fourth color chip are connected in series or in parallel.
For realizing the double-loop flexible lamp strip with four colors, two chips in the first double-chip lamp bead and the second double-chip lamp bead can be connected in series or in parallel, and different connecting modes can also bring different other effects.
When the first color chip is connected with the second color chip in series and the third color chip is connected with the fourth color chip in series, the first color chip and the second color chip can emit light or the third color chip and the fourth color chip can emit light or the first color chip, the second color chip, the third color chip and the fourth color chip can emit light simultaneously by controlling the single loop conduction or the double loop conduction of the two loops of the upper conductive circuit layer and the lower conductive circuit layer.
When the first color chip is connected with the second color chip in parallel and the third color chip is connected with the fourth color chip in parallel, if the positive and negative poles of the first color chip and the second color chip are the same, the positive and negative poles of the third color chip and the fourth color chip are also the same, at this time, the first color chip and the second color chip can emit light or the third color chip and the fourth color chip can emit light or the first color chip, the second color chip, the third color chip and the fourth color chip can emit light simultaneously by controlling the single circuit conduction or the double circuit simultaneous conduction of the two circuits of the upper conducting circuit layer and the lower conducting circuit layer; if the positive and negative poles of the first color chip and the second color chip are opposite, and the positive and negative poles of the third color chip and the fourth color chip are also opposite, at the moment, the single color chip can alternatively emit light or the four color chips can simultaneously emit light by controlling the conduction of the single and double loops of the two loops of the upper and lower conducting circuit layers and the switching of the positive and negative poles of the current, and certainly, the simultaneous light emission of the four color chips can be realized when the switching frequency of the positive and negative poles of the current is fast enough.
Further, the lamp pearl pad equidistance that insulating rete in top and last conducting wire layer laminating part formed is arranged, the lamp pearl pad equidistance that insulating rete in top and lower conducting wire layer laminating part formed is arranged.
The luminous homogeneity of each part in lamp area can effectively be improved to lamp pearl pad equidistance arrangement.
Furthermore, a plurality of electrode holes are formed in the first metal electrode plate, the second metal electrode plate and the third metal electrode plate.
The first metal electrode plate, the second metal electrode plate and the third metal electrode plate on the top conducting circuit layer can be conducted with the first electrode, the second electrode and the third electrode in the bottom conducting circuit layer respectively through soldering tin on the electrode holes, and in the actual soldering process, a false soldering phenomenon sometimes occurs to cause that the top conducting circuit layer cannot be conducted; and a plurality of electrode holes are formed in the first metal electrode plate, the second metal electrode plate and the third metal electrode plate, so that the probability of cold joint can be effectively reduced.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a two return circuits flexible lamp area that is used for four-color to switch can realize through two return circuits and only three electrode lines that four-color lamp pearl give off light in turn or give off light simultaneously, and the whole width in lamp area is compared in current four-color lamp area narrowly, and overall structure is compact reasonable.
Drawings
Fig. 1 is the whole structure diagram of the utility model discloses after the laminating of top insulating rete and top conducting wire layer of embodiment 1.
Fig. 2 is a top conductive trace diagram according to embodiment 1 of the present invention.
Fig. 3 is a bottom conductive trace diagram according to embodiment 1 of the present invention.
Fig. 4 is the whole structure diagram of the utility model discloses after top insulating rete and the laminating of top conducting wire layer of embodiment 2.
Fig. 5 is a top conductive trace diagram according to embodiment 2 of the present invention.
Fig. 6 is a bottom conductive trace diagram according to embodiment 2 of the present invention.
Fig. 7 is a structural view of the first metal sheet of the present invention.
Fig. 8 shows a repeating unit according to embodiment 2 of the present invention.
Fig. 9 is a diagram of a layer structure of the flexible printed circuit board of the present invention.
Fig. 10 is a structural diagram of the bottom conductive circuit layer of the present invention.
In the drawings are labeled: 100 parts of a top insulating film layer, 110 parts of lamp bead welding discs and 120 parts of resistance welding discs; top conductive line layer-200, first metal electrode sheet-210, second metal electrode sheet-220, third metal electrode sheet-230, first metal sheet-240, lower end-241, connecting part-242, upper end-243, protruding unit-244, second metal sheet-250 and third metal sheet-260; an insulation base layer-300; a bottom conductive trace layer-400, a first electrode-410, a second electrode-420, a third electrode-430; bottom insulating film layer-500.
Detailed Description
The drawings of the present invention are for illustration purposes only and are not to be construed as limiting the invention. For a better understanding of the following embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Example 1
A double-loop flexible circuit board comprises a flexible circuit board and a lamp bead unit welded on the flexible circuit board, as shown in figure 9, the flexible circuit board comprises a top insulating film layer 100, a top conducting circuit layer 200, an insulating base layer 300, a bottom conducting circuit layer 400 and a bottom insulating film layer 500 which are sequentially arranged, as shown in figures 1-3, the top conducting circuit layer 200 comprises an end metal electrode unit, an upper conducting circuit layer and a lower conducting circuit layer; the end metal electrode unit comprises a first metal electrode plate 210, a second metal electrode plate 220 and a third metal electrode plate 230, wherein the first metal electrode plate 210 and the second metal electrode plate 220 are arranged at one end and are arranged up and down, and the third metal electrode plate 230 is arranged at the other end; as shown in fig. 10, the bottom conductive trace layer 400 includes a first electrode 410, a second electrode 420, and a third electrode 430; the first metal electrode plate 210, the second metal electrode plate 220 and the third metal electrode plate 230 of the top conductive circuit layer 200 are all provided with electrode holes which penetrate through the insulating base layer 300 to reach the first electrode 410, the second electrode 420 and the third electrode 430 respectively; the first electrode 410 and the second electrode 420 are the same electrode, and the third electrode 430 is an opposite electrode; the upper and lower conductive circuit layers and the end metal electrode unit form a double-loop in parallel; a plurality of groups of lamp bead bonding pad through holes are formed in the top insulating film layer 100, and are attached to the top conductive circuit layer 200 to form a plurality of groups of lamp bead bonding pads 110 or resistance bonding pads 120; the lamp bead bonding pad 110 at one end of the upper conductive circuit layer corresponds to the lamp bead bonding pad 110 on the first metal electrode plate 210 to form a group of lamp bead bonding pads 110, and the lamp bead bonding pad 110 at the other end of the upper conductive circuit layer corresponds to the lamp bead bonding pad 110 on the third metal electrode plate 230 to form a group of lamp bead bonding pads 110; the lamp bead bonding pad 110 at one end of the lower conductive circuit layer corresponds to the lamp bead bonding pad 110 on the second metal electrode plate 220 to form a group of lamp bead bonding pads 110, and the lamp bead bonding pad 110 at the other end of the lower conductive circuit layer corresponds to the lamp bead bonding pad 110 on the third metal electrode plate 230 to form a group of lamp bead bonding pads 110; the lamp bead unit comprises a first double-chip lamp bead welded on a lamp bead bonding pad in the upper conductive circuit layer and a second double-chip lamp bead welded on a lamp bead bonding pad in the lower conductive circuit layer; the first double-chip lamp bead comprises a first color chip and a second color chip, and the second double-chip lamp bead comprises a third color chip and a fourth color chip; the first color chip, the second color chip, the third color chip and the fourth color chip are different in chip color.
In this embodiment, the upper and lower conductive circuit layers in the dual-loop flexible printed circuit board and the end metal electrode unit form a dual loop connected in parallel, and the end metal electrode unit includes three metal electrode pieces, two of which are anodes, and the other metal electrode piece is a cathode, which is essentially the dual-loop flexible printed circuit board having three lines, one of which is a common line, so that the space occupied by the dual-loop flexible printed circuit board can be effectively reduced, and the width of the lamp strip can be reduced. The chip colors of the first color chip, the second color chip, the third color chip and the fourth color chip are respectively red, green, blue and white; the first color chip and the second color chip are connected in parallel and have opposite positive and negative poles, and the third color chip and the fourth color chip are connected in parallel and have opposite positive and negative poles; in the upper conducting circuit layer, when the first electrode is a positive electrode, the third electrode is a negative electrode, current flows from the first metal electrode plate to the third metal electrode plate, if the lamp strip emits red light, then when the first electrode is a negative electrode, current flows from the third metal electrode plate to the first metal electrode plate, and the lamp strip emits green light. Similarly, in the lower conductive circuit layer, blue and white light can be alternately emitted by switching the current anode and the current cathode. Thus, there are four current directions, respectively: the first metal electrode plate flows to the third metal electrode plate, the third metal electrode plate flows to the first metal electrode plate, the second metal electrode plate flows to the third metal electrode plate, and the third metal electrode plate flows to the second metal electrode plate.
In the present embodiment, as shown in fig. 2, the upper conductive trace layer is formed by connecting 11 first metal sheets 240 in series, as shown in fig. 7, the first metal sheets 240 are composed of a lower end portion 241, a connecting portion 242 and an upper end portion 243, and the upper end portion 243 has a downward protruding unit 244; in the present embodiment, the protrusion unit 244 has a trapezoid shape, but the protrusion unit 244 may also have a parallelogram shape; the upper end 243 of the previous first metal sheet 240 and the lower end 241 of the next first metal sheet 240 form a protrusion, which is flush with the lower end 241; a groove is formed between the lower end part 241 and the projection; the whole upper conductive circuit layer forms a concave-convex structure conductive circuit.
In this embodiment, as shown in fig. 3, the composition and distribution of the lower conductive trace layer are completely consistent with those of the upper conductive trace layer, and the lower conductive trace layer and the upper conductive trace layer are centrosymmetric and are staggered and embedded with each other. The protrusion on the upper conductive circuit layer corresponds to the groove on the lower conductive circuit layer, and the groove on the upper conductive circuit layer corresponds to the protrusion on the lower conductive circuit layer, so that the upper conductive circuit layer and the lower conductive circuit layer can be well embedded together, and then the upper conductive circuit layer and the lower conductive circuit layer are connected in series with the end electrode metal unit to form a complete top conductive circuit layer 200, so that the whole double-loop flexible circuit board structure is more compact, and the width of the flexible circuit board is reduced.
In the present embodiment, as shown in fig. 1, the end metal electrode tabs include a first metal electrode tab 210, a second metal electrode tab 220, and a third metal electrode tab 230; one end of the first metal electrode sheet 210 is provided with two electrode holes, penetrates through the insulating base layer 300 to the first electrode 410, and is conducted with the first electrode 410 through soldering tin in the electrode holes; the other end of the first metal electrode sheet 210 protrudes downwards and corresponds to the lower end 241 of the leftmost first metal sheet 240; one end of the second metal electrode sheet 220 is also provided with two electrode holes, penetrates through the insulating base layer 300 to the second electrode 420, and is conducted with the second electrode 420 through soldering tin in the electrode holes; the other end of the second metal electrode sheet 220 is positioned in a space formed by the first metal electrode sheet 210 and the leftmost end of the lower conductive circuit layer and corresponds to the bulge at the leftmost end of the lower conductive circuit layer; the third metal electrode plate 230 has two electrode holes at one end, and an electrode hole at the bottom of the third metal electrode plate, except for the rightmost end of the upper and lower conductive circuit layers, and can be connected to the third electrode 430 through soldering tin in the electrode hole.
In this embodiment, after the top conductive circuit layer 200 is attached to the top insulating film layer 100, the bead pad through hole falls on the corresponding part of the protrusion in the upper and lower layer of the electric circuit layer to form the bead pad 110; in upper and lower conducting circuit layer, lamp pearl pad 110 is the equidistance and arranges.
In the embodiment, the corners of all the metal sheets in the upper and lower conductive circuit layers are chamfered; the connection portion 242 of the first metal sheet 240 is arranged obliquely; the upper end 243 forms an upper edge. No matter the corners of the first metal sheet 240, the first metal electrode sheet 210, the second metal electrode sheet 220 and the third metal electrode sheet 230 are chamfered or the connecting part 242 of the first metal sheet 240 is obliquely arranged, the redundant metal rim charge in the top conductive circuit layer 200 is conveniently torn off in the production process; in the production process, the raw material that top conducting wire led is a smooth sheetmetal, and through cutting on the sheetmetal, unnecessary metal rim charge links together, can get rid of unnecessary metal rim charge through once tearing off, and the slope design of chamfer design and connecting portion 242 is tearing off the in-process and is difficult to tear relatively, improves the efficiency of tearing off greatly.
Example 2
A double-loop flexible circuit board comprises a flexible circuit board, and a lamp bead unit and a resistance unit which are welded on the flexible circuit board, as shown in figure 9, the flexible circuit board comprises a top insulating film layer 100, a top conducting circuit layer 200, an insulating base layer 300, a bottom conducting circuit layer 400 and a bottom insulating film layer 500 which are sequentially arranged, as shown in figures 4-6, the top conducting circuit layer 200 comprises an end metal electrode unit, an upper conducting circuit layer and a lower conducting circuit layer; the end metal electrode unit comprises a first metal electrode plate 210, a second metal electrode plate 220 and a third metal electrode plate 230, wherein the first metal electrode plate 210 and the second metal electrode plate 220 are arranged at one end and are arranged up and down, and the third metal electrode plate 230 is arranged at the other end; as shown in fig. 10, the bottom conductive trace layer 400 includes a first electrode 410, a second electrode 420, and a third electrode 430; the first metal electrode plate 210, the second metal electrode plate 220 and the third metal electrode plate 230 of the top conductive circuit layer 200 are all provided with electrode holes which penetrate through the insulating base layer 300 to reach the first electrode 410, the second electrode 420 and the third electrode 430 respectively; the first electrode 410 and the second electrode 420 are the same electrode, and the third electrode 430 is an opposite electrode; as shown in fig. 4, the upper and lower conductive circuit layers and the end metal electrode units form a dual-circuit in parallel; a plurality of groups of lamp bead bonding pad through holes and a plurality of groups of resistance bonding pad through holes are formed in the top insulating film layer 100 and are mixed, and a plurality of groups of lamp bead bonding pads 110 or resistance bonding pads 120 are formed after the lamp bead bonding pad through holes and the top conductive circuit layer 200 are attached; as shown in fig. 5, the lamp bead pads 110 at one end of the upper conductive circuit layer correspond to the lamp bead pads 110 on the first metal electrode plate 210 to form a group of lamp bead pads 110, and the lamp bead pads 110 at the other end of the upper conductive circuit layer correspond to the lamp bead pads 110 on the third metal electrode plate 230 to form a group of lamp bead pads 110; as shown in fig. 6, a set of bead pads 110 is formed by the bead pads 110 at one end of the lower conductive circuit layer corresponding to the bead pads 110 on the second metal electrode sheet 220, and a set of bead pads 110 is formed by the bead pads 110 at the other end of the lower conductive circuit layer corresponding to the bead pads 110 on the third metal electrode sheet 230; the lamp bead unit comprises a first double-chip lamp bead welded on a lamp bead bonding pad in the upper conductive circuit layer and a second double-chip lamp bead welded on a lamp bead bonding pad in the lower conductive circuit layer; the first double-chip lamp bead comprises a first color chip and a second color chip, and the second double-chip lamp bead comprises a third color chip and a fourth color chip; the first color chip, the second color chip, the third color chip and the fourth color chip have different chip colors; the resistance unit is welded on the resistance pad in the upper conductive circuit layer and the lower conductive circuit layer.
In this embodiment, the upper and lower conductive circuit layers in the dual-loop flexible printed circuit board and the end metal electrode unit form a dual loop connected in parallel, and the end metal electrode unit includes three metal electrode pieces, two of which are anodes, and the other metal electrode piece is a cathode, which is essentially the dual-loop flexible printed circuit board having three lines, one of which is a common line, so that the space occupied by the dual-loop flexible printed circuit board can be effectively reduced, and the width of the lamp strip can be reduced. The chip colors of the first color chip, the second color chip, the third color chip and the fourth color chip are respectively red, green, blue and white; the first color chip and the second color chip are connected in parallel and have opposite positive and negative poles, and the third color chip and the fourth color chip are connected in parallel and have opposite positive and negative poles; in the upper conducting circuit layer, when the first electrode is a positive electrode, the third electrode is a negative electrode, current flows from the first metal electrode plate to the third metal electrode plate, if the lamp strip emits red light, then when the first electrode is a negative electrode, current flows from the third metal electrode plate to the first metal electrode plate, and the lamp strip emits green light. Similarly, in the lower conductive circuit layer, blue and white light can be alternately emitted by switching the current anode and the current cathode. Thus, there are four current directions, respectively: the first metal electrode plate flows to the third metal electrode plate, the third metal electrode plate flows to the first metal electrode plate, the second metal electrode plate flows to the third metal electrode plate, and the third metal electrode plate flows to the second metal electrode plate.
As shown in fig. 5, the upper conductive trace layer is formed by connecting three repeating units in series, and as shown in fig. 8, the repeating unit is formed by connecting two first metal sheets 240 and a third metal sheet 260 in series, and then connecting a second metal sheet 250 and a first metal sheet 240 in series; a first metal sheet 240 in which the third repeating unit does not include a terminal end; the first metal sheet 240 is composed of a lower end portion 241, a connecting portion 242, and an upper end portion 243, and the upper end portion 243 has a downward protrusion unit 244; the second metal sheet 250 is a structure with two ends protruding downwards and the middle recessed downwards, and the third metal sheet 260 is in a strip shape; the upper end 243 of the previous first metal sheet 240 corresponds to the lower end 241 of the next first metal sheet 240, the upper end 243 of the next first metal sheet 240 corresponds to one end of a third metal sheet 260, the other end of the third metal sheet 260 corresponds to one end of a second metal sheet 250, and the other end of the second metal sheet 250 corresponds to the lower end 241 of the last first metal sheet 240; the repeating unit is provided with 5 bulges which are arranged at intervals and 4 grooves between two adjacent bulges, and the bulges at two ends are shared with the bulges of two adjacent repeating units; in the upper conducting circuit layer, all the bulges are level and the bottoms of all the grooves are level and level; the upper conductive circuit layer forms a conductive circuit with a concave-convex structure.
As shown in fig. 6, the lower conductive trace layer also forms a conductive trace with a concave-convex structure, and the conductive trace and the upper conductive trace layer are distributed in a central symmetry manner and are staggered and embedded with each other. The composition structure of the lower conductive circuit layer is basically similar to that of the upper conductive circuit layer, wherein the composition unit structures corresponding to the third metal sheet 260 in the lower conductive circuit layer and the upper conductive circuit layer are completely consistent, the composition unit parts corresponding to the first metal sheet 240 in the upper conductive circuit layer are consistent, part of the composition unit parts are different in the protruding units 244, and similar points exist on the composition unit structures corresponding to the second metal sheet 250 in the upper conductive circuit layer, both ends of the composition unit parts are provided with protrusions, but the structures of the protrusions at both ends are different; however, the concave-convex structure formed on the lower conductive circuit layer is completely consistent with the concave-convex structure formed on the upper conductive circuit layer, so that the concave-convex structure and the convex-concave structure can be well embedded together, and the width of the flexible circuit board is reduced.
In this embodiment, the protrusion units 244 in the upper conductive trace layer include isosceles trapezoid protrusions, non-isosceles trapezoid protrusions, and parallelogram protrusions, which are mutually matched to ensure that all the space is fully utilized in a minimum occupied area.
After the top conductive circuit layer 200 is attached to the top insulating film layer 100, the bead pad through holes fall on the corresponding parts of the protrusions of the upper conductive circuit layer and the lower conductive circuit layer to form bead pads 110; the through holes of the resistance pad fall on the corresponding portion of the third metal sheet 260 and the second metal sheet 250 in the upper conductive trace layer, and the through holes of the resistance pad 120 on the lower conductive trace layer fall on the central symmetry of the corresponding portion.
In the present embodiment, as shown in fig. 4, the end metal electrode tabs include a first metal electrode tab 210, a second metal electrode tab 220, and a third metal electrode tab 230; one end of the first metal electrode sheet 210 is provided with two electrode holes, penetrates through the insulating base layer 300 to the first electrode 410, and is conducted with the first electrode 410 through soldering tin in the electrode holes; the other end of the first metal electrode sheet 210 protrudes downwards and corresponds to the lower end 241 of the leftmost first metal sheet 240; one end of the second metal electrode sheet 220 is also provided with two electrode holes, penetrates through the insulating base layer 300 to the second electrode 420, and is conducted with the second electrode 420 through soldering tin in the electrode holes; the other end of the second metal electrode sheet 220 is positioned in a space formed by the first metal electrode sheet 210 and the leftmost end of the lower conductive circuit layer and corresponds to the bulge at the leftmost end of the lower conductive circuit layer; the third metal electrode plate 230 has two electrode holes at one end, and an electrode hole at the bottom of the third metal electrode plate, except for the rightmost end of the upper and lower conductive circuit layers, and can be connected to the third electrode 430 through soldering tin in the electrode hole.
In this embodiment, in the upper and lower conductive circuit layers, the bead pads 110 are arranged at equal intervals.
In the embodiment, the corners of all the metal sheets in the upper and lower conductive circuit layers are chamfered; the connection portion 242 of the first metal sheet 240 is arranged obliquely; the upper end 243 forms an upper edge. No matter the corners of the first metal sheet 240, the second metal sheet 250, the third metal sheet 260, the first metal electrode sheet 210, the second metal electrode sheet 220 and the third metal electrode sheet 230 are chamfered or the connecting part 242 of the first metal sheet 240 is arranged obliquely, the redundant metal rim charge in the top conductive circuit layer 200 is conveniently torn off in the production process; in the production process, the raw material that top conducting wire led is a smooth sheetmetal, and through cutting on the sheetmetal, unnecessary metal rim charge links together, can get rid of unnecessary metal rim charge through once tearing off, and the slope design of chamfer design and connecting portion 242 is tearing off the in-process and is difficult to tear relatively, improves the efficiency of tearing off greatly.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the technical solutions of the present invention, and are not limitations to the specific embodiments of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims (10)
1. A double-loop flexible lamp strip for four-color switching comprises a flexible circuit board, and a lamp bead unit and/or a resistor unit welded on the flexible circuit board, wherein the flexible circuit board comprises a top insulating film layer, a top conductive circuit layer, an insulating base layer, a bottom conductive circuit layer and a bottom insulating film layer which are sequentially arranged; the end metal electrode unit comprises a first metal electrode plate, a second metal electrode plate and a third metal electrode plate, wherein the first metal electrode plate and the second metal electrode plate are arranged at one end and are arranged up and down, and the third metal electrode plate is arranged at the other end; the bottom conducting circuit layer comprises a first electrode, a second electrode and a third electrode; electrode holes are formed in the first metal electrode plate, the second metal electrode plate and the third metal electrode plate of the top conducting circuit layer and penetrate through the insulating base layer to reach the first electrode, the second electrode and the third electrode respectively; the first electrode and the second electrode are of the same polarity, and the third electrode is of opposite polarity; the upper and lower conductive circuit layers and the end metal electrode unit form a double-loop in parallel; the top insulating film layer is provided with a plurality of groups of lamp bead bonding pad through holes and/or a plurality of groups of resistance bonding pad through holes, and a plurality of groups of lamp bead bonding pads and/or resistance bonding pads are formed after the top insulating film layer is attached to the top conducting circuit layer; a lamp bead bonding pad at one end of the upper conductive circuit layer corresponds to a lamp bead bonding pad on the first metal electrode plate, and a lamp bead bonding pad at the other end of the upper conductive circuit layer corresponds to a lamp bead bonding pad on the third metal electrode plate; a lamp bead bonding pad at one end of the lower conductive circuit layer corresponds to a lamp bead bonding pad on the second metal electrode plate, and a lamp bead bonding pad at the other end of the lower conductive circuit layer corresponds to a lamp bead bonding pad on the third metal electrode plate; the lamp bead unit comprises a first double-chip lamp bead welded on a lamp bead bonding pad in the upper conductive circuit layer and a second double-chip lamp bead welded on a lamp bead bonding pad in the lower conductive circuit layer; the first double-chip lamp bead comprises a first color chip and a second color chip, and the second double-chip lamp bead comprises a third color chip and a fourth color chip; the first color chip, the second color chip, the third color chip and the fourth color chip have different chip colors; the resistance unit is welded on the resistance welding pads in the upper conductive circuit layer and the lower conductive circuit layer.
2. The dual-loop flexible light strip for four-color switching according to claim 1, wherein the upper conductive circuit layer is formed by connecting a plurality of conductive units in series to form a conductive circuit having a concave-convex structure, and the concave-convex structure faces to the center; the lower conductive circuit layer is also a conductive circuit with a concave-convex structure, is distributed in a central symmetry way relative to the upper conductive circuit layer, staggers the concave-convex structure on the upper conductive circuit layer, and is embedded with the concave-convex structure on the upper conductive circuit layer.
3. A dual-loop flexible light strip for four-color switching according to claim 2, wherein said conductive element comprises a first metal sheet; the first metal sheet is composed of a lower end part, a connecting part and an upper end part, and the upper end part is provided with a downward convex unit; the lower end part of the front first metal sheet corresponds to the upper end part of the rear first metal sheet; after the top insulating film layer is attached to the top conducting circuit layer, the bead welding disc through holes fall on the corresponding parts of the two adjacent first metal sheets.
4. A dual-loop flexible light strip for four-color switching according to claim 3, wherein said bump units comprise trapezoidal bumps and/or parallelogram bumps.
5. A dual-loop flexible light strip for four-color switching according to claim 3, wherein said conductive unit further comprises a second metal sheet and a third metal sheet; the second metal sheet is a metal sheet with two ends protruding downwards and the middle sinking upwards, and the third metal sheet is strip-shaped; arranging a second metal sheet and a first metal sheet every two first metal sheets, and arranging a third metal sheet below the upper end part of each first metal sheet and the left end bulge of each second metal sheet to form a repeating unit; in the repeating unit, the upper end part of a front first metal sheet corresponds to the lower end part of a rear first metal sheet, the upper end part of the rear first metal sheet and the left end of a second metal sheet both correspond to a third metal sheet below, and the right end of the second metal sheet corresponds to the lower end part of the first metal sheet; the repeating units comprise 5 bulges arranged at intervals and a groove arranged between every two adjacent bulges, wherein the bulges at two ends and the two adjacent repeating units are shared bulges; after the top conductive circuit layer is attached to the top conductive insulating film layer, the bead pad through hole falls on the protrusion, and the resistance pad through hole falls on the right end of the third protrusion.
6. The dual-loop flexible light strip for four-color switching according to claim 5, wherein the corners of the first metal sheet, the second metal sheet, the third metal sheet, the first metal electrode sheet, the second metal electrode sheet and the third metal electrode sheet are chamfered.
7. A dual-loop flexible light strip for four-color switching according to any one of claims 3 to 6, wherein said connection portion is disposed in an inclined manner.
8. The dual-loop flexible light strip for four-color switching according to any one of claims 1 to 6, wherein the first color chip and the second color chip are connected in series or in parallel; the third color chip and the fourth color chip are connected in series or in parallel.
9. The double-loop flexible light strip for four-color switching according to any one of claims 1 to 6, wherein the top insulating film layer is disposed at an equal distance from the lamp bead pads formed by the upper conductive circuit layer bonding portion, and the top insulating film layer is disposed at an equal distance from the lamp bead pads formed by the lower conductive circuit layer bonding portion.
10. The dual-circuit flexible light strip for four-color switching according to any one of claims 1 to 6, wherein a plurality of electrode holes are formed on the first metal electrode sheet, the second metal electrode sheet and the third metal electrode sheet.
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| CN112728443A (en) * | 2020-12-31 | 2021-04-30 | 广东顺德施瑞科技有限公司 | Four-color lamp strip and control circuit thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112728443A (en) * | 2020-12-31 | 2021-04-30 | 广东顺德施瑞科技有限公司 | Four-color lamp strip and control circuit thereof |
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