CN213958016U

CN213958016U - Liquid cooling heat radiation structure for computer

Info

Publication number: CN213958016U
Application number: CN202120195517.6U
Authority: CN
Inventors: 孙海涛; 米庆雪
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-01-25
Filing date: 2021-01-25
Publication date: 2021-08-13
Anticipated expiration: 2031-01-25

Abstract

The utility model discloses a liquid cooling heat radiation structure that computer was used, including computer machine case, go up cooling device, work frame, bent pipe and left cooling tube, computer machine incasement portion right side has the coolant liquid case through the screw fixation, and the left downside fixed mounting of coolant liquid case has the inlet tube, and the inlet tube tip is fixed with the heating panel simultaneously to the upper left side of cooling panel is provided with the outlet pipe, work frame fixed connection is inside computer machine lateral wall, and work frame is inside to have radiator fan through the support mounting, and the cooling frame is installed in the radiator fan left side simultaneously, bent pipe left side and circulating pipe fixed connection. This liquid cooling heat radiation structure for computer, two cooling processes simultaneous working improve radiator fan to the radiating effect of coolant liquid, and the outside circumference position of left cooling tube, right cooling tube evenly is provided with multiunit heat radiation fins simultaneously, and heat radiation fins's setting can further improve the radiating effect of air current to the inside coolant liquid of cooling tube.

Description

Liquid cooling heat radiation structure for computer

Technical Field

The utility model relates to a computer cooling equipment science and technology technical field specifically is a liquid cooling heat radiation structure for computer.

Background

The cooling system inside the computer mainframe box at present generally adopts two kinds of modes of air cooling and water cooling, along with the continuous development of display card processing chip, its calorific capacity that produces in the course of the work constantly promotes, in order to guarantee good heat dispersion and display card normal work, its air cooling must adopt high rotational speed fan cooling, and high rotational speed fan brings huge noise and vibrations, makes people vexed.

In view of the above, the present invention has been made in view of the above problems.

Therefore, a liquid cooling heat dissipation structure for a computer is provided to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a liquid cooling heat radiation structure that computer was used to solve the defect mentioned in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a liquid cooling heat dissipation structure for a computer comprises a computer case, an upper cooling device, a working frame, a curved pipe and a left heat dissipation pipe, wherein a cooling liquid tank is fixed on the right side inside the computer case through screws, and the left lower side of the cooling liquid tank is fixedly provided with a water inlet pipe, the end part of the water inlet pipe is fixed with the heat dissipation plate, and the left upper side of the radiating plate is provided with a water outlet pipe, the working frame is fixedly connected with the inner side of the outer side wall of the computer case, and a radiating fan is arranged in the working frame through a bracket, meanwhile, the left side of the heat radiation fan is provided with a cooling frame, the left side of the curved pipe is fixedly connected with the circulating pipe, the right side of the curved pipe is fixedly connected with the water inlet end of the circulating pump, meanwhile, the water outlet end of the circulating pump is communicated with the cooling liquid tank through a return pipe, the heat dissipation plate is installed on the surface of the computer mainboard through screws, and a computer CPU is installed on the surface of the computer mainboard.

Preferably, the coolant tank is communicated with the heat dissipation plate through a water inlet pipe, and the heat dissipation plate is fixed with the shunt pipe inside the cooling frame through a water outlet pipe.

Preferably, the heating panel is the rectangle structure of being made by pure copper material, and the inside even four wave baffles of group of fixedly connected with of heating panel, and the heating panel is inside to form five cooling bath groups through four baffle groups, and five cooling bath groups intercommunication sets up simultaneously to the bottom fixedly connected with limiting plate of heating panel, the limiting groove has been seted up to limiting plate inside, and the limiting plate passes through its inside limiting groove card at computer CPU's upper surface.

Preferably, the upper cooling device is composed of four parts, namely a cooling frame, a left radiating pipe, a right radiating pipe and a radiating fan, the radiating fan and the cooling frame are arranged oppositely, and the upper cooling device and the lower cooling device are consistent in composition structure.

Preferably, the upper cooling device and the lower cooling device are arranged in series, and the water outlet pipe is communicated with the circulating pipe sequentially through the upper cooling device and the lower cooling device.

Preferably, cooling frame is inside to have left cooling tube and right cooling tube through the support mounting, and left cooling tube and right cooling tube be symmetrical structure about the shunt tubes, and the shunt tubes sets up two sets of upper and lower both ends of fixing at cooling frame respectively simultaneously, and the shunt tubes is "Y" shape structure of being made by the metal material, and the shunt tubes and the outlet pipe intercommunication that are located cooling frame upper end set up, and the shunt tubes and the intercommunication setting of communicating pipe that are located cooling frame lower extreme.

Preferably, the outer circumferential positions of the left radiating pipe and the right radiating pipe are uniformly and fixedly connected with a plurality of groups of radiating fins, and the left radiating pipe and the right radiating pipe are arranged in an S shape in the cooling frame.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the upper cooling device carries out a first cooling process on the cooling liquid, meanwhile, the lower cooling device carries out a second cooling process on the cooling liquid, the two cooling processes work simultaneously, the heat dissipation effect of the cooling fan on the cooling liquid is improved, meanwhile, a plurality of groups of heat dissipation fins are uniformly arranged at the circumferential positions of the outer sides of the left cooling tube and the right cooling tube, and the heat dissipation effect of air flow on the cooling liquid in the cooling tubes can be further improved due to the arrangement of the heat dissipation fins; the condition that the fan with high rotating speed brings huge noise and vibration and is annoying is avoided.

2. The interior of the heat dissipation plate is isolated into five groups of cooling tanks through four groups of partition plates, cooling liquid sequentially passes through the five groups of cooling tanks, and the partition plates are provided with openings for circulating the cooling liquid; the arrangement of the five groups of cooling grooves can improve the retention time of the cooling liquid in the heat dissipation plate so as to achieve the characteristic of improving the heat dissipation effect on the CPU of the computer.

Drawings

FIG. 1 is a front view of the structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the cooling device of the present invention;

FIG. 3 is a schematic sectional view taken along line A-A in FIG. 2;

FIG. 4 is a schematic view of the heat dissipation plate of the present invention;

fig. 5 is a top view of the structure heat dissipation plate of the present invention.

Reference numbers in the figures: 1. a computer chassis; 2. a coolant tank; 3. a water inlet pipe; 4. a computer motherboard; 5. a heat dissipation plate; 6. a water outlet pipe; 7. an upper cooling device; 8. a working frame; 9. a heat radiation fan; 10. a cooling frame; 11. a communicating pipe; 12. a lower cooling device; 13. a circulation pipe; 14. a curved tube; 15. a circulation pump; 16. a return pipe; 17. a left radiating pipe; 18. a shunt tube; 19. a right radiating pipe; 20. heat dissipation fins; 21. a computer CPU; 22. a limiting plate; 23. a partition plate; 24. and (6) cooling the tank.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a liquid cooling heat radiation structure for a computer comprises a computer case 1, an upper cooling device 7, a working frame 8, a curved pipe 14 and a left heat radiation pipe 17, wherein a cooling liquid tank 2 is fixed on the right side inside the computer case 1 through screws, a water inlet pipe 3 is fixedly installed on the lower left side of the cooling liquid tank 2, the end part of the water inlet pipe 3 is fixed with a heat radiation plate 5, a water outlet pipe 6 is arranged on the upper left side of the heat radiation plate 5, the cooling liquid tank 2 is communicated with the heat radiation plate 5 through the water inlet pipe 3, and the heat radiation plate 5 is fixed with a flow division pipe 18 inside a cooling frame 10 through the water outlet pipe 6; a left radiating pipe 17 and a right radiating pipe 19 are arranged in the cooling frame 10 through a support, the left radiating pipe 17 and the right radiating pipe 19 are in a symmetrical structure relative to a shunt pipe 18, two groups of shunt pipes 18 are arranged and fixed at the upper end and the lower end of the cooling frame 10 respectively, the shunt pipes 18 are in a Y-shaped structure made of metal materials, the shunt pipes 18 positioned at the upper end of the cooling frame 10 are communicated with the water outlet pipe 6, and the shunt pipes 18 positioned at the lower end of the cooling frame 10 are communicated with the communicating pipes 11; the working frame 8 is fixedly connected to the inside of the outer side wall of the computer case 1, a cooling fan 9 is mounted inside the working frame 8 through a support, a cooling frame 10 is mounted on the left side of the cooling fan 9, the left side of a curved pipe 14 is fixedly connected with a circulating pipe 13, the right side of the curved pipe 14 is fixedly connected with the water inlet end of a circulating pump 15, the water outlet end of the circulating pump 15 is communicated with the cooling liquid tank 2 through a return pipe 16, a cooling plate 5 is mounted on the surface of a computer mainboard 4 through screws, and a computer CPU21 is mounted on the surface of the computer mainboard 4; the heat dissipation plate 5 is of a rectangular structure made of pure copper, four groups of wavy partition plates 23 are uniformly and fixedly connected inside the heat dissipation plate 5, five groups of cooling grooves 24 are formed inside the heat dissipation plate 5 through the four groups of partition plates 23, meanwhile, the five groups of cooling grooves 24 are communicated, a limiting plate 22 is fixedly connected to the bottom of the heat dissipation plate 5, a limiting groove is formed inside the limiting plate 22, and the limiting plate 22 is clamped on the upper surface of the CPU21 of the computer through the limiting groove inside the limiting plate 22; the upper cooling device 7 is composed of four parts, namely a cooling frame 10, a left radiating pipe 17, a right radiating pipe 19 and a radiating fan 9, the radiating fan 9 and the cooling frame 10 are arranged oppositely, and the upper cooling device 7 and the lower cooling device 12 are consistent in composition structure; the upper cooling device 7 and the lower cooling device 12 are arranged in series, and the water outlet pipe 6 is communicated with the circulating pipe 13 sequentially through the upper cooling device 7, the lower cooling device 12 and the circulating pipe 13; a plurality of sets of heat dissipation fins 20 are uniformly and fixedly connected to the outer circumferential positions of the left heat dissipation tube 17 and the right heat dissipation tube 19, and the left heat dissipation tube 17 and the right heat dissipation tube 19 are disposed inside the cooling frame 10 in an "S" shape.

As shown in fig. 1-2: after the cooling liquid takes away the heat generated by the computer CPU21, as the cooling liquid enters the inside of the diversion pipe 18 through the water outlet pipe 6, the diversion pipe 18 arranged in the shape of "Y" enters the inside of the left radiating pipe 17 and the right radiating pipe 19 in sequence, when the cooling liquid flows inside the left radiating pipe 17 and the right radiating pipe 19, the cooling fan 9 accelerates the flow rate of the air flow, the air cooling heat dissipation work is performed on the left radiating pipe 17 and the right radiating pipe 19, so as to achieve the purpose of reducing the temperature of the cooling liquid inside the left radiating pipe 17 and the right radiating pipe 19, which is the working mode of the upper cooling device 7, the upper cooling device 7 is connected with the lower cooling device 12 in series, the upper cooling device 7 performs a first cooling process on the cooling liquid, the lower cooling device 12 performs a second cooling process on the cooling liquid, the two cooling processes work simultaneously, the heat dissipation effect of the cooling fan 9 on the cooling liquid is improved, and simultaneously, the left radiating pipe 17, the right radiating pipe 19, A plurality of sets of heat dissipation fins 20 are uniformly arranged at the outer circumferential position of the right heat dissipation pipe 19, and the arrangement of the heat dissipation fins 20 can improve the heat dissipation effect of the air flow on the cooling liquid inside the heat dissipation pipe.

As shown in fig. 1 and fig. 4-5: the cooling liquid enters the heat dissipation plate 5 through the water inlet pipe 3, the heat dissipation plate 5 is internally partitioned into five groups of cooling grooves 24 through four groups of partition plates 23, the cooling liquid sequentially passes through the five groups of cooling grooves 24, and the partition plates 23 are provided with openings for circulating the cooling liquid; the five groups of cooling grooves 24 can improve the retention time of the cooling liquid in the heat dissipation plate 5, so as to achieve the characteristic of improving the heat dissipation effect on the computer CPU 21; the bottom of the heat dissipation plate 5 is clamped on the upper surface of the computer CPU21 through the limiting plate 22, so that the positioning and installation work between the heat dissipation plate 5 and the limiting plate 22 can be realized.

The working principle is as follows: when the liquid cooling heat dissipation structure for a computer is used, the circulating pump 15 is started, the circulating pump 15 injects the liquid inside the curved pipe 14 into the cooling liquid tank 2 through the return pipe 16, at this time, the pressure inside the cooling liquid tank 2 is increased, so that the cooling liquid enters the water inlet pipe 3 and enters the heat dissipation plate 5, the heat dissipation plate 5 covers the surface of the computer CPU21, the water cooling operation is performed on the computer CPU21, at this time, the cooling liquid is heated and then enters the water outlet pipe 6, the liquid inside the water outlet pipe 6 is injected into the shunt pipe 18 and then sequentially enters the left heat dissipation pipe 17 and the right heat dissipation pipe 19, at this time, the heat dissipation fan 9 performs the heat dissipation operation on the cooling liquid inside the left heat dissipation pipe 17 and the right heat dissipation pipe 19, meanwhile, the lower cooling device 12 performs the secondary heat dissipation operation on the cooling liquid, the temperature reduction operation on the cooling liquid is completed, and then sequentially passes through the circulation pipe 13, The curved pipe 14, the circulating pump 15 and the return pipe 16 are recycled into the cooling liquid tank 2 to finish the heat dissipation work of the computer CPU21 and improve the heat dissipation effect of the computer CPU 21; this is the whole process of the liquid cooling heat dissipation structure for the computer.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a liquid cooling heat radiation structure that computer was used, includes computer machine case (1), goes up cooling device (7), work frame (8), bent pipe (14) and left cooling tube (17), its characterized in that: the cooling liquid box (2) is fixed on the right side in the computer case (1) through screws, the water inlet pipe (3) is fixedly installed on the lower left side of the cooling liquid box (2), the end part of the water inlet pipe (3) is fixed with the heat dissipation plate (5), the water outlet pipe (6) is arranged on the upper left side of the heat dissipation plate (5), the working frame (8) is fixedly connected inside the outer side wall of the computer case (1), the heat dissipation fan (9) is installed inside the working frame (8) through a support, the cooling frame (10) is installed on the left side of the heat dissipation fan (9), the left side of the curved pipe (14) is fixedly connected with the circulating pipe (13), the right side of the curved pipe (14) is fixedly connected with the water inlet end of the circulating pump (15), the water outlet end of the circulating pump (15) is communicated with the cooling liquid box (2) through a return pipe (16), and the heat dissipation plate (5) is installed on the surface of a computer main board (4) through screws, and a computer CPU (21) is arranged on the surface of the computer mainboard (4).

2. The liquid-cooled heat dissipating structure for a computer according to claim 1, wherein: the cooling liquid tank (2) is communicated with the heat dissipation plate (5) through the water inlet pipe (3), and the heat dissipation plate (5) is fixed with the shunt pipe (18) inside the cooling frame (10) through the water outlet pipe (6).

3. The liquid-cooled heat dissipating structure for a computer according to claim 1, wherein: heating panel (5) are the rectangle structure of being made by pure copper material, and heating panel (5) inside even fixedly connected with four groups of wavy baffles (23), heating panel (5) are inside to form five groups of cooling bath (24) through four groups of baffles (23), five groups of cooling bath (24) intercommunication sets up simultaneously, and bottom fixedly connected with limiting plate (22) of heating panel (5), the spacing groove has been seted up to limiting plate (22) inside, limiting plate (22) are through its inside spacing groove card at the upper surface of computer CPU (21).

4. The liquid-cooled heat dissipating structure for a computer according to claim 1, wherein: go up cooling device (7) and constitute by cooling frame (10), left cooling tube (17), right cooling tube (19) and radiator fan (9) four bibliographic categories, and radiator fan (9) and cooling frame (10) are relative setting, go up cooling device (7) and be consistent with lower cooling device's (12) component structure.

5. The liquid-cooled heat dissipating structure for a computer according to claim 1, wherein: the upper cooling device (7) and the lower cooling device (12) are arranged in series, and the water outlet pipe (6) is communicated with the circulating pipe (13) sequentially through the upper cooling device (7) and the lower cooling device (12).

6. The liquid-cooled heat dissipating structure for a computer according to claim 1, wherein: cooling frame (10) is inside to have left cooling tube (17) and right cooling tube (19) through the support mounting, and left cooling tube (17) and right cooling tube (19) are symmetrical structure about shunt tubes (18), shunt tubes (18) set up two sets of upper and lower both ends of fixing respectively in cooling frame (10) simultaneously, shunt tubes (18) are "Y" shape structure of being made by the metal material, shunt tubes (18) and outlet pipe (6) intercommunication setting that are located cooling frame (10) upper end, shunt tubes (18) and communicating pipe (11) intercommunication setting that are located cooling frame (10) lower extreme.

7. The liquid-cooled heat dissipating structure for a computer according to claim 1, wherein: the outer circumferential positions of the left radiating pipe (17) and the right radiating pipe (19) are uniformly and fixedly connected with a plurality of groups of radiating fins (20), and the left radiating pipe (17) and the right radiating pipe (19) are arranged in an S shape in the cooling frame (10).