CN213956602U - Temperature sensor - Google Patents
Temperature sensor Download PDFInfo
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- CN213956602U CN213956602U CN202022382278.3U CN202022382278U CN213956602U CN 213956602 U CN213956602 U CN 213956602U CN 202022382278 U CN202022382278 U CN 202022382278U CN 213956602 U CN213956602 U CN 213956602U
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- temperature sensor
- heat shrinkable
- shrinkable tube
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Abstract
The utility model discloses a temperature sensor, include: a temperature sensor chip having first and second electrode terminals; a first lead connected to a first electrode terminal of the temperature sensor chip; a second lead connected to a second electrode terminal of the temperature sensor chip; a first heat shrinkable tube heat-shrunk on the outer cladding of the first lead; a second heat shrinkable tube heat-shrunk on the outer cladding layer of the second lead; and a third heat shrinkage pipe heat-shrunk on the first heat shrinkage pipe, the second heat shrinkage pipe and the temperature sensor chip. The first heat shrinkable tube extends from the outer covering layer of the first lead up to the first electrode terminal of the temperature sensor chip such that one end of the first heat shrinkable tube is heat shrunk on the first electrode terminal and the other end is heat shrunk on the outer covering layer of the first lead. The utility model discloses in, the pyrocondensation pipe of inlayer extends to the electrode terminal of temperature sensor chip from the lead wire always to greatly improved temperature sensor's sealing performance.
Description
Technical Field
The utility model relates to a temperature sensor especially relates to a temperature sensor with sealed function.
Background
In the prior art, some temperature sensors must be immersed in the liquid to detect the temperature of the liquid. Therefore, such a temperature sensor must have a waterproof and oil-proof sealing function. In the prior art, a heat shrinkable tube is usually heat-shrunk on the lead wire and the core of the temperature sensor to prevent liquid from entering the inside of the core of the temperature sensor.
However, the problem that liquid enters the core body still occurs after the existing temperature sensor is soaked in the liquid for a long time, so that the resistance value of the temperature sensor jumps and drifts, the detection precision of the temperature sensor is seriously influenced, and even the temperature sensor fails.
SUMMERY OF THE UTILITY MODEL
The object of the present invention is to solve at least one of the above problems and drawbacks existing in the prior art.
According to an aspect of the present invention, there is provided a temperature sensor, including: a temperature sensor chip having a first electrode terminal and a second electrode terminal; a first lead connected to a first electrode terminal of the temperature sensor chip; a second lead connected to a second electrode terminal of the temperature sensor chip; a first heat shrink tube heat shrunk on the outer cladding of the first lead; a second heat shrink tube heat shrunk on the outer cladding of the second lead; and a third heat shrinkage pipe which is heat-shrunk on the first heat shrinkage pipe, the second heat shrinkage pipe and the temperature sensor chip. The first heat shrinkable tube extends from the outer cladding of the first lead up to the first electrode terminal of the temperature sensor chip so that one end of the first heat shrinkable tube is heat shrunk on the first electrode terminal and the other end is heat shrunk on the outer cladding of the first lead.
According to an exemplary embodiment of the present invention, the second heat shrinkable tube extends from the outer cladding of the second lead up to the second electrode terminal of the temperature sensor chip, so that one end of the second heat shrinkable tube is heat-shrunk on the second electrode terminal and the other end is heat-shrunk on the outer cladding of the second lead.
According to another exemplary embodiment of the present invention, the third heat shrinkable tube extends from the other end of the first heat shrinkable tube all the way to the other end of the second heat shrinkable tube; and one end of the third heat shrinkable tube is heat shrunk on the other end of the first heat shrinkable tube, and the other end is heat shrunk on the other end of the second heat shrinkable tube.
According to another exemplary embodiment of the present invention, one end of the third heat shrinkable tube extends beyond the other end of the first heat shrinkable tube and is heat shrunk onto the outer cladding of the first lead; and the other end of the third heat shrinkable tube extends beyond the other end of the second heat shrinkable tube and is heat-shrunk onto the outer cladding of the second lead.
According to another exemplary embodiment of the present invention, the first electrode terminal of the temperature sensor chip is completely wrapped in one end of the first heat shrinkage tube; and the second electrode terminal of the temperature sensor chip is completely wrapped in one end of the second heat shrinkage tube.
According to another exemplary embodiment of the present invention, the first heat shrinkable tube and the second heat shrinkable tube are heat shrinkable tubes made of the same heat shrinkable material; the third heat shrinkable tube is a heat shrinkable tube made of a heat shrinkable material different from the first heat shrinkable tube and the second heat shrinkable tube.
According to another exemplary embodiment of the present invention, the first heat shrinkable tube and the second heat shrinkable tube are FEP heat shrinkable tubes made of FEP material, and the third heat shrinkable tube is PTFE heat shrinkable tube made of PTFE material.
According to another exemplary embodiment of the present invention, the temperature sensor is an NTC temperature sensor, and the temperature sensor chip is an NTC thermistor chip.
According to another exemplary embodiment of the present invention, the temperature sensor chip comprises an NTC thermistor and an insulating package wrapped around the NTC thermistor; the first electrode terminal and the second electrode terminal are connected to both ends of the NTC thermistor, respectively.
According to another exemplary embodiment of the present invention, the first lead has an exposed first conductor electrically connected to a first electrode terminal of the temperature sensor chip; the second lead has an exposed second conductor electrically connected to a second electrode terminal of the temperature sensor chip.
According to another exemplary embodiment of the present invention, one of the first conductor and the second conductor is bent into a U-shape, and the other extends along a straight line, so that the temperature sensor is U-shaped.
According to another exemplary embodiment of the present invention, the first conductor and the second conductor both extend along a straight line, so that the temperature sensor is in the shape of a straight bar.
According to another exemplary embodiment of the present invention, the first conductor and the second conductor are electrically connected to the first electrode terminal and the second electrode terminal, respectively, by welding or crimping.
In the aforementioned various exemplary embodiments of the present invention, the heat shrinkable tube of the inner layer extends from the lead wire to the electrode terminal of the temperature sensor chip, so that the sealing performance of the temperature sensor is greatly improved, and the problem that the liquid enters the temperature sensor chip after the temperature sensor is soaked in the liquid for a long time is avoided.
Other objects and advantages of the present invention will become apparent from the following description of the invention, which is made with reference to the accompanying drawings, and can help to provide a thorough understanding of the present invention.
Drawings
Fig. 1 shows a schematic view of a temperature sensor according to an exemplary embodiment of the present invention;
fig. 2 shows a schematic view of a temperature sensor according to another exemplary embodiment of the present invention.
Detailed Description
The technical solution of the present invention is further specifically described below by way of examples and with reference to the accompanying drawings. In the specification, the same or similar reference numerals denote the same or similar components. The following description of the embodiments of the present invention with reference to the drawings is intended to explain the general inventive concept and should not be construed as limiting the invention.
Furthermore, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in schematic form in order to simplify the drawing.
According to a general technical concept of the present invention, there is provided a temperature sensor, including: a temperature sensor chip having a first electrode terminal and a second electrode terminal; a first lead connected to a first electrode terminal of the temperature sensor chip; a second lead connected to a second electrode terminal of the temperature sensor chip; a first heat shrink tube heat shrunk on the outer cladding of the first lead; a second heat shrink tube heat shrunk on the outer cladding of the second lead; and a third heat shrinkage pipe which is heat-shrunk on the first heat shrinkage pipe, the second heat shrinkage pipe and the temperature sensor chip. The first heat shrinkable tube extends from the outer cladding of the first lead up to the first electrode terminal of the temperature sensor chip so that one end of the first heat shrinkable tube is heat shrunk on the first electrode terminal and the other end is heat shrunk on the outer cladding of the first lead.
Fig. 1 shows a schematic view of a temperature sensor according to an exemplary embodiment of the present invention.
As shown in fig. 1, in the illustrated embodiment, the temperature sensor mainly includes a temperature sensor chip 100, a first lead 10, a second lead 20, a first heat shrinkable tube 11, a second heat shrinkable tube 21, and a third heat shrinkable tube 30. The temperature sensor chip 100 has a first electrode terminal 110 and a second electrode terminal 120. The first lead 10 is connected to the first electrode terminal 110 of the temperature sensor chip 100. The second lead 20 is connected to the second electrode terminal 120 of the temperature sensor chip 100. The first heat shrinkable tube 11 is heat-shrunk on an outer clad layer (e.g., an outermost insulation layer of the lead) of the first lead 10. A second heat shrink tube 21 is heat shrunk on the outer cladding of the second lead 20 (e.g., the outermost insulation layer of the lead).
As shown in fig. 1, in the illustrated embodiment, the third heat shrinkable tube 30 is heat-shrunk on the first heat shrinkable tube 11, the second heat shrinkable tube 21, and the temperature sensor chip 100. As shown in fig. 1, the first heat shrinkable tube 11, the second heat shrinkable tube 21, and the temperature sensor chip 100 are all wrapped in the third heat shrinkable tube 30.
As shown in fig. 1, in the illustrated embodiment, the first heat shrinkable tube 11 extends from the outer clad of the first lead 10 up to the first electrode terminal 110 of the temperature sensor chip 100 such that one end 11a of the first heat shrinkable tube 11 is heat-shrunk on the first electrode terminal 110 and the other end 11b is heat-shrunk on the outer clad of the first lead 10.
As shown in fig. 1, in the illustrated embodiment, the second heat shrinkable tube 21 extends from the outer clad of the second lead 20 up to the second electrode terminal 120 of the temperature sensor chip 100 such that one end 21a of the second heat shrinkable tube 21 is heat-shrunk on the second electrode terminal 120 and the other end 21b is heat-shrunk on the outer clad of the second lead 20.
As shown in fig. 1, in the illustrated embodiment, the first heat shrinkable tube 11 and the second heat shrinkable tube 21 of the inner layer provide a first layer of sealing, and the third heat shrinkable tube 30 of the outer layer provides a second layer of sealing, so that the sealing performance of the temperature sensor can be greatly improved by the double layer sealing.
As shown in fig. 1, in the illustrated embodiment, the third heat shrinkable tube 30 extends from the other end 11b of the first heat shrinkable tube 11 all the way to the other end 21b of the second heat shrinkable tube 21. One end 31 of the third heat shrinkable tube 30 is heat-shrunk on the other end 11b of the first heat shrinkable tube 11, and the other end 31 is heat-shrunk on the other end 21b of the second heat shrinkable tube 21.
As shown in fig. 1, in the illustrated embodiment, one end 31 of the third heat shrinkable tube 30 extends beyond the other end 11b of the first heat shrinkable tube 11 and is heat-shrunk onto the outer cladding of the first lead 10. The other end 31 of the third heat shrinkable tube 30 extends beyond the other end 21b of the second heat shrinkable tube 21 and is heat-shrunk onto the outer cladding of the second lead 20.
As shown in fig. 1, in the illustrated embodiment, the first electrode terminal 110 of the temperature sensor chip 100 is completely wrapped in one end 11a of the first heat shrinkable tube 11. The second electrode terminal 120 of the temperature sensor chip 100 is completely wrapped in one end 21a of the second heat shrinkable tube 21. Thus, the sealing performance of the first heat shrinkable tube 11 and the second heat shrinkable tube 21 of the inner layer can be further improved.
As shown in fig. 1, in the illustrated embodiment, the first heat shrinkable tube 11 and the second heat shrinkable tube 21 are heat shrinkable tubes made of the same heat shrinkable material. The third heat shrinkable tube 30 is a heat shrinkable tube made of a different heat shrinkable material from the first heat shrinkable tube 11 and the second heat shrinkable tube 21. For example, in an exemplary embodiment of the present invention, the first and second heat shrinkable tubes 11 and 21 may be FEP heat shrinkable tubes made of FEP (Fluorinated Ethylene Propylene copolymer) material, and the third heat shrinkable tube 30 may be PTFE heat shrinkable tubes made of PTFE (Poly tetrafluoroethylene) material.
As shown in fig. 1, in the illustrated embodiment, the Temperature sensor is an NTC (Negative Temperature Coefficient) Temperature sensor, and the Temperature sensor chip 100 is an NTC thermistor chip.
As shown in fig. 1, in the illustrated embodiment, the temperature sensor chip 100 includes an NTC thermistor (not shown) and an insulating package (not shown) wrapped around the NTC thermistor. The first electrode terminal 110 and the second electrode terminal 120 are connected to both ends of the NTC thermistor, respectively.
As shown in fig. 1, in the illustrated embodiment, the first lead 10 has an exposed first conductor 10a, and the first conductor 10a is electrically connected to the first electrode terminal 110 of the temperature sensor chip 100. The second lead 20 has an exposed second conductor 20a, and the second conductor 20a is electrically connected to the second electrode terminal 120 of the temperature sensor chip 100.
As shown in fig. 1, in the illustrated embodiment, the first and second conductors 10a and 20a are electrically connected to the first and second electrode terminals 110 and 120, respectively, by welding or crimping.
As shown in fig. 1, in the illustrated embodiment, both the first conductor 10a and the second conductor 20a extend in a straight line, so that the temperature sensor has a straight rod shape. However, the present invention is not limited to the illustrated embodiment, and the temperature sensor may have other suitable shapes.
Fig. 2 shows a schematic view of a temperature sensor according to another exemplary embodiment of the present invention.
The temperature sensor shown in fig. 2 is different from the temperature sensor shown in fig. 1 only in the outer shape of the temperature sensor.
As shown in fig. 2, in an exemplary embodiment of the present invention, one of the first conductor 10a of the first lead 10 and the second conductor 20a of the second lead 20 is bent in a U-shape, and the other extends in a straight line, so that the temperature sensor has a U-shape. As shown in fig. 2, the second conductor 20a of the second lead 20 is bent in a U-shape, and the first conductor 10a of the first lead 10 extends in a straight line, so that the temperature sensor has a U-shape.
Otherwise, other technical features of the temperature sensor shown in fig. 2 are substantially the same as those of the temperature sensor shown in fig. 1, and for brevity, detailed description is omitted, and reference may be made to the temperature sensor shown in fig. 1.
It will be appreciated by those skilled in the art that the embodiments described above are exemplary and can be modified by those skilled in the art, and that the structures described in the various embodiments can be freely combined without conflict in structure or principle.
Although the present invention has been described in connection with the accompanying drawings, the embodiments disclosed in the drawings are intended to exemplify preferred embodiments of the present invention, and should not be construed as limiting the present invention.
Although a few embodiments of the present general inventive concept have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the claims and their equivalents.
It should be noted that the word "comprising" does not exclude other elements or steps, and the words "a" or "an" do not exclude a plurality. Additionally, any element numbers of the claims should not be construed as limiting the scope of the invention.
Claims (13)
1. A temperature sensor, comprising:
a temperature sensor chip (100) having a first electrode terminal (110) and a second electrode terminal (120);
a first lead (10) connected to a first electrode terminal (110) of the temperature sensor chip (100);
a second lead (20) connected to a second electrode terminal (120) of the temperature sensor chip (100);
a first heat shrinkable tube (11) heat-shrunk on the outer clad layer of the first lead (10);
a second heat shrinkable tube (21) heat-shrunk on the outer clad layer of the second lead (20); and
a third heat shrinkable tube (30) heat-shrunk on the first heat shrinkable tube (11), the second heat shrinkable tube (21), and the temperature sensor chip (100),
the method is characterized in that:
the first heat shrinkable tube (11) extends from the outer covering layer of the first lead (10) up to the first electrode terminal (110) of the temperature sensor chip (100) such that one end (11a) of the first heat shrinkable tube (11) is heat-shrunk on the first electrode terminal (110) and the other end (11b) is heat-shrunk on the outer covering layer of the first lead (10).
2. The temperature sensor of claim 1, wherein:
the second heat shrinkable tube (21) extends from the outer covering layer of the second lead (20) up to the second electrode terminal (120) of the temperature sensor chip (100) so that one end (21a) of the second heat shrinkable tube (21) is heat-shrunk on the second electrode terminal (120) and the other end (21b) is heat-shrunk on the outer covering layer of the second lead (20).
3. The temperature sensor of claim 2, wherein:
the third heat shrinkable tube (30) extends from the other end (11b) of the first heat shrinkable tube (11) up to the other end (21b) of the second heat shrinkable tube (21); and is
One end (31) of the third heat shrinkable tube (30) is heat-shrunk on the other end (11b) of the first heat shrinkable tube (11), and the other end (31) is heat-shrunk on the other end (21b) of the second heat shrinkable tube (21).
4. The temperature sensor of claim 3, wherein:
one end (31) of the third heat shrinkable tube (30) extends beyond the other end (11b) of the first heat shrinkable tube (11) and is heat-shrunk onto the outer cladding of the first lead (10); and is
The other end (31) of the third heat shrinkable tube (30) extends beyond the other end (21b) of the second heat shrinkable tube (21) and is heat-shrunk onto the outer clad of the second lead (20).
5. The temperature sensor of claim 3, wherein:
the first electrode terminal (110) of the temperature sensor chip (100) is completely wrapped in one end (11a) of the first heat shrinkable tube (11); and is
The second electrode terminal (120) of the temperature sensor chip (100) is completely wrapped in one end (21a) of the second heat shrinkable tube (21).
6. The temperature sensor of claim 1, wherein:
the first heat shrinkable tube (11) and the second heat shrinkable tube (21) are heat shrinkable tubes made of the same heat shrinkable material;
the third heat shrinkable tube (30) is a heat shrinkable tube made of a heat shrinkable material different from the first heat shrinkable tube (11) and the second heat shrinkable tube (21).
7. The temperature sensor of claim 6, wherein:
the first heat shrinkable tube (11) and the second heat shrinkable tube (21) are FEP heat shrinkable tubes made of FEP materials, and the third heat shrinkable tube (30) is a PTFE heat shrinkable tube made of PTFE materials.
8. The temperature sensor of claim 1, wherein:
the temperature sensor is an NTC temperature sensor, and the temperature sensor chip (100) is an NTC thermistor chip.
9. The temperature sensor of claim 8, wherein:
the temperature sensor chip (100) comprises an NTC thermistor and an insulation package wrapped on the NTC thermistor;
the first electrode terminal (110) and the second electrode terminal (120) are connected to both ends of the NTC thermistor, respectively.
10. The temperature sensor of claim 2, wherein:
the first lead (10) has an exposed first conductor (10a), the first conductor (10a) being electrically connected to a first electrode terminal (110) of the temperature sensor chip (100);
the second lead (20) has an exposed second conductor (20a), and the second conductor (20a) is electrically connected to a second electrode terminal (120) of the temperature sensor chip (100).
11. The temperature sensor of claim 10, wherein:
one of the first conductor (10a) and the second conductor (20a) is bent in a U-shape, and the other extends in a straight line, so that the temperature sensor has a U-shape.
12. The temperature sensor of claim 10, wherein:
the first conductor (10a) and the second conductor (20a) both extend in a straight line, so that the temperature sensor has a straight rod shape.
13. The temperature sensor of claim 10, wherein:
the first conductor (10a) and the second conductor (20a) are electrically connected to the first electrode terminal (110) and the second electrode terminal (120), respectively, by welding or crimping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022382278.3U CN213956602U (en) | 2020-10-23 | 2020-10-23 | Temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022382278.3U CN213956602U (en) | 2020-10-23 | 2020-10-23 | Temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213956602U true CN213956602U (en) | 2021-08-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022382278.3U Active CN213956602U (en) | 2020-10-23 | 2020-10-23 | Temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213956602U (en) |
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2020
- 2020-10-23 CN CN202022382278.3U patent/CN213956602U/en active Active
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