CN217304169U

CN217304169U - High temperature resistant packaging structure temperature sensor

Info

Publication number: CN217304169U
Application number: CN202221146961.XU
Authority: CN
Inventors: 郑启富; 李长路
Original assignee: Shenzhen Ampron Technology Corp
Current assignee: Shenzhen Ampron Technology Corp
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-08-26
Anticipated expiration: 2032-05-13

Abstract

The utility model belongs to the field of temperature sensors, and particularly provides a high temperature resistant packaging structure temperature sensor, which comprises a packaging shell, an NTC resistor and a single branch line; the two support legs of the NTC resistor are respectively connected with the end part of one single branch line through a riveting terminal; an FEP sleeve is sleeved at the joint of the support leg of the NTC resistor and the single branch line; the outer part of the single branch is wrapped by an FEP sheath; the NTC resistor and the end part of the single branch line are wrapped by the packaging layer and fixed in the packaging shell. The FEP sheath and the outer layer of the single branch are both made of materials which can resist high temperature of 200 ℃, and the temperature measuring range is wide; the utility model is suitable for a multiple application scene, simple to operate. The FEP sheath can improve the insulating and voltage-resisting capability of the product, and can also improve the production efficiency and save the equipment cost.

Description

High temperature resistant packaging structure temperature sensor

Technical Field

The utility model belongs to the temperature sensor field, concretely relates to high temperature resistant packaging structure temperature sensor.

Background

A temperature sensor is a sensor that senses temperature and converts it into a usable output signal. The temperature sensor is a core part for temperature information feedback and various temperature detection, has various types, and can be suitable for various different working environments. However, some temperature sensors in working environments have requirements on probes, the temperature sensors are required to be used at a high temperature of 200 ℃ or above, and the humidity resistance of the temperature sensors is required to be good, and the temperature sensors in the current market are generally packaged by adopting the following processing scheme:

1. the outer cover and the inner core are connected with the NTC through the PVC sheath wires, then epoxy resin is packaged, and then the hardware shell is assembled for epoxy resin encapsulation, and the maximum temperature resistance of the product can only reach 105 ℃.

2. The sheath wire with the outer coating made of silica gel and the inner core made of Teflon is connected with the NTC, then epoxy resin is packaged, and then the sheath wire is assembled into a hardware shell for epoxy resin encapsulation, and the temperature measuring range of the product can reach 200 ℃, but the insulation and pressure resistance capability is poor.

SUMMERY OF THE UTILITY MODEL

The utility model provides a high temperature resistant packaging structure temperature sensor can reach better withstand voltage ability when temperature measurement range is great.

The high-temperature-resistant packaging structure temperature sensor comprises a packaging shell, an NTC resistor and a single branch line;

the two support legs of the NTC resistor are respectively connected with the end part of one single branch line through a riveting terminal; an FEP sleeve is sleeved at the joint of the support leg of the NTC resistor and the single branch line;

the outer part of the single branch is wrapped by an FEP sheath; the NTC resistor and the end part of the single branch line are wrapped by the packaging layer and fixed in the packaging shell.

Particularly, the end part of the inner layer wire core of the single branch line is connected with the support leg of the NTC resistor; an outer layer wire skin is arranged outside the inner layer wire core; the outer layer wire sheath is made of FEP.

Particularly, the packaging layer is epoxy resin or silica gel.

In particular, the packaging layer is made of metal.

Particularly, a layer of transparent heat-shrinkable tube is wrapped outside the FEP sleeve; an FEP sheath is arranged outside the transparent heat-shrinkable tube.

The utility model has the advantages that:

the FEP sheath and the outer layer of the single branch are made of materials which are high temperature resistant and 200 ℃, so the temperature measuring range is wide; the utility model is suitable for a multiple application scene, simple to operate.

The utility model discloses inside FEP sheath can improve product insulation, pressure resistance, also can improve production efficiency and saving equipment cost simultaneously.

The utility model connects the two ends of the NTC resistor with the end of the single branch line respectively; then wrapping the single branch by an FEP sheath, and wrapping the end part of the single branch and the NTC resistor by using epoxy resin as a wrapping layer; finally, the packaging layer is arranged in the packaging shell, and the packaging shell is filled with epoxy resin, so that the packaging layer is fixedly packaged in the packaging shell; the insulation and voltage resistance capability is ensured.

Drawings

Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention;

fig. 2 is a schematic view of another structure of the embodiment of the present invention;

fig. 3 is an exploded view of an embodiment of the present invention.

In the figure: the cable comprises a packaging shell 1, a single branch wire 2, an FEP sleeve 3, an NTC resistor 4, a riveting terminal 6, a transparent heat-shrinkable tube 7, an FEP jacket 8, an inner wire core 21 and an outer wire sheath 22.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solutions adopted by the present invention and the technical effects achieved by the present invention clearer, the embodiments of the present invention are described in further detail below, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

The utility model discloses in, NTC indicates Negative Temperature Coefficient, and Negative Temperature Coefficient, NTC resistance 4 indicate Negative Temperature Coefficient thermistor. FEP refers to Fluorinated ethylene propylene copolymer.

Example 1

As shown in fig. 1-3, the present invention is composed of four parts, i.e., a package housing 1, an NTC resistor 4, a single wire 2 and an FEP sheath 8.

Wherein NTC resistance 4 does the utility model discloses a main part temperature measuring device, NTC resistance 4 has two stabilizer blades and main part. Two support legs of the NTC resistor 4 are respectively connected with the end part of one single branch line 2; each single branch 2 is divided into an inner wire core 21 and an outer wire skin 22, the outer wire skin 22 is wrapped at the outer end of the inner wire core 21 and is slightly shorter than the inner wire core 21, so that the part of the inner wire core 21 is exposed outside; the outer sheath 22 is of FEP. The exposed end of the inner wire core 21 is electrically connected with the leg of the NTC resistor 4 through the rivet terminal 6.

An FEP sleeve 3 is sleeved outside the joint of the inner layer wire core 21 and the NTC resistor 4 to serve as a first insulating packaging layer. Outside the FEP sleeve 3, a transparent heat shrinkable tube 7 is provided for tight wrapping. An FEP sheath 8 is arranged outside the transparent heat-shrinkable tube 7, and the joint of the single branch line 2 and the NTC resistor 4 is packaged and wrapped by taking epoxy resin as a packaging layer. After being encapsulated, the main body of the NTC resistor 4 is placed inside the encapsulation housing 1 and fixed with an encapsulating medium epoxy.

The packaging shell 1 is made of metal materials and has good mechanical properties. The packaging shell 1 is a metal circular tube structure, wherein the inner part of one end is spherical, so that the main body part of the NTC resistor 4 can conveniently enter the packaging shell.

Example 2

The difference from the embodiment 1 is that in this embodiment, the FEP sleeve 3 is coated on the connection part of the inner layer wire core 21 and the NTC resistor 4, and the transparent heat shrinkable tube 7 is not arranged, but the FEP sleeve 8 is directly coated. Meanwhile, the joint of the single branch line 2 and the NTC resistor 4 is packaged and wrapped by silica gel. After being packaged, the main body part of the NTC resistor 4 is placed inside the package housing 1 and fixed by using silicon gel.

In the description herein, it is to be understood that the terms "upper," "lower," "left," "right," and the like are used merely for convenience in description and simplicity of operation, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims

1. The temperature sensor with the high-temperature resistant packaging structure is characterized by comprising a packaging shell, an NTC resistor and a single branch line;

2. The high temperature resistant package structure temperature sensor of claim 1, wherein the end of the inner wire core of the single branch is connected with the leg of the NTC resistor; and an outer layer of wire skin is arranged outside the inner layer of wire core.

3. The high temperature resistant package structure temperature sensor of claim 2, wherein the outer layer of wire sheath is of FEP.

4. The high temperature resistant package structure temperature sensor of claim 1, wherein the package layer is epoxy or silicone.

5. The temperature sensor of claim 1, wherein the encapsulation layer is made of metal.

6. The high temperature resistant package structure temperature sensor of claim 1, wherein the FEP sleeve is surrounded by a transparent heat shrink tube; an FEP sheath is arranged outside the transparent heat-shrinkable tube.