CN213952556U - Wall positioning system of insulation board - Google Patents

Abstract

The utility model discloses a wall positioning system of a heat-insulating plate, which comprises a first positioning piece, wherein the first positioning piece is arranged at a first reserved gap, and the first positioning piece is penetrated through a wafer body by a first positioning component and is fastened in a wall at the end part of the wafer body so as to drive the lower end surface of the wafer body to be attached and abutted against the upper end surfaces of all the heat-insulating plates which are intersected to form the first reserved gap; and the second positioning piece is arranged at the second reserved gap, penetrates through the plate body by the second positioning component and is fastened in the wall surface with the end part of the second positioning component so as to drive the lower end surfaces at the two ends of the plate body to be respectively attached to and abutted against the upper end surfaces of the two adjacent insulation boards. The utility model discloses an adopt setting element one and setting element two to implement the location to the different regional positions of heated board, the effectual face location effect that improves the heated board need not to destroy the plate structure simultaneously and can accomplish high-efficient location, the effectual performance that improves the heated board.

Description

Wall positioning system of insulation board

Technical Field

The utility model relates to an heated board location technical field specifically is a wall positioning system of heated board.

Background

At present, the application of heated board is comparatively extensive, and is multi-purpose in interior wall or outdoor wall, can play effectual heat preservation effect, and in the implementation to the fixed in-process of heated board, need implement the fixed to the heated board, the method of general adoption is to adopt the inflation screw to run through the heated board and fasten in wall department, and more only adopt a set of inflation screw to implement fixedly on every heated board, and this kind of fixed mode has following problem:

1: the fixing piece (expansion screw) needs to penetrate through the thickness of the heat insulation plate, and the positioning mode is implemented in a mode of damaging the heat insulation plate, so that the overall heat insulation performance of the heat insulation plate is not facilitated;

2: in the prior art, in order to reduce damage to the overall structure of the insulation board caused by a penetrating positioning mode, the insulation board is fixed by using a few expansion screws, and the insulation board is easy to fall off after the positioning mode is used at a later stage, so that the risk of falling off of a wall body is increased;

3: the variety of heated board is more, and the vacuum insulation board that adopts among the prior art is in outer tectorial membrane of board core and evacuation, through traditional locate mode implementation running through, has destroyed the vacuum environment of panel for the thermal insulation performance of panel discounts greatly.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wall positioning system of heated board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a wall positioning system of a heat-insulating plate is characterized in that heat-insulating plates located in different area positions are arranged on a wall, a first reserved gap is formed at the edge intersection of at least three heat-insulating plates, a second reserved gap is formed between every two adjacent heat-insulating plates, the wall positioning system comprises a first positioning piece, the first positioning piece is arranged at the first reserved gap and comprises a wafer body and a first positioning component penetrating through the center of the wafer body, the end part of the first positioning component penetrates through the wafer body, the first positioning piece is fastened in the wall so as to drive the lower end face of the wafer body to be abutted against the upper end faces of all the heat-insulating plates which are intersected to form the first reserved gap; and the second positioning piece is arranged at the second reserved gap and comprises a plate body and a second positioning component penetrating through the central part of the plate body, and the second positioning component penetrates through the plate body by virtue of the second positioning component and is fastened in the wall surface with the end part of the second positioning component so as to drive the lower end surfaces at the two ends of the plate body to be respectively attached to and abutted against the upper end surfaces of the two adjacent insulation boards.

The second positioning piece is arranged at the center of the second reserved gap.

The second positioning piece is provided with an end portion pressed on the board surface of the heat insulation board, the end portion extends from the edge of the heat insulation board towards the end face of the inner side of the edge of the heat insulation board in the vertical direction, and the extending length is larger than or equal to the width of the second reserved gap.

The wafer body is pressed on the surface of the insulation board, and the radial distance of the pressed part is the same as the extension length of the end part of the second positioning piece.

According to the above technical scheme, the utility model discloses an adopt setting element one and setting element two to implement the location to the different regional positions of heated board, the effectual face location effect that improves the heated board need not to destroy the plate structure simultaneously and can accomplish high-efficient location, the effectual performance that improves the heated board.

Drawings

FIG. 1 is a schematic diagram of the arrangement position of the heat insulation board in the gap of the heat insulation board;

FIG. 2 is a top view of a structure of the positioning plate;

FIG. 3 is a side sectional view of the second structure of the positioning plate;

FIG. 4 is a top view of the second positioning plate;

FIG. 5 is a side sectional view of the second structure of the positioning plate;

FIG. 6 is a side cross-sectional view of a plurality of splines after they are stacked on top of one another;

FIG. 7 is a side sectional view of the structure after the first positioning plate and the second positioning plate are sequentially stacked;

FIG. 8 is a top view of the positioning member II;

FIG. 9 is a side view of the positioning member;

FIG. 10 is a partially enlarged view of the second positioning member;

FIG. 11 is a schematic view of the connection of a positioning member I at the junction of three insulation boards.

In the figure: the positioning device comprises a first positioning piece 1, a first reserved gap 101, a second reserved gap 102, a third reserved gap 103, a fourth reserved gap 104, a fifth reserved gap 105, a sixth reserved gap 106, a 107 connecting gap, a first positioning piece 11, a first 111 through hole, a turned edge 112, a first 113 wafer body, a first 114 groove, a first 115 circular hole, a turned part 116, a tip 1161, a first 117 boss part, a second 12 positioning piece, a second 121 groove, a second 122 circular hole, a second 123 wafer body, a second 124 through hole, a second 125 boss part, a 13 screw, a 14 expansion screw, a second positioning piece 2, a first 21 plate, a third 211 circular hole, a 212 reinforcing rib, a first 2121 connecting part, a second 2122 connecting part, a second 22 plate, a first 221 end part, a second 222 end part, a third 23 plate, a first 231 end part, a second 232 end part, a first 3 plate part, a second plate part, a third plate part, a fourth 6 plate part, a fifth plate.

Detailed Description

The present invention will be further explained with reference to the accompanying drawings:

the present case adopts to implement the location through specific setting element in the different mounted position of wall to the heated board to make the heated board need not take the positioning mode that the terminal surface punched to realize the wall fastening, the effectual later stage heat preservation effect that improves the heated board has prevented because of gas leakage or the structrual failure scheduling problem that punch and lead to, further improvement the availability factor. Here, the specific structure and the installation position distribution of the positioning member of the present disclosure need to be described in conjunction with the installation position of the heat insulation board on the wall surface.

Referring to fig. 1, in fig. 1, the insulation board includes a first plate 3, a second plate 4, a third plate 5, and a fourth plate 6, according to the arrangement position relationship, the second plate 4 and the third plate 5 are vertically arranged, and a reserved gap three 103 is reserved between the two plates, the first plate 3 is arranged above the second plate 4 and the third plate 5, a reserved gap two 102 is reserved between the first plate 4 and the third plate 5, and a plate four 6 is arranged on one side of the first plate 3 and the third plate 5, wherein a reserved gap one 101 is reserved between the first plate 3 and the third plate 5, and here, it can be understood by those skilled in the art that the reserved gap one 101, the reserved gap two 102, and the reserved gap three 103 all have the same gap width to ensure the uniform distribution degree of the insulation boards on the wall surface, and a first reserved gap is formed at the intersection of the edges of at least three insulation boards, a second reserved gap is formed between two adjacent insulation boards, and here, it can be understood by referring to fig. 1 that the intersection of the first plate 3, the second plate 4, and the third plate 5 is a first reserved gap, the intersection of the first plate 3, the third plate 5, and the fourth plate 6 is a first reserved gap, the second reserved gap (i.e., a first reserved gap 101) is formed between the third plate 5 and the fourth plate 6, the second reserved gap (i.e., a third reserved gap 103) is formed between the second plate 4 and the third plate 5, the positioning of the insulation board is implemented at the first reserved gap by using a positioning element 1, the positioning of the insulation board is implemented at the second reserved gap by using a positioning element 2, and the positioning element 1 and the positioning element 2 are as follows:

referring to fig. 2-5, a first positioning member 1, the first positioning member 1 includes a first positioning plate 11 and a second positioning plate 12, wherein, the first positioning plate 11 has a first wafer body 113, the second positioning plate 12 has a second wafer body 123, a first groove 114 formed by axially inwards concave is formed at the center part of the first wafer body 113, a first circular hole 115 concentric with the first groove 114 is arranged at the center of the first groove, a first through hole 111 is arranged on the end face of the first wafer body 113, the inner edge of the first hole type (i.e. the folded edge 112) of the first through hole 111 is formed with a folded part 116 formed downwards along the axial direction of the first disc body 113 end face, the lower end surface of the first wafer body 113 is provided with a boss part first 117 formed by axially inwards recessing the first groove 114, the lower end surface of the first boss part 117 is arranged above the end part of the folded part 116; a second wafer body 123, wherein a second groove 121 formed by sinking axially inwards is formed in the center of the second wafer body 123, a second circular hole 122 concentric with the second groove 121 is formed in the center of the second groove 121, a second through hole 124 is formed in the end face of the second wafer body 123, and a second boss 125 formed by sinking the second groove 121 axially inwards is formed on the lower end face of the second wafer body 123; in practice, the first wafer body 113 and the second wafer body 123 may be used in a combined manner, that is, the first wafer body 113 may be used alone to cooperate with the positioning member to implement fixation, and meanwhile, the first wafer body 113 and the second wafer body 123 may also be used in a stacked manner to implement fixation.

Referring to fig. 6-7, in the drawings, fig. 6 shows stacking of a plurality of positioning pieces one 11, in practice, the plurality of positioning pieces one 11 are stacked and coaxially penetrate through the positioning members in the circular holes one 115, and a plurality of stacked wafer bodies one 113 are penetrated through by the positioning members and are fastened at the ends thereof in the wall surface of the first reserved gap; or, fig. 7 shows stacking of the plurality of positioning pieces one 11 combined with the positioning piece two 12, in practice, the positioning piece two 12 is stacked at the upper end face of the positioning piece one 11, and the plurality of stacked wafer bodies one 113 and two 123 are penetrated by the positioning member and fastened at the end part thereof in the wall face of the first reserved gap; the skilled person can know from the drawings that the positioning member described herein is a screw assembly that is conventional in the prior art, and includes a screw 13 and an expansion screw 14, generally, the expansion screw 14 is a plastic member, and is preset at a wall surface of the first reserved gap, and an end portion of the expansion screw 14 is in fit connection with the boss portion i 117 or the boss portion ii 125, and the screw 13 is inserted through the circular hole i 115 and the circular hole ii 122, and the screw 13 is fixedly disposed in the expansion screw 14, and is axially fastened with respect to end surfaces of the positioning piece i 11 and the positioning piece ii 12, so as to effectively perform a positioning connection function; here, the folded part 116 is configured as a triangular structure with the same size as the first 111 hole pattern of the through hole, and a tip 1161 facing downward is formed at the end of the folded part 116, by this configuration, in the process of fixing the insulation board, the tip 1161 penetrates into the insulation board, so that effective fixing is performed, and it is prevented from loosening; meanwhile, the diameter of the second wafer body 123 is larger than that of the first wafer body 113, so that the stress area can be further enlarged, the contact surface between the second wafer body 123 and the heat insulation plate is effectively enlarged, and the fixing effect is further improved.

Referring to fig. 8-10, the second positioning member 2 includes a first plate 21, a second plate 22 disposed at two ends of the first plate 21, and a third plate 23 disposed at an outer end of the second plate 22, where the first plate 21, the second plate 22, and the third plate 23 are integrally formed and a predetermined bending angle is formed at a joint, where the second plate 22 is obliquely bent upward relative to the joint of the first plate 21, the third plate 23 is obliquely bent downward relative to the joint of the first plate 21, and a horizontal plane of the outer end of the third plate 23 is lower than a lower end surface of the first plate 21; the upper end face of the first plate 21 is provided with a reinforcing rib 212 formed along the length direction of the first plate, the reinforcing rib 212 is provided with a first connecting part 2121 and a second connecting part 2122 far away from the first connecting part 2121, the first connecting part 2121 and the second connecting part 2122 are fixedly arranged on the second plate 22 on two sides respectively, the central part of the first plate 21 is provided with a third circular hole 211, a positioning member penetrates through the third circular hole 211, the second positioning member 2 penetrates through the positioning member and is fastened in a wall face at the end part of the second positioning member, and the third plate 23 on two sides is abutted against the upper end face of the heat insulation plate on two sides of the second reserved gap; furthermore, the two sides of the circular hole three 211 of the reinforcing rib 212 are respectively provided with one reinforcing rib, and the two reinforcing ribs 212 are arranged in parallel.

Referring to fig. 11, in the illustration, the heat insulation board includes a fifth plate 7, a sixth plate 8 and a seventh plate 9, a fourth reserved gap 104 is formed between the fifth plate 7 and the sixth plate 8, a fifth reserved gap 105 is formed between the fifth plate 7 and the seventh plate 9, a sixth reserved gap 106 is formed between the sixth plate 8 and the seventh plate 9, a connection gap 107 is formed at an intersection of the fifth plate 7, the sixth plate 8 and the seventh plate 9, and the first positioning element 1 is fixedly disposed at the connection gap 107.

Further, the second positioning element 2 is arranged at the center of the second reserved gap.

Furthermore, the second positioning piece 2 has an end portion pressed on the board surface of the heat insulation board, the end portion extends from the edge of the heat insulation board towards the end face of the inner side of the edge of the heat insulation board in the vertical direction, and the extending length is greater than or equal to the width of the second reserved gap.

The above-mentioned embodiments are only for describing the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art without departing from the design spirit of the present invention should fall into the protection scope defined by the claims of the present invention.

Claims (4)

1. The utility model provides a wall positioning system of heated board, in the heated board that is located different zone position has been arranged on the wall, is formed with first reservation clearance in the edge intersection of at least three heated board, is formed with second reservation clearance between two adjacent heated boards, a serial communication port, include:

the first positioning part is arranged at the first reserved gap and comprises a wafer body and a first positioning component penetrating through the central part of the wafer body, and the first positioning component penetrates through the wafer body through the first positioning component and is fastened in a wall surface at the end part of the first positioning component so as to drive the lower end surface of the wafer body to be abutted against the upper end surfaces of all the insulation boards which are intersected to form the first reserved gap;

and the second positioning piece is arranged at the second reserved gap and comprises a plate body and a second positioning component penetrating through the central part of the plate body, and the second positioning component penetrates through the plate body by virtue of the second positioning component and is fastened in the wall surface with the end part of the second positioning component so as to drive the lower end surfaces at the two ends of the plate body to be respectively attached to and abutted against the upper end surfaces of the two adjacent insulation boards.

2. The wall positioning system of the insulation board according to claim 1, characterized in that: the second positioning piece is arranged at the center of the second reserved gap.

3. The wall positioning system of the insulation board according to claim 1, characterized in that: the second positioning piece is provided with an end portion pressed on the board surface of the heat insulation board, the end portion extends from the edge of the heat insulation board towards the end face of the inner side of the edge of the heat insulation board in the vertical direction, and the extending length is larger than or equal to the width of the second reserved gap.

4. The wall positioning system of the insulation board according to claim 3, characterized in that: the wafer body is pressed on the surface of the insulation board, and the radial distance of the pressed part is the same as the extension length of the end part of the second positioning piece.

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