CN213947700U - Combined multifunctional heat-conducting silica gel sheet - Google Patents
Combined multifunctional heat-conducting silica gel sheet Download PDFInfo
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- CN213947700U CN213947700U CN202022517036.0U CN202022517036U CN213947700U CN 213947700 U CN213947700 U CN 213947700U CN 202022517036 U CN202022517036 U CN 202022517036U CN 213947700 U CN213947700 U CN 213947700U
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Abstract
The utility model discloses a modular multi-functional heat conduction silica gel piece, it is including heat conduction silica gel piece body, heat conduction silica gel piece body includes that PET leaves type rete, polyimide thin layer, heat conduction silica gel layer, viscose layer and PET reticulation protection rete, heat conduction silica gel piece body is equipped with the built-up connection structure, the viscose layer is including strong glue impressed watermark buffer part, weak bonding parcel portion and perk handle portion. The utility model discloses a set up PET and realize heat conduction, buffer protection, insulating nature and anti puncture nature multi-functionally from type rete, polyimide film layer, heat conduction silica gel layer and PET reticulation protection rete, improve the functionality. The heat-conducting silica gel sheet bodies with different specifications can be formed by arranging the combined connection structure, so that electronic components or parts to be cooled with different specifications can be conveniently used, the applicability is improved, and the cost is reduced; the fastening connection between the film layers is improved by arranging the heat conduction connecting mechanism, the thermal resistance between the film layers is reduced, the heat dissipation efficiency is improved, and short circuit is not easy to generate.
Description
Technical Field
The utility model relates to a technical field of heat conduction silica gel piece, concretely relates to modular multi-functional heat conduction silica gel piece.
Background
With the development of the industrial society and the vigorous development of the technologies in various electronic device fields and new energy fields, the development of the heat dissipation technology in the electronic device field and the new energy technical field, especially in the new energy field and the new energy battery field, becomes a bottleneck restricting the development of the related technology.
In the structural fields of electronics, electrical appliances, new energy batteries and the like, a heat conduction silica gel sheet is generally adopted for heat conduction and heat dissipation, so that the normal working performance of internal components such as the electronics, the electrical appliances, the new energy batteries and the like is ensured, the existing heat conduction silica gel sheet only provides heat conduction, the heat resistance is higher, the heat conduction efficiency and the heat dissipation efficiency are reduced, the existing heat conduction silica gel sheet does not have insulation and buffering performance, external force factors such as external vibration, impact and the like easily cause the material to be pierced to cause short circuit conduction, so that the components are damaged, and the electronic components or heat-dissipated parts cannot be better protected. Present heat conduction silica gel piece is mostly the area of pasting according to different specifications and is customized and cut, can not make up, and is with high costs, can only be used for the electronic components of a specification or by use such as radiating part, and the suitability is lower, and the heat conduction silica gel piece is pasted electronic components or by radiating part on, clears away very inconveniently when changing.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a to present technique not enough, provide a modular multi-functional heat conduction silica gel piece.
The utility model discloses a realize that the technical scheme that above-mentioned purpose adopted is:
a combined multifunctional heat-conducting silica gel sheet comprises a heat-conducting silica gel sheet body, wherein the heat-conducting silica gel sheet body comprises a PET release film layer, a polyimide film layer, a heat-conducting silica gel layer and an adhesive layer, a PET reticulate protective film layer is arranged between the heat-conducting silica gel layer and the adhesive layer, the combined multifunctional heat-conducting silica gel sheet is arranged in a mode that the PET release film layer, the polyimide film layer, the heat-conducting silica gel layer, the PET reticulate protective film layer and the adhesive layer are sequentially stacked, and the heat-conducting silica gel sheet body is provided with a combined connection structure;
further improvement is made, the viscose layer is including from left to right strong glue impressed watermark buffer that sets gradually, glues parcel portion and perk handle portion weakly, strong glue impressed watermark buffer, glue parcel portion and perk handle portion weakly and be an overall structure, strong glue impressed watermark buffer is in the coplanar with weak gluing parcel portion.
The improved structure is characterized in that a plurality of reinforcing block mechanisms are arranged at the top of the PET release film layer, and the side edges of the PET release film layer, the adhesive layer, the polyimide film layer, the heat-conducting silica gel layer and the PET reticulate protective film layer are provided with a plurality of heat-conducting connecting mechanisms.
The combined connection structure comprises a combined convex block and a combined groove, the combined convex block is a T-shaped structure convex block, the combined groove is a T-shaped groove, the combined convex block is arranged on the front side surface of the heat-conducting silica gel sheet body, and the combined groove is arranged behind the heat-conducting silica gel sheet body.
Further improvement is made, it distributes in the bottom on viscose layer to glue the impressed watermark buffer portion by force and be "concave" font, it is equipped with wavy impressed watermark to glue the impressed watermark buffer portion by force, wavy impressed watermark upper surface covers the glue film.
The improved structure is characterized in that the weakly-adhesive wrapping portion is arranged in the middle of the strongly-adhesive embossing buffering portion, the surface of the weakly-adhesive wrapping portion is provided with a dispensing area, a plurality of glue dots with round dot structures are arranged in the dispensing area, and the upwarp handle portion is provided with bending indentations at the joint of the weakly-adhesive wrapping portion.
The improved structure is characterized in that a plurality of heat conduction connecting mechanisms are provided with gold-plated layers.
In a further improvement, a plurality of the reinforcing block mechanisms are provided with holes.
The PET release film layer, the polyimide film layer, the heat conducting silica gel layer, the PET reticulate pattern protection film layer and the adhesive layer are sequentially adhered and fixed into a whole through the adhesive from top to bottom.
The utility model has the advantages that: the utility model discloses a set up PET and make heat conduction silica gel piece body have heat conduction, buffer protection, insulating nature and anti puncture nature multi-functionally from type rete, polyimide film layer, heat conduction silica gel layer and PET reticulation protection rete, improve functional, better protection electronic components or by the heat dissipation part. The combined connection structure is used for forming the heat-conducting silica gel sheet bodies with different specifications according to use requirements, so that the heat-conducting silica gel sheet bodies can be used for electronic components or parts to be cooled with different specifications, the applicability is improved, customized cutting is not needed, and the processing cost is reduced; the heat conduction connecting mechanism is used for improving the fastening connection among the film layers, improving the laminating connectivity, reducing the thermal resistance of each part, improving the heat dissipation efficiency and preventing short circuit; the polyimide film layer is used for providing insulating property and puncture resistance, so that the adhered part is protected better; wave formula impressed watermark can effectual solution atmospheric pressure reinforce and reduce area of contact and realize the easy separation, easy transport, the height of the heat conduction silica gel piece body that the line of uplift also increases plays the cushioning effect, is used for pasting the stable adhesion of heat conduction silica gel piece body to pasted electronic component or battery through setting up strong gluey impressed watermark buffer section, the point of weak bonding parcel section is glued the district and is favorable to weak bonding parcel section to break away from the surface of being pasted electronic component or being pasted the part, is convenient for with the multi-functional heat conduction silica gel piece of combination formula with being pasted electronic component or part separately, the clearance of being convenient for, is convenient for operate the pull-up through setting up perk handle portion.
The present invention will be further described with reference to the accompanying drawings and the following detailed description.
Drawings
FIG. 1 is a schematic view of the overall structure of the combined multifunctional heat-conducting silicone sheet according to the present embodiment;
fig. 2 is an exploded view of the combined multifunctional heat-conducting silicone sheet of the present embodiment;
FIG. 3 is a schematic view of an adhesive layer structure according to the present embodiment;
FIG. 4 is a schematic cross-sectional view of the adhesive layer of the present embodiment;
FIG. 5 is an enlarged view of A in the present embodiment;
fig. 6 is an enlarged schematic view B of the present embodiment.
In the figure: 1. the combined type multifunctional heat-conducting silica gel sheet comprises a heat-conducting silica gel sheet body, a PET release film layer, a polyimide film layer, a heat-conducting silica gel layer, a glue layer, a PET reticulate pattern protection film layer, a combined connecting structure, 80 combined bumps, 81 combined grooves, 60 strong glue embossing buffer parts, 61 weak glue wrapping parts, 62 tilting handle parts, 600 wavy embossing, 610 glue dispensing areas, 611 glue dispensing points, 620 bending indentations, 9 reinforcing mechanisms and 10 heat-conducting connecting mechanisms.
Detailed Description
The following description is only a preferred embodiment of the present invention, and does not limit the scope of the present invention.
In the embodiment, referring to fig. 1 to 6, a combined multifunctional heat-conducting silicone sheet 1 comprises a heat-conducting silicone sheet body 2, wherein the heat-conducting silicone sheet body 2 comprises a PET release film layer 3, a polyimide film layer 4, a heat-conducting silicone adhesive layer 5 and an adhesive layer 6, a PET reticulate protective film layer 7 is arranged between the heat-conducting silicone adhesive layer 5 and the adhesive layer 6, the combined multifunctional heat-conducting silicone sheet 1 is arranged in a manner that the PET release film layer 3, the polyimide film layer 4, the heat-conducting silicone adhesive layer 5, the PET reticulate protective film layer 7 and the adhesive layer 6 are sequentially stacked, the polyimide film layer 4 is subjected to corona treatment, the composite effect between the polyimide film layer 4 and the heat-conducting silicone adhesive layer 5 is improved, so that the insulating property and puncture resistance of the combined multifunctional heat-conducting silicone sheet 1 are improved, bubbles are avoided, thermal resistance is reduced, and the heat dissipation effect is improved, the heat-conducting silica gel sheet body 2 is provided with a combined connecting structure 8, the combined connecting structure 8 comprises a combined convex block 80 and a combined groove 81, the combined convex block 80 is a T-shaped convex block, the combined groove 81 is a T-shaped groove, the combined convex block 80 is arranged on the front side surface of the heat-conducting silica gel sheet body 2, the combined groove 81 is arranged behind the heat-conducting silica gel sheet body 2, and the combined connecting structure 8 is used for forming the heat-conducting silica gel sheet bodies 2 with different specifications according to requirements, so that the heat-conducting silica gel sheet body 2 can be used for electronic components with different specifications or heat-radiated parts, and the applicability is improved.
The viscose layer 6 includes from left to right strong glue impressed watermark buffer portion 60 that sets gradually, weak bonding parcel portion 61 and perk handle portion 62, strong glue impressed watermark buffer portion 60, weak bonding parcel portion 61 and perk handle portion 62 are an overall structure, strong glue impressed watermark buffer portion 60 is on the coplanar with weak bonding parcel portion 61, strong glue impressed watermark buffer portion 60 is "concave" font and distributes in the bottom of viscose layer 6, strong glue impressed watermark buffer portion 60 is equipped with wavy impressed watermark 600, the surface covering glue film on wavy impressed watermark 600, the glue film is used for providing the effect that strong glue is glued to with combination formula multifunctional heat conduction silica gel piece 1 adhesion on electronic components or by the radiating part, prevent to drop, wavy impressed watermark 600 is used for when combination formula multifunctional heat conduction silica gel piece 1 stacks, and this structure can effectual solution atmospheric pressure powerful box reduces area of contact and realizes separating, easy transport, the heat conduction silica gel piece body 2's that the line of uplift also increased height plays certain cushioning effect.
Weakly glue parcel portion 61 sets up glue the embossing buffer portion 60 in the middle of strongly, weakly glue parcel portion surface 61 is equipped with the point and glues district 610, be equipped with the point of glue 611 of a plurality of dot structures in the point and glue the district 610, the point of glue 611 of weakly gluing parcel portion 61 does benefit to weakly glue parcel portion 61 and breaks away from the surface by pasting electronic components or by radiating part to with the multi-functional heat conduction silica gel piece of combination formula 1 with by pasting electronic components or by radiating part separately, the perk handle portion 62 with weakly glue parcel portion 61 linking department is equipped with crooked indentation 620, perk handle portion 62 can be along crooked folding up or down of crooked indentation 620, thereby makes things convenient for subsequent operation of breaking away from.
The top of the PET release film layer 3 is provided with a plurality of reinforcing block mechanisms 9, the reinforcing block mechanisms 9 are used for improving the stability of the PET release film layer 3, the plurality of reinforcing block mechanisms 9 are all provided with holes which are used for improving the heat dissipation performance, and plays a certain role in buffering, a plurality of heat conduction connecting mechanisms 10 are arranged on the lateral sides of the PET release film layer 3, the adhesive layer 6, the polyimide film layer 4, the heat conduction silicon adhesive layer 5 and the PET reticulate pattern protection film layer 7, a gold plating layer is arranged on a plurality of heat conduction connecting mechanisms 10, the heat-conducting connecting mechanisms 10 are used for improving the fastening connection among the PET release film layer 3, the polyimide film layer 4, the heat-conducting silicon adhesive layer 5, the adhesive layer 6 and the PET reticulate pattern protective film layer 7, thereby improving the lamination connectivity and for improving the heat conduction and transfer efficiency, thereby improving the heat dissipation efficiency.
PET leaves type rete 3, polyimide thin layer 4, heat conduction silica gel layer 5, PET reticulation protection rete 7 and viscose layer 6 from the top down loops through the sticking agent laminating and fixes as an organic whole, when heat conduction silica gel layer 5 dispels the heat, reduces the thermal resistance of each part, saves manufacturing cost, has improved production efficiency, and is difficult for producing the short circuit.
The utility model discloses a set up PET and make heat conduction silica gel piece body have heat conduction, buffer protection, insulating nature and anti puncture nature multi-functionally from type rete, polyimide thin layer, heat conduction silica gel layer and PET reticulation protection rete, improve functional, better protection electronic components or by the radiating part. The combined connection structure is used for forming the heat-conducting silica gel sheet bodies with different specifications according to use requirements, so that the heat-conducting silica gel sheet bodies can be used for electronic components or parts to be cooled with different specifications, the applicability is improved, customized cutting is not needed, and the processing cost is reduced; the heat conduction connecting mechanism is used for improving the fastening connection among the film layers, improving the laminating connectivity, reducing the thermal resistance of each part, improving the heat dissipation efficiency and preventing short circuit; the polyimide film layer is used for providing insulating property and puncture resistance, so that the adhered part is protected better; wave formula impressed watermark can effectual solution atmospheric pressure reinforce and reduce area of contact and realize the easy separation, easy transport, the height of the heat conduction silica gel piece body that the line of uplift also increases plays the cushioning effect, is used for pasting the stable adhesion of heat conduction silica gel piece body to pasted electronic component or battery through setting up strong gluey impressed watermark buffer section, the point of weak bonding parcel section is glued the district and is favorable to weak bonding parcel section to break away from the surface of being pasted electronic component or being pasted the part, is convenient for with the multi-functional heat conduction silica gel piece of combination formula with being pasted electronic component or part separately, the clearance of being convenient for, is convenient for operate the pull-up through setting up perk handle portion.
The utility model discloses be not limited to above-mentioned embodiment, adopt and the utility model discloses above-mentioned embodiment is the same or similar structure or device, and the other that obtain is used for the multi-functional heat conduction silica gel piece of combination formula, all is within the utility model discloses a within the protection scope.
Claims (7)
1. The utility model provides a modular multi-functional heat conduction silica gel piece which characterized in that: the combined multifunctional heat-conducting silica gel sheet comprises a heat-conducting silica gel sheet body, wherein the heat-conducting silica gel sheet body comprises a PET release film layer, a polyimide film layer, a heat-conducting silica gel layer and an adhesive layer, a PET reticulate protective film layer is arranged between the heat-conducting silica gel layer and the adhesive layer, the combined multifunctional heat-conducting silica gel sheet is arranged in a mode that the PET release film layer, the polyimide film layer, the heat-conducting silica gel layer, the PET reticulate protective film layer and the adhesive layer are sequentially stacked, and the heat-conducting silica gel sheet body is provided with a combined connection structure;
the viscose layer includes from left to right strong glue impressed watermark buffer that sets gradually, glues parcel portion and perk handle portion weakly, strong glue impressed watermark buffer, glue parcel portion and perk handle portion weakly and be an overall structure, strong glue impressed watermark buffer is in the coplanar with weak gluing parcel portion.
2. The combined multifunctional heat-conducting silica gel sheet according to claim 1, characterized in that: PET is provided with a plurality of reinforcement piece mechanisms from the top of type rete, PET is from the type rete the viscose layer polyimide film layer, heat conduction silica gel layer and PET reticulation protection rete's avris all is provided with a plurality of heat conduction coupling mechanism.
3. The combined multifunctional heat-conducting silica gel sheet according to claim 2, characterized in that: the combined connecting structure comprises a combined convex block and a combined groove, the combined convex block is a T-shaped structure convex block, the combined groove is a T-shaped groove, the combined convex block is arranged on the front side surface of the heat-conducting silica gel sheet body, and the combined groove is arranged behind the heat-conducting silica gel sheet body.
4. The combined multifunctional heat-conducting silica gel sheet according to claim 3, characterized in that: the strong glue embossing buffer part is 'concave' font and distributes in the bottom of viscose layer, the strong glue embossing buffer part is equipped with wavy impressed watermark, surface covering glue film on the wavy impressed watermark.
5. The combined multifunctional heat-conducting silica gel sheet according to claim 4, wherein: the weakly-adhesive wrapping portion is arranged in the middle of the strongly-adhesive embossing buffer portion, the surface of the weakly-adhesive wrapping portion is provided with a dispensing area, a plurality of glue dots of dot structures are arranged in the dispensing area, and bent indentations are arranged at the joint of the upwarping handle portion and the weakly-adhesive wrapping portion.
6. The combined multifunctional heat-conducting silica gel sheet according to claim 5, wherein: and the heat conduction connecting mechanisms are all provided with gold-plated layers.
7. The combined multifunctional heat-conducting silica gel sheet according to claim 6, wherein: and a plurality of reinforcing block mechanisms are provided with holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022517036.0U CN213947700U (en) | 2020-11-04 | 2020-11-04 | Combined multifunctional heat-conducting silica gel sheet |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022517036.0U CN213947700U (en) | 2020-11-04 | 2020-11-04 | Combined multifunctional heat-conducting silica gel sheet |
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| CN213947700U true CN213947700U (en) | 2021-08-13 |
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| CN202022517036.0U Active CN213947700U (en) | 2020-11-04 | 2020-11-04 | Combined multifunctional heat-conducting silica gel sheet |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113709967A (en) * | 2021-09-07 | 2021-11-26 | 东莞市哲华电子有限公司 | High-thermal-conductivity composite copper foil capable of stretching under heating and preparation method thereof |
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2020
- 2020-11-04 CN CN202022517036.0U patent/CN213947700U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113709967A (en) * | 2021-09-07 | 2021-11-26 | 东莞市哲华电子有限公司 | High-thermal-conductivity composite copper foil capable of stretching under heating and preparation method thereof |
| CN113709967B (en) * | 2021-09-07 | 2022-09-06 | 东莞市哲华电子有限公司 | High-thermal-conductivity composite copper foil capable of stretching under heating and preparation method thereof |
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