CN213931707U

CN213931707U - Drying device for wafer

Info

Publication number: CN213931707U
Application number: CN202022974433.0U
Authority: CN
Inventors: 吴继勇
Original assignee: Jiangsu Suxin Electronic Technology Co ltd
Current assignee: Jiangsu Suxin Semiconductor Co.,Ltd.
Priority date: 2020-12-14
Filing date: 2020-12-14
Publication date: 2021-08-10
Anticipated expiration: 2030-12-14

Abstract

The utility model discloses a drying device for wafer relates to circuit element processing technology field. The utility model discloses a base, preheating cabinet, drying cabinet and drying plate, the top of base is provided with the preheating cabinet, is provided with the drying cabinet on the base of preheating cabinet one side, and the drying cabinet is used for the drying, and the preheating cabinet is used for accepting the waste heat and preheats, and the inside symmetry of drying cabinet is pegged graft and is had the drying plate for place the wafer main part, the top through connection of connecting pipe and drying cabinet is passed through at the top of preheating cabinet, and the four corners of base bottom is fixed with fills up the foot, realizes the stable support. The utility model discloses a set up base, drying cabinet, preheating cabinet, drying plate, solved the problem of drying efficiency low, energy resource consumption high and unable big dry wafer in batches.

Description

Drying device for wafer

Technical Field

The utility model belongs to the technical field of circuit element processing, especially, relate to a drying device for wafer.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with the purity as high as 99.999999999 percent. In the processing or recovery of the wafer, many processes are required, and drying is an indispensable part.

1. When the wafer is dried, the existing drying mode is not perfect, the drying efficiency is low, and the energy consumption is high;

2. when wafers are dried, the wafers cannot be dried in large batch, which results in low processing efficiency and high cost.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a drying device for wafer through setting up base, drying cabinet, preheating cabinet, drying plate, has solved the problem of drying efficiency low, energy resource consumption height and unable big dry wafer in batches.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model relates to a drying device for wafer, including base, preheating cabinet, drying cabinet and drying board, the top of base is provided with the preheating cabinet, be provided with the drying cabinet on the base of preheating cabinet one side, the drying cabinet is used for the drying, and the preheating cabinet is used for accepting the waste heat and preheats, the inside symmetry of drying cabinet is pegged graft and is had the drying board for place the wafer main part, the top through connection of pipe and drying cabinet is passed through at the top of preheating cabinet, the four corners of base bottom is fixed with the pad foot, realizes the outrigger.

Furthermore, slots are symmetrically formed in two sides of the drying box, a limiting frame is fixed in the drying box in each slot, a drying plate is fixedly connected to the inner side of the limiting frame in an inserting mode, the drying box and the preheating box are consistent in structure, and the limiting frame is used for achieving clamping and fixing of the drying plate.

Further, run through in the base of drying cabinet bottom and seted up logical groove, it is fixed with the far infrared heating pipe to lead to the inslot, the logical inslot that the far infrared heating pipe below is fixed with the fan, the base upper end that leads to on the groove is fixed with the card frame, the joint of drying cabinet bottom is in the card frame outside, realizes that the heat-seal blows, rapid draing.

Further, the surface of drying plate is the rectangle array and has seted up the standing groove, the wafer main part has been placed to the inside of standing groove.

Furthermore, the bottoms of the drying box and the preheating box are all designed to be through, and the limiting frame inside the drying box is obliquely arranged and corresponds to the slot.

The utility model discloses following beneficial effect has:

1. the utility model discloses a set up base, drying cabinet, preheating cabinet, solved the problem that drying efficiency is low, energy consumption is high, the utility model discloses more high-efficient than traditional drying method, drying efficiency is higher, and is more thorough to the utilization of the energy, adopts the far infrared heating, and the cooperation fan blows, blows hot-air to the drying cabinet, carries out quick drying to the wafer in the drying cabinet, and unnecessary heat from managing the direction preheating cabinet even, utilizes the waste heat, exchanges the position with the preheating cabinet and can save subsequent energy consumption in the drying cabinet after the drying.

2. The utility model discloses a set up drying plate, drying cabinet, solved the problem of unable big batch dry wafer, the utility model discloses can dry a large amount of wafers, guarantee good drying efficiency, promote drying effect, save time, reduction in production cost sets up a large amount of standing grooves on drying plate, places the wafer main part in it, and the slope inserts and carries out quick big batched dry use in the drying cabinet.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is an internal structural view of the present invention;

fig. 3 is an exploded view of the drying plate and the limiting frame of the present invention;

FIG. 4 is a view of the base of the present invention;

in the drawings, the components represented by the respective reference numerals are listed below:

1. a base; 11. a foot pad; 12. a far infrared heating pipe; 13. a fan; 14. clamping a frame; 15. a through groove; 2. a preheating box; 3. a drying oven; 31. a slot; 32. a limiting frame; 4. connecting pipes; 5. drying the plate; 51. a wafer body; 52. and (6) placing the groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Please refer to fig. 1-4, the present invention relates to a drying device for wafers, which comprises a base 1, a preheating box 2, a drying box 3 and a drying plate 5, wherein the preheating box 2 is disposed above the base 1, the drying box 3 is disposed on the base 1 at one side of the preheating box 2, the drying plate 5 is symmetrically inserted into the drying box 3, the top of the preheating box 2 is connected to the top of the drying box 3 through a connecting tube 4, the preheating box 2 and the drying box 3 are connected through the connecting tube 4, when the wafers are dried in the drying box 3, the excessive waste heat is guided into the preheating box 2 through the connecting tube 4, the wafers in the preheating box 2 are preliminarily preheated, thereby ensuring the full utilization of heat, saving energy consumption, avoiding a large amount of heating in the subsequent drying process, the pad feet 11 are fixed at four corners of the bottom of the base 1, and ensuring stable support through the pad feet 11, and a certain distance from the ground, and (4) moisture resistance.

As shown in fig. 1 to 3, the surface of the drying plate 5 is provided with placing grooves 52 in a rectangular array, and a wafer main body 51 is placed inside the placing grooves 52; slots 31 are symmetrically formed in two sides of the drying box 3, a limiting frame 32 is fixed in the drying box 3 in the slots 31, a drying plate 5 is fixedly inserted in the inner side of the limiting frame 32, and the drying box 3 and the preheating box 2 are consistent in structure.

Run through in the base 1 of 3 bottoms of drying cabinet and seted up logical groove 15, lead to the inslot and be fixed with far infrared heating pipe 12 in the groove 15, lead to the inslot 15 internal fixation of far infrared heating pipe 12 below and have fan 13, lead to 1 upper ends of base on the groove 15 and be fixed with

card frame

14, 3 bottoms of drying cabinet joint in the card frame 14 outside.

The bottoms of the drying box 3 and the preheating box 2 are both in a through design, and a limiting frame 32 in the drying box 3 is obliquely arranged and corresponds to the slot 31; when the wafer main body 51 is dried, the wafer main body is placed in the placing groove 52, the drying plate 5 is inserted into the limiting frame 32 in the drying box 3 through the inserting groove 31, inclined placement is achieved, then the fan 13 and the far infrared heating pipe 12 are opened, heat is blown to the inside of the drying box 3 through wind power, the wafer main body 51 on the drying plate 5 is dried, waste heat enters the preheating box 2 to be preheated, after the wafer main body 51 in the drying box 3 is dried, the position of the wafer main body and the position of the preheating box 2 are exchanged, materials in the preheating box 2 can be dried, the drying plate 5 in the drying box 3 is taken out, a new drying plate 5 is inserted, preheating is conducted, and the operation is repeated.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A drying device for wafers comprises a base (1), a preheating box (2), a drying box (3) and a drying plate (5), and is characterized in that: the drying device is characterized in that a preheating box (2) is arranged above the base (1), a drying box (3) is arranged on the base (1) on one side of the preheating box (2), drying plates (5) are symmetrically inserted into the drying box (3), the top of the preheating box (2) is in through connection with the top of the drying box (3) through a connecting pipe (4), and pad feet (11) are fixed at four corners of the bottom of the base (1).

2. The wafer drying device according to claim 1, wherein slots (31) are symmetrically formed in two sides of the drying box (3), a limiting frame (32) is fixed in the drying box (3) in the slots (31), a drying plate (5) is fixedly inserted in the inner side of the limiting frame (32), and the drying box (3) and the preheating box (2) are consistent in structure.

3. The drying device for the wafer according to claim 1, wherein a through groove (15) penetrates through the base (1) at the bottom of the drying box (3), the far infrared heating pipe (12) is fixed in the through groove (15), the fan (13) is fixed in the through groove (15) below the far infrared heating pipe (12), a clamping frame (14) is fixed at the upper end of the base (1) on the through groove (15), and the bottom of the drying box (3) is clamped outside the clamping frame (14).

4. The drying device for the wafer as claimed in claim 1, wherein the drying plate (5) has a rectangular array of placing slots (52) on the surface, and the wafer body (51) is placed inside the placing slots (52).

5. The drying device for wafers as claimed in claim 1, wherein the bottom of the drying box (3) and the preheating box (2) are designed to be through, and the limiting frame (32) inside the drying box (3) is disposed obliquely and corresponds to the slot (31).